Radio frequency microwave module bonding jig and system
By designing a heating base plate and multiple removable pad hot plates in the RF microwave module bonding fixture, and using a vacuum source to evacuate, compatibility with different module thicknesses is achieved. This solves the problems of high cost and long time in the existing technology, and realizes cost reduction and management convenience.
Patent Information
- Application Number
- CN202520100400.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-01-15
AI Technical Summary
Existing technologies require the separate fabrication of bonding fixtures for RF microwave modules of different sizes, resulting in high R&D and manufacturing costs, long processing times, and complex management.
Design a radio frequency microwave module bonding fixture, including a heating base plate and multiple pad hot plates of different thicknesses. By opening adsorption through holes on the heating base plate and using a vacuum source to evacuate the vacuum, combined with detachable pad hot plates, compatibility with different module thicknesses can be achieved.
It reduces the research and development and manufacturing costs of bonding fixtures, shortens the processing cycle, facilitates fixture management and maintenance, and achieves compatibility of the same bonding fixture with different module thicknesses.
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Figure CN223912876U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of radio frequency microwave technology, in particular, to a radio frequency microwave module bonding jig and system. BACKGROUND
[0002] With the continuous development of science and technology, radio frequency microwave technology is increasingly widely used in various industries. In order to meet the radio frequency microwave needs of different industries and different enterprises, the module structure and module size of the radio frequency microwave module manufactured based on radio frequency microwave technology show a diversified evolution trend, which leads to the fact that the general packaging bonding equipment cannot directly realize bonding processing when facing some radio frequency microwave modules with specific module sizes (for example, the module thickness is too large or too small, and the module length and width size is too large or too small). Therefore, a set of size-adapted bonding jig needs to be separately made for these radio frequency microwave modules, so as to ensure that the packaging bonding equipment can effectively realize the packaging bonding effect for the corresponding radio frequency microwave module by using the bonding jig.
[0003] It is worth noting that because a set of size-adapted bonding jig needs to be separately made for radio frequency microwave modules with different module sizes, the development cost and manufacturing cost of the bonding jig are greatly increased, and a large amount of time is needed to manufacture the bonding jig during the radio frequency microwave module processing process, which is not conducive to the radio frequency microwave module processing and production, and is prone to the phenomenon of complex jig models, which is not conducive to the management and maintenance of the jig. CONTENT OF THE INVENTION
[0004] Therefore, the purpose of the present application is to provide a radio frequency microwave module bonding jig and a radio frequency microwave module bonding system, which can effectively adapt to the bonding needs of radio frequency microwave modules with different module thickness sizes by using the same bonding jig, reduce the development cost and manufacturing cost of the bonding jig, effectively shorten the radio frequency microwave module processing cycle, and facilitate the management and maintenance of the jig.
[0005] In order to achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:
[0006] In a first aspect, the present application provides a radio frequency microwave module bonding jig, which comprises a heating bottom plate and a plurality of pad thermal plates with different thicknesses, wherein a first suction through hole is formed on the heating bottom plate, and each pad thermal plate is provided with a second suction through hole at a position corresponding to the first suction through hole.
[0007] The first adsorption through hole is communicated with a vacuum source at a first bottom plate surface of the heating bottom plate, and the first adsorption through hole is vacuumized by the vacuum source to fix the to-be-bonded radio frequency microwave module on a second bottom plate surface of the heating bottom plate through at least one cushion heat plate or directly.
[0008] In an optional embodiment, the number of through holes of the first adsorption through hole is the same as the number of through holes of the second adsorption through hole on each cushion heat plate, and the number of through holes of the first adsorption through hole is at least one.
[0009] In an optional embodiment, when the number of through holes of the first adsorption through hole is multiple, multiple first adsorption through holes are arrayed on the second bottom plate surface.
[0010] In an optional embodiment, the heating bottom plate is provided with at least one first auxiliary adsorption groove on the second bottom plate surface, and a groove bottom of each first auxiliary adsorption groove is communicated with at least one first adsorption through hole.
[0011] In an optional embodiment, each cushion heat plate is provided with at least one second auxiliary adsorption groove on a heat plate surface for adsorbing and fixing a radio frequency microwave module or other cushion heat plates, and a groove bottom of each second auxiliary adsorption groove is communicated with at least one second adsorption through hole on the corresponding cushion heat plate.
[0012] In an optional embodiment, a groove projection shape of each first auxiliary adsorption groove on the second bottom plate surface is any one of a rectangular shape, a circular shape, an elliptical shape, a waist shape, and an X shape.
[0013] A groove projection shape of each second auxiliary adsorption groove on the corresponding heat plate surface is any one of a rectangular shape, a circular shape, an elliptical shape, a waist shape, and an X shape.
[0014] In an optional embodiment, the heating bottom plate is provided with multiple first positioning holes, and each cushion heat plate is provided with a positioning pin at a position corresponding to part of the first positioning holes on a second heat plate surface, and the first heat plate surface and the second heat plate surface of the same cushion heat plate are mutually away from each other.
[0015] The at least one cushion heat plate is detachably assembled on the heating bottom plate through plug-in connection between the positioning pin and the first positioning hole.
[0016] In an optional embodiment, the heating bottom plate is respectively provided with at least one auxiliary limiting block on two opposite plate body sides, and the at least one auxiliary limiting block is used to assist the heating bottom plate in through-hole alignment with the at least one cushion block hot plate.
[0017] In an optional embodiment, the bonding jig further comprises a module clamping unit, the module clamping unit comprising an elastic member, two limiting members and two abutting members.
[0018] The two limiting members are respectively arranged on two opposite plate body sides of the heating bottom plate or the target cushion block hot plate which directly contact the to-be-bonded radio frequency microwave module, each limiting member is fixedly connected with one abutting member through the elastic member, and the two abutting members abut against each other under the action of the corresponding elastic member to fix the to-be-bonded radio frequency microwave module on the heating bottom plate or the target cushion block hot plate.
[0019] In a second aspect, the application provides a radio frequency microwave module bonding system, the bonding system comprising a packaging bonding device and the radio frequency microwave module bonding jig according to any one of the preceding embodiments, the packaging bonding device being used to realize the packaging bonding function of the radio frequency microwave module.
[0020] The radio frequency microwave module bonding jig is detachably installed in the packaging bonding device and is used to adsorb and fix the to-be-bonded radio frequency microwave module, so that the to-be-bonded part of the to-be-bonded radio frequency microwave module is located in the effective bonding working space of the packaging bonding device.
[0021] In this case, the beneficial effects of the embodiments of the application can include the following:
[0022] The application opens a first adsorption through hole on the heating bottom plate, and opens a second adsorption through hole at a position corresponding to the first adsorption through hole for each pad hot plate with different thicknesses, and then connects the first adsorption through hole with a vacuum source on the first bottom plate surface of the heating bottom plate, so that in the case of vacuumizing the first adsorption through hole by the vacuum source, the to-be-bonded radio frequency microwave module can be adsorbed and fixed on the second bottom plate surface of the heating bottom plate through at least one pad hot plate or directly, and is within the effective bonding working space range of the packaging bonding equipment under the cooperation of the thickness of at least one pad hot plate and the heating bottom plate, or the thickness of the heating bottom plate acts independently, to ensure that the corresponding packaging bonding equipment can effectively realize the packaging bonding effect for the to-be-bonded radio frequency microwave module, so as to effectively compatible the radio frequency microwave module bonding requirements of different module thickness sizes through the same bonding fixture, reduce the research and development cost and manufacturing cost of the bonding fixture, and effectively shorten the processing cycle of the radio frequency microwave module, facilitate the management and maintenance of the fixture. When at least one pad hot plate is between the to-be-bonded radio frequency microwave module and the heating bottom plate, the at least one pad hot plate is detachably assembled on the second bottom plate surface of the heating bottom plate, and the second adsorption through hole of the at least one pad hot plate and the first adsorption through hole of the heating bottom plate are in communication with each other.
[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.
[0025] Figure 1 One of the composition schematic diagram of the radio frequency microwave module bonding fixture provided by the embodiments of the present application;
[0026] Figure 2 The second composition schematic diagram of the radio frequency microwave module bonding fixture provided by the embodiments of the present application;
[0027] Figure 3 The third composition schematic diagram of the radio frequency microwave module bonding fixture provided by the embodiments of the present application;
[0028] Figure 4 The fourth composition schematic diagram of the radio frequency microwave module bonding fixture provided by the embodiments of the present application;
[0029] Figure 5Figure 5 is a schematic view of a fifth embodiment of a radio frequency microwave module bonding jig provided by the present application.
[0030] Figure 1 is a schematic view of a first embodiment of a radio frequency microwave module bonding jig provided by the present application. Figure 2 is a schematic view of a second embodiment of a radio frequency microwave module bonding jig provided by the present application. Figure 3 is a schematic view of a third embodiment of a radio frequency microwave module bonding jig provided by the present application. Figure 4 is a schematic view of a fourth embodiment of a radio frequency microwave module bonding jig provided by the present application. DETAILED DESCRIPTION
[0031] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.
[0033] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0034] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0035] In addition, the terms "first", "second", "third", and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance.
[0036] It should be noted that, in the description of the present application, unless specifically defined and limited, the terms "set", "install", "connect", "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0037] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following examples and features in the examples can be combined with each other without conflict.
[0038] Please refer to Figure 1 and Figure 2 , wherein Figure 1 is one of the composition schematic diagrams of the radio frequency microwave module bonding jig 10 provided by the embodiments of the present application, Figure 2 is the second composition schematic diagram of the radio frequency microwave module bonding jig 10 provided by the embodiments of the present application. In the embodiments of the present application, the radio frequency microwave module bonding jig 10 can effectively meet the bonding requirements of radio frequency microwave modules with different module thickness sizes, and assist the radio frequency microwave modules with different module thickness sizes to achieve the effect of packaging bonding at the packaging bonding equipment.
[0039] In the embodiments of the present application, the radio frequency microwave module bonding jig 10 can include a heating bottom plate 11 and a plurality of cushion heat plates 12; wherein the length and width dimensions of the plate surface of each of the plurality of cushion heat plates 12 are the same (for example, the length of the plate surface of each of the plurality of cushion heat plates 12 is 11.6mm, and the width of the plate surface of each of the plurality of cushion heat plates 12 is 11mm), and the length and width dimensions of the plate surface of the heating bottom plate 11 are slightly larger than the length and width dimensions of the plate surface of any one of the cushion heat plates 12 (for example, the length of the plate surface of the heating bottom plate 11 is 12mm, and the width of the plate surface of the heating bottom plate 11 is 11mm); the thicknesses of the plate bodies of the plurality of cushion heat plates 12 are different from each other (for example, the thickness of the plate body of a certain cushion heat plate 12 is 2.2mm, and the thickness of the plate body of another cushion heat plate 12 is 3.2mm), and the thickness of the plate body of the heating bottom plate 11 is greater than the thickness of the plate body of each of the plurality of cushion heat plates 12 (for example, the thickness of the plate body of the heating bottom plate 11 is 4.6mm).
[0040] In the embodiment of the present application, the heating base plate 11 is provided with a first adsorption through hole 113, which penetrates through the opposite two base plate surfaces of the heating base plate 11 (including the first base plate surface 111 for connecting the vacuum source, and the second base plate surface 112 for contacting the cushion hot plate 12 or the radio frequency microwave module); each cushion hot plate 12 is provided with a second adsorption through hole 121 at the position corresponding to the first adsorption through hole 113, and each second adsorption through hole 121 in the same cushion hot plate 12 penetrates through the opposite two hot plate surfaces of the cushion hot plate 12 (including the first hot plate surface for adsorbing and fixing the radio frequency microwave module or other cushion hot plates, and the second hot plate surface opposite to the first hot plate surface), wherein the number of the second adsorption through holes on a single cushion hot plate 12 is the same as the number of the first adsorption through holes on the heating base plate 11. In an implementation form of the embodiment, the heating base plate 11 is provided with only one first adsorption through hole 113, and each of the plurality of cushion hot plates 12 is also provided with only one second adsorption through hole 121, wherein the hole surface diameter of each of the first adsorption through hole 113 and the second adsorption through hole 121 can be 4 mm.
[0041] In the embodiment of the present application, when the to-be-bonded radio frequency microwave module only needs to be in the effective bonding working space range of the packaging and bonding equipment under the assistance of the heating base plate 11, the first adsorption through hole 113 can be connected to the vacuum source on the side of the first base plate surface 111 of the heating base plate 11, and the to-be-bonded radio frequency microwave module is placed on the second base plate surface 112 of the heating base plate 11, at this time, the vacuum source can be used to perform vacuumizing treatment on the first adsorption through hole 113, so that the to-be-bonded radio frequency microwave module is directly adsorbed and fixed on the second base plate surface 112 of the heating base plate 11, thereby ensuring that the to-be-bonded radio frequency microwave module can be in the effective bonding working space range of the packaging and bonding equipment under the independent action of the thickness of the heating base plate 11, so as to ensure that the packaging and bonding equipment can effectively realize the packaging and bonding effect for the to-be-bonded radio frequency microwave module.
[0042] In the embodiment of the present application, when the to-be-bonded radio frequency microwave module needs to be in the effective bonding workspace range of the packaging and bonding device under the synergistic action of the heating base plate 11 and at least one pad heat plate 12, the first adsorption through hole 113 of the heating base plate 11 can be directly connected to the vacuum source on the side of the first base plate surface 111 of the heating base plate 11, and at least one pad heat plate 12 meeting the bonding requirements of the to-be-bonded radio frequency microwave module can be detachably assembled on the second base plate surface 112 of the heating base plate 11, so that the second adsorption through hole 121 of each of the at least one pad heat plate 12 is in communication with the position corresponding first adsorption through hole 113, and then the to-be-bonded radio frequency microwave module is placed on the first heat plate surface of the target pad heat plate (i.e. the pad heat plate 12 farthest from the heating base plate 11 among the at least one pad heat plate 12). At this time, the vacuum source can be used to perform vacuumizing treatment on the first adsorption through hole 113, so as to perform vacuumizing treatment on the adsorption channel formed by the communication between the first adsorption through hole 113 and the second adsorption through hole 121, so as to adsorb and fix the to-be-bonded radio frequency microwave module on the second base plate surface 112 of the heating base plate 11 through the at least one pad heat plate 12. Thus, the to-be-bonded radio frequency microwave module can be in the effective bonding workspace range of the packaging and bonding device under the synergistic action of the thickness of the heating base plate 11 and the at least one pad heat plate 12, so as to ensure that the packaging and bonding device can effectively realize the packaging and bonding effect for the to-be-bonded radio frequency microwave module. Wherein, the at least one pad heat plate 12 can be detachably connected to the heating base plate 11 through buckle connection, threaded fastening connection, plug-in connection and the like; when the number of heat plates of the at least one pad heat plate 12 is multiple, the multiple pad heat plates 12 can also be detachably connected to each other in a stacked manner through buckle connection, threaded fastening connection, plug-in connection and the like, so that the thicknesses of the plate bodies of the multiple pad heat plates 12 can be stacked together.
[0043] Optionally, in the embodiment of the present application, a plurality of first positioning holes 115 are formed on the heating base plate 11, and each cushion heat plate 12 is provided with a positioning pin 123 at a position corresponding to part of the first positioning holes 115 on the second heat plate surface of the cushion heat plate 12, so that when at least one cushion heat plate 12 needs to be assembled on the heating base plate 11, the at least one cushion heat plate 12 can be detachably assembled on the heating base plate 11 by plugging the positioning pin 123 of each cushion heat plate 12 into the first positioning hole 115 on the heating base plate 11. When a plurality of cushion heat plates 12 need to be stacked on the heating base plate 11, second positioning holes can be formed on each cushion heat plate 12 at positions corresponding to the remaining first positioning holes 115 except the positioning pin 123, so that any two cushion heat plates 12 can be stacked by plugging the second positioning hole into the positioning pin 123.
[0044] Optionally, in the embodiment of the present application, at least one auxiliary limiting block 116 is mounted on the heating base plate 11 on the opposite two plate body sides, and the at least one auxiliary limiting block 116 assists the heating base plate 11 in the through hole alignment with the at least one cushion heat plate 12 (including the through hole alignment between the first adsorption through hole 113 and the second adsorption through hole 121).
[0045] Therefore, the radio frequency microwave module bonding jig 10 provided by the present application can effectively meet the bonding requirements of radio frequency microwave modules of different thickness sizes by increasing, decreasing or replacing the cushion heat plates, so that the radio frequency microwave modules of different thickness sizes can be placed in the effective bonding working space of the packaging and bonding equipment, ensuring that the packaging and bonding equipment can achieve the packaging and bonding effect for the to-be-bonded radio frequency microwave module, without the need to separately manufacture a set of size-adapted bonding jig for different module thickness sizes, thereby reducing the research and development cost and manufacturing cost of the bonding jig, shortening the processing cycle of the radio frequency microwave module, and facilitating the jig management and maintenance effect.
[0046] Optionally, please refer to Figure 3 , Figure 3 is a third constituent diagram of the radio frequency microwave module bonding jig 10 provided by the embodiment of the present application. In the embodiment of the present application, the number of first adsorption through holes formed on the heating base plate 11 of the radio frequency microwave module bonding jig 10 is a plurality, and the plurality of first adsorption through holes 113 are arrayed on the second bottom plate surface 112 of the heating base plate 11 (for example, the 9 first adsorption through holes 113 in Figure 3 are arrayed in a 3x3 array), at this time, the number of second adsorption through holes on each cushion heat plate 12 is also a plurality, and the plurality of second adsorption through holes 121 on the same cushion heat plate 12 are also arrayed (for example,Figure 3 The 9 second adsorption through holes 121 on each pad hot plate 12 are arranged in a 3x3 array to improve the adsorption capacity of the radio frequency microwave module bonding jig 10 to the radio frequency microwave module. The more the first adsorption through holes, the smaller the hole face diameter of a single first adsorption through hole 113 can be.
[0047] Optionally, please refer to Figure 4 , Figure 4 is a fourth constituent diagram of the radio frequency microwave module bonding jig 10 provided by the embodiments of the present application. In the embodiments of the present application, at least one first auxiliary adsorption groove 114 is formed on the second bottom plate surface 112 of the heating bottom plate 11, so that the groove bottom of each first auxiliary adsorption groove 114 is in communication with at least one first adsorption through hole 113. When the heating bottom plate 11 is in contact with the second hot plate surface of the radio frequency microwave module or a certain pad hot plate 12, each first auxiliary adsorption groove 114 on the heating bottom plate 11 will be in close contact with the contact object (i.e. the radio frequency microwave module or a certain pad hot plate 12) to form a cavity, and the adsorption area of the contact object can be increased under the action of the vacuum source, so as to prevent the corresponding radio frequency microwave module from moving during the bonding process.
[0048] For each first auxiliary adsorption groove 114 formed on the heating bottom plate 11, the groove projection shape on the second bottom plate surface 112 is any one of a rectangle, a circle, an ellipse, a waist shape, and an X shape.
[0049] Optionally, in the embodiments of the present application, the radio frequency microwave module bonding jig 10 can also form at least one second auxiliary adsorption groove 122 on the first hot plate surface of each pad hot plate 12, so that the groove bottom of each second auxiliary adsorption groove 122 is in communication with at least one second adsorption through hole 121. When the corresponding pad hot plate 12 is in contact with the second hot plate surface of the radio frequency microwave module or other pad hot plates 12, each second auxiliary adsorption groove 122 on the pad hot plate 12 will be in close contact with the contact object (i.e. the radio frequency microwave module or other pad hot plates 12) to form a cavity, and the adsorption area of the contact object can be increased under the action of the vacuum source, so as to prevent the corresponding radio frequency microwave module from moving during the bonding process.
[0050] For any one of the second auxiliary adsorption grooves 122 in each pad hot plate 12, the groove projection shape of the second auxiliary adsorption groove 122 on the corresponding second hot plate surface is any one of a rectangle, a circle, an ellipse, a waist shape, and an X shape.
[0051] In the first implementation of the embodiment, each first adsorption through hole 113 in the radio frequency microwave module bonding jig 10 is individually equipped with a first auxiliary adsorption groove 114, and each second adsorption through hole 121 in the radio frequency microwave module bonding jig 10 is also individually equipped with a second auxiliary adsorption groove 122.
[0052] In the second implementation of the embodiment, all first adsorption through holes 113 in the radio frequency microwave module bonding jig 10 share the same first auxiliary adsorption groove 114, and all second adsorption through holes 121 on each cushion heat plate 12 in the radio frequency microwave module bonding jig 10 share the same second auxiliary adsorption groove 122.
[0053] Optionally, please refer to Figure 5 , Figure 5 is the fifth component schematic diagram of the radio frequency microwave module bonding jig 10 provided by the embodiment. In the embodiment, the radio frequency microwave module bonding jig 10 can further include a module clamping unit 13, which is used for the fixing requirements of radio frequency microwave modules with different module length and width sizes, wherein the module clamping unit 13 can include an elastic member 131 (for example, a spring), two limiting members 132, and two abutting members 133.
[0054] In the embodiment, the two limiting members 132 are respectively installed on the two plate body side surfaces opposite to the heating bottom plate 11 directly contacting the radio frequency microwave module to be bonded, or the two limiting members 132 are respectively installed on the two plate body side surfaces opposite to the target cushion heat plate directly contacting the radio frequency microwave module to be bonded; each limiting member 132 of the two limiting members 132 is fixedly connected with one abutting member 133 through at least one elastic member 131, so that the two abutting members 133 can abut against each other with the radio frequency microwave module to be bonded under the action of the corresponding elastic member 131, so as to fix the radio frequency microwave module to be bonded on the heating bottom plate 11 or the target cushion heat plate, thereby realizing the bonding and fixing effect of radio frequency microwave modules with different module length and width sizes.
[0055] It can be understood that for each plate structure of the heating bottom plate 11 and the plurality of cushion heat plates 12 included in the radio frequency microwave module bonding jig 10, a sliding groove matched with the two abutting pieces 133 can be opened on the plate surface of the corresponding plate structure for adsorbing the radio frequency microwave module (for example, the second bottom plate surface 112 and the first heat plate surface of each cushion heat plate 12), so that the two abutting pieces 133 can be limited and accommodated by the sliding groove when installed on a certain plate structure, facilitating the effective movement range of the two abutting pieces 133 on the corresponding plate structure, and ensuring that the module clamping unit 13 can meet the bonding requirements of radio frequency microwave modules of different module sizes compatible with the heating bottom plate 11 and the plurality of cushion heat plates 12.
[0056] In the present application, the embodiments of the present application also provide a radio frequency microwave module bonding system, which comprises a packaging bonding device and any one of the radio frequency microwave module bonding jigs 10 described above, wherein the packaging bonding device is used to realize the packaging bonding function of the radio frequency microwave module.
[0057] Among them, the radio frequency microwave module bonding jig 10 is detachably installed in the packaging bonding device, and through the way of increasing, decreasing or replacing the cushion heat plate, the to-be-bonded radio frequency microwave module is adsorbed and fixed under the action of the vacuum source, so that the to-be-bonded part of the to-be-bonded radio frequency microwave module is located in the effective bonding working space of the packaging bonding device, and the corresponding packaging bonding device can effectively realize the packaging bonding effect for the to-be-bonded radio frequency microwave module, so as to effectively compatible with the radio frequency microwave module bonding work of different module thickness sizes through the same bonding jig, without the need to separately manufacture a set of size-matched bonding jig for different module thickness sizes, thereby reducing the research and development cost and manufacturing cost of the bonding jig, shortening the processing period of the radio frequency microwave module, and facilitating the jig management and maintenance effect.
[0058] The above is only various embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A radio frequency microwave module bonding fixture, characterized by, The bonding jig comprises a heating base plate and a plurality of cushion heat plates with different thicknesses, wherein the heating base plate is provided with first suction through holes, and each cushion heat plate is provided with second suction through holes at positions corresponding to the first suction through holes; The first suction through holes are communicated with a vacuum source at a first base plate surface of the heating base plate, and the first suction through holes are vacuumized by the vacuum source to fix the to-be-bonded radio frequency microwave module on a second base plate surface of the heating base plate through at least one cushion heat plate or directly; 2. The bonding tool of claim 1, wherein The number of the first suction through holes is at least one, and the number of the second suction through holes on each cushion heat plate is the same as that of the first suction through holes.
3. The bonding tool of claim 2, wherein When the number of the first suction through holes is multiple, the multiple first suction through holes are arrayed on the second base plate surface.
4. The bonding tool of claim 1, wherein The heating base plate is provided with at least one first auxiliary suction groove on the second base plate surface, and the groove bottom of each first auxiliary suction groove is communicated with at least one first suction through hole.
5. The bonding tool of claim 4, wherein Each cushion heat plate is provided with at least one second auxiliary suction groove on a first heat plate surface for suction fixing of the radio frequency microwave module or other cushion heat plates, and the groove bottom of each second auxiliary suction groove is communicated with at least one second suction through hole on the corresponding cushion heat plate.
6. The bonding tool of claim 5, wherein The projection shape of each first auxiliary suction groove on the second base plate surface is any one of a rectangle, a circle, an ellipse, a waist shape and an X shape. The projection shape of each second auxiliary suction groove on the corresponding heat plate surface is any one of a rectangle, a circle, an ellipse, a waist shape and an X shape.
7. The bonding tool of claim 1, wherein The heating base plate is provided with a plurality of first positioning holes, each cushion heat plate is provided with a positioning pin at a position corresponding to part of the first positioning holes on a second heat plate surface, and the first heat plate surface and the second heat plate surface of the same cushion heat plate are mutually away from each other. The at least one cushion heat plate is detachably assembled on the heating base plate through plug-in connection between the positioning pin and the first positioning hole.
8. The bonding tool of claim 7, wherein The heating base plate is provided with at least one auxiliary limiting block on each of the two opposite plate body sides, and the at least one auxiliary limiting block assists in through hole alignment between the heating base plate and the at least one cushion heat plate.
9. The bonding tool according to any one of claims 1 to 8, wherein The bonding jig further comprises a module clamping unit, and the module clamping unit comprises an elastic member, two limiting members and two abutting members. The two limiting members are respectively installed on the two opposite plate body sides of the heating base plate or the target cushion heat plate directly contacting the to-be-bonded radio frequency microwave module, each limiting member is fixedly connected with one abutting member through the elastic member, and the two abutting members abut each other with the to-be-bonded radio frequency microwave module under the action of the corresponding elastic member, so as to fix the to-be-bonded radio frequency microwave module on the heating base plate or the target cushion heat plate.
10. A radio frequency microwave module bonding system, characterized by, The bonding system comprises a package bonding device and the radio frequency microwave module bonding jig according to any one of claims 1-9, wherein the package bonding device is used to realize the package bonding function of the radio frequency microwave module. The radio frequency microwave module bonding jig is detachably installed in the package bonding device, and is used to adsorb and fix the radio frequency microwave module to be bonded, so that the bonding part of the radio frequency microwave module to be bonded is located in the effective bonding working space of the package bonding device.