Wafer hanger electrode plugging reliability device
By adopting a sheet-like structure for the mounting electrodes and electrode connectors, the problem of poor contact caused by bending deviation and socket deformation of the wafer mounting electrodes is solved, achieving more stable conductive contact and longer socket life, thus improving equipment safety.
Patent Information
- Application Number
- CN202520312300.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-02-26
AI Technical Summary
Existing wafer mount electrodes suffer from poor contact due to bending deviations and deformation of the M-shaped sockets, resulting in metal debris and accelerated socket wear, requiring frequent replacement.
The mounting electrodes and electrode connectors, which adopt a sheet-like structure, are connected in the same vertical plane by interference fit to avoid deformation and ensure face-to-face contact. A nickel-gold layer is electroplated at the contact point to improve conductivity and corrosion resistance.
It improves the reliability of conductive contact, reduces poor contact and metal debris generation, extends the service life of the socket, reduces heat generation and resistance, and enhances equipment safety performance.
Smart Images
Figure CN223906988U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of electroplating especially relates to a wafer hanger electrode connector reliability device. BACKGROUND
[0002] Electroplating, as the name implies, needs to be powered on, and the workpiece surface is treated with metal plating. For safety considerations, the voltage is set within the range of personal safety, and the current is set to be relatively large. In the wafer product electroplating equipment, the wafer is placed in the electroplating tank liquid through the wafer hanger, and the wafer hanger is operated by the electroplating process.
[0003] Figure 1 For the wafer hanger in the prior art, the hanger electrode is in a bent shape and is installed on the side of the hanger with a cover and connected with the socket. However, the electrode bending may have deviations, the M-shaped socket bending may be deformed, the electrode and the socket may not be in an ideal state of facing and connecting, but may be in single-wire contact or single-point contact, forming a poor contact phenomenon, and after deformation, the electrode and the socket are connected obliquely, not only generating metal debris, but also accelerating the wear and replacement frequency of the socket. In order to solve the above phenomenon in the prior art, the electrode plate is usually thickened to increase the contact area of the electrode and the socket, but simply thickening the electrode plate or the connector has more disadvantages: thickening the electrode plate may deform the connector; thickening the connector may reduce the elasticity and cannot rebound, which may also cause poor contact. Therefore, there is an urgent need for a wafer hanger electrode connector reliability device. SUMMARY
[0004] In order to solve the problems of the electrode bending deviation, the M-shaped socket bending deformation leading to poor contact, and the electrode and the socket being connected obliquely after deformation, generating metal debris, and accelerating the wear and replacement frequency of the socket in the prior art, the utility model provides a wafer hanger electrode connector reliability device;
[0005] The wafer hanger electrode connector reliability device provided by the utility model adopts the following technical scheme:
[0006] A wafer hanger electrode connector reliability device, comprising a wafer hanger body, a hanger electrode, and an electrode connector, the hanger electrode is in a sheet structure, the hanger electrode is fixedly connected to the side wall of the wafer hanger body and is in the same vertical plane as the wafer hanger body, and the wafer hanger body is detachably connected to the electrode connector through the hanger electrode.
[0007] Further, the hanger electrode is an L-shaped electrode sheet, the electrode connector is an M-shaped socket, and the hanger electrode is inserted into the inside of the electrode connector through interference fit and the connection direction is parallel to the wafer hanger body.
[0008] Further, the hanger electrode and the electrode connector are both in a multi-piece structure and correspond to each other.
[0009] Further, the electrode connector is plated with a nickel layer on the surface and plated with a gold layer at the position in contact with the electrode connector.
[0010] Further, the end section of the hanger electrode in contact with the electrode connector is triangular.
[0011] Further, the material of the hanger electrode is copper or titanium.
[0012] In summary, the utility model has the beneficial effects that:
[0013] The utility model discloses a hanger electrode is changed to the back side, is not bent, reduces the bending processing deviation, makes the processing assembly deviation fault tolerance improvement, and the conductive contact reliability is doubled and promotes.Through setting up the hanger electrode of sheet structure and changing the connection position and direction of hanger electrode and electrode connector, the poor contact caused by deformation is avoided, the hanger electrode and electrode connector form face-to-face contact, and the contact is good and does not produce metal scrap, and the socket is less damaged and does not need frequent replacement, and simultaneously, the good contact of hanger electrode and electrode connector makes the resistance value of the connected part not be big, the heat quantity is small, the heat of circuit is greatly reduced, and the use safety performance of equipment rises. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the electrode and socket schematic view in the prior art of the utility model;
[0015] Figure 2 It is the front view structure schematic view of the utility model;
[0016] Figure 3 It is the front view structure schematic view of the utility model;
[0017] Figure 4 It is the A structure amplification schematic view in the utility model; Figure 2
[0018] Figure 5 It is the hanger electrode structure schematic view of the utility model.
[0019] As shown in the drawing: 1-wafer hanger body, 2-hanger electrode, 3-electrode connector. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings of the utility model to make a further detailed description: Figure 2 - the drawings of the utility model Figure 5 The utility model will be further described in detail as follows:
[0021] The utility model embodiment discloses a wafer hanger electrode connector reliability device, which comprises a wafer hanger body, a hanger electrode and an electrode connector. Figure 2 ,Figure 3 As shown, this utility model discloses a wafer mount electrode connection reliability device, comprising a wafer mount body 1, mount electrodes 2, and electrode connectors 3. The mount electrodes 2 are sheet-like structures, fixedly connected to the side wall of the wafer mount body 1 and located in the same vertical plane as the wafer mount body 1. The wafer mount body 1 is detachably connected to the electrode connectors 3 via the mount electrodes 2. In this embodiment, the mount electrodes 2 are sheet-like structures, and their positions and orientations are as follows... Figure 1 As shown, the mounting electrode 2 and the wafer mounting body 1 are in the same vertical plane; by moving the mounting electrode 2 to the rear side without bending, the bending processing deviation is reduced, which improves the tolerance to processing and assembly deviations and increases the reliability of conductive contact by a factor of two. It is worth noting that in the prior art, the electrodes, because they are located on the covered side of the mounting bracket, exert a force on the M-shaped joint of the socket under the action of gravity, causing deformation of the electrodes and socket. This transforms the face-to-face contact between the electrodes and socket into a single-line contact or a single-point contact, resulting in poor contact. In this embodiment, the mounting electrode 2 is located on the side wall of the wafer mounting bracket body 1 and is in the same vertical plane as the wafer mounting bracket body 1. This changes the direction of the force, avoiding the deformation of the mounting electrode 2 and electrode connector 3 caused by this, reducing poor contact due to deformation. Furthermore, the mounting electrode 2 and electrode connector 3 form a face-to-face contact, resulting in good contact without the generation of metal debris. This reduces socket damage and the need for frequent replacement. At the same time, the good contact between the mounting electrode 2 and electrode connector 3 prevents the resistance value of the connected part from increasing, resulting in less heat generation and a significant reduction in the heat generated by the circuit, thus improving the safety performance of the equipment.
[0022] like Figure 3 , Figure 4 As shown, the mounting electrode 2 is an L-shaped electrode sheet, and the electrode connector 3 is an M-shaped socket. The mounting electrode 2 is inserted into the electrode connector 3 through an interference fit, and the connection direction is parallel to the wafer mounting body 1. In this embodiment, the electrode connector 3 is an M-shaped socket, and the shape of the mounting electrode 2 is as follows: Figure 3As shown, the hanger electrode 2 is L-shaped, one end of which is fixedly connected to the sidewall of the wafer hanger body 1, and the other end is bent downward and inserted into the inside of the electrode connector 3. When connected, the hanger electrode 2 and the wafer hanger body generate a force on the socket under the action of gravity, and the direction of the force is downward, which does not cause the deformation of the electrode connector 3. By setting the hanger electrode 2 in a sheet structure and changing the connection method of the hanger electrode 2 and the electrode connector 3, the electrode connector 3 does not deform, avoiding the situation that the hanger electrode 2 and the electrode connector 3 are obliquely connected due to deformation, metal debris is generated, and wear is accelerated. Preferably, the hanger electrode 2 and the electrode connector 3 are both multi-piece structures and correspond to each other; the hanger electrode 2 and the electrode connector 3 are both multi-piece structures, which increases the contact area and further improves the stability and reliability of the connection. Preferably, the surface of the electrode connector 3 is plated with a nickel layer and the position in contact with the electrode connector 3 is plated with a gold layer; not only improves the conductivity and corrosion resistance, reduces the contact resistance, ensures the stability of signal transmission, but also effectively prevents oxidation and corrosion, prolongs the service life of the device. Preferably, the end portion in contact with the electrode connector 3 of the hanger electrode 2 is triangular in cross section; it is convenient to align and plug, and simplifies the operation process. Preferably, the material of the hanger electrode 2 is copper or titanium; the hanger electrode 2 is made of copper or titanium, which has good conductivity and corrosion resistance, and ensures the stability and efficiency of current transmission.
[0023] The basic principle and main features of the present application and the advantages of the present application are shown and described above. The components mentioned in the present application are common techniques in the existing field, which should be understood by the technicians in the industry. The present application is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principle of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A wafer-hanger electrode connector reliability device comprising a wafer-hanger body (1), a hanger electrode (2) and an electrode connector (3), characterized in that: The hanger electrode (2) is a sheet structure, and is fixedly connected to the sidewall of the wafer hanger body (1) and in the same vertical plane with the wafer hanger body (1), and the wafer hanger body (1) is detachably connected to the electrode connector (3) through the hanger electrode (2).
2. The wafer-hanger electrode-connector reliability apparatus of claim 1, wherein: The hanger electrode (2) is an L-shaped electrode sheet, and the electrode connector (3) is an M-shaped socket, and the hanger electrode (2) is inserted into the interior of the electrode connector (3) through interference fit and the connection direction is parallel to the wafer hanger body (1).
3. The wafer hanger electrode connector reliability apparatus of claim 2, wherein: The hanger electrode (2) and the electrode connector (3) are both multi-sheet structures and correspond to each other.
4. The wafer hanger electrode connector reliability apparatus of claim 3, wherein: The surface of the electrode connector (3) is electroplated with a nickel layer, and the position in contact with the electrode connector (3) is electroplated with a gold layer.
5. The wafer hanger electrode connector reliability apparatus of claim 1, wherein: The end section in contact with the electrode connector (3) of the hanger electrode (2) is triangular.
6. The wafer hanger electrode connector reliability apparatus of claim 1, wherein: The material of the hanger electrode (2) is copper or titanium.