Electronic tag assembly

By incorporating an outer packaging layer and strip packaging material into the tire electronic tag design, the problems of positioning and counting of electronic tags in automated production were solved, achieving unified packaging and efficient production.

CN223911263UActive Publication Date: 2026-02-13QINGDAO HIGHWAY IOT TECH CO LTD
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Patent Information

Application Number
CN202520595704.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-02-13
Estimated Expiration
2035-03-31

AI Technical Summary

Technical Problem

Existing tire electronic tags are arbitrary in their packaging methods and cannot meet the positioning and counting requirements of automated production processes.

Method used

Multiple electronic tags are wrapped together in an outer packaging layer. Layered strip packaging materials form a space to accommodate RFID chips and PCB board antennas. Positioning holes and grooves are provided for positioning and fixing. Paper or plastic packaging materials are used and fixed by adhesive or thermoplastic bonding.

Benefits of technology

It enables unified packaging of electronic tags, facilitating positioning and counting in automated production processes and improving production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an electronic tag assembly. The electronic tag assembly comprises a plurality of electronic tags and an outer packaging layer, wherein each electronic tag assembly comprises an RFID (Radio Frequency Identification) chip and a PCB (Printed Circuit Board) card antenna which is fixedly connected with the RFID chip; wherein the number of the PCB card antennas is two, and the two PCB card antennas are respectively arranged on two opposite sides of the RFID chip; the outer packaging layer comprises a first strip-shaped packaging material and a second strip-shaped packaging material which are stacked; an accommodating space is formed between the first strip-shaped packing material and the second strip-shaped packing material; and at least one of the RFID chip and the PCB card antenna is accommodated in the accommodating space. According to the technical scheme, the electronic tag assemblies are uniformly wrapped by the outer packaging layer, so that the electronic tag assemblies are packaged consistently, positioning and position state requirements in the subsequent automatic production process are facilitated, and meanwhile delivery and counting are facilitated.
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Description

TECHNICAL FIELD

[0001] The present application relates to the tire technical field, and particularly relates to an electronic tag assembly. BACKGROUND

[0002] In the production of a conventional tire tread, a vulcanized electronic tag assembly is the only identity information of a tire in a tire flow process, but with the continuous promotion of the intelligent manufacturing concept and the continuous improvement of the automation level in the tire industry, RFID (Radio Frequency Identification) electronic tags for tires are about to be widely used. However, the current electronic tags are packaged in a relatively arbitrary manner and cannot be applied to an automatic production process. SUMMARY

[0003] The utility model of the present application aims to provide an electronic tag assembly for facilitating application in an automatic production process.

[0004] In a first aspect, an electronic tag assembly is provided, comprising: a plurality of electronic tags and an outer packaging layer; wherein,

[0005] Each electronic tag comprises an RFID chip and a PCB card antenna fixedly connected to the RFID chip; wherein, the number of the PCB card antennas is two and arranged on opposite sides of the RFID chip;

[0006] The outer packaging layer comprises a first strip-shaped packaging material and a second strip-shaped packaging material; and a containing space is formed between the first strip-shaped packaging material and the second strip-shaped packaging material;

[0007] The containing space contains at least one component of the RFID chip and the PCB card antenna.

[0008] In the above technical solution, the plurality of electronic tags are uniformly packaged by the outer packaging layer, so that the electronic tags are packaged uniformly, facilitating positioning, position state requirements in the subsequent automatic production process, and facilitating delivery and counting.

[0009] In a specific implementable embodiment, the containing space contains only a plurality of the RFID chips.

[0010] In a specific implementable embodiment, the number of the first strip-shaped packaging material and the second strip-shaped packaging material is three.

[0011] The containing space formed by one of the first strip-shaped packaging material and the corresponding second strip-shaped packaging material contains only the PCB card antennas on the same side of the plurality of electronic tags.

[0012] Another accommodating space formed by one of the first strip packaging materials and the corresponding second strip packaging material accommodates the PCB plate antenna on the other side of the electronic tags.

[0013] A third accommodating space formed by one of the first strip packaging materials and the corresponding second strip packaging material accommodates the RFID chip in the electronic tags.

[0014] In a specific embodiment, at least one of the first strip packaging material and the second strip packaging material is provided with a groove for accommodating the RFID chip.

[0015] In a specific embodiment, the first strip packaging material and the second strip packaging material are provided with a plurality of positioning holes, and the plurality of positioning holes are located on the same side of the groove, and the plurality of positioning holes and the plurality of PCB plate antennas are arranged alternately.

[0016] In a specific embodiment, the material of the first strip packaging material and the second strip packaging material is paper or plastic.

[0017] In a specific embodiment, when the first strip packaging material and the second strip packaging material are paper, the first strip packaging material and the second strip packaging material are bonded; or,

[0018] When the first strip packaging material and the second strip packaging material are both plastic, the first strip packaging material and the second strip packaging material are thermoplastically fixed.

[0019] In a specific embodiment, the end of the length direction of the first strip packaging material is arranged in a staggered manner with the end of the length direction of the second strip packaging material.

[0020] In a specific embodiment, the plurality of electronic tags are arranged in a single row and are uniformly arranged.

[0021] In a specific embodiment, the number of the first strip packaging material and the second strip packaging material is two; and one of the first strip packaging material and the corresponding second strip packaging material forms an accommodating space which accommodates the PCB plate antenna on the same side of the electronic tags.

[0022] Another accommodating space formed by one of the first strip packaging materials and the corresponding second strip packaging material accommodates the PCB plate antenna on the other side of the electronic tags. BRIEF DESCRIPTION OF DRAWINGS

[0023] In the drawings, like reference numerals refer to same or similar components throughout the several views. The drawings are not necessarily to scale. It should be understood that the drawings are merely schematic representations, which are presented for the purpose of understanding only, and are not intended to limit the scope of the present disclosure.

[0024] Figure 1 A structural schematic diagram of an electronic tag assembly provided by an embodiment of the present application is shown in the figure.

[0025] Figure 2 A structural schematic diagram of an electronic tag provided by an embodiment of the present application is shown in the figure.

[0026] Figure 3 A structural schematic diagram of another electronic tag assembly provided by an embodiment of the present application is shown in the figure.

[0027] Figure 4 A structural schematic diagram of another electronic tag assembly provided by an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0028] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0029] It should be noted that, unless otherwise defined, technical terms or scientific terms used in one or more embodiments of the present application should be understood as the common meanings thereof by those skilled in the art to which the present disclosure pertains. The terms “first”, “second” and similar words used in one or more embodiments of the present application do not represent any order, number or importance, but are only used to distinguish different components. The terms “include” or “contain” and similar words mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, without excluding other elements or objects. The terms “connect” or “connected” and similar words do not mean physical or mechanical connection, but can include electrical connection, whether direct or indirect. The terms “up”, “down”, “left”, “right” and the like only represent relative positional relationships, which can change accordingly when the absolute positions of the described objects change.

[0030] To facilitate understanding of the electronic tag assembly provided by an embodiment of the present application, first, the application scenario thereof is described. The electronic tag assembly provided by an embodiment of the present application is applied in a tire, for providing identification information of the tire. The current electronic tag is packaged without unified requirements, resulting in relatively random packaging of the electronic tag, which cannot be positioned and counted in the automatic production process. Therefore, an electronic tag assembly is provided by an embodiment of the present application, to facilitate application of the electronic tag assembly in the automatic production process. The electronic tag assembly will be described in detail below in combination with specific drawings and embodiments.

[0031] Reference Figure 1 as shown, Figure 1 A structure diagram of an electronic tag assembly is shown. The main structure of the electronic tag assembly includes an electronic tag 100 and an outer packaging layer 200. The electronic tag 100 is used to record various information of the tire (such as production date, production batch, size, etc.), and the outer packaging layer 200 is used to protect the electronic tag 100. The structures of the electronic tag assembly are described in detail below in combination with specific drawings.

[0032] Reference Figure 2 , Figure 2 A structure diagram of the electronic tag 100 is shown. The electronic tag 100 includes an RFID chip 110 and a PCB card antenna 120. The RFID chip 110 is used to realize the main function of the electronic tag 100. The PCB card antenna 120 is used to transmit and receive signals, so as to write external information into the RFID chip 110 through the PCB card antenna 120, or read information in the RFID chip 110 through the PCB card antenna 120. When arranged, the PCB card antenna 120 is fixedly connected with the RFID chip 110, and the number of the PCB card antenna 120 is two. The two PCB card antennas 120 are arranged on opposite sides of the RFID chip 110, so that the entire electronic tag 100 forms a strip-shaped structure as shown in Figure 2 When the two PCB card antennas 120 are used, the information interaction capability of the electronic chip 110 can be enhanced. In addition, when the two PCB card antennas 120 are arranged in the above manner, the PCB card antenna 120 can be used as a connecting structure for fixing the electronic tag 100 to the tire, for example, the two PCB card antennas 120 are embedded in the tire, so that the fixing firmness of the electronic tag 100 is improved.

[0033] In a specific embodiment, the two PCB card antennas 120 are an integral structure, and the RFID chip 110 is fixed on the integral structure, so that the overall structural strength of the electronic tag 100 is improved.

[0034] In an optional solution, the width of the fixed position of the RFID chip 110 is greater than the width of the PCB card antenna 120, so as to form a structure similar to a watch, and a step is formed in the width direction of the electronic chip 110, so as to enhance the fixing firmness of the electronic tag 100 in the tire.

[0035] Reference Figure 1 and Figure 2The outer packaging layer 200 provided in this embodiment includes two stacked packaging materials. For ease of description, the two packaging materials are respectively named a first strip packaging material 210 and a second strip packaging material 220. When the first strip packaging material 210 and the second strip packaging material 220 are stacked, multiple electronic tags 100 are sandwiched between them. Specifically, when the first strip packaging material 210 and the second strip packaging material 220 are stacked, a receiving space is formed between them, and the electronic tags 100 are located within this receiving space.

[0036] When packaging multiple electronic tags 100, the outer packaging layer 200, within its accommodating space, shall accommodate at least one component of the RFID chip 110 and the PCB board antenna 120 of the multiple electronic tags 100. Different packaging methods may also be used when the outer packaging layer 200 wraps the electronic tags 100. For example, Figure 1 As shown, when packaging electronic tags 100, the outer packaging layer 200 simultaneously wraps the RFID chips 110 of multiple electronic tags 100; or as shown in the diagram. Figure 3 As shown, the outer packaging layer 200 simultaneously includes RFID chips 110 of multiple electronic tags 100 and PCB board antennas 120; or as... Figure 4 As shown, the outer packaging layer 200 simultaneously wraps the PCB board antenna 120 of multiple electronic tags 100.

[0037] As can be seen from the above description, in the electronic tag component provided in this application, multiple electronic tags 100 are uniformly wrapped by an outer packaging layer 200, so that the packaging of the electronic tags 100 is consistent, which facilitates the positioning and location status requirements in the subsequent automated production process, and also facilitates delivery and counting.

[0038] Continue to refer to Figure 1 , Figure 1 The example illustrates a structure where the space accommodates multiple RFID chips 110 for multiple electronic tags 100. (See diagram below.) Figure 1 As shown, in Figure 1 In the illustrated electronic tag assembly, the outer packaging layer 200 only encloses multiple RFID chips 110; that is, during encapsulation, the accommodating space within the outer packaging layer 200 accommodates only the RFID chips 110. Specifically, the number of the first strip chip 110 and the second strip chip 110 is one, and the first strip packaging material 210 and the second strip packaging material 220 are stacked to form the accommodating space. The multiple RFID chips 110 are arranged in a single row with intervals. The arrangement direction of the RFID chips 110 is along the length direction of the first strip packaging material 210.

[0039] When the outer packaging layer 200 is wrapped around the electronic tags 100, the RFID chips 110 of the plurality of electronic tags 100 are wrapped and fixed so that the plurality of electronic tags 100 are kept in a single-row spaced arrangement, facilitating counting and positioning. Thus, it is convenient to apply in an automated production process.

[0040] In an optional solution, for the convenience of positioning the electronic tags 100, at least one of the first strip packaging material 210 and the second strip packaging material 220 is provided with a groove for accommodating the RFID chip 110. For example, only the first strip packaging material 210 is provided with a groove for accommodating the RFID chip 110, or only the second strip packaging material 220 is provided with a groove for accommodating the RFID chip 110, or both the first strip packaging material 210 and the second strip packaging material 220 are provided with a groove for accommodating the RFID chip 110. When the RFID chip 110 is accommodated in the above-mentioned manner, the RFID chip 110 can be positioned by the groove provided on any strip packaging material, facilitating the fixation of the electronic tag 100.

[0041] In an optional solution, for the convenience of the electronic tags 100 in the automatic production, a plurality of positioning holes 230 are provided on the first strip packaging material 210 and the second strip packaging material 220. Among them, the plurality of positioning holes 230 are located on the same side of the groove, and the plurality of positioning holes 230 are alternately arranged with the plurality of PCB card antennas 120. For example, the plurality of positioning holes 230 are arranged at intervals along the length direction of the first strip packaging material 210, and for the same side of the PCB card antenna 120, any one of the PCB card antennas 120 is located between the adjacent two positioning holes 230.

[0042] When the positioning hole 230 is provided, the positioning hole 230 can be a circular hole, a square hole, an oval hole or other types of holes. And for any positioning hole 230, it is a through hole, so as to facilitate positioning with the equipment in the automatic production process.

[0043] In addition, when a plurality of positioning holes 230 are provided, the plurality of positioning holes 230 are uniformly distributed on the outer packaging layer 200, thereby facilitating positioning of the equipment.

[0044] In a specific implementation solution, the end of the length direction of the first strip packaging material 210 is arranged in a staggered manner with the end of the length direction of the second strip packaging material 220. That is, the lengths of the first strip packaging material 210 and the second strip packaging material 220 are different, one end is aligned, and the other end is arranged in a staggered manner. When this method is used, it is convenient to disassemble the outer packaging layer 200. Of course, in addition to the above-mentioned example, the two ends of the first strip packaging material 210 and the second strip packaging material 220 can also be aligned, but a notch is arranged on one of the strip packaging materials to facilitate disassembly of the outer packaging layer 200.

[0045] In an implementable solution, the strip-shaped packaging material of the outer packaging layer 200 can be made of different materials. For example, the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 can be made of paper or plastic. Of course, other materials with certain structural strength can also be used to wrap the outer packaging layer 200.

[0046] When the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 are connected, different connection methods can be selected according to the material of the strip-shaped packaging material. For example, when the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 are made of paper, the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 are connected by adhesion; and when the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 are made of plastic, the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 are connected by thermal plasticization. Regardless of the connection method, the outer packaging layer 200 formed by the connection method should reliably wrap and fix the electronic tags 100.

[0047] Reference Figure 3 is shown, Figure 3 Another electronic tag assembly is shown. In Figure 3 In the electronic tag assembly shown, the outer packaging layer 200 wraps the RFID chips 110 and the PCB card antennas 120 of the plurality of electronic tags 100. The arrangement of the electronic tags 100 can refer to the arrangement in Figure 1 , which will not be described here. The materials and connection methods of the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 can refer to the related descriptions in Figure 1 , which will not be described here. In Figure 3 , the number of the first strip-shaped packaging material 210 and the second strip-shaped packaging material 220 is three, and one first strip-shaped packaging material 210 and one second strip-shaped packaging material 220 form a pair of strip-shaped packaging materials.

[0048] When wrapping the electronic tags 100, one pair of strip-shaped packaging materials wrap the PCB card antennas 120 on the same side of the electronic tags 100. Specifically, the accommodating space formed by one first strip-shaped packaging material 210 and the corresponding second strip-shaped packaging material 220 only accommodates the PCB card antennas 120 on the same side of the plurality of electronic tags 100.

[0049] Another pair of strip-shaped packaging materials wrap the PCB card antennas 120 on the other side of the electronic tags 100. Specifically, the accommodating space formed by another first strip-shaped packaging material 210 and the corresponding second strip-shaped packaging material 220 only accommodates the PCB card antennas 120 on the other side of the plurality of electronic tags 100.

[0050] The third pair of bar-shaped packaging materials encloses the RFID chip 110 of the electronic tag 100. Specifically, the receiving space formed by the third first bar-shaped packaging material 210 and the corresponding second bar-shaped packaging material 220 only accommodates the RFID chip 110 of multiple electronic tags 100.

[0051] As described above, the three pairs of strip-shaped packaging materials respectively wrap the RFID chip 110 of the electronic tag 100 and the two PCB board antennas 120. This improves the positioning and wrapping effect of the electronic tag 100.

[0052] In one alternative configuration, three pairs of shaped packaging materials are spaced apart and arranged at intervals along the length of the RFID tag 100. This allows the end of the PCB board antenna 120 furthest from the RFID chip 110 to be secured, improving the fixation effect on the RFID tag 100.

[0053] In one alternative, the three first strip packaging materials 210 can be of a single integrated structure, while the three second strip packaging materials 220 can be of a separate structure. This improves support for the electronic tag 100 and facilitates the removal of the packaging layers. Alternatively, the three first strip packaging materials 210 and the three second strip packaging materials 220 can both be of a single integrated structure. This structure enhances the protection of the electronic tag 100.

[0054] In an alternative embodiment, when wrapping the electronic chip 110, the three pairs of strip packaging materials can have grooves corresponding to the RFID chip 110 on the strip packaging materials. For specific arrangement methods, please refer to [reference needed]. Figure 1 The groove shown is configured as shown. Alternatively, a groove corresponding to the PCB board antenna 120 can also be provided on the strip packaging material. The method and effect are similar to those of fixing the RFID chip 110, and will not be described in detail here.

[0055] In an alternative embodiment, positioning holes 230 can also be provided on the outer packaging layer 200. The positioning holes 230 can be provided on any pair of strip packaging materials. For specific arrangement, please refer to [reference needed]. Figure 1 The setting method of the positioning hole 230 in the middle will not be explained in detail here.

[0056] like Figure 4 As shown, Figure 4 A schematic diagram of another electronic tag component is shown. Figure 4 In the illustrated electronic tag assembly, the outer packaging layer 200 simultaneously encloses the two PCB board antennas 120 of each electronic tag 100. The arrangement of the electronic tags 100 can be found in [reference needed]. Figure 1 The arrangement of the components will not be elaborated here. The materials and connection methods of the first strip packaging material 210 and the second strip packaging material 220 can be found in [reference needed]. Figure 1The related descriptions in the foregoing embodiments of the electronic tag 100 are also applicable to the electronic tag 100 in the present embodiment, and will not be described herein again. Figure 4 In the present embodiment, the number of the first strip-shaped packaging materials 210 and the second strip-shaped packaging materials 220 is two, and one first strip-shaped packaging material 210 and one second strip-shaped packaging material 220 form a pair of strip-shaped packaging materials.

[0057] When the electronic tags 100 are packaged, one pair of strip-shaped packaging materials wrap the PCB card antennas 120 on the same side of the electronic tags 100. Specifically, the accommodating space formed by one first strip-shaped packaging material 210 and the corresponding second strip-shaped packaging material 220 only accommodates the PCB card antennas 120 on the same side of the electronic tags 100.

[0058] Another pair of strip-shaped packaging materials wrap the PCB card antennas 120 on the other side of the electronic tags 100. Specifically, the accommodating space formed by the other first strip-shaped packaging material 210 and the corresponding second strip-shaped packaging material 220 only accommodates the PCB card antennas 120 on the other side of the electronic tags 100.

[0059] As can be seen from the foregoing description, two pairs of strip-shaped packaging materials wrap the two PCB card antennas 120 of the electronic tags 100, thereby improving the positioning and packaging effect of the electronic tags 100.

[0060] In an optional solution, the two first strip-shaped packaging materials 210 are arranged at intervals and are arranged at intervals along the length direction of the electronic tags 100. Thus, the end of the PCB card antenna 120 away from the RFID chip 110 can be fixed, and the fixing effect of the electronic tags 100 is improved.

[0061] In an optional solution, the two first strip-shaped packaging materials 210 can adopt an integrated structure, and the two second strip-shaped packaging materials 220 can adopt a split structure, which on the one hand improves the support of the electronic tags 100 and on the other hand facilitates disassembly of the packaging layer.

[0062] In an optional solution, when the two pairs of strip-shaped packaging materials wrap the electronic chip 110, grooves corresponding to the PCB card antennas 120 can be arranged on the strip-shaped packaging materials, and the manner and effect are similar to those of fixing the RFID chip 110, which will not be described herein again.

[0063] In an optional solution, the positioning holes 230 can also be arranged on the outer packaging layer 200, and the positioning holes 230 can be arranged on any pair of strip-shaped packaging materials. The specific arrangement manner can refer to the arrangement manner of the positioning holes 230 in the foregoing embodiment, which will not be described herein again. Figure 1

[0064] ​As can be seen from the above description, the electronic tag assembly provided by the embodiment of the present application is banded in the middle (RFID chip 110) or on both sides (PCB board card antenna 120) of the electronic tag 100, and the electronic tags 100 are regularly arranged to meet the positioning and position state requirements in the automatic production process, and facilitate delivery and counting.

[0065] One or more embodiments of the present specification are intended to cover all such alternatives, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of one or more embodiments of the present specification should be included in the protection scope of the present disclosure.

[0066] The above is merely specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic tag component, characterized in that, include: Multiple electronic tag components and outer packaging layer; among which, Each electronic tag assembly includes an RFID chip and a PCB board antenna fixedly connected to the RFID chip; wherein, there are two PCB board antennas, which are arranged on opposite sides of the RFID chip; The outer packaging layer includes a first strip-shaped packaging material and a second strip-shaped packaging material stacked together; and an accommodating space is formed between the first strip-shaped packaging material and the second strip-shaped packaging material; The space shall contain at least one of the RFID chip and the PCB board antenna.

2. The electronic tag assembly according to claim 1, characterized in that, The space is designed to hold only a number of the RFID chips.

3. The electronic tag assembly according to claim 1, characterized in that, There are three of each of the first and second strip packaging materials; The accommodating space formed by one of the first strip packaging materials and the corresponding second strip packaging material can only accommodate multiple PCB board antennas located on the same side of the electronic tags; The other first strip packaging material and the corresponding second strip packaging material form a receiving space that can only accommodate multiple PCB board antennas on the other side of the electronic tags; The third, first strip packaging material and corresponding second strip packaging material form a receiving space that can only accommodate the RFID chips in the multiple electronic tags.

4. The electronic tag assembly according to claim 2 or 3, characterized in that, At least one of the first and second strip packaging materials has a groove for accommodating the RFID chip.

5. The electronic tag assembly according to claim 4, characterized in that, The first strip packaging material and the second strip packaging material are provided with a plurality of positioning holes, and the plurality of positioning holes are located on the same side of the groove, and the plurality of positioning holes are alternately arranged with a plurality of PCB board antennas.

6. The electronic tag assembly according to claim 1, characterized in that, The first and second strip packaging materials are made of paper or plastic.

7. The electronic tag assembly according to claim 6, characterized in that, When both the first and second strip packaging materials are made of paper, the first and second strip packaging materials are bonded together; or, When both the first and second strip packaging materials are made of plastic, the first and second strip packaging materials are thermoformed and fixed.

8. The electronic tag assembly according to claim 1, characterized in that, The ends of the first strip packaging material along its length are offset from the ends of the second strip packaging material along its length.

9. The electronic tag assembly according to claim 1, characterized in that, The electronic tags are arranged in a single row and are evenly distributed.

10. The electronic tag assembly according to claim 1, characterized in that, There are two of the first strip packaging material and two of the second strip packaging material; and the accommodating space formed by one of the first strip packaging materials and the corresponding second strip packaging material can only accommodate multiple PCB board antennas located on the same side of the electronic tags; The other first strip packaging material and the corresponding second strip packaging material form a receiving space that only accommodates the PCB board antennas on the other side of the multiple electronic tags.