Semiconductor device with heating structure

Abstract

The utility model relates to the technical field of semiconductor manufacturing process, and discloses a semiconductor device with a heating structure, which comprises a main chamber structure, a second adapter, a first adapter and a source electrode shell, and an installation mechanism is arranged between the source electrode shell and the first adapter. The mounting mechanism comprises a sealing ring fixedly arranged on the first adapter, and two rotary clamping grooves are formed in the sealing ring. The moving block is shifted downwards through the shifting block, so that the inserting block is separated from the inserting groove, the shifting block can be loosened after the overturning handle is overturned to the position away from the fixed block, then the source electrode shell is rotated anticlockwise, so that the clamping block slides to the entrance and exit of the rotary clamping groove, and then the source electrode shell is separated from the first adapter. According to the utility model, the source shell can be conveniently and rapidly disassembled, so that when particle collimators or source shells of different sizes need to be replaced, an operator can conveniently and rapidly complete the replacement work, and the whole equipment does not need to be subjected to large-scale adjustment.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing process, concretely to a semiconductor equipment with heating structure. BACKGROUND

[0002] In the semiconductor manufacturing process, physical vapor deposition technology is widely used to form a metal connection layer. By particle collimator can constrain the movement of sputtering particles, improve the collimation of particles, and thus improve the step coverage in high aspect ratio structure. Particle collimator may adsorb some gas or impurities during use, pollute the vacuum environment of the cavity, affect the purity and stability of the deposition process, and cause the performance of the semiconductor device to decline and reliability problems. In order to reduce the pollution of particle collimator to the cavity vacuum, the particle collimator needs to be heated to release gas.

[0003] Chinese patent provides a semiconductor equipment with heating structure, the publication number is CN221645035U, including particle collimator, first heating structure and first adapter, wherein the particle collimator is internally provided with collimating hole for particle beam to pass through. The first heating structure is located on the outer circumferential side of the particle collimator, and the first heating structure is used for heating and releasing gas to the particle collimator. The first adapter is used for sleeving on the outer circumferential side of the particle collimator, and the first adapter is covered on the first heating structure. By sleeving the first adapter on the outer circumferential side of the particle collimator, the first heating structure is covered on the first heating structure, and the particle collimator is directly and effectively baked by the first heating structure, thereby improving the effect and safety of the heating process of the particle collimator. Through the first adapter, the particle collimator and the surrounding parts can be maintained and replaced without disassembling the heating lamp.

[0004] But the first adapter and the source shell are connected only by the connection mode of embedded splicing, which is too simple, lacks locking structure, and the connection stability of the first adapter and the source shell is poor, and gas leakage is easy to occur, therefore, a semiconductor equipment with heating structure needs to be provided. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a semiconductor equipment with heating structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: A semiconductor equipment with heating structure, including main chamber structure, second adapter, first adapter and source shell, installation mechanism is provided between the source shell and the first adapter, the installation mechanism includes the sealing ring fixedly arranged on the first adapter, two rotary clamping grooves are opened on the sealing ring, the both ends of the sealing ring are fixedly arranged with fixed block, the bottom of the fixed block is opened with the insertion slot, the both ends of the source shell are fixedly arranged with two clamping blocks matched with the rotary clamping groove, the clamping block and the rotary clamping groove are slidably clamped, the both ends of the source shell are fixedly arranged with the mounting block above the clamping block, one end of the mounting block is fixedly arranged with the rotating shaft, the rotating shaft is rotatably sleeved with the turnover handle, the inner side of the turnover handle is fixedly arranged with two slide rails, the slide rail is fixedly arranged with the sliding rod, the sliding rod is slidably sleeved with the sliding block slidably connected with the slide rail, the both ends of the sliding block are fixedly arranged with the moving block, the sliding rod is sleeved with the spring fixedly arranged between the sliding block and the slide rail, the moving block is fixedly arranged with the insertion block, the insertion block and the insertion slot are insertedly connected, the outer side of the moving block is fixedly arranged with the knob.

[0007] Preferably, the sealing ring is made of silicon carbide, and the source shell and the sealing ring are in sealing sliding connection.

[0008] Preferably, the main chamber structure is provided with a main chamber, and the main chamber is provided with a heating structure.

[0009] Preferably, the second adapter is arranged on the top of the main chamber structure, and the first adapter is arranged on the top of the second adapter.

[0010] Preferably, the first adapter is provided with a particle collimator, the particle collimator is internally provided with a collimating hole through which a particle beam can pass, and the first adapter is arranged on the outer circumferential side of the particle collimator.

[0011] Preferably, the first adapter is provided with a heating lamp below the particle collimator, and the heating lamp is used for heating the particle collimator.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1) The semiconductor equipment with the heating structure, by knob the moving block is downwardly knobed, makes the insertion block separate from the insertion slot, after the turnover handle is turned over to the position far from the fixed block, the knob can be released, then the source shell is counterclockwise rotated, the clamping block is slid to the entrance and exit of the rotary clamping groove, then the source shell and the first adapter are separated, the source shell can be quickly disassembled, so that when the particle collimator or the source shell of different sizes needs to be replaced, the operator can quickly complete the replacement work without large-scale adjustment of the whole equipment.

[0014] 2) the semiconductor equipment with heating structure, through the card block is inserted from the rotary card slot entrance, then the source shell is rotated clockwise, the card block is along the rotary card slot and is clamped, and the preliminary fixation of the source shell is completed, at this time, the turning handle is on the same vertical line with the fixed block, then the moving block is slid to the end away from the mounting block through the poking block, the sliding block is along the surface of the sliding rod in the slide rail and is extruded spring, then the turning handle is turned to the fixed block through the rotating shaft, the plug block is aligned with the plug slot on the fixed block, then the poking block is loosened, the moving block is reset under the rebound of the spring, and then the plug block on the moving block can be automatically inserted into the plug slot, the locking and fixation of the source shell are realized, and the source shell and the first adapter are quickly installed. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a perspective structural schematic view of the semiconductor equipment with heating structure in the embodiment of the utility model;

[0016] Figure 2 It is a separation structure schematic view of the source shell and the first adapter in the embodiment of the utility model;

[0017] Figure 3 It is a sectional structure schematic view of the main cavity structure, the second adapter and the first adapter in the embodiment of the utility model;

[0018] Figure 4 It is a sectional structure schematic view of the sealing ring in the embodiment of the utility model;

[0019] Figure 5 It is a sectional structure schematic view of the source shell in the embodiment of the utility model;

[0020] Figure 6 It is the structure explosion map of the turning handle in the embodiment of the utility model.

[0021] In the drawing: 1, main cavity structure; 101, main cavity; 102, heating structure;

[0022] 2, second adapter;

[0023] 3, first adapter; 301, particle collimator; 302, collimating hole; 303, heating lamp;

[0024] 4, source shell;

[0025] 5, mounting mechanism; 501, sealing ring; 502, rotating clamping groove; 503, fixed block; 504, slot; 505, clamping block; 506, mounting block; 507, rotating shaft; 508, turnover handle; 509, slide rail; 510, slide rod; 511, spring; 512, moving block; 513, sliding block; 514, insertion block; 515, knob. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0027] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixing" and the like should be broadly understood, for example, "fixing" can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise explicitly limited. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] Embodiment one

[0029] In combination Figures 1-6 A semiconductor device with a heating structure, comprising a main chamber structure 1, a second adapter 2, a first adapter 3 and a source shell 4, a main chamber 101 is arranged in the main chamber structure 1, a heating structure 102 is arranged in the main chamber 101, the second adapter 2 is arranged at the top of the main chamber structure 1, the first adapter 3 is arranged at the top of the second adapter 2, a particle collimator 301 is arranged in the first adapter 3, the particle collimator 301 is internally provided with a collimating hole 302 through which a particle beam can pass, the first adapter 3 is used to be sleeved on the outer circumferential side of the particle collimator 301, a heating lamp 303 is arranged below the particle collimator 301 in the first adapter 3, the heating lamp 303 is used to heat the particle collimator 301, and the source shell 4 and the first adapter 3 are provided with a mounting mechanism 5.

[0030] Referring to Figures 2-6, further get, installation mechanism 5 includes fixedly arranged on the first adapter 3 sealing ring 501, sealing ring 501 is made of silicon carbide, source shell 4 and sealing ring 501 sealing sliding connection, sealing ring 501 is provided with two rotating clamping groove 502, the both ends of sealing ring 501 are fixedly provided with fixed block 503, the bottom of fixed block 503 is provided with slot 504;Two ends of source shell 4 are fixedly provided with two clamping blocks 505 adapted with rotating clamping groove 502, clamping block 505 and rotating clamping groove 502 are slidingly engaged, two ends of source shell 4 and located above clamping block 505 are fixedly provided with mounting block 506, one end of mounting block 506 is fixedly provided with rotating shaft 507, rotating shaft 507 is rotatably provided with turnover handle 508;Two slide rails 509 are fixedly arranged on the inner side of turnover handle 508, slide rail 509 is fixedly provided with slide rod 510, slide rod 510 is slidingly provided with sliding block 513 connected with slide rail 509, two sliding blocks 513 are fixedly provided with moving block 512, spring 511 is provided on the slide rod 510 and fixedly arranged between sliding block 513 and slide rail 509, moving block 512 is fixedly provided with insertion block 514, insertion block 514 is insertedly connected with slot 504, and the outer side of moving block 512 is fixedly provided with actuating block 515.

[0031] Specifically, by inserting clamping block 505 from the entrance of rotating clamping groove 502, then rotating source shell 4 clockwise, clamping block 505 is slid along rotating clamping groove 502 and engaged with it, the preliminary fixation of source shell 4 is completed, at this time, turnover handle 508 is on the same vertical line with fixed block 503, then by actuating block 515, moving block 512 is slid away from one end of mounting block 506, at the same time, sliding block 513 is slid along the surface of slide rod 510 in slide rail 509 and presses spring, then by rotating shaft 507, turnover handle 508 is turned to adhere to fixed block 503, insertion block 514 is aligned with slot 504 on fixed block 503, then actuating block 515 is released, moving block 512 is reset under the rebound of spring 511, then insertion block 514 on moving block 512 can be automatically inserted into slot 504, the locking and fixation of source shell 4 is realized, which is convenient for quick installation of source shell 4 and first adapter 3;

[0032] By actuating block 515, moving block 512 is actuated downward, insertion block 514 is separated from slot 504, after turning over handle 508 is turned away from fixed block 503, actuating block 515 can be released, then by rotating source shell 4 counterclockwise, clamping block 505 is slid to the entrance of rotating clamping groove 502, then source shell 4 is separated from first adapter 3, which is convenient for quick disassembly of source shell 4, so that when different sizes of particle collimator or source shell 4 need to be replaced, the operator can quickly complete the replacement work without large-scale adjustment of the whole equipment.

[0033] In actual operation, the source shell 4 is sleeved on the sealing ring 501 on the first adapter 3, the clamping block 505 on the source shell 4 is inserted from the entrance of the rotating clamping groove 502 on the sealing ring 501, then the source shell 4 is rotated clockwise, the clamping block 505 is slid along the rotating clamping groove 502 and clamped with the rotating clamping groove 502, the preliminary fixation of the source shell 4 is completed, at this time the turnover handle 508 is on the same vertical line with the fixed block 503, then the moving block 512 is slid away from the one end of the mounting block 506 by the knob 515, the sliding block 513 is slid along the surface of the slide rod 510 in the slide rail 509 and presses the spring, then the turnover handle 508 is turned over to be attached to the fixed block 503 by the rotating shaft 507, the insertion block 514 is aligned with the insertion slot 504 on the fixed block 503, then the knob 515 is released, the moving block 512 is reset and moved under the rebounding action of the spring 511, then the insertion block 514 on the moving block 512 can be automatically inserted into the insertion slot 504, the locking and fixation of the source shell 4 are realized, the quick installation of the source shell 4 and the first adapter 3 is completed, the source shell 4 and the sealing ring 501 are in plug-in sealing connection, the sealing property of the equipment is effectively improved, and gas leakage is prevented.

[0034] The moving block 512 is downwardly pushed by the knob 515, the insertion block 514 is separated from the insertion slot 504, the knob 515 can be released after the turnover handle 508 is turned over to be away from the fixed block 503, then the source shell 4 is counterclockwise rotated, the clamping block 505 is slid to the entrance of the rotating clamping groove 502, then the source shell 4 is separated from the first adapter 3, the quick disassembly of the source shell 4 is completed, and then the maintenance and replacement of the parts in the equipment are facilitated.

[0035] Of course, the above only describes the preferred embodiments of the present application, and does not limit the patent range of the present application, any equivalent structural transformation made according to the contents of the present application and the drawings, or direct / indirect application in other related technical fields is included in the patent protection range of the present application, and should be protected by the present application.

Claims

1. A semiconductor device with a heating structure, comprising a main chamber structure (1), a second adapter (2), a first adapter (3) and a source housing (4), characterized in that: The mounting mechanism (5) is arranged between the source shell (4) and the first adapter (3). The mounting mechanism (5) comprises a sealing ring (501) fixedly arranged on the first adapter (3), two rotating clamping grooves (502) are arranged on the sealing ring (501), and fixed blocks (503) are fixedly arranged at both ends of the sealing ring (501). Both ends of the source shell (4) are fixedly provided with two clamping blocks (505) matched with the rotating clamping grooves (502), the clamping blocks (505) are slidably clamped with the rotating clamping grooves (502), and mounting blocks (506) are fixedly arranged at both ends of the source shell (4) and above the clamping blocks (505). The rotating shaft (507) is rotatably sleeved with a turnover handle (508).

2. The semiconductor device having a heating structure according to claim 1, wherein: The inner side of the turnover handle (508) is fixedly provided with two sliding rails (509), the sliding rails (509) are fixedly provided with sliding rods (510) inside, the sliding rods (510) are slidably sleeved with sliding blocks (513) slidably connected with the sliding rails (509), and moving blocks (512) are fixedly arranged between the two sliding blocks (513).

3. The semiconductor device having a heating structure according to claim 1, wherein: The sliding rods (510) are sleeved with springs (511) fixedly arranged between the sliding blocks (513) and the sliding rails (509), the moving blocks (512) are fixedly provided with insertion blocks (514), the insertion blocks (514) are insertedly connected with the insertion grooves (504), and the outer side of the moving blocks (512) is fixedly provided with a knob (515).

4. The semiconductor device having a heating structure according to claim 3, wherein: The sealing ring (501) is made of silicon carbide, and the source shell (4) is in sealing and sliding connection with the sealing ring (501).

5. The semiconductor device having a heating structure according to claim 4, wherein: The main cavity structure (1) is provided with a main cavity (101), and the main cavity (101) is provided with a heating structure (102).

6. The semiconductor device having a heating structure according to claim 1, wherein: The second adapter (2) is arranged at the top of the main cavity structure (1), and the first adapter (3) is arranged at the top of the second adapter (2). The first adapter (3) is provided with a particle collimator (301), the particle collimator (301) is internally provided with a collimating hole (302) through which a particle beam passes, and the first adapter (3) is arranged on the outer periphery of the particle collimator (301). The first adapter (3) is provided with a heating lamp (303) below the particle collimator (301), and the heating lamp (303) is used for heating the particle collimator (301).

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