Wafer AOI (Automated Optical Inspection) film-to-film arranging equipment

Abstract

The utility model provides wafer AOI film-to-film arrangement equipment, which comprises a wafer arrangement module comprising a picking device, at least one vertically arranged main bearing disc and at least two vertically arranged auxiliary bearing discs, the main bearing disc is used for bearing wafers to be processed, and the two auxiliary bearing discs are respectively used for bearing qualified product empty diaphragms and unqualified product empty diaphragms; the detection module is sequentially provided with a rotation correction unit, a five-surface appearance detection unit, a subfissure detection unit and a front-surface appearance detection unit around the picking device, and is used for carrying out six-surface and internal detection on crystal grains on the to-be-processed wafer; the picking device obtains the crystal grains from the wafer to be processed, through detection of the detection module, the crystal grains of the same grade are placed on the same qualified product empty membrane, and the unqualified crystal grains are placed on the unqualified product empty membrane. The equipment integrates an advanced AOI detection system, can comprehensively detect the front surface, the back surface and four side surfaces of the wafer, and is equipped with an IR subfissure detection unit to detect the subfissure condition in the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, especially to a wafer AOI film to film chip arranging equipment. BACKGROUND

[0002] In FOWLP (fan-out wafer level packaging) technology, wafer rearrangement is a key process, and the chip arranging and detection efficiency and precision directly affect the quality and performance of the final product. However, most of the current market devices have significant deficiencies in precision detection, efficiency and safety, which cannot meet the strict requirements of FOWLP for high precision, high efficiency and die integrity. The semiconductor manufacturing process requires high-precision operation in a highly clean environment, which puts higher requirements on the equipment.

[0003] At present, many devices can only detect part of the surface of the wafer, and cannot achieve full coverage. This limitation leads to the fact that hidden cracks and other minor defects cannot be discovered in time, which seriously threatens the quality and reliability of the product. In addition, traditional detection methods rely mainly on simple comparison techniques, making it difficult to achieve efficient and accurate defect identification. The traditional feeding and discharging method not only occupies a lot of space, but also the operation is relatively complicated, greatly limiting the production efficiency. In a dust-free workshop, the cleanliness and anti-static measures of the equipment are crucial, and any carelessness may cause irreversible damage to the product.

[0004] The existing film-to-film chip arranging machine has obvious deficiencies in many aspects, especially in the key areas of dust-free level, full optical detection (AOI) and hidden crack detection. Specifically, these devices usually do not meet the requirements of Class 10 dust-free workshop, have poor stability, are easy to introduce pollution, and affect the cleanliness of the production environment and the quality of the product. At the same time, the detection capacity of the traditional equipment is limited, and multiple devices need to work together to complete the full detection, which increases the cost of equipment and operation and reduces the production efficiency. In addition, the existing equipment lacks infrared (IR) hidden crack detection function and cannot identify hidden cracks inside the die, which may cause serious problems in subsequent use and affect the reliability and service life of the product. UTILITY MODEL CONTENTS

[0005] In order to solve all or part of the problems of the prior art, the utility model provides a wafer AOI film-to-film chip arranging equipment, which realizes full-automatic chip arranging and optical detection of the wafer, from feeding and discharging to arranging and then to detection, each link closely connects, without frequent manual intervention, greatly reducing the manual operation time and improving the production rhythm.

[0006] To achieve the above purpose, the utility model provides the following technical scheme:

[0007] A wafer AOI film-to-film chip arranging equipment, comprising:

[0008] The sorting module comprises a sorting device, at least one vertically arranged main carrier plate for carrying the wafer to be processed, and at least two vertically arranged sub-carrier plates for carrying qualified empty wafer and unqualified empty wafer respectively.

[0009] The detection module comprises a rotation correction unit, a five-side appearance detection unit, a hidden crack detection unit and a front appearance detection unit arranged in sequence around the sorting device, and is used for six-side and internal detection of the die on the wafer to be processed.

[0010] The sorting device obtains the die from the wafer to be processed, and through the detection of the detection module, the die of the same grade is placed on the same qualified empty wafer, and the unqualified die is placed on the unqualified empty wafer.

[0011] The sorting device comprises a turret and a plurality of adsorption assemblies, the adsorption assemblies are equidistantly arranged around the turret, and are used for sucking and transferring the die from the main carrier plate, and each unit in the detection module is arranged around the turret and matches the rotation angle of the adsorption assembly.

[0012] The detection module further comprises a suction nozzle detection unit and a suction nozzle cleaning unit, the suction nozzle detection unit is arranged at a downstream position of the sub-carrier plate, and is used for detecting whether the suction nozzle is dirty or worn; the suction nozzle cleaning unit is arranged on the main carrier plate or the sub-carrier plate, shares a driving mechanism with the main carrier plate or the sub-carrier plate, and is used for cleaning the suction nozzle.

[0013] The rotation correction unit comprises a mounting base, a die placement platform, a θ-direction driving mechanism, an X-direction driving mechanism, a Z-direction driving mechanism and a vision unit, the die placement platform is arranged at a driving end of the θ-direction driving mechanism, a lower end of the θ-direction driving mechanism is connected with a driving end of the X-direction driving mechanism through a first connecting plate, and a driving end of the Z-direction driving mechanism is connected with side edges of the θ-direction driving mechanism and the X-direction driving mechanism through a second connecting plate.

[0014] The five-side appearance detection unit comprises a camera and a first reflection mechanism, the camera faces the back of the die, and the first reflection mechanism reflects the images of the four sides of the die to the camera for appearance detection of the five sides; the hidden crack detection unit comprises an infrared camera and a second reflection mechanism, the infrared camera faces the back of the die, and the second reflection mechanism reflects the infrared images of the four sides of the die to the infrared camera for internal defect detection of the die.

[0015] The front appearance detection unit comprises a visual component and a light reflection component, the light reflection component is arranged in front of the sub-carrier disc wafer placement position, the visual component is arranged above the light reflection component, and the light reflection component refracts the front of the wafer to the visual component for front appearance detection.

[0016] The main carrier disc and the sub-carrier disc are arranged oppositely, and the picking device is arranged between the main carrier disc and the sub-carrier disc; the main carrier disc and the sub-carrier disc are each provided with an X-axis driving mechanism, a Z-axis driving mechanism and a rotating mechanism, which are used for adjusting the positions of the main carrier disc and the sub-carrier disc in X direction and Z direction and adjusting the main carrier disc and the sub-carrier disc from vertical placement to horizontal placement.

[0017] The wafer AOI film-to-film wafer arranging device further comprises a buffer module provided with a plurality of buffer areas, which are used for storing qualified wafer chips, unqualified wafer chips, empty films and wafer chips to be processed in different grades; the wafer chips of the same grade which are qualified after wafer arranging are placed on the same empty film, and the empty films of the same grade are placed in the same box.

[0018] The wafer AOI film-to-film wafer arranging device further comprises a feeding and discharging module, which comprises a rack, a plurality of buffer stations in the rack for placing the boxes and at least two transfer stations, and two feeding and discharging platforms, and one side of the rack is provided with a transfer mechanism, which is used for transferring the boxes between the feeding and discharging platforms, the buffer stations and the transfer stations.

[0019] The wafer AOI film-to-film wafer arranging device further comprises a carrying module, which comprises a rack and a first mechanical arm and a second mechanical arm arranged on the rack, and is used for carrying the wafer chips between the modules. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0021] Figure 1 It is a first perspective view of the wafer AOI film-to-film wafer arranging device.

[0022] Figure 2 It is a second perspective view of the wafer AOI film-to-film wafer arranging device.

[0023] Figure 3 It is a top view of the wafer AOI film-to-film wafer arranging device.

[0024] Figure 4A structure schematic view of the feeding and discharging module in the wafer AOI film-to-film chip arranging equipment.

[0025] Figure 5 A front view of the feeding and discharging module in the wafer AOI film-to-film chip arranging equipment.

[0026] Figure 6 A structure schematic view of the buffer module in the wafer AOI film-to-film chip arranging equipment.

[0027] Figure 7 A plan view of the detecting module and the chip arranging module in the wafer AOI film-to-film chip arranging equipment.

[0028] Figure 8 A simple schematic view of the detecting module and the chip arranging module in the wafer AOI film-to-film chip arranging equipment.

[0029] Figure 9 A partial side view of the detecting module and the chip arranging module in the wafer AOI film-to-film chip arranging equipment.

[0030] Figure 10 A structure schematic view of the rotating correction unit in the wafer AOI film-to-film chip arranging equipment.

[0031] Figure 11 A structure schematic view of the five-surface appearance detecting unit and the hidden crack detecting unit in the wafer AOI film-to-film chip arranging equipment.

[0032] Figure 12 A first perspective structure schematic view of the carrying module in the wafer AOI film-to-film chip arranging equipment.

[0033] Figure 13 A second perspective structure schematic view of the carrying module in the wafer AOI film-to-film chip arranging equipment.

[0034] Label: 1, feeding and discharging module; 101, rack; 102, buffer station; 103, transfer station; 104, transfer mechanism; 105, feeding and discharging platform; 2, buffer module; 3, detection module; 301, rotation correction unit; 3011, mounting base; 3012, die placement platform; 3013, θ direction driving mechanism; 3014, X direction driving mechanism; 3015, Z direction driving mechanism; 302, five-side appearance detection unit; 303, hidden crack detection unit; 304, front appearance detection unit; 305, suction nozzle detection unit; 306, suction nozzle cleaning unit; 4, wafer sorting module; 401, sorting device; 402, main carrier disc; 403, auxiliary carrier disc; 5, conveying module; 501, rack; 502, first robot; 503, second robot. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0036] In the embodiments of the present application, as shown in the reference Figures 1 to 13 The present application provides an automatic optical inspection (AOI) film-to-film wafer sorting device for wafers. The device aims to efficiently re-sort the dies on the wafers to be processed to ensure that dies of the same grade can be placed on the same wafer. The wafers to be processed have been accurately divided into multiple dies of the same specification, and each wafer to be processed is marked with a barcode. These barcodes not only identify the source and batch of the wafer, but also store detailed information related to each die, including its grade, production date, manufacturer information, the relative position of the die on the wafer, and other important attributes. Through this barcode identification, effective tracking and management of each die can be achieved, ensuring that the characteristics and status of each die can be quickly and accurately obtained during subsequent production and quality control processes. The device also integrates appearance detection and hidden crack detection functions during the re-sorting process, allowing real-time identification and classification of appearance defects and internal hidden crack problems of the dies. For dies detected to have defects in appearance or internally, the device automatically places them on the unqualified product empty film, thereby effectively preventing unqualified products from flowing into subsequent production links.

[0037] The chip arranging device comprises a feeding and discharging module 1, a buffer module 2, a detection module 3, a chip arranging module 4 and a carrying module 5. The feeding and discharging module 1 is used for storing the material box conveyed by the upstream trolley, and the material box is loaded with the chips to be processed. The buffer module 2 is provided with a plurality of chip taking stations, and is specially used for storing the material box loaded with the chips to be processed, the material box corresponding to at least seven quality grades of chips, the material box of unqualified chips and the material box of empty chips. In the embodiment, the chip grades are divided into seven grades, and according to the requirements, at most 100 grades can be divided for operation, and nine chip taking stations are provided, and the corresponding material box is placed on each station, and each material box is provided with 13 chip storage slots, and each slot can be used as a grade storage position. The buffer module 2 is used as the chip taking position of the chip arranging module 4, and the carrying module 5 is responsible for obtaining the chips from the buffer module 2 and transferring them to the chip arranging module 4. The chip arranging module 4 comprises a picking device 401, at least one main bearing disc 402 arranged vertically and at least two auxiliary bearing discs 403. The main bearing disc 402 is used for bearing the chips to be processed, and the auxiliary bearing disc 403 is used for bearing the qualified empty chips and the unqualified empty chips. The picking device 401 is used for obtaining the die from the chips to be processed, and the carried die is sequentially detected by the detection module 3. The detection module 3 is sequentially provided with a rotation correction unit 301, a five-surface appearance detection unit 302, a hidden crack detection unit 303 and a front surface appearance detection unit 304, and these units are arranged on the periphery of the picking device 401, and are used for comprehensive detection of the die. After detection, the chips of the same grade are placed on the same empty chip carried by the auxiliary bearing disc 403, and the unqualified chips are placed on the unqualified empty chip.

[0038] As Figures 4-5As shown, the structural design of the feeding and discharging module 1 includes a rack 101, which is internally provided with a plurality of buffer stations 102 and at least two transfer stations 103. The rack 101 serves as the core component of the entire feeding and discharging module 1, and is equipped with a feeding and discharging platform 105 at the top. The function of the feeding platform is to receive the material box conveyed from the upstream trolley. The trolley, as an automated handling equipment, can accurately place the material box on this platform, thereby preparing for the subsequent transfer and detection of the material box. The discharging platform is used to carry the wafer material box after the wafer is arranged. The trolley carries it to the next process or storage area, thereby realizing efficient and automated transfer between the rack 101 and external equipment. The buffer stations 102 provided inside the feeding and discharging module 1 are mainly used for temporarily storing the material box during the production process, thereby playing a buffering role. When the external feeding speed and the internal wafer arrangement or transfer speed do not match, the buffer stations 102 can store a certain number of material boxes, thereby avoiding production interruption caused by untimely feeding or processing stagnation, thereby effectively saving feeding and discharging time and improving overall production efficiency. In addition, the at least two transfer stations 103 inside the rack 101 serve as fixed positions for the wafer pickup and drop-off of the handling module 5, thereby ensuring smooth circulation and efficient processing of the wafer in the feeding and discharging module 1. The rack 101 is provided with a transfer mechanism 104 on one side, which mainly functions to realize the orderly transfer of the material box between different stations (including the buffer stations 102 and the transfer stations 103) inside the rack 101. The transfer mechanism 104 is composed of a transfer assembly, a Y-direction linear guide rail, and two Z-direction linear guide rails. The two Z-direction linear guide rails are fixedly installed on the rack 101, and the Y-direction linear guide rail is connected to the two Z-direction linear guide rails at both ends. The transfer assembly is installed on the Y-direction linear guide rail to facilitate its movement in the Y-direction and the Z-direction. When the material box needs to be transferred, the transfer assembly first clamps the material box, and then the Y-direction linear guide rail moves the material box to the handling channel in the middle of the rack 101. Subsequently, the Z-direction linear guide rail drives the Y-direction linear guide rail and the clamped material box to move to the preset position, and finally the Y-direction linear guide rail sends the material box carried by the transfer assembly to the designated station.

[0039] The design of the transfer assembly aims to clamp the magazine and move it stably between various stations of the magazine rack 101, ensuring the safe transfer of materials. To meet the needs of different magazines, the transfer assembly can use various forms of clamping devices, such as pneumatic clamps, electric clamps, or mechanical fingers, etc. The specific clamping method will be selected according to factors such as the size, weight, shape, and material of the magazine, to ensure firm and stable grasping of the magazine, providing a reliable foundation for subsequent position changing operations. In this embodiment, the upstream crane system runs on the unmanned workshop ceiling track, hoisting the magazine containing wafers to the loading platform, which serves as the starting position for loading. Subsequent operations are further processed by the transfer mechanism 104 in the loading and unloading module 1. The magazine can be divided into at least four types: the first type is used to place wafers to be arranged, the second type is used to store wafers that have been arranged, the third type is used to place defective wafers, and the fourth type is used to place empty films. Each magazine can contain 13 wafers, and the crane system records and archives information about each magazine and its internal wafers, including batch, wafer grade, and other information, which users can obtain by scanning the code. When the magazine containing wafers that have been arranged is placed on the unloading platform by the transfer mechanism 104 in the loading and unloading module 1, the magazine is grabbed by the crane system's material taking mechanism and then transferred to the next operation process for further production operations.

[0040] As Figure 6As shown, the buffer module 2 is provided with at least nine buffer areas, of which seven areas are used to store the wafer boxes of different grades. According to the grade information of the dies on the wafer generated in the previous process, the dies of the same grade and qualified after the processing of the detection module 3 and the die arranging module 4 will be placed on the same wafer, while the wafers of different grades will be respectively stored in the wafer boxes of the corresponding buffer areas for subsequent unified processing and die arranging. The remaining two areas are respectively used to store the wafer boxes of unqualified wafers and the wafer boxes of empty films, and the wafers to be processed are also placed in the wafer boxes of empty films. In other embodiments, a wafer box for wafers to be processed can also be separately provided. In terms of management of the buffer areas, when the wafers in a wafer box reach a certain number (for example, 12 or 13), the mechanical hand of the transfer module 5 will automatically transfer the wafers in the wafer box to the corresponding wafer box in the loading and unloading module 1. For example, when the wafer box of the first grade of wafers that have completed die arranging in the buffer area reaches 12 wafers, the mechanical hand of the transfer module 5 will transfer the wafers in the wafer box to the corresponding wafer box of the first grade of wafers in the loading and unloading module 1. When the wafer box of the first grade of wafers in the loading and unloading module 1 is full, the transfer mechanism 104 will transfer it to the unloading platform, and then the crane system will take away the wafer box for the next process. This management process ensures efficient classification and circulation of wafers, significantly improving overall production efficiency and product quality. When the external loading speed does not match the internal die arranging or transfer speed, the buffer module 2 can store a certain number of wafers to avoid production interruption due to untimely loading or processing stagnation, thereby effectively saving loading and unloading time, making the production process smoother, and further improving overall production efficiency.

[0041] In a conventional embodiment, in the wafer box storing the wafers that have completed die arranging, the wafers of each grade are respectively placed in independent wafer boxes, thereby ensuring that the wafers in the same wafer box are of the same grade, facilitating subsequent unified processing and precise control of wafers of different grades. However, in some special embodiments, based on specific production requirements or process optimization considerations, wafers of different grades can also be placed in the same wafer box, but the principle of placing wafers of the same grade on the same film must be followed. This special placement method may be to facilitate operators to obtain multiple grades of wafers at one time in some processes that have specific requirements for mixed use of wafers, while still being able to distinguish and manage wafers of the same grade through the film, thereby avoiding confusion of wafers of different grades in subsequent processing links, and thus meeting special production requirements while still ensuring the basic requirements for distinguishing wafers of different grades and the feasibility of quality control in the production process.

[0042] As shown in FIG. 1, the wafer box 100 is provided with a plurality of film pieces 101, and each film piece 101 is provided with a plurality of die arranging areas 102. In the embodiment shown in FIG. 1, each film piece 101 is provided with 13 die arranging areas 102, and the die arranging areas 102 of different film pieces 101 are arranged in a staggered manner. In other embodiments, the number of die arranging areas 102 in each film piece 101 and the arrangement manner of the die arranging areas 102 of different film pieces 101 can be appropriately adjusted according to actual needs. Figures 7-9As shown, the core function of the wafer sorting module 4 is to detect the appearance of the wafer and rearrange it. The module includes a picking device 401, at least one vertically arranged main carrier disc 402, and at least two vertically arranged auxiliary carrier discs 403, which are divided into OK (qualified wafer) carrier disc and NG (unqualified wafer) carrier disc. The main carrier disc 402 serves as the starting point of the entire wafer sorting process, mainly used to carry the wafer to be processed which has been divided into multiple identical dies, while the auxiliary carrier disc 403 is used to carry the qualified empty film and unqualified empty film. The qualified empty film serves as the carrier for die rearrangement, used to receive the qualified dies after being picked and detected by the picking device 401, while the unqualified empty film is used to collect the dies judged as unqualified in the detection process. The main function of the picking device 401 is to obtain the dies from the wafer to be processed on the main carrier disc 402 and carry them through the detection module 3 in sequence for detection. After detection, the qualified dies of the same level will be accurately placed on the same empty film carried by the auxiliary carrier disc 403, while the unqualified dies will be placed on the unqualified empty film, so as to realize the classification and arrangement of the dies. In this embodiment, the main carrier disc 402 is arranged opposite to the auxiliary carrier disc 403, and the picking device 401 is located between them. Both the main carrier disc 402 and the auxiliary carrier disc 403 are equipped with Y-axis driving mechanism, Z-axis driving mechanism and rotating mechanism. Among them, the Y-axis driving mechanism and the Z-axis driving mechanism are used to adjust the positions of the main carrier disc 402 and the auxiliary carrier disc 403 in Y direction and Z direction, while the rotating mechanism is used to place the wafer on the main carrier disc 402 and the auxiliary carrier disc 403 after angle rotation correction. This design not only ensures efficient processing and accurate placement of the dies, but also significantly improves the overall production efficiency. In addition, the main carrier disc 402 and the auxiliary carrier disc 403 can also be equipped with X-axis driving mechanism for adjusting their positions in X direction, thereby further enhancing the flexibility and adaptability of the equipment. These improved designs can meet the needs of different production scenarios and further optimize the processing flow of the dies.

[0043] In traditional film-to-film wafer sorting equipment, the main carrier disc 402 and the auxiliary carrier disc 403 are placed horizontally. This layout causes the motion trajectory span of the two carrier discs to increase as the size of the wafer increases, thereby increasing the handling distance of die picking and placing, which significantly affects the work efficiency. To solve this problem, the main carrier disc 402 and the auxiliary carrier disc 403 are vertically placed, so that the motion trajectories of the two carrier discs do not interfere with each other. This vertical layout not only effectively shortens the picking and placing distance of the dies, improves the operation efficiency, but also significantly reduces the risk of dust pollution to the chips, thereby improving the quality and reliability of the products.

[0044] The picking device 401 is the core execution component of the sorting module 4, and its structure includes a turret and a plurality of suction assemblies. The suction assemblies are arranged equidistantly around the turret, and are used to suck the dies from the main carrier disc 402 and transfer them to the target positions. The detection module 3 is arranged around the periphery of the turret, and each unit in the detection module 3 corresponds to the rotation angle of the suction assembly, so as to realize the one-by-one detection and classification processing of the dies. In this embodiment, the suction assemblies are 12 suction nozzles arranged in a ring on the turret, and the included angle between adjacent suction nozzles is 30°. The suction nozzles are sequentially detected by the corresponding detection units through the rotation of the turret, and the suction, detection and placement operations of the dies are completed. Each suction nozzle has a negative pressure suction function, and its design fully considers the contact mode and stability with the dies, so as to ensure that the dies are not damaged during high-speed rotation and operation. The suction nozzles perform suction operation on the dies from the same fixed position, and perform placement operation on the dies at the same position. The driving mechanism of the main carrier disc 402 is responsible for moving the dies to be sucked to the suction position of the suction nozzle; and the driving mechanism of the auxiliary carrier disc 403 moves the placement position of the dies on the empty film to the position corresponding to the placement operation of the suction nozzle. The bottom of each suction nozzle is connected with a driving mechanism, which can drive the suction nozzle to move a certain distance forward, so that the die can be placed in the detection unit for detection. In addition, the negative pressure suction function of the suction nozzle can firmly grasp the die, while avoiding the die from falling off due to vibration or high-speed movement. In order to ensure the continuity and stability of the air path and the circuit connection of the suction nozzle during rotation, an electrical integrated slip ring device is integrated on the turret. The slip ring device can continuously provide stable transmission of the air path (including positive pressure and negative pressure) and the circuit during the rotation of the turret, so as to ensure the normal work of the suction nozzle during rotation, thereby realizing the continuous processing of the dies. This design not only improves the operation efficiency of the equipment, but also significantly improves the precision and reliability of the die processing, and provides technical support for the efficient operation of the sorting module 4.

[0045] As shown in Figures 8-11 The detection module 3 includes a rotation correction unit 301, a five-face appearance detection unit 302, a hidden crack detection unit 303, a front-face appearance detection unit 304, a suction nozzle detection unit 305 and a suction nozzle cleaning unit 306, and each unit closely cooperates to comprehensively guarantee the quality, precision and process stability of the dies from wafer suction, processing to sorting. Specifically, after the suction assembly sucks the dies, it first enters the rotation correction unit 301, which aims to solve the rotation or displacement problem of the dies caused by the adhesion of the blue film or the UV film. The rotation correction unit 301 integrates multi-axis correction and high-precision visual positioning functions, and can detect the current position and angle deviation of the dies in real time, and dynamically adjust through a precise multi-axis driving system. The unit adopts advanced visual algorithms and high-resolution imaging equipment to ensure that the dies quickly recover to the preset standard position and angle, and eliminate the suction deviation to provide protection for the subsequent processes.

[0046] In the present embodiment, the rotation correction unit 301 has correction capabilities in the X-axis direction, the Z-axis direction, and the θ-axis direction, and is suitable for complex deviation cases. In addition, the Y-axis direction correction capability can also be added to improve the correction accuracy and the applicable range. The unit includes a mounting base 3011, a die placement platform 3012, a θ-direction driving mechanism 3013, an X-direction driving mechanism 3014, a Z-direction driving mechanism 3015, and a vision unit. The mounting base 3011 provides stable support, the die placement platform 3012 carries the die and is connected to the θ-direction driving mechanism 3013, and each driving mechanism cooperatively controls the position and posture of the die. The θ-direction driving mechanism 3013 drives the die placement platform 3012 to rotate, the X-direction driving mechanism 3014 pushes it to move in the X direction, and the Z-direction driving mechanism 3015 drives it to move synchronously in the Z direction, realizing accurate positioning of the die in three-dimensional space. The vision unit includes a camera and a reflecting component, the camera lens is directed downward along the Z axis, and the die placement platform 3012 image is captured through the reflecting component, solving the problem of layout restriction of the work station, ensuring the accuracy and reliability of image acquisition. Two suction holes are provided on the die placement platform 3012 and are connected to a vacuum generating device, the position of the first suction hole corresponds to the center of the suction nozzle, and the position of the second suction hole corresponds to the center of the camera of the vision unit. The suction nozzle places the die on the surface of the suction hole, and the suction hole fixes the die by vacuum suction, ensuring the stability of the correction operation. The design of the die placement platform 3012 includes a flat surface and two suction holes, the suction holes are distributed symmetrically with the rotation center as the axis and pass through the center of the axis, connected to the vacuum pipeline and connected to the vacuum generating device, generating negative pressure to adsorb the die when started, improving the stability and reliability of the correction process.

[0047] The rotation correction process is as follows: after the first suction nozzle sucks up the die and moves to the rotation correction unit 301, the first die is placed in the first suction hole position, the die placement platform 3012 rotates 180° to move the first die under the vision unit, the vision unit is started, the camera captures the die position, and the image processing algorithm calculates the θ-axis deviation value. At the same time, the first suction nozzle idles for 30°, and the second suction nozzle places the die on the second suction hole. According to the calculation result of the image processing algorithm, the rotation correction table accurately transfers the first chip to the center of the suction nozzle position by using the X, Z, and θ axes. The corrected chip is sucked by the second suction nozzle and transferred to the next work station. The above steps are repeated, so that each subsequent suction nozzle can suck the corrected chip. By timely correcting the die posture, quality problems caused by inaccurate initial position and angle are avoided, the die placement accuracy is guaranteed from the source, the process accuracy and stability of subsequent appearance, hidden crack detection, die placement, and other processes are ensured, and quality problems caused by poor initial posture are avoided. The design scheme of two-hole alternation can avoid the problem of unable to take pictures caused by the overlap of the suction nozzle and the camera, and improve the work efficiency.

[0048] The crystal grain after rotation correction is carried by the suction nozzle to the five-face appearance detection unit 302. The unit is equipped with a camera and a first reflection mechanism composed of a prism composed of four 45° mirrors, and the camera faces the back of the crystal grain. With the help of 45° mirrors, the camera can simultaneously shoot the four sides and the back of the crystal grain, detect appearance defects, dirt, dust or cracks, etc. The detection results are transmitted to the control system in real time, and the wafer quality is evaluated and classified according to the preset standards and procedures. The qualified wafers are transported to the next unit, and the unqualified wafers are marked and transferred to the unqualified area of the auxiliary support disc 403. The crystal grain with appearance detection passes through the suction nozzle and moves to the hidden crack detection unit 303. The unit is equipped with an infrared camera and a second reflection mechanism, which is arranged in the same way as the first reflection mechanism. The infrared camera faces the back of the crystal grain, and the second reflection mechanism reflects the infrared images of the four sides of the crystal grain to the camera. The infrared camera is carefully selected and installed, which can effectively penetrate the surface of the crystal grain and detect internal cracks and other defects. Its parameters and detection algorithm are optimized to ensure accurate identification of internal defects and provide important information for quality evaluation. The detection results are fed back to the control system in real time to process and classify the crystal grains. The hidden crack detection unit 303 and the five-face appearance detection unit 302 are reasonably arranged on the turret to realize comprehensive detection of internal and external defects of the crystal grain and improve the detection precision of product quality.

[0049] The front appearance detection unit 304 is arranged opposite to the position where the crystal grain is placed on the auxiliary support disc 403, which includes a vision unit and a reflection component due to space limitations. The vision unit contains a high-resolution camera and an advanced image processing system, which can accurately capture and deeply analyze the image of the crystal grain. The reflection component is placed between the auxiliary support disc 403 and the vision unit, which skillfully reflects the shooting direction of the camera to the front of the crystal grain to complete the front information shooting task. After the crystal grain is placed on the auxiliary support disc 403, the unit starts immediately. First, adjust the angle of the reflection component to ensure clear imaging of the front of the crystal grain by the camera, and then capture the image with the help of the reflection component. The image processing system then analyzes the image in detail to accurately identify front defects or abnormalities, including scratches, cracks, pits and other types of defects. Once a defect is found, the system immediately records the relevant information and classifies or marks the crystal grain according to the preset rules to provide clear guidance for subsequent processing. This design skillfully deals with space limitations, quickly and accurately detects the front quality after the crystal grain is placed, and greatly improves the detection efficiency and accuracy. In this embodiment, the front appearance detection unit 304 has a dual function, on the one hand, it detects the appearance of the crystal grain, and on the other hand, it also performs positioning when the crystal grain is placed on the auxiliary support disc 403. Specifically, during the process of placing the crystal grain, the position where the crystal grain is to be placed on the auxiliary support disc 403 needs to be accurately moved to the pre-set placement position of the suction nozzle, so as to ensure that the crystal grain can be accurately placed on the specified position of the auxiliary support disc 403, thereby ensuring the accuracy and efficiency of the entire crystal grain placement process.

[0050] A nozzle detection unit 305 is provided at a downstream position of the secondary carrier disk 403 for detecting the state of the nozzle before picking up the die, determining whether it is dirty or worn. This unit uses a high-precision vision system to monitor the cleanliness and integrity of the nozzle in real time, ensuring that the nozzle is in good condition before operation, improving the reliability and accuracy of the picking process. A nozzle cleaning unit 306 is provided on the primary carrier disk 402 or the secondary carrier disk 403, sharing a drive mechanism, which can automatically clean after the nozzle is detected, optimizing space utilization, improving maintenance efficiency, ensuring that the nozzle is in the best state before each use, and reducing production defects. In this embodiment, the nozzle cleaning unit 306 is provided on the primary carrier disk 402, and after the nozzle is detected by the detection unit, if it is found to be dirty, it is cleaned before being moved to the primary carrier disk 402 to pick up the die. In other embodiments, the nozzle cleaning unit 306 can also be provided on the periphery of the turret, after the detection unit, and cleaned immediately after detection.

[0051] As Figures 12-13As shown, the carrying module 5 includes a rack 501 and at least two mechanical hands arranged on the rack 501. The mechanical hands are moved by a driving mechanism mounted on the rack 501 and can be flexibly operated on the rack 501. The rack 501 is designed in an XY gantry structure, so that the mechanical hands can be accurately adjusted in the X-axis and Y-axis directions. In addition, the mechanical hands are connected with the rack 501 through a Z-axis driving mechanism, the mechanical hands are mounted on the driving end of the Z-axis driving mechanism and can move up and down, thereby enhancing the flexibility and adaptability of the whole carrying module 5. In this embodiment, the first mechanical hand 502 is used to transfer wafers between the feeding and discharging module 1 and the buffer module 2, and the second mechanical hand 503 is used to transfer wafers between the buffer module 2 and the wafer arranging module 4. Each mechanical hand is provided with a clamping arm connected with the mechanical hand body through a 90° rotary joint and a 360° rotary joint. The clamping arm can rotate 360° around the connection end, and when the mechanical hand picks up a wafer from the buffer module 2 and transfers it to the main carrier disc 402 or the auxiliary carrier disc 403 of the wafer arranging module 4, the picked-up wafer is rotated by means of the 360° rotary joint, so that the front surface of the wafer always faces outward. At the same time, the clamping arm can move in the vertical direction by means of the 90° rotary joint, and when the mechanical hand picks up a wafer from the feeding and discharging module 1 and transfers it to the buffer module 2, the wafers in the magazine of the feeding and discharging module 1 are placed horizontally, and the mechanical hand can be vertically rotated 90° by means of the 90° rotary joint, so that the clamping arm can pick up the horizontally placed wafer, and after picking up, the wafer is placed in the vertical direction in the magazine of the buffer module 2. This design enables the mechanical hand to accurately pick up and place the wafer at different heights and angles, not only significantly improves the flexibility and adaptability of the mechanical hand, but also effectively reduces the risk of damaging the wafer during the transfer process, and ensures the integrity and safety of the wafer during the whole carrying process. In addition, a scanning component is arranged on each mechanical hand for scanning and identifying the barcode on each wafer, so as to realize effective tracking and management of the wafer.

[0052] The wafer arranging device meets the unmanned workshop operation standard of 10-level clean level, can be connected with the overhead crane full-automatic feeding and discharging system, and realizes efficient wafer processing. At the same time, the wafer arranging device has the ability of film-to-film wafer arranging, and can automatically optically detect (AOI) and infrared detect (IR) the six surfaces of the wafer.

[0053] The utility model also provides a kind of wafer AOI film-to-film wafer arranging device's working method, which is based on the above-mentioned wafer arranging device, and specifically includes the following steps:

[0054] Firstly, the overhead crane system transports a plurality of cassettes containing wafers to be processed and empty cassettes to the loading platform of the loading and unloading module 1 in a certain order. Inside the loading and unloading module 1, the transfer mechanism 104 starts to work, which moves the received cassettes containing wafers to be processed and empty cassettes to the buffer station 102 for temporary storage. Then, according to the system instructions, the transfer mechanism 104 accurately operates to transfer the cassette containing wafers to be processed to the transfer station 103, and at the same time, the empty cassette is transferred to another transfer station 103.

[0055] Next, the first mechanical arm 502 of the carrying module 5 moves to the transfer station 103. After arriving, the first mechanical arm 502 first turns 90°, then clamps the wafer to be processed from the cassette in the transfer station 103, and after clamping is completed, restores itself to the initial angle, and then moves to the buffer module 2 with the help of the driving mechanism on the rack 501, and places the clamped wafer into the empty cassette. Subsequently, the first mechanical arm 502 clamps the empty film from another transfer station 103, and after successfully clamping the empty film, the first mechanical arm 502 horizontally rotates the empty film by 180°, and then moves towards the empty cassette of the buffer module 2 and places it therein. The purpose of this is to ensure that the empty film is outwardly facing when it is moved to the secondary carrier disc 403.

[0056] The second mechanical arm 503 of the carrying module 5 moves to the buffer module 2. The second mechanical arm 503 takes out the wafer to be processed from the empty cassette of the buffer module 2, moves to the wafer sorting module 4 through the driving mechanism on the rack 501, and places the wafer to be processed on the primary carrier disc 402; and takes out the empty film from the empty cassette, and places it on the OK carrier disc and the NG carrier disc, respectively.

[0057] Then, the picking device 401 starts. The nozzle of the turret sucks the wafer from the same position of the primary carrier disc 402, and after sucking, the nozzle rotates by 30° and moves to the rotation correction unit 301. At the rotation correction unit 301, the nozzle moves forward under the drive of its own driving mechanism, so that the wafer is placed on the rotation correction unit 301 for rotation correction. After correction, the next nozzle sucks the wafer to continue the subsequent process.

[0058] The suction nozzle rotates 30° again and moves to the five-face appearance detection unit 302, where the suction nozzle moves the wafer into the reflection mechanism of the five-face appearance detection unit 302 for appearance detection of the back surface and four sides of the wafer. After the appearance detection is completed, the suction nozzle continues to rotate 30° and then moves the wafer into the reflection mechanism of the internal crack detection unit 303 for internal crack detection. After the detection is completed, the suction nozzle rotates 30° again. If the previous appearance detection and crack detection are both qualified, the drive mechanism of the auxiliary carrier disk 403 moves the OK carrier disk to the wafer placement position, and the suction nozzle places the wafer on the OK carrier disk. If the previous detection is not qualified, the drive mechanism of the auxiliary carrier disk 403 moves the NG carrier disk to the wafer placement position, and the suction nozzle places the wafer on the NG carrier disk.

[0059] During the wafer sorting process, the following principles should be followed: the same grade of wafers are sequentially sucked from the wafers to be sorted on the main carrier disk 402. For the qualified wafers sucked, they are placed on the OK carrier disk of the auxiliary carrier disk 403. When all the wafers of the same grade are sucked, the empty film on the OK carrier disk needs to be replaced in time. Subsequently, the above wafer sorting process is repeated to continue sorting the wafers of the same grade to a new empty film until all the wafers of the wafer to be sorted are completed. By this method, the efficiency and accuracy of wafer classification and sorting are ensured, thereby significantly improving the overall efficiency of the production process and product quality.

[0060] After the wafer to be sorted is completed, the second robot 503 transfers the wafer to the designated box in the buffer module 2. For the empty film on the OK carrier disk, the second robot 503 places it in the corresponding grade box in the buffer module 2 according to the grade of the wafer carried. When the unqualified wafer on the NG carrier disk reaches the full load state, the second robot 503 transfers it to the unqualified box in the buffer module 2. The wafer finally completed sorting is transferred by the first robot 502 to the loading and unloading module 1 and is transported away by the crown block system. This process ensures efficient classification and storage of wafers, improving overall production efficiency and product quality.

[0061] The wafer AOI film-to-film chip arranging equipment is designed for wafer chip arranging and detecting in the process of semiconductor integrated circuit fan-out wafer level packaging manufacturing. The equipment adopts an unmanned feeding and discharging module 1, accurately transports the material box to the feeding platform through a crown block system, and sequentially takes out the wafer from the material box by a manipulator and arranges and detects the wafer, so that manual intervention is not needed in the whole process. The fully automatic operation not only greatly reduces manual intervention and avoids human errors, but also significantly improves production efficiency and reduces production cost, and brings an efficient and reliable production mode for the semiconductor manufacturing industry. The equipment is designed according to the Class 10 dust-free workshop standard, adopts an advanced pollution treatment mode, effectively reduces pollution sources, and ensures stable operation in a high-cleanliness production environment. The equipment integrates a global leading AOI detection system, can comprehensively detect the front surface, back surface and four side surfaces of the wafer, is equipped with an IR hidden crack detection unit 303, and can detect the hidden crack condition inside the wafer. Through omnibearing and multilevel detection, the equipment can identify and classify the appearance defects and internal hidden crack problems of the wafer in real time, ensure high quality and high reliability of the product, and meet the stringent requirements of the semiconductor manufacturing industry on product quality.

[0062] It should be noted that, for those skilled in the art of the present technology, without departing from the principles of the present utility model, the present utility model can be improved and modified in several ways, and these improvements and modifications also fall within the scope of protection of the claims of the present utility model.

Claims

1. A wafer AOI film-to-film de-stacking apparatus, characterized by, The device comprises: a sorting module (4) comprising a picking device (401), at least one vertically arranged main carrier disc (402) for carrying the wafer to be processed, and at least two vertically arranged sub-carrier discs (403) for carrying the qualified empty wafer and the unqualified empty wafer respectively; a detection module (3) comprising a rotation correction unit (301), a five-side appearance detection unit (302), a hidden crack detection unit (303), and a front appearance detection unit (304) arranged in sequence around the picking device (401) for six-side and internal detection of the die on the wafer to be processed; the picking device (401) obtains the die from the wafer to be processed, and through the detection of the detection module (3), the die of the same grade is placed on the same qualified empty wafer, and the unqualified die is placed on the unqualified empty wafer.

2. The apparatus of claim 1, wherein, The picking device (401) comprises a turret and a plurality of adsorption assemblies, the adsorption assemblies are equidistantly arranged around the turret, and are used for sucking and transferring the die from the main carrier disc (402); and each unit in the detection module (3) is arranged around the turret and matches the rotation angle of the adsorption assemblies.

3. The apparatus of claim 2, wherein, The detection module (3) further comprises a suction nozzle detection unit (305) and a suction nozzle cleaning unit (306), the suction nozzle detection unit (305) is arranged at a downstream position of the sub-carrier disc (403) and is used for detecting whether the suction nozzle is dirty or worn; and the suction nozzle cleaning unit (306) is arranged on the main carrier disc (402) or the sub-carrier disc (403) and shares a driving mechanism with the main carrier disc (402) or the sub-carrier disc (403), and is used for cleaning the suction nozzle.

4. The apparatus of claim 1, wherein, The rotation correction unit (301) comprises a mounting base (3011), a die placement platform (3012), a θ-direction driving mechanism (3013), an X-direction driving mechanism (3014), a Z-direction driving mechanism (3015), and a vision unit, the die placement platform (3012) is arranged at the driving end of the θ-direction driving mechanism (3013), the lower end of the θ-direction driving mechanism (3013) is connected with the driving end of the X-direction driving mechanism (3014) through a first connecting plate, and the driving end of the Z-direction driving mechanism (3015) is connected with the side edges of the θ-direction driving mechanism (3013) and the X-direction driving mechanism (3014) through a second connecting plate.

5. The apparatus of claim 1, wherein, The five-side appearance detection unit (302) comprises a camera and a first reflection mechanism, the camera faces the back of the die, and the first reflection mechanism reflects the images of the four sides of the die to the camera for appearance detection of the five sides; the hidden crack detection unit (303) comprises an infrared camera and a second reflection mechanism, the infrared camera faces the back of the die, and the second reflection mechanism reflects the infrared images of the four sides of the die to the infrared camera for internal defect detection of the die.

6. The apparatus of claim 1, wherein, The front appearance detection unit (304) comprises a visual component and a light reflection component, the light reflection component is arranged in front of the die placement position of the sub-carrier disc (403), and the visual component is arranged above the light reflection component, the light reflection component refracts the front of the die to the visual component for front appearance detection.

7. The apparatus of claim 1, wherein, The main carrier disc (402) and the sub-carrier disc (403) are arranged oppositely, and the picking device (401) is arranged between the two; the main carrier disc (402) and the sub-carrier disc (403) are both provided with an X-axis driving mechanism, a Z-axis driving mechanism and a rotating mechanism, which are used for adjusting the positions of the main carrier disc (402) and the sub-carrier disc (403) in X direction and Z direction, and adjusting the main carrier disc (402) and the sub-carrier disc (403) from vertical placement to horizontal placement.

8. The apparatus of claim 1, wherein, Further comprising: The buffer module (2) is provided with a plurality of buffer areas for classified storage of qualified wafer chips, unqualified wafer chips, empty film pieces and wafer chips to be processed; The qualified wafer chips of the same grade after the wafer chip sorting are placed on the same empty film piece, and the empty film pieces of the same grade are placed in the same box.

9. The apparatus of claim 1, wherein, Further comprising: The feeding and discharging module (1) comprises a rack (101), a plurality of buffer stations (102) and at least two transfer stations (103) inside the rack (101) for placing the boxes, and two feeding and discharging platforms (105), one side of the rack (101) is provided with a transfer mechanism (104) for transferring the boxes between the feeding and discharging platforms (105), the buffer stations (102) and the transfer stations (103).

10. The apparatus of claim 1, wherein, Further comprising: The carrying module (5) comprises a rack (501) and a first mechanical hand (502) and a second mechanical hand (503) arranged on the rack (501), which are used for carrying the wafer chips between the modules.

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