Chip marking laser equipment

Abstract

The utility model relates to chip marking laser equipment, which comprises a laser mechanism, the laser mechanism comprises a laser mechanism, a horizontally arranged optical bench, a marking lens and a vertically arranged lifting driving mechanism, the driving end of the lifting driving mechanism is connected with the optical bench through a connecting plate, and the laser mechanism is arranged at one end of the optical bench. The marking lens is installed at the other end of the laser mechanism, and the lifting driving mechanism is used for driving the optical bench to drive the marking lens and the laser mechanism to do lifting motion. According to the laser equipment, flexible adjustment of a laser light path is achieved, the laser focal length can be accurately adjusted according to the specification of a chip, and the laser marking efficiency and accuracy are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser marking technical field, in particular to a chip marking laser equipment. BACKGROUND

[0002] In the semiconductor manufacturing and electronic product packaging process, after the chip is burned or tested, the laser marking method is used to print mark information, so as to distinguish good products from defective products, prevent mixing, and track product batches. As a kind of high-precision, clear and durable marking method, laser marking has become one of the key links in the production process.

[0003] Most of the laser marking equipment in the prior art directly integrates the laser mechanism and the marking lens. Although this design is simple in structure, the laser mechanism is fixed in the light path, and the laser output position cannot be flexibly adjusted, so that the equipment is difficult to adapt to chips of various sizes. Or through manual adjustment of the light path position and laser focal length of the equipment to complete the marking task, the operation is complex and inefficient, and cannot meet the rapid and high-precision marking requirements, especially in the case of frequent replacement of chip specifications. UTILITY MODEL CONTENT

[0004] The technical problem to be solved by the utility model is to provide a chip marking laser equipment, which not only realizes flexible adjustment of the laser light path, but also accurately adjusts the laser focal length according to the specifications of the chip, greatly improving the efficiency and accuracy of laser marking.

[0005] The technical scheme adopted by the utility model to solve the technical problem is: a chip marking laser equipment, comprising a laser assembly, the laser assembly comprising a laser mechanism, a horizontally arranged optical bench, a marking lens and a vertically arranged lifting drive mechanism, the driving end of the lifting drive mechanism being connected with the optical bench through a connecting plate, the laser mechanism being connected with the optical bench through an optical fiber, the marking lens being installed at the other end of the laser mechanism, and the lifting drive mechanism being used to drive the optical bench to drive the marking lens and the laser mechanism to move up and down.

[0006] In one of the embodiments, the lifting drive mechanism of the chip marking laser equipment comprises a jacking electric cylinder, two symmetrical support seats, a fixed seat and a guide column assembly, the two support seats are respectively connected with the two ends of the fixed seat, the jacking electric cylinder is installed between the two support seats, the driving end of the jacking electric cylinder passes through the fixed seat and is connected with the connecting plate, one end of the guide column assembly is fixedly connected with the connecting plate, and the other end of the guide column assembly is slidably connected with the fixed seat through a shaft sleeve.

[0007] In one embodiment, the guide post assembly of the chip marking laser equipment includes a positioning plate and two symmetrically arranged guide posts. The positioning plate is connected to a connecting plate, one end of each of the two guide posts is connected to the positioning plate, and the other end of each guide post is slidably engaged with a fixed seat via a bushing. The driving end of the lifting electric cylinder is connected to the positioning plate, and the lifting electric cylinder is used to drive the positioning plate to move the connecting plate and the optical bench in a lifting motion.

[0008] In one embodiment, the chip marking laser equipment further includes a flipping mechanism for picking up and flipping the chip. The flipping mechanism includes a rotary motor and a carrier stage. The carrier stage is provided with a suction cup assembly for gripping the chip. The drive end of the rotary motor is connected to the carrier stage, and the rotary motor is used to drive the carrier stage to flip the chip.

[0009] In one embodiment, a dust cover for collecting dust is also provided between the flipping mechanism and the marking lens of the chip marking laser device.

[0010] The beneficial effects of this application are as follows:

[0011] This application provides a laser marking device for chips. By setting up an optical bench, the laser beam is transmitted through an optical fiber to the optical bench and the marking lens, enabling flexible adjustment of the laser optical path. Furthermore, by incorporating a lifting drive mechanism, the laser focal length can be precisely adjusted according to the chip specifications, adapting to chips of different sizes. This achieves automated, highly precise adjustment, improving the efficiency and accuracy of laser marking. This laser device, employing a laser mechanism, possesses excellent flexibility and is widely applicable to different chip feeding and unloading methods, enabling flexible marking and solving problems caused by feeding methods or equipment adjustments in traditional technologies. Attached Figure Description

[0012] Figure 1 A schematic diagram of the laser mechanism of the chip marking laser device according to an embodiment of this application;

[0013] Figure 2 This is a schematic diagram of a chip marking laser device according to an embodiment of this application;

[0014] in:

[0015] 1. Laser assembly; 2. Tilting mechanism; 3. Dust cover; 11. Laser mechanism; 12. Optical bench; 13. Marking lens; 14. Lifting drive mechanism; 15. Connecting plate; 141. Lifting cylinder; 142. Support base; 143. Fixing base; 144. Guide column assembly; 001. Positioning plate; 002. Guide column; 21. Rotary motor; 22. Carrier platform; 23. Suction cup assembly. Detailed Implementation

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0017] like Figure 1 As shown, an embodiment of this application provides a chip marking laser device, including a laser component 1. The laser component 1 includes a laser mechanism 11, a horizontally arranged optical bench 12, a marking lens 13, and a vertically arranged lifting drive mechanism 14. The driving end of the lifting drive mechanism 14 is connected to the optical bench 12 through a connecting plate 15. The laser mechanism 11 and the optical bench 12 are connected through an optical fiber. The marking lens 13 is installed at the other end of the laser mechanism 11. The lifting drive mechanism 14 is used to drive the optical bench 12 to move the marking lens 13 and the laser mechanism 11 in a lifting motion.

[0018] Specifically, after the chip is picked up and fixed on the flipping mechanism 2, the flipping mechanism 2 drives the chip to flip for laser marking. The control system calculates the chip size in real time, thereby automatically adjusting the driving height of the lifting drive mechanism 14 to raise and lower the optical bench 12 to the optimal marking position. The beam generated by the laser mechanism 11 is transmitted through optical fiber to the optical bench and the marking lens 13 to form the marking area, allowing precise focusing on the chip surface to form a clear mark. During the adjustment process, no additional adjustments to the feeding and unloading processes are required.

[0019] In the aforementioned structure, the optical bench not only facilitates stable laser beam transmission but also allows for fine-tuning according to chip specifications, ensuring the accuracy of the laser focal length. Furthermore, the lifting drive mechanism 14, in conjunction with the optical bench 12, enables automatic adjustment of the laser focal length based on chips of different sizes, ensuring clarity and consistency in laser marking, improving marking accuracy, and simultaneously increasing work efficiency while saving labor and time costs. This laser mechanism 1 features a simple structure, high flexibility, and compatibility with various chip feeding and unloading methods, requiring no additional customization or adjustment, and can be widely used in various production environments.

[0020] like Figure 1As shown, in one embodiment, the lifting drive mechanism 14 of the chip marking laser equipment includes a lifting cylinder 141, two symmetrically arranged support seats 142, a fixed seat 143, and a guide column assembly 144. The two support seats 142 are respectively connected to both ends of the fixed seat 143. The lifting cylinder 141 is installed between the two support seats 142. The driving end of the lifting cylinder 141 passes through the fixed seat 143 and is connected to the connecting plate 15. One end of the guide column assembly 144 is fixedly connected to the connecting plate 15, and the other end of the guide column assembly 144 is slidably engaged with the fixed seat 143 through a bushing. The two symmetrically arranged support seats 142 provide support for the lifting cylinder 141, the optical fiber mount, the laser mechanism 11, and the marking lens 13, respectively. The lifting cylinder 141 can automatically drive the connecting plate 15 to adjust the height of the optical fiber mount, the laser mechanism 11, and the marking lens 13 according to the size of the chip, thereby achieving the optimal laser focal length. The lifting electric cylinder 141 is designed to automatically adjust the laser focal length according to the different sizes of the chips, ensuring the clarity and consistency of laser marking, and improving the versatility and marking efficiency of the equipment.

[0021] like Figure 1 As shown, in one embodiment, the guide post assembly 144 of the chip marking laser equipment includes a positioning plate 001 and two symmetrically arranged guide posts 002. The positioning plate 001 is connected to a connecting plate 15. One end of each guide post 002 is connected to the positioning plate 001, and the other end of each guide post 002 is slidably engaged with a fixed base 143 via a bushing. The driving end of the lifting electric cylinder 141 is connected to the positioning plate 001, and the lifting electric cylinder 141 drives the positioning plate 001 to move the connecting plate 15 and the optical bench 12 in a lifting motion. The lifting electric cylinder 141 drives the positioning plate 001 to move the connecting plate 15 and the optical bench 12 in a lifting motion along the extension direction of the two guide posts 002. The guide post assembly 144 not only provides guidance but also prevents deviation during height adjustment.

[0022] like Figure 2 As shown, in one embodiment, the chip marking laser equipment further includes a flipping mechanism 2 for picking up and flipping the chip. The flipping mechanism includes a rotary motor 21 and a carrier stage 22. The carrier stage 22 is equipped with a suction cup assembly 23 for gripping the chip. The drive end of the rotary motor 21 is connected to the carrier stage 22, and the rotary motor 21 drives the carrier stage 22 to flip the chip. The chip can be loaded onto the suction cup assembly 23 of the carrier stage 22, where the suction cup assembly 23 grips the chip, and the rotary motor 21 drives the carrier stage 22 to rotate 180 degrees for flipping. This configuration facilitates chip fixation and flipping, and allows for easy coordination with the laser mechanism 1 for chip marking.

[0023] like Figure 2As shown, in one embodiment, a dust cover 3 for collecting dust is also provided between the flipping mechanism 2 and the marking lens 13 of the chip marking laser equipment. The dust cover 3 can prevent marking dust from entering the working environment and can also avoid contaminating the laser mechanism 1.

[0024] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A laser marking device for chips, characterized in that, The system includes a laser assembly, which includes a laser mechanism (11), a horizontally positioned optical bench (12), a marking lens (13), and a vertically positioned lifting drive mechanism (14). The driving end of the lifting drive mechanism (14) is connected to the optical bench (12) via a connecting plate (15). The laser mechanism (11) is connected to the optical bench (12) via an optical fiber. The marking lens (13) is installed at the other end of the laser mechanism (11). The lifting drive mechanism (14) is used to drive the optical bench (12) to move the marking lens (13) and the laser mechanism (11) up and down.

2. The chip marking laser equipment according to claim 1, characterized in that, The lifting drive mechanism (14) includes a lifting electric cylinder (141), two symmetrically arranged support seats (142), a fixed seat (143), and a guide column assembly (144). The two support seats (142) are respectively connected to the two ends of the fixed seat (143). The lifting electric cylinder (141) is installed between the two support seats (142). The driving end of the lifting electric cylinder (141) passes through the fixed seat (143) and is connected to the connecting plate (15). One end of the guide column assembly (144) is fixedly connected to the connecting plate (15), and the other end of the guide column assembly (144) is slidably engaged with the fixed seat (143) through a bushing.

3. The chip marking laser equipment according to claim 2, characterized in that, The guide post assembly (144) includes a positioning plate (001) and two symmetrically arranged guide posts (002). The positioning plate (001) is connected to the connecting plate (15). One end of each of the two guide posts (002) is connected to the positioning plate (001), and the other end of each guide post (002) is slidably engaged with the fixed seat (143) through a bushing. The driving end of the lifting electric cylinder (141) is connected to the positioning plate (001). The lifting electric cylinder (141) is used to drive the positioning plate (001) to drive the connecting plate (15) and the optical bench (12) to perform lifting and lowering movements.

4. The chip marking laser equipment according to claim 1, characterized in that, It also includes a flipping mechanism (2) for picking up and flipping the chip. The flipping mechanism includes a rotary motor (21) and a carrier platform (22). The carrier platform (22) is provided with a suction cup assembly (23) for gripping the chip. The drive end of the rotary motor (21) is connected to the carrier platform (22). The rotary motor (21) is used to drive the carrier platform (22) to flip the chip.

5. The chip marking laser equipment according to claim 4, characterized in that, A dust cover (3) for collecting dust is also provided between the flipping mechanism (2) and the laser mechanism.

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