Splicing structure of linear image sensor

Abstract

The utility model relates to a splicing structure of a linear image sensor, a first circuit board and a second circuit board, a first sensor module is installed along the length direction of the first circuit board, and a second sensor module is installed along the length direction of the second circuit board. At least one end part of the first sensor module is provided with a first splicing part, at least one end part of the second sensor module is provided with a second splicing part, and after the first circuit board and the second circuit board are located at the splicing position, the first splicing part and the second splicing part are spliced in an abutting mode or in a staggered mode. The first sensor module and the second sensor module extend out of the end parts of the first circuit board and the second circuit board, so that the sensor is not influenced by blank areas at the edges of the circuit boards after being spliced, and the splicing effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of image sensor splicing, in particular to a splicing structure of linear image sensor. BACKGROUND

[0002] Line scan industrial camera is a special imaging device, mainly used for industrial detection occasions requiring high-speed and high-precision image acquisition. Unlike traditional area array cameras (which can take one two-dimensional image at a time), line scan industrial cameras only capture one line of data at a time, and then acquire a complete two-dimensional image by continuously moving the measured object or the camera itself.

[0003] As the core component of line scan industrial camera, image sensor can achieve sub-micron resolution, and single-row sensor does not need to consider perspective distortion, and is suitable for continuous motion material detection. In the prior art, if a product of a wider size is encountered, multiple scans or the use of several groups of line scan industrial cameras at the same time are usually required to complete the scanning, which requires more time for multiple scans and higher cost for multiple cameras. Therefore, there is an urgent need to provide a splicing structure of linear image sensor with higher scanning efficiency. CONTENT OF THE INVENTION

[0004] Therefore, in order to further improve the use range of linear image sensor, the embodiment provides a splicing structure of linear image sensor, which comprises a splicing structure of linear image sensor, characterized by comprising: a first circuit board and a second circuit board, a first sensor module is installed along the length direction of the first circuit board, a second sensor module is installed along the length direction of the second circuit board, a first splicing part is arranged on at least one end of the first sensor module, a second splicing part is arranged on at least one end of the second sensor module, and the first splicing part and the second splicing part are abutted or staggered after the first sensor module and the second sensor module are spliced.

[0005] Preferably, the first splicing part is formed by extending the first sensor module installed on the first circuit board out of the first circuit board towards the second circuit board;

[0006] The second splicing part is formed by extending the second sensor module installed on the second circuit board out of the second circuit board towards the first circuit board.

[0007] Preferably, a protrusion is arranged at the end of the first circuit board, and a recess is arranged at the end of the second circuit board to be inserted into the protrusion; or a protrusion is arranged at the end of the second circuit board, and a recess is arranged at the end of the first circuit board to be inserted into the protrusion; the first splicing part and the second splicing part are spliced or staggered in the area where the protrusion and the recess are inserted.

[0008] Preferably, after the first sensor module and the second sensor module are spliced, the first splicing part has an overlapping area in the length direction of the first circuit board, and the second splicing part has an overlapping area in the length direction of the second circuit board.

[0009] Preferably, the first protrusion is arranged at the end of the first circuit board, and the second protrusion is arranged at the end of the second circuit board, the first splicing part is arranged at the edge of the first protrusion, and the second splicing part is arranged at the edge of the second protrusion.

[0010] After the first circuit board and the second circuit board are assembled, the first protrusion and the second protrusion are staggered, so that the first splicing part and the second splicing part have overlapping areas in the length direction of the first circuit board and the length direction of the second circuit board.

[0011] Preferably, the overlapping area is 10-600 pixels.

[0012] Compared with the prior art, the application has the following advantages:

[0013] (1) In the application, the first sensor module and the second sensor module are arranged to extend out of the ends of the first circuit board and the second circuit board, so that the spliced sensors are not affected by the blank area at the edge of the circuit board, and the splicing effect is improved.

[0014] (2) In the application, protrusions and recesses are arranged at the ends of the first sensor and the second sensor, and the splicing parts of the sensors are arranged at the edges of the protrusions, so that the spliced sensors have overlapping areas in the length direction of the circuit board, and the splicing effect is improved. At the same time, the cooperation of the recesses and the protrusions further improves the splicing stability. BRIEF DESCRIPTION OF DRAWINGS

[0015] The application will be further described below in conjunction with the drawings and embodiments:

[0016] Figure 1 FIG. 1 is a structural schematic diagram of a linear image sensor splicing structure according to Embodiment 1 of the application;

[0017] Figure 2 FIG. 2 is a structural schematic diagram of a linear image sensor splicing structure according to Embodiment 2 of the application;

[0018] Figure 3 Structure diagram of embodiment 3 of a splicing structure of a linear image sensor according to the present application;

[0019] Figure 4 Structure diagram of embodiment 3 of a splicing structure of a linear image sensor according to the present application;

[0020] Figure 5 Structure diagram of embodiment 4 of a splicing structure of a linear image sensor according to the present application.

[0021] Wherein, 1, first circuit board, 11, protruding part, 12, first boss, 13, first groove, 2, second circuit board, 21, inner recess, 22, second boss, 23, second groove, 3, first sensor module, 4, second sensor module, 31, first splicing part, 41, second splicing part. DETAILED DESCRIPTION

[0022] In order to make the objects, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0023] The term "embodiment" referred to herein means a specific feature, structure or characteristic that can be included in at least one implementation of the present application. In the description of the embodiments of the present application, it should be understood that the terms "first", "second" and "third" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" and "third" can be explicitly or implicitly included one or more of the features. Moreover, the terms "first", "second" and "third" are used to distinguish similar objects, and do not necessarily be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "comprise" and any variations thereof are intended to cover non-exclusive inclusion.

[0024] Embodiment 1

[0025] As Figure 1As shown, this embodiment provides a stitching structure for a linear image sensor, including a first circuit board 1 and a second circuit board 2. A first sensor module 3 is mounted along the length of the first circuit board 1, and a second sensor module 4 is mounted along the length of the second circuit board 2. The first sensor module 3 and the second sensor module 4 are single-row sensors, capable of capturing images line by line through object movement or camera scanning motion, ultimately synthesizing a two-dimensional image. Typically, either the first sensor module 3 or the second sensor module 4 can scan an object independently. However, in some scenarios, the object is large, and the size of a single sensor set is insufficient. Therefore, it is necessary to stitch the two sensor sets together. In this embodiment, a first stitching part 31 is provided at one end of the first sensor module 3, and a second stitching part 41 is provided at one end of the second sensor module 4. The first circuit board 1 and the second circuit board 2 are stitched together along their length. After board 1 and the second circuit board 2 are respectively in the splicing position, the first sensor module 3 and the second sensor module 4 can be spliced ​​into a set of sensor modules. In this process, the shorter the distance between the first sensor module 3 and the second sensor module 4, the better. However, usually, there will be a blank area at both ends of the circuit board. After splicing the two sets of sensors at once, a large blank area will appear in the middle. In order to solve this problem, in this embodiment, the end of the first sensor module 3 extends out of the end of the first circuit board 1, and the end of the second sensor module 4 extends out of the end of the second circuit board 2. Specifically, the first splicing part 31 is located outside the orthographic projection area of ​​the first circuit board 1, and the second splicing part 41 is located outside the orthographic projection area of ​​the second circuit board 2. Thus, after the first circuit board 1 and the second circuit board 2 are spliced, the first splicing part 31 and the second splicing part 41 are in contact or infinitely close to each other outside the orthographic projection areas of the first circuit board 1 and the second circuit board 2.

[0026] Example 2

[0027] like Figure 2 As shown, the first circuit board 1 has at least one protrusion 11 at its end, and the second circuit board 2 has at least one recess 21 at its end that mates with the protrusion 11. When the first circuit board 1 and the second circuit board 2 are assembled, the protrusion 11 and the recess 21 serve to prevent mistaken insertion and also make the installation of the first circuit board 1 and the second circuit board 2 more stable. In this embodiment, the first splicing part 31 and the second splicing part 41 abut against each other or move infinitely close to each other within the area where the protrusion 11 and the recess 21 are inserted. The two sides of the second circuit board 2 surrounding the recess are also respectively configured as protruding shapes, fitting into the two sides of the protrusion 11.

[0028] Example 3

[0029] As Figures 3-4 shown, after the first sensor module 3 and the second sensor module 4 are spliced, the first splicing part 31 has an overlapping area in the length direction of the first circuit board 1 and the second splicing part 41 has an overlapping area in the length direction of the second circuit board 2, although the pair of sensor modules are not on the same line in the length direction, but the integrity of the sensor modules in the length direction can be guaranteed. In this embodiment, the ends of the first circuit board 1 and the second circuit board 2 respectively have a notch, and one side of the notch is attached to the side of the sensor module. When the two sets of sensor modules are spliced, they have an overlapping area. In this embodiment, the overlapping area is 10-600 pixels. Generally, there may be a precision offset condition on the machine chip, so the 10-pixel overlapping area can cover the tolerance accuracy of the process technology. When using a chip with a high pixel, such as 1800 dpi (the size of the photosensitive unit pixel is 14um), the sensor module overlapping 1mm setting will have 70 pixels. In order to better ensure the accuracy, the maximum number of overlapping pixels in this embodiment can be up to 600.

[0030] Embodiment 4

[0031] As Figure 5 shown, a first boss 12 is provided at the end of the first circuit board 1, and a second boss 22 is provided at the end of the second circuit board 2. A first recess 13 is provided on one side of the first boss 12, and a second recess 23 is provided on one side of the second boss 22. One end of the first sensor module 3 is arranged on the first boss 12, and the side edge of the first splicing part 31 is attached to the edge of the first recess 13. One end of the second sensor module 4 is arranged on the second boss 22, and the side edge of the second splicing part 41 is attached to the edge of the second recess 23. After the first circuit board 1 and the second circuit board 2 are assembled, the first boss 12 and the second boss 22 are respectively assembled in the opposite second recess 23 and first recess 13. At the same time, the first splicing part 31 and the second splicing part 41 have an overlapping area in the length direction. At the same time, the boss and the recess can further fix the circuit board, and ensure the stability of the assembly.

[0032] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application, therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A tiled structure of linear image sensors, characterized in that, The application relates to a sensor module. The first circuit board (1) and the second circuit board (2) are provided with the first sensor module (3) and the second sensor module (4) respectively, the first sensor module (3) is provided with the first splicing part (31) at one end, the second sensor module (4) is provided with the second splicing part (41) at one end, and the first splicing part (31) and the second splicing part (41) are spliced or staggered when the first circuit board (1) and the second circuit board (2) are in the splicing position.

2. The tiled structure of linear image sensors according to claim 1, characterized in that, The first splicing part (31) is formed by extending the first sensor module (3) installed on the first circuit board (1) out of the first circuit board (1) towards the second circuit board (2). The second splicing part (41) is formed by extending the second sensor module (4) installed on the second circuit board (2) out of the second circuit board (2) towards the first circuit board (1).

3. The tiled structure of linear image sensors according to claim 2, wherein, The end of the first circuit board (1) is provided with a protruding part (11), the end of the second circuit board (2) is provided with an inner recess part (21) matched with the protruding part (11), or the end of the second circuit board (2) is provided with a protruding part (11), the end of the first circuit board (1) is provided with an inner recess part (21) matched with the protruding part (11), and the first splicing part (31) and the second splicing part (41) are spliced or staggered in the area where the protruding part (11) and the inner recess part (21) are matched.

4. The tiled structure of linear image sensors of claim 1, wherein, After the first sensor module (3) and the second sensor module (4) are staggered, the first splicing part (31) and the second splicing part (41) have an overlapping area in the length direction of the first circuit board (1) and the second circuit board (2) respectively.

5. The tiled structure of linear image sensors according to claim 4, characterized in that, The end of the first circuit board (1) is provided with a first boss (12), the end of the second circuit board (2) is provided with a second boss (22), the first splicing part (31) is installed on the edge of the first boss (12), and the second splicing part (41) is installed on the edge of the second boss (22).

6. The tiled structure of linear image sensors according to claim 5, wherein, After the first circuit board (1) and the second circuit board (2) are assembled, the first boss (12) and the second boss (22) are staggered, so that the first splicing part (31) and the second splicing part (41) have an overlapping area in the length direction of the first circuit board (1) and the second circuit board (2).

7. The tiled structure of linear image sensors according to any of claims 4-6, characterized in that, The overlapping area is 10-600 pixel points.

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