Semiconductor optical detection device

Abstract

The utility model discloses a semiconductor optical detection device, which comprises a detection working table, a plurality of conveying assemblies sequentially arranged along a second direction are arranged on the detection working table, and detection stations of the plurality of conveying assemblies are sequentially distributed in the second direction; a code reading assembly, a detector assembly and a material receiving assembly are sequentially arranged on the detection workbench in the first direction. The code reading assembly is used for reading codes of the chip material strips on the code reading station; the detector assembly comprises a detection Y-axis moving module and a detector, the detection Y-axis moving module extends in the second direction and is arranged above the multiple conveying assemblies, and the detection Y-axis moving module is installed on the detection workbench. The detector is installed on the detection Y-axis moving module in a sliding mode and can move above the detection stations of the multiple conveying assemblies in the second direction. The material receiving assembly is used for moving the chip material strips out of the conveying assembly from the material receiving station; wherein the first direction is perpendicular to the second direction.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor optical detection, particularly to a semiconductor optical detection device. BACKGROUND

[0002] With the rapid development of integrated circuit industry, the demand of chip packaging and detection is increasingly prosperous. At present, the existing semiconductor optical detection device detects the chip strip in the magazine, and the whole detection production line has only one detection station, and the next chip strip needs to wait for the whole detection production line after the previous chip strip, so that the detection efficiency of the device is low. UTILITY MODEL CONTENTS

[0003] The utility model aims at providing a semiconductor optical detection device, which can improve the detection efficiency of the chip strip.

[0004] In order to realize the above-mentioned purpose, the utility model provides a semiconductor optical detection device, which comprises:

[0005] A detection workbench is provided with a plurality of conveying assemblies arranged in sequence along a second direction on the detection workbench, the conveying assemblies extend along a first direction, the conveying assemblies are sequentially provided with a feeding station, a code reading station, a detection station and a material collecting station along the first direction, the conveying assemblies are used for moving the chip strip from the feeding station to the code reading station, the detection station and the material collecting station in sequence, and the detection stations of the plurality of conveying assemblies are sequentially distributed in the second direction.

[0006] A code reading assembly, a detector assembly and a material collecting assembly are sequentially arranged along the first direction on the detection workbench.

[0007] The code reading assembly is used for reading the code of the chip strip on the code reading station.

[0008] The detector assembly comprises a detection Y-axis moving module and a detector, the detection Y-axis moving module extends along the second direction and is arranged above the plurality of conveying assemblies, the detection Y-axis moving module is installed on the detection workbench, and the detector is slidingly installed on the detection Y-axis moving module and can move above the detection stations of the plurality of conveying assemblies along the second direction.

[0009] The material collecting assembly is used for moving the chip strip out of the conveying assembly from the material collecting station.

[0010] Wherein, the first direction and the second direction are perpendicular to each other.

[0011] Preferably, the detection Y-axis moving module is provided with a detection X-axis moving module extending along the first direction, one end of the detection X-axis moving module is slidingly installed on the detection Y-axis moving module, and the detector is slidingly installed on the detection X-axis moving module.

[0012] Preferably, the detection X-axis moving module is provided with a detection Z-axis moving module extending along the third direction and slidingly installed on the detection X-axis moving module, and the detector is slidingly installed on the detection Z-axis moving module.

[0013] The first direction, the second direction and the third direction are perpendicular to each other.

[0014] Preferably, a plurality of detection stations are provided between the code reading station and the material receiving station of the conveying assembly along the first direction, and each detection station is provided with one detector assembly.

[0015] The conveying assembly is used to move the chip strip along the first direction from the feeding station to the code reading station, the plurality of detection stations and the material receiving station in sequence.

[0016] Preferably, two detector assemblies are provided between the code reading assembly and the material receiving assembly along the first direction on the detection workbench, and two detection stations are provided between the code reading station and the material receiving station of the conveying assembly along the first direction.

[0017] A follow-up Y-axis moving piece is provided between the two detection Y-axis moving modules along the first direction on the detection workbench, the follow-up Y-axis moving piece extends along the second direction and is provided above the plurality of conveying assemblies, and the follow-up Y-axis moving piece is installed on the detection workbench.

[0018] The follow-up Y-axis moving piece is provided with two Y-axis moving tracks extending along the second direction, the two Y-axis moving tracks are arranged in sequence along the first direction and are parallel to each other, the two Y-axis moving tracks are respectively provided on the follow-up Y-axis moving piece near one side of the two detection Y-axis moving modules, and the Y-axis moving track is provided with a sliding block.

[0019] The detection Y-axis moving module is provided with a detection X-axis moving module extending along the first direction, both ends of the detection X-axis moving module are respectively installed on the detection Y-axis moving module and the sliding block of the corresponding Y-axis moving track, and the detector is slidingly installed on the detection X-axis moving module.

[0020] Preferably, the conveying assembly comprises a supporting assembly and a conveying track.

[0021] The support assembly extends along a first direction, and the support assembly is sequentially provided with the feeding station, the code reading station, the detection station and the collecting station along the first direction. A plurality of support assemblies are sequentially arranged on the detection workbench along a second direction, and the support assemblies are used for supporting the chip material strips;

[0022] The conveying track and the support assembly are one-to-one corresponding and parallel arranged. The conveying track is provided with clamping pieces sliding along the conveying track. The clamping pieces are used for clamping the chip material strips on the support assembly to move along the first direction from the feeding station to the code reading station, the detection station and the collecting station in sequence.

[0023] Preferably, the support assembly is sequentially provided with the feeding station, the code reading station, a plurality of detection stations and the collecting station along the first direction. The support assembly is provided with a transition station between two detection stations along the first direction.

[0024] The clamping pieces are provided with two clamping pieces, and the two clamping pieces are both installed on the conveying track and slide along the conveying track. One of the clamping pieces is used for clamping the chip material strips on the support assembly to move along the first direction from the feeding station to the code reading station, the detection station and the transition station in sequence. The other clamping piece is used for clamping the chip material strips on the support assembly to move along the first direction from the transition station to the detection station and the collecting station in sequence.

[0025] Preferably, the clamping piece comprises:

[0026] An upper clamping jaw;

[0027] A linear motor installed on the conveying track and capable of sliding along the conveying track;

[0028] A loss prevention guide rail installed on the top of the linear motor;

[0029] A fixed block installed on the top of the linear motor, and the fixed block is located on one side of the loss prevention guide rail in the first direction;

[0030] A sliding block installed on the loss prevention guide rail and capable of sliding along the loss prevention guide rail;

[0031] A lower clamping jaw installed on the sliding block, and the height of the lower clamping jaw is flush with the height of the support assembly;

[0032] A driving piece installed on the sliding block, the driving piece is connected with the upper clamping jaw and the lower clamping jaw, and the driving piece is used for driving the upper clamping jaw to move towards or away from the lower clamping jaw;

[0033] A tensile and compressive force sensor is installed between the sliding block and the fixed block, two ends of the tensile and compressive force sensor are connected with the sliding block and the fixed block respectively, and the tensile and compressive force sensor is electrically connected with the linear motor.

[0034] Preferably, the code reading stations of the plurality of conveying assemblies are sequentially arranged in the second direction.

[0035] The code reading assembly comprises:

[0036] A code reading moving module extends along the second direction and is arranged above the plurality of conveying assemblies, and the code reading moving module is installed on the detection workbench.

[0037] A code reader is slidingly installed on the code reading moving module and can move above the code reading stations of the plurality of conveying assemblies along the second direction.

[0038] Preferably, the material collecting stations of the plurality of conveying assemblies are sequentially arranged in the second direction.

[0039] The material collecting assembly comprises a material collecting support and a plurality of vertical driving members.

[0040] The material collecting support extends along the second direction and is installed on the detection workbench.

[0041] The plurality of vertical driving members are sequentially installed on the material collecting support along the second direction, the plurality of vertical driving members correspond to the plurality of conveying assemblies one by one in the first direction, the vertical driving members extend along the third direction, horizontal driving members are installed on the vertical driving members, the vertical driving members are used for driving the horizontal driving members to move along the vertical driving members, pushers are installed on the horizontal driving members, the horizontal driving members are used for driving the pushers to move along the first direction, and the pushers are used for moving the chip material strips of the material collecting stations of the corresponding conveying assemblies out of the conveying assemblies.

[0042] Compared with the prior art, the semiconductor optical detection device has the beneficial effects that:

[0043] The multiple chip strips are moved from the feeding station to the code reading station on the corresponding conveying assembly, the code reading assembly reads the code of the chip strip on the code reading station, after the code reading is completed, the conveying assembly moves the chip strip from the code reading station to the detection station, the detection stations of the multiple conveying assemblies are sequentially distributed in the second direction, the entire device has multiple detection stations, the detector of the detector assembly moves along the detection Y-axis moving module in the second direction, after the detector detects the chip strip above the detection station of the previous conveying assembly, the detector can move to the detection station of the next conveying assembly in the second direction to detect the chip strip, compared with the prior art detection device with only one detection station, the semiconductor optical detection device can detect multiple chip strips faster, and the efficiency of detecting the chip strip is improved.

[0044] After the chip strip detection is completed, the conveying assembly moves the chip strip from the detection station to the material collecting station, and the material collecting assembly moves the chip strip out of the conveying assembly from the material collecting station, until all the chip strips are moved out of the conveying assembly. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 is a structural schematic view of the semiconductor optical detection device of the embodiment of the utility model;

[0046] Figure 2 is a structural schematic view of the code reading assembly, the detector assembly and the material collecting assembly of the embodiment of the utility model;

[0047] Figure 3 is a top view of the code reading assembly, the detector assembly and the material collecting assembly of the embodiment of the utility model;

[0048] Figure 4 is a structural schematic view of the detector assembly of the embodiment of the utility model;

[0049] Figure 5 is a top view of the supporting assembly of the embodiment of the utility model;

[0050] Figure 6 is a structural schematic view of the supporting assembly of the embodiment of the utility model;

[0051] Figure 7 is a structural schematic view of the conveying track and the clamping piece of the embodiment of the utility model;

[0052] Figure 8 is a structural schematic view of the clamping piece of the embodiment of the utility model;

[0053] Figure 9 is a structural schematic view of the lifting plate and the lifting driving piece of the embodiment of the utility model;

[0054] Figure 10Is the structure schematic view of the light emitting piece of the embodiment of the utility model;

[0055] Figure 11 Is the structure schematic view of the code reading assembly of the embodiment of the utility model;

[0056] Figure 12 Is the structure schematic view of the material receiving assembly of the embodiment of the utility model;

[0057] In the figure, 1, semiconductor optical detection device;101, detection workbench;2, conveying assembly;201, support assembly;2011, fixed track;2012, adjusting track;2013, screw rod driving motor;2014, screw rod;2015;moving piece;202, conveying track;203, clamping piece;2031, upper clamping jaw;2032, lower clamping jaw;2033, driving piece;2034, anti-damage guide rail;2035, sliding block;2036, fixed block;2037, tension and pressure sensor;2038, linear motor;

[0058] 3, code reading assembly;301, code reading moving module;302, code reader;4, detector assembly;401, detection Y-axis moving module;402, detector;403, detection X-axis moving module;404, detection Z-axis moving module;5, material receiving assembly;501, material receiving support;502, vertical driving piece;503, horizontal driving piece;504, pushing piece;6, follow-up Y-axis moving piece;601, Y-axis moving track;7, lifting plate;8, lifting driving piece;9, light emitting piece. DETAILED DESCRIPTION

[0059] The specific embodiments of the utility model are described in further detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but are not used to limit the scope of the utility model.

[0060] In the description of the utility model, it should be understood that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected;Can be mechanical connection, can also be electrical connection;Can be directly connected, can also be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the embodiment of the utility model can be understood according to the specific circumstances.

[0061] In the description of this utility model, it should be understood that the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," "longitudinal," "X-axis direction," "Y-axis direction," and "Z-axis direction," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Moreover, some of the above terms, in addition to indicating orientation or positional relationship, may also be used to indicate other meanings; for example, the term "upper" may in some cases be used to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0062] like Figures 1-4 As shown, a semiconductor optical inspection device 1 according to an embodiment of the present invention includes: an inspection worktable 101, on which a plurality of conveying components 2 are arranged sequentially along a second direction. The conveying components 2 extend along a first direction and are sequentially provided with a loading station, a code reading station, an inspection station and a receiving station along the first direction. The conveying components 2 are used to move chip strips from the loading station to the code reading station, the inspection station and the receiving station in sequence. The inspection stations of the plurality of conveying components 2 are distributed sequentially in the second direction.

[0063] The inspection workbench 101 is provided with a barcode reading component 3, a detector component 4, and a receiving component 5 arranged sequentially along the first direction X.

[0064] The code reading component 3 is used to read the codes on the chip strips at the code reading station;

[0065] The detector assembly 4 includes a detection Y-axis moving module 401 and a detector 402. The detection Y-axis moving module 401 extends along the second direction and is disposed above the plurality of conveying assemblies 2. The detection Y-axis moving module 401 is mounted on the detection worktable 101. The detector 402 is slidably mounted on the detection Y-axis moving module 401 and is capable of moving along the second direction above the detection station of the plurality of conveying assemblies 2.

[0066] The receiving component 5 is used to move the chip strips from the receiving unit out of the conveying component 2;

[0067] The first direction and the second direction are perpendicular to each other.

[0068] It should be noted that the plurality of chip strips are respectively moved from the feeding station to the code reading station on the corresponding conveying assembly 2, the code reading assembly 3 reads the code of the chip strip on the code reading station, after the code reading is completed, the conveying assembly 2 moves the chip strip from the code reading station to the detection station, the detection stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction, the entire device has a plurality of detection stations, the detector 402 of the detector assembly 4 moves along the detection Y-axis moving module 401 in the second direction, after the detection of the chip strip above the detection station of the previous conveying assembly 2 is completed, the detector 402 can move to the detection station above the next conveying assembly 2 in the second direction to detect the chip strip, compared with the prior art detection device with only one detection station, the semiconductor optical detection device 1 of the present application can detect a plurality of chip strips faster, and the efficiency of detecting the chip strip is improved.

[0069] After the detection of the chip strip is completed, the conveying assembly 2 moves the chip strip from the detection station to the material collecting station, and the material collecting assembly moves the chip strip out of the conveying assembly 2 from the material collecting station until all the chip strips are moved out of the conveying assembly 2.

[0070] As shown in the more specific embodiment, Figures 2-4 the detection X-axis moving module 403 is installed on the detection Y-axis moving module 401, the detection X-axis moving module 403 extends along the first direction X, one end of the detection X-axis moving module 403 is slidingly installed on the detection Y-axis moving module 401, and the detector 402 is slidingly installed on the detection X-axis moving module 403.

[0071] It should be noted that when the position of the detection station on the conveying assembly 2 changes, or the length of the chip strip located in the detection station in the first direction X is too poor to cause the limited field of view of the detector 402, one end of the detection X-axis moving module 403 is slidingly installed on the detection Y-axis moving module 401, and the detector 402 is slidingly installed on the detection X-axis moving module 403, so that the detector 402 can slide in the first direction X for detection.

[0072] The driving mode of the detection X-axis moving module 403 is not limited here.

[0073] As shown in the more specific embodiment, Figures 2-4 the detection Z-axis moving module 404 is installed on the detection X-axis moving module 403, the detection Z-axis moving module 404 extends along the third direction Z and is slidingly installed on the detection X-axis moving module 403, and the detector 402 is slidingly installed on the detection Z-axis moving module 404.

[0074] Among them, the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0075] It should be noted that the detection Z-axis movement module 404 is arranged to extend along the third direction Z and is slidingly mounted on the detection X-axis movement module 403, and the detector 402 is slidingly mounted on the detection Z-axis movement module 404, so that the detector 402 can slide along the third direction Z, and the distance between the detector 402 and the chip strip on the detection station can be adjusted, and more use scenarios can be applied.

[0076] The driving mode of the detection Z-axis movement module 404 is not limited here.

[0077] As shown in the figure, in a more specific embodiment, a plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying assembly 2, and each detection station is correspondingly provided with a detector assembly 4. Figures 2-4

[0078] The conveying assembly 2 is used to move the chip strip along the first direction X from the feeding station to the code reading station, the plurality of detection stations and the material receiving station in sequence.

[0079] It should be noted that a plurality of detection stations are arranged on one conveying assembly 2, and a plurality of detector assemblies 4 corresponding to the detection stations are arranged on the detection workbench 101, so that the chip strip can be detected multiple times.

[0080] As shown in the figure, in a more specific embodiment, the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same or different. Figures 2-4

[0081] When the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same, the accuracy of the plurality of detectors 402 arranged in sequence along the first direction increases in sequence.

[0082] It should be noted that the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same or different. When the detectors 402 of the detector assemblies 4 corresponding to each detection station are different, for example, 2D detectors and 3D detectors, etc., the chip strip can be detected in multiple ways.

[0083] When the detectors 402 of the detector assemblies 4 corresponding to each detection station are the same, the accuracy of the detectors 402 of the detector assemblies 4 corresponding to the plurality of detection stations arranged in sequence along the first direction increases in sequence, that is, the accuracy of the detector 402 located on the right side in the first direction X is higher than that of the detector 402 located on the left side, so that the chip strip can be detected by the detector 402 with higher accuracy after being detected by the detector 402 with lower accuracy, and the reliability of the detection result can be improved.

[0084] As shown in the figure, in a more specific embodiment, a plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material receiving station of the conveying assembly 2, and each detection station is correspondingly provided with a detector assembly 4. Figures 2-4 ​​As shown, in a more specific embodiment, the detection workbench 101 is provided with two detector assemblies 4 arranged in sequence along the first direction X between the code reading assembly 3 and the material receiving assembly 5 on the detection workbench 101, and the detection workbench 101 is provided with two detection stations arranged in sequence along the first direction X between the code reading station and the material receiving station of the conveying assembly 2;

[0085] The detection workbench 101 is provided with a follow-up Y-axis moving piece 6 between the two detection Y-axis moving modules 401 along the first direction X, the follow-up Y-axis moving piece 6 extends along the second direction Y and is arranged above the plurality of conveying assemblies 2, and the follow-up Y-axis moving piece 6 is installed on the detection workbench 101;

[0086] The follow-up Y-axis moving piece 6 is provided with two Y-axis moving tracks 601 extending along the second direction Y, the two Y-axis moving tracks 601 are arranged in sequence along the first direction and are parallel to each other, the two Y-axis moving tracks 601 are respectively arranged on the follow-up Y-axis moving piece 6 near one side of the two detection Y-axis moving modules 401, and the Y-axis moving track 601 is provided with a sliding block;

[0087] The detection Y-axis moving module 401 is installed with a detection X-axis moving module 403, the detection X-axis moving module 403 extends along the first direction, the two ends of the detection X-axis moving module 403 are respectively installed on the detection Y-axis moving module 401 and the sliding block of the corresponding Y-axis moving track 601, and the detector 402 is slidingly installed on the detection X-axis moving module 403.

[0088] It should be noted that, in order to ensure the stability of the two detection X-axis moving modules 403, the follow-up Y-axis moving piece 6 is arranged between the two detection Y-axis moving modules 401, the follow-up Y-axis moving piece 6 is provided with two Y-axis moving tracks 601 extending along the second direction Y, the two Y-axis moving tracks 601 are parallel to each other, the two Y-axis moving tracks 601 are respectively arranged on the follow-up Y-axis moving piece 6 near one side of the two detection Y-axis moving modules 401, and the Y-axis moving track 601 is provided with a sliding block, and the two ends of the detection X-axis moving module 403 are respectively installed on the detection Y-axis moving module 401 and the sliding block of the corresponding Y-axis moving track 601.

[0089] Therefore, when the detection X-axis moving module 403 moves along the detection Y-axis moving module 401, the sliding block connected to the other end of the detection X-axis moving module 403 can slide on the Y-axis moving track 601, thereby stably supporting the detection X-axis moving module 403.

[0090] As shown in the drawings, Figures 3-7 In a more specific embodiment, the conveying assembly 2 includes a support assembly 201 and a conveying track 202;

[0091] The support component 201 extends along the first direction X. The support component 201 is provided with a feeding station, a code reading station, a detection station and a receiving station in sequence along the first direction X. Multiple support components 201 are arranged in sequence on the detection workbench 101 along the second direction Y. The support component 201 is used to support the chip strip.

[0092] The conveying track 202 and the support component 201 are arranged in parallel and correspond to each other. The conveying track 202 is equipped with a clamping member 203 that slides along the conveying track 202. The clamping member 203 is used to clamp the chip strip on the support component 201 and move it sequentially from the loading station to the code reading station, the detection station and the receiving station along the first direction X.

[0093] It should be noted that the support component 201 supports the chip strip and does not have a conveying function. The clamping component 203 clamps the chip strip on the support component 201 along the conveying track 202 and moves it from the loading station to the code reading station, the detection station, and the receiving station, realizing the conveying of the chip strip to each station of the process. The driving method of the clamping component 203 is not limited here.

[0094] When there are two conveying components 2, the conveying tracks 202 of the two conveying components 2 are set in a mirror symmetrical manner with the first direction X as the central axis.

[0095] In another, more specific embodiment, the conveying component 2 is a component with its own conveying function, which moves the chip strips sequentially from the loading station to the code reading station, the detection station, and the receiving station.

[0096] like Figures 3-7 As shown, in a more specific embodiment, the support component 201 is provided with a feeding station, a code reading station, a detection station and a receiving station in sequence along the first direction X, and a transition station is provided between two of the detection stations along the first direction X of the support component 201.

[0097] Two clamping members 203 are provided. Both clamping members 203 are installed on the conveying track 202 and slide along the conveying track 202. One clamping member 203 is used to clamp the chip strip on the support assembly 201 and move it sequentially from the loading station to the code reading station, the detection station and the transition station along the first direction X. The other clamping member 203 is used to clamp the chip strip on the support assembly 201 and move it sequentially from the transition station to the detection station and the receiving station along the first direction X.

[0098] It should be noted that when there are multiple detection stations on the support assembly 201, the length of the support assembly 201 in the first direction X becomes longer. Therefore, the structures of the two clamping members 203 may be the same or different. In the initial state, the two clamping members 203 are respectively set at both ends of the conveying track 202.

[0099] One of the clamping components 203 first clamps the chip strip along the first direction X and moves it sequentially from the loading station to the code reading station and the detection station. Then, it clamps the chip strip and moves it from the detection station to the transition station. After clamping the chip strip to each detection station, the clamping component 203 returns to the safety position. After the chip strip is detected by the detector 402, it clamps the chip strip to the next detection station. After clamping the chip strip to the transition station, it returns to the safety position.

[0100] Another clamping member 203 slides along the conveying track 202 to the position corresponding to the transition position, and then clamps the chip strip along the first direction X and moves it from the transition position to the subsequent detection station. After clamping the chip strip to each detection station, it must return to the safety position. After the chip strip is detected by the detector 402, it clamps the chip strip to the next detection station. After clamping the chip strip to the receiving station, it returns to the safety position, which can be the position in the initial state.

[0101] When there are two conveying components 2, the two clamping members 203 on the conveying track 202 of the two conveying components 2 are mirror-symmetrically arranged with the first direction X as the central axis.

[0102] like Figure 8 As shown, in a more specific embodiment, the clamping member 203 includes: an upper clamping jaw 2031, a linear motor 2038, a damage prevention guide rail 2034, a fixing block 2036, a sliding block 2035, a lower clamping jaw 2032, a driving member 2033, and a tension / compression sensor 2037;

[0103] The linear motor 2038 is mounted on the conveyor track and can slide along the conveyor track;

[0104] The damage prevention guide rail 2034 is mounted on top of the linear motor 2038;

[0105] The fixing block 2036 is installed on the top of the linear motor 2038, and the fixing block 2036 is located on one side of the anti-damage guide rail 2034 in the first direction X;

[0106] The sliding block 2035 is mounted on the damage prevention guide rail 2034 and can slide along the damage prevention guide rail 2034;

[0107] The lower gripper 2032 is mounted on the sliding block 2035, and the height of the lower gripper 2032 is flush with the height of the support assembly.

[0108] The driving component 2033 is mounted on the sliding block 2035. The driving component 2033 is connected to the upper jaw 2031 and the lower jaw 2032. The driving component 2033 is used to drive the upper jaw 2031 to move closer to or further away from the lower jaw 2032.

[0109] The tension / compression sensor 2037 is installed between the sliding block 2035 and the fixed block 2036. The two ends of the tension / compression sensor 2037 are connected to the sliding block 2035 and the fixed block 2036 respectively. The tension / compression sensor 2037 is electrically connected to the linear motor 2038.

[0110] It should be noted that the height of the support component is flush with the height of the lower gripper 2032. The lower gripper 2032 is fixed on the sliding block 2035. When the driving component 2033 drives the upper gripper 2031 to move closer to the lower gripper 2032, the upper gripper 2031 and the lower gripper 2032 can clamp the chip strip on the support component. When the driving component 2033 drives the upper gripper 2031 to move away from the lower gripper 2032, the upper gripper 2031 and the lower gripper 2032 separate and release the chip strip. When the clamping component 203 moves, the upper gripper 2031 and the lower gripper 2032 will not touch the chip strip.

[0111] When the linear motor 2038 slides back and forth along the conveying track in the first direction, if the lower gripper 2032 suddenly encounters resistance, the lower gripper 2032 will drive the sliding block 2035 to move on the anti-damage guide rail 2034, thereby changing the distance between the sliding block 2035 and the fixed block 2036. The tension and pressure sensor 2037 between the sliding block 2035 and the fixed block 2036 will detect the change in tension and pressure. When the tension and pressure exceed the preset value, the tension and pressure sensor 2037 sends a corresponding signal to the linear motor 2038, the linear motor 2038 stops sliding on the conveying track, and the tension and pressure sensor 2037 sends an alarm signal.

[0112] The drive component 2033 can be a cylinder or an electric motor, etc.

[0113] The tension / compression sensor 2037 can be replaced with an electromagnet, which is fixed to the sliding block 2035. The fixing block 2036 is made of iron. The electromagnet works in conjunction with the photoelectric sensor. When the lower gripper 2032 encounters resistance, it will cause the sliding block 2035 to move on the anti-damage guide rail 2034, thus affecting the position of the electromagnet. For example, when the electromagnet attracts the fixing plate, it will cause the electromagnet to detach from the fixing plate. When the electromagnet detaches from the fixing plate, it will cause the electromagnet to attract the fixing plate. The photoelectric sensor detects the movement of the electromagnet's position and transmits the corresponding signal to the linear motor 2038, which then stops sliding on the conveyor track.

[0114] like Figures 3-7 As shown, in a more specific embodiment, the support assembly 201 includes a fixed track 2011, an adjustable track 2012, a lead screw drive motor 2013, a lead screw 2014, and a moving part 2015;

[0115] The fixed rails 2011 and the adjusting rails 2012 are used for jointly supporting the chip strip, the fixed rails 2011 and the adjusting rails 2012 are both extended along the first direction, the fixed rails 2011 and the adjusting rails 2012 are arranged in parallel on the detection workbench 101, the fixed rails 2011 and the adjusting rails 2012 have the same height in the third direction Z, the adjusting rails 2012 are movable along the second direction Y to the direction close to or away from the fixed rails 2011; the lead screw 2014 is connected with the lead screw driving motor 2013, the lead screw 2014 is extended along the second direction Y; the moving piece 2015 is provided with a threaded hole, the lead screw 2014 passes through the threaded hole, and the moving piece 2015 is connected with the adjusting rails 2012.

[0116] It should be noted that the fixed rails 2011 and the adjusting rails 2012 jointly support the chip strip, the fixed rails 2011 and the adjusting rails 2012 have the same height in the third direction Z, so that the supported chip strip has good levelness. The adjusting rails 2012 are movable along the second direction Y to the direction close to or away from the fixed rails 2011, so that the distance between the fixed rails 2011 and the adjusting rails 2012 can be adjusted to adapt to chip strips with different widths. Adjacent two fixed rails 2011 and adjacent two adjusting rails 2012 can be symmetrical about the same horizontal center line.

[0117] The lead screw driving motor 2013 drives the lead screw 2014 to rotate, the moving piece 2015 is provided with a threaded hole, the lead screw 2014 passes through the threaded hole, so that the lead screw 2014 can drive the moving piece 2015 to move along the lead screw 2014 when the lead screw 2014 rotates, and since the lead screw 2014 is extended along the second direction Y, the moving piece 2015 can move along the second direction Y, the moving piece 2015 is connected with the adjusting rails 2012, so that the adjusting rails 2012 move along the second direction Y.

[0118] In other embodiments, other driving modes can be used to drive the adjusting rails 2012 to move along the second direction Y.

[0119] As shown in FIGS. Figure 3 , 9 In a more specific embodiment, the detection workbench 101 is further provided with a lifting plate 7 and a lifting driving piece 8;

[0120] The lifting plate 7 is located between the fixed rails 2011 and the adjusting rails 2012 at the detection station;

[0121] The lifting driving piece 8 is connected with the lifting plate 7, and the lifting driving piece 8 is used for driving the lifting plate 7 to move back and forth along the third direction Z from a first position to a second position, the first position is a position flush with the height of the fixed rails 2011, and the second position is a position corresponding to the lower side of the fixed rails 2011.

[0122] It should be noted that the lifting plate 7 is set on the inspection workbench 101 and located between the fixed rail 2011 and the adjusting rail 2012 at the inspection station, that is, in the second direction Y, the fixed rail 2011, the lifting plate 7, and the adjusting rail 2012 are arranged sequentially. When the lifting drive 8 drives the lifting plate 7 to rise, the lifting plate 7 rises to the first position, and the height of the lifting plate 7 is flush with that of the fixed rail 2011. Since the fixed rail 2011 and the adjusting rail 2012 are at the same height, the heights of the lifting plate 7, the fixed rail 2011, and the adjusting rail 2012 are the same, which lifts the middle of the chip strip and improves the flatness of the chip strip during inspection.

[0123] The lifting plate 7 is preferably a vacuum tray, and the lifting drive component 8 is preferably a lifting module. The driving method of the lifting module is not limited here.

[0124] like Figure 3 , 9 As shown in Figure 10, in a more specific embodiment, the lifting plate 7 is a light-transmitting plate;

[0125] The inspection workbench 101 is also equipped with a light-emitting element 9, which is located below the lifting plate 7.

[0126] It should be noted that the lifting plate 7 is a light-transmitting plate, specifically a transparent acrylic plate. The light-emitting element 9 on the inspection workbench 101 is located below the lifting plate 7, so the light emitted by the light-emitting element 9 can pass through the lifting plate 7 and illuminate the chip strip from the bottom, thus illuminating the chip strip on the inspection station. The detector 402 is a vision detector 402, which can improve the detection accuracy of the detector 402.

[0127] The light-emitting component 9 includes a support base, a mounting block, and a light source component. The mounting block is mounted on the inspection worktable 101 via the support base, and the light source component is mounted on the top of the mounting block.

[0128] like Figures 2-3 As shown in Figures 1 and 11, in a more specific embodiment, the reading stations of the multiple transmission components 2 are sequentially distributed in the second direction Y.

[0129] The code reading component 3 includes a code reading mobile module 301 and a code reader 302;

[0130] The code reading moving module 301 extends along the second direction Y and is disposed above the plurality of conveying components 2. The code reading moving module 301 is mounted on the detection workbench 101.

[0131] The barcode reader 302 is slidably mounted on the barcode reading moving module 301 and can move along the second direction Y above the barcode reading station of the multiple conveying components 2.

[0132] It should be noted that the code reading stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction Y, and thus the code reader 302 moves along the code reading moving module 301 in the second direction Y, and after the code reading assembly 3 finishes reading the code of the chip strip above the code reading station of the previous conveying assembly 2, the code reading assembly 3 can move to the code reading station of the next conveying assembly 2 in the second direction Y to read the code of the chip strip, so as to continuously read the code of the chip strip on the plurality of conveying assemblies 2 and improve the code reading efficiency of the chip strip. The driving mode of the code reading moving module 301 is not limited here.

[0133] In another more specific embodiment, the code reading moving module 301 is provided with a code reader 302 adjusting mounting plate extending in the third direction Z, and the code reader 302 adjusting mounting plate is provided with a track, and the code reader 302 is slidingly mounted on the track and can slide in the third direction Z.

[0134] The code reader 302 is provided with a code reader light source.

[0135] As shown in FIGS. Figures 2-3 , 12, in a more specific embodiment, the material receiving stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction Y;

[0136] The material receiving assembly 5 comprises a material receiving support 501 and a plurality of vertical driving members 502.

[0137] The material receiving support 501 extends in the second direction Y and is mounted on the detection workbench 101.

[0138] The plurality of vertical driving members 502 are sequentially mounted on the material receiving support 501 in the second direction Y, and the plurality of vertical driving members 502 correspond one-to-one to the plurality of conveying assemblies 2 in the first direction X. The vertical driving member 502 extends in the third direction Z, and the vertical driving member 502 is provided with a horizontal driving member 503, and the vertical driving member 502 is used to drive the horizontal driving member 503 to move along the vertical driving member 502. The horizontal driving member 503 is provided with a pushing member 504, and the horizontal driving member 503 is used to drive the pushing member 504 to move in the first direction X. The pushing member 504 is used to move the chip strip of the corresponding material receiving station of the conveying assembly 2 out of the conveying assembly 2.

[0139] It should be noted that the receiving stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction Y, and therefore the vertical driving members 502 on the receiving support 501 and the conveying assemblies 2 correspond to each other in the first direction X, the vertical driving members 502 drive the horizontal driving members 503 to move along the vertical driving members 502 in the third direction Z, and therefore when the chip strip is moved to the receiving station, the vertical driving members 502 drive the horizontal driving members 503 to move downward in the third direction Z until the pushing members 504 are located on the left side of the strip in the first direction X, and then the horizontal driving members 503 drive the pushing members 504 to move the chip strip out of the conveying assembly 2 from the receiving station, so that the chip strip can be moved out of the conveying assembly 2 more horizontally, facilitating subsequent receiving by the unloading assembly, and avoiding damage to the chip strip. After the pushing members 504 are pushed, the horizontal driving members 503 drive the pushing members 504 to retract to the left, and the vertical driving members 502 drive the horizontal driving members 503 to move upward in the third direction Z, facilitating movement of another chip strip from the detection station to the receiving station.

[0140] The vertical driving members 502 and the horizontal driving members 503 are driven by air cylinders, and can also be driven by other driving modes.

[0141] The receiving assembly 5 can also be other assembly capable of moving the chip strip out of the conveying assembly 2 from the receiving station.

[0142] The working process of the semiconductor optical detection device is as follows: a plurality of chip strips are moved from the feeding stations to the code reading stations on the corresponding conveying assemblies 2, the code reading assembly 3 reads the codes of the chip strips on the code reading stations, after the code reading is completed, the conveying assemblies 2 move the chip strips from the code reading stations to the detection stations, the detection stations of the plurality of conveying assemblies 2 are sequentially distributed in the second direction, the entire device has a plurality of detection stations, the detector 402 of the detector assembly 4 moves the detection Y-axis moving module 401 in the second direction, and after the detection of the chip strip on the detection station of the previous conveying assembly 2 is completed, the detector 402 can move to above the detection station of the next conveying assembly 2 in the second direction to detect the chip strip. After the detection of the chip strip is completed, the conveying assemblies 2 move the chip strips from the detection stations to the receiving stations, and the receiving assemblies move the chip strips out of the conveying assemblies 2 from the receiving stations, until all the chip strips are moved out of the conveying assemblies 2.

[0143] In summary, the semiconductor optical detection device provided by the embodiment of the present application can improve the detection efficiency of the chip strip.

[0144] The above description is only preferred embodiments of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present application.

Claims

1. A semiconductor optical detection device, characterized by, The utility model relates to a chip strip detection device and method, including: a detection workbench is provided with a plurality of conveying assemblies arranged in sequence along the second direction, the conveying assembly extends along the first direction, the conveying assembly is sequentially provided with a feeding station, a code reading station, a detection station and a material collecting station along the first direction, the conveying assembly is used for moving the chip strip from the feeding station to the code reading station, the detection station and the material collecting station in sequence, and the detection stations of the plurality of conveying assemblies are sequentially distributed in the second direction; the detection workbench is sequentially provided with a code reading assembly, a detector assembly and a material collecting assembly along the first direction; the code reading assembly is used for reading the code of the chip strip on the code reading station; the detector assembly includes a detection Y-axis moving module and a detector, the detection Y-axis moving module extends along the second direction and is arranged above the plurality of conveying assemblies, the detection Y-axis moving module is installed on the detection workbench, and the detector is slidingly installed on the detection Y-axis moving module and can move above the detection stations of the plurality of conveying assemblies along the second direction; the material collecting assembly is used for moving the chip strip out of the conveying assembly from the material collecting station; wherein the first direction and the second direction are perpendicular to each other.

2. The semiconductor optical detection device according to claim 1, characterized by a detection X-axis moving module is installed on the detection Y-axis moving module, the detection X-axis moving module extends along the first direction, one end of the detection X-axis moving module is slidingly installed on the detection Y-axis moving module, and the detector is slidingly installed on the detection X-axis moving module.

3. The semiconductor optical detection device of claim 2, wherein a detection Z-axis moving module is installed on the detection X-axis moving module, the detection Z-axis moving module extends along the third direction and is slidingly installed on the detection X-axis moving module, and the detector is slidingly installed on the detection Z-axis moving module; wherein the first direction, the second direction and the third direction are perpendicular to each other.

4. The semiconductor optical detection device of claim 1, wherein a plurality of detection stations are arranged in sequence along the first direction between the code reading station and the material collecting station of the conveying assembly, and each detection station is provided with one detector assembly; the conveying assembly is used for moving the chip strip from the feeding station to the code reading station, the plurality of detection stations and the material collecting station in sequence along the first direction.

5. The semiconductor optical detection device of claim 4, wherein two detector assemblies are arranged in sequence along the first direction between the code reading assembly and the material collecting assembly on the detection workbench, and two detection stations are arranged in sequence along the first direction between the code reading station and the material collecting station of the conveying assembly. a follow-up Y-axis moving piece is arranged between the two detection Y-axis moving modules along the first direction on the detection workbench, the follow-up Y-axis moving piece extends along the second direction and is arranged above the plurality of conveying assemblies, and the follow-up Y-axis moving piece is installed on the detection workbench; two Y-axis moving tracks extending along the second direction are arranged on the follow-up Y-axis moving piece, the two Y-axis moving tracks are arranged in sequence along the first direction and are parallel to each other, the two Y-axis moving tracks are arranged on the follow-up Y-axis moving piece near one side of the two detection Y-axis moving modules respectively, and a sliding block is arranged on the Y-axis moving track; The detection X-axis moving module is installed on the detection Y-axis moving module and extends along a first direction, and two ends of the detection X-axis moving module are respectively installed on a slider of the detection Y-axis moving module and a corresponding Y-axis moving track.

6. The semiconductor optical detection device of claim 1, wherein The conveying assembly comprises a support assembly and a conveying track; The support assembly extends along the first direction, and the support assembly is sequentially provided with the feeding station, the code reading station, the detection station and the collecting station along the first direction. The conveying track and the support assembly are correspondingly arranged in parallel, the conveying track is provided with a clamping piece sliding along the conveying track, and the clamping piece is used to clamp the chip strip on the support assembly to move along the first direction from the feeding station to the code reading station, the detection station and the collecting station in sequence.

7. The semiconductor optical detection device of claim 6, wherein The support assembly is sequentially provided with the feeding station, the code reading station, a plurality of detection stations and the collecting station along the first direction. The clamping piece is provided with two clamping pieces, both of which are installed on the conveying track and slide along the conveying track.

8. The semiconductor optical detection device of claim 6, wherein The clamping piece comprises: an upper clamping jaw; a linear motor installed on the conveying track and capable of sliding along the conveying track; a loss-preventing guide rail installed on the top of the linear motor; a fixed block installed on the top of the linear motor and located on one side of the loss-preventing guide rail in the first direction; a sliding block installed on the loss-preventing guide rail and capable of sliding along the loss-preventing guide rail; a lower clamping jaw installed on the sliding block and having a height level with that of the support assembly; a driving piece installed on the sliding block, connected with the upper clamping jaw and the lower clamping jaw, and used to drive the upper clamping jaw to move towards or away from the lower clamping jaw; a tension sensor installed between the sliding block and the fixed block, both ends of the tension sensor being connected with the sliding block and the fixed block respectively, and the tension sensor being electrically connected with the linear motor.

9. The semiconductor optical detection device of claim 1, wherein The code reading stations of a plurality of the conveying assemblies are sequentially distributed in the second direction. The code reading assembly comprises: a code reading moving module extending along the second direction and arranged above a plurality of the conveying assemblies, the code reading moving module being installed on the detection workbench; a code reader slidingly installed on the code reading moving module and capable of moving above the code reading stations of a plurality of the conveying assemblies along the second direction.

10. The semiconductor optical detection device of claim 1, wherein The receiving stations of the plurality of conveying assemblies are sequentially arranged in the second direction; The receiving assembly comprises a receiving support and a plurality of vertical driving members; The receiving support extends along the second direction and is mounted on the detection workbench; The plurality of vertical driving members are sequentially arranged on the receiving support along the second direction, and the plurality of vertical driving members correspond to the plurality of conveying assemblies one by one in the first direction. The vertical driving members extend along the third direction, and a horizontal driving member is mounted on each vertical driving member. The vertical driving member is configured to drive the horizontal driving member to move along the vertical driving member. A pushing member is mounted on the horizontal driving member, and the horizontal driving member is configured to drive the pushing member to move along the first direction. The pushing member is configured to move the chip strip of the receiving station of the corresponding conveying assembly out of the conveying assembly.

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