Grinding wire and grinding structure
By designing a grinding wire with internal and external abrasive components for graded grinding, the problem of initial time consumption of existing grinding wires has been solved, achieving more efficient surface treatment and precision control, which is suitable for mechanical manufacturing and optical devices.
Patent Information
- Application Number
- CN202520330212.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-02-26
AI Technical Summary
Existing abrasive wires consume an initial 40 seconds when polishing sapphire, sunglasses, and other processed parts, resulting in low surface treatment efficiency.
The grinding wire is designed as an integral structure, including an inner abrasive group and an outer abrasive group. The abrasive matrix of the outer abrasive group protrudes from the outer surface of the mounting base layer, while the abrasive matrix of the inner abrasive group is located inside the mounting base layer. The outer abrasive group comes into contact with the surface of the workpiece at the beginning of grinding, while the inner abrasive group gradually plays its role in the subsequent process to achieve graded grinding.
It reduces initial grinding time, improves surface treatment efficiency, and enhances workpiece surface quality and dimensional accuracy control, making it suitable for mechanical manufacturing and optical device applications.
Smart Images
Figure CN223917620U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of grinding technology, and in particular to a grinding wire and a grinding structure. Background Technology
[0002] Abrasive wire is a tool used to improve the surface finish and precision of workpieces, and it is widely used in fields such as machinery manufacturing, aerospace, automotive parts, and optical devices. Its main function is to remove burrs, oxide layers, and other imperfections from the workpiece surface through friction between the abrasive wire and the workpiece surface, thereby achieving precise control of workpiece dimensions and improving surface quality.
[0003] In related technologies, the abrasive wire used for polishing sapphire, sunglasses and other processed parts usually includes a matrix and agglomerated abrasive. The agglomerated abrasive is located inside the matrix. In the first 40 seconds after the polishing begins, the surface acts on the workpiece, with basically no polishing effect. After 40 seconds, the agglomerated abrasive appears on the matrix surface, and the polishing effect is officially achieved. This results in a certain amount of time consumption, leading to low surface treatment efficiency. Utility Model Content
[0004] The main purpose of this invention is to propose a grinding wire that aims to improve grinding efficiency.
[0005] To achieve the above objective, the abrasive wire comprises:
[0006] Install the base layer; and
[0007] The grinding layer is an integral structure with the mounting substrate layer. The grinding layer is provided with an inner abrasive group and an outer abrasive group, and both the inner abrasive group and the outer abrasive group include multiple abrasive substrates. The abrasive substrates of the inner abrasive group are located inside the mounting substrate layer, and at least a portion of the abrasive substrates of the outer abrasive group protrudes from the outer surface of the mounting substrate layer.
[0008] The abrasive matrix is configured to perform surface roughness treatment on the workpiece.
[0009] In one embodiment of this utility model, the external abrasive group includes a first abrasive substrate group and a second abrasive substrate group. The first abrasive substrate group is located at both ends of the mounting substrate layer, and the second abrasive substrate group is located between the first abrasive substrate groups. The abrasive mesh number of the first abrasive substrate group is greater than the abrasive mesh number of the second abrasive substrate group.
[0010] In one embodiment of this utility model, the abrasive mesh number of the inner abrasive group is greater than that of the outer abrasive group.
[0011] In one embodiment of this utility model, the particle size of the abrasive matrix of the inner abrasive group is smaller than that of the abrasive matrix of the outer abrasive group.
[0012] In one embodiment of this utility model, the abrasive mesh number of the internal abrasive group gradually increases from the surface near the mounting substrate layer to the surface away from the mounting substrate layer.
[0013] In one embodiment of this utility model, the mounting substrate layer has a ring structure, and the abrasive substrate is arranged around the mounting substrate layer.
[0014] In one embodiment of this utility model, the mounting substrate layer is a flexible structure.
[0015] In one embodiment of the present invention, each abrasive matrix includes abrasive particles and a brittle media matrix, wherein the brittle media matrix and the abrasive particles are an integral structure.
[0016] In one embodiment of this invention, the brittle medium matrix is glass.
[0017] This utility model also proposes a grinding structure, which includes the aforementioned grinding wire.
[0018] In the technical solution of this utility model, the grinding wire includes a mounting base layer and an integral grinding layer. The grinding layer is provided with an inner abrasive group and an outer abrasive group. At least a portion of the abrasive matrix of the outer abrasive group protrudes from the outer surface of the mounting base layer. Compared with the traditional technology where all agglomerated abrasives are located inside the base, the abrasive matrix of the outer abrasive group can directly contact the surface of the workpiece at the start of grinding, achieving the grinding and polishing effect. Unlike traditional grinding wires, it does not require waiting about 40 seconds for the agglomerated abrasives to take effect, thus reducing the initial grinding time consumption, improving surface treatment efficiency, and enabling the grinding wire to more quickly roughen the workpiece surface, thereby improving the workpiece surface quality and dimensional accuracy control. This is beneficial for improving production efficiency and processing quality in fields such as mechanical manufacturing and optical devices. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0020] Figure 1 A schematic diagram of the structure of the grinding wire provided by this utility model.
[0021] Explanation of icon numbers:
[0022] 10. Install the substrate layer; 20. Abrasive particles; 30. Brittle media matrix.
[0023] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first," "second," etc., these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0027] Please see Figure 1 The abrasive wires include:
[0028] Install the base layer 10; and
[0029] The grinding layer and the mounting substrate layer 10 are an integral structure. The grinding layer is provided with an inner abrasive group and an outer abrasive group. Both the inner abrasive group and the outer abrasive group include multiple abrasive substrates. The abrasive substrates of the inner abrasive group are located inside the mounting substrate layer 10, and at least a portion of the abrasive substrates of the outer abrasive group protrude from the outer surface of the mounting substrate layer 10.
[0030] The abrasive matrix is configured to treat the surface roughness of the workpiece.
[0031] In the technical solution of this utility model, the grinding wire includes a mounting substrate layer 10 and an integral grinding layer. The grinding layer is provided with an inner abrasive group and an outer abrasive group. At least a portion of the abrasive matrix of the outer abrasive group protrudes from the outer surface of the mounting substrate layer 10. Compared with the traditional technology where all agglomerated abrasives are located inside the substrate, the abrasive matrix of the outer abrasive group can directly contact the surface of the workpiece at the start of grinding, achieving the grinding and polishing effect. Unlike traditional grinding wires, it does not require waiting about 40 seconds for the agglomerated abrasives to take effect, thereby reducing the initial grinding time consumption, improving surface treatment efficiency, and enabling the grinding wire to perform roughness treatment on the workpiece surface more quickly. This achieves the purpose of improving workpiece surface quality and dimensional accuracy control, which is beneficial to improving production efficiency and processing quality in fields such as mechanical manufacturing and optical devices.
[0032] Specifically, the mounting base layer 10 provides a fixed foundation for the grinding layer, preventing the outer abrasive assembly from becoming loose or falling off the mounting base layer 10. For example, part of the structure of the outer abrasive assembly can be embedded in the mounting base layer 10, or an adhesive can be applied to the surface of the mounting base layer 10 to fix the outer abrasive assembly to the mounting base layer 10, thus forming an integral fixed structure. It is understood that the cross-section of the mounting base layer 10 can be square, circular, etc., and is not limited here.
[0033] The grinding layer acts on the surface of the workpiece to be processed, thereby reducing the surface roughness of the workpiece and improving its surface smoothness. The grinding layer includes an inner abrasive group and an outer abrasive group. The abrasive matrix of the inner abrasive group is located inside the mounting base layer 10. At least a portion of the abrasive matrix of the outer abrasive group protrudes from the outer surface of the mounting base layer 10. This protrusion can be either the entire structure of the abrasive matrix exposed on the surface of the mounting base layer 10, or only the end of the abrasive matrix exposed on the surface of the mounting base layer 10, with the remaining portion embedded inside the mounting base layer 10. This is not limited here. In this way, when the grinding wire with the outer abrasive group performs surface treatment on workpieces such as sapphire, sunglasses, and glass, it can contact the surface of the workpiece immediately and achieve a polishing effect. Each abrasive matrix is designed with a slightly raised shape, such as a hemisphere, cone, or pyramid. Taking a hemisphere as an example, this raised shape of the abrasive matrix can better contact the workpiece surface and quickly remove larger raised parts of the workpiece surface in the early stages of grinding. When the grinding wire comes into contact with the workpiece, the hemispherical agglomerated abrasive tip will contact the workpiece first, just like a small "grinding head", which can concentrate the force to perform preliminary and rapid grinding on the workpiece surface.
[0034] Furthermore, the outer abrasive assembly includes a first abrasive substrate assembly and a second abrasive substrate assembly. The first abrasive substrate assembly is located at both ends of the mounting substrate layer 10, and the second abrasive substrate assembly is located between the first abrasive substrate assemblies. The abrasive mesh count of the first abrasive substrate assembly is greater than that of the second abrasive substrate assembly. The first abrasive substrate assembly is used to polish the edges of optical devices such as sapphire, sunglasses, and glass. These areas have chamfers, burrs, and other structures, so the density of the agglomerated abrasive can be appropriately increased. Since the surface finish requirements of optical components are extremely high, the density of the agglomerated abrasive in the second abrasive substrate assembly can be relatively low. This ensures that the second abrasive substrate assembly acts more gently on the workpiece surface during polishing, reducing the possibility of scratches.
[0035] In one embodiment of this utility model, the abrasive mesh number of the inner abrasive group is greater than that of the outer abrasive group. It can be understood that, under the condition that the particles of the abrasive matrix are the same or similar, the larger the abrasive mesh number, the better the grinding effect. Thus, as the grinding wire is used, the outer abrasive group gradually wears down, and the inner abrasive group can continue to perform fine grinding on the workpiece, further improving the surface quality of the workpiece, making the workpiece surface smoother, meeting the requirements of high-precision processing, and benefiting the improvement of production efficiency and processing quality in fields such as mechanical manufacturing and optical devices.
[0036] Furthermore, the abrasive particles in the inner abrasive group are smaller than those in the outer abrasive group. The larger particles in the outer abrasive group can quickly remove larger protrusions and burrs from the workpiece surface during the initial grinding stage, achieving preliminary surface treatment. Meanwhile, the smaller particles in the inner abrasive group can perform more refined surface treatment in subsequent grinding processes, further reducing surface roughness and improving surface smoothness, resulting in a smoother surface that meets the requirements of high-precision machining. Simultaneously, the different particle sizes in the inner and outer abrasive groups allow the grinding wires to achieve a graded grinding effect. In the initial grinding stage, the larger particles in the outer abrasive group play a major role in coarse grinding. As grinding progresses, the smaller particles in the inner abrasive group gradually take effect, performing fine grinding and preventing scratches on the workpiece surface. This graded grinding method better adapts to the different needs of the workpiece surface, improving grinding quality and efficiency.
[0037] In one embodiment, the abrasive mesh size of the inner abrasive group gradually increases from the surface near the mounting substrate layer 10 to the surface away from the mounting substrate layer 10. This distribution allows the inner abrasive substrate to replenish the abrasive wire in a timely manner as the outer abrasive substrate gradually wears down during use, maintaining sufficient abrasive power. For brittle optical components such as glass, this gradient distribution can also prevent excessive impact on the workpiece surface caused by a sudden large amount of internal abrasive exposure during the abrasive process, which could lead to defects such as cracks on the workpiece surface.
[0038] In one embodiment of this utility model, the mounting base layer 10 has an annular structure, and the abrasive matrix is arranged around the mounting base layer 10. In this way, the annular structure of the mounting base layer 10 makes the abrasive matrix evenly distributed in the circumference, avoiding excessive local wear, which is suitable for high-precision machining of cylindrical workpieces (such as bearings and shafts). At the same time, the annular structure of the mounting base layer 10 is easy to integrate with rotating tools (such as grinding wheel spindles) to improve grinding efficiency.
[0039] Furthermore, the mounting substrate layer 10 is a flexible structure. It is understood that the flexibility allows the flexible mounting substrate layer 10 to bend and deform to fit irregular workpiece surfaces (such as mold cavities and freeform surfaces), expanding application scenarios. At the same time, the flexible structure of the mounting substrate layer 10 can absorb grinding impact vibrations, reduce processing noise, and improve surface finish. It is understood that the material of the mounting substrate layer 10 can be high-temperature resistant thermoplastic elastomers, high-temperature resistant nylon, and high-temperature resistant fiber fabrics, etc., without limitation.
[0040] In one embodiment of this utility model, each abrasive matrix includes abrasive agglomerates 20 and a brittle media matrix 30. The brittle media matrix 30 and the abrasive agglomerates 20 are integrally structured. Specifically, when the abrasive agglomerates 20 exist in the form of a slurry, the brittle media matrix 30 is added to the abrasive agglomerate slurry. The brittle media matrix 30 can be added in the form of fragments, large particles, etc. Then, through processes such as stirring and shaking, the brittle media matrix 30 and the abrasive agglomerate 20 slurry are mixed. Then, through high temperature and high pressure treatment methods, the brittle media matrix 30 and the abrasive agglomerates 20 are made into an integral structure, thereby ensuring the brittle media matrix 30 and the abrasive agglomerates 20 are integrally structured. To enhance the connection strength and prevent the brittle media matrix 30 from detaching from the abrasive particles 20, the grinding wire proposed in this invention utilizes the brittle physical properties of the brittle media matrix 30 during workpiece grinding. Under the reaction force of the workpiece, it is prone to fracture. Under the action of its own weight and friction, the detached brittle media matrix 30 can detach from the mounting substrate layer 10 carrying abrasive particle debris, thereby preventing abrasive particle debris from adhering to the outer surface and / or between the abrasive substrate, maintaining the cutting performance of the abrasive, and improving grinding quality and efficiency. It is understood that the brittle media matrix 30 can be a brittle material such as ceramic, glass, or quartz, and is not limited here. Furthermore, the brittle media matrix 30 can be a shape with an arc surface, such as a sphere, hemisphere, or similar circular shape. In this way, when the abrasive substrate is being ground, the problem of easy breakage due to stress concentration caused by right angles, straight edges, or other structures is avoided.
[0041] In one embodiment of this utility model, the brittle medium matrix 30 is glass. Glass material is low in cost and easy to form, making it suitable for large-scale production. At the same time, glass is corrosion resistant, which can ensure that the brittle medium matrix 30 is not corroded and loses its brittleness in some wet grinding or chemical environment scenarios.
[0042] This utility model also proposes a grinding structure, such as a grinding wheel or a grinding belt. The grinding structure includes grinding wires, and the specific structure of the grinding wires is as described in the above embodiments. Since the grinding structure proposed by this utility model adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0043] The above are merely exemplary embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A grinding wire, characterized in that, The abrasive wire comprises: Install the substrate layer (10); and The grinding layer is integral with the mounting substrate layer (10); the grinding layer includes an inner abrasive group and an outer abrasive group, both of which include multiple abrasive substrates; the abrasive substrates of the inner abrasive group are located inside the mounting substrate layer (10), and at least a portion of the abrasive substrates of the outer abrasive group protrude from the outer surface of the mounting substrate layer (10); The abrasive matrix is configured to perform surface roughness treatment on the workpiece.
2. The abrasive wire as described in claim 1, characterized in that, The external abrasive group includes a first abrasive substrate group and a second abrasive substrate group. The first abrasive substrate group is located at both ends of the mounting substrate layer (10), and the second abrasive substrate group is located between the first abrasive substrate groups. The abrasive mesh number of the first abrasive substrate group is greater than that of the second abrasive substrate group.
3. The abrasive wire as described in claim 2, characterized in that, The abrasive mesh size of the inner abrasive group is greater than that of the outer abrasive group.
4. The abrasive wire as described in claim 1, characterized in that, The particle size of the abrasive matrix in the inner abrasive group is smaller than that in the outer abrasive group.
5. The abrasive wire as described in claim 4, characterized in that, The abrasive mesh size of the inner abrasive group gradually increases from the surface near the mounting substrate layer (10) to the surface away from the mounting substrate layer (10).
6. The abrasive wire according to any one of claims 1 to 5, characterized in that, The mounting substrate layer (10) has a ring structure, and the abrasive substrate is arranged around the mounting substrate layer (10).
7. The abrasive wire as described in claim 6, characterized in that, The mounting substrate layer (10) is a flexible structure.
8. The abrasive wire as described in claim 6, characterized in that, Each of the abrasive matrices includes abrasive particles (20) and a brittle media matrix (30), wherein the brittle media matrix (30) and the abrasive particles (20) are an integral structure.
9. The abrasive wire as described in claim 8, characterized in that, The brittle medium matrix (30) is glass.
10. A grinding structure, characterized in that, The grinding structure includes the grinding wire as described in any one of claims 1 to 9.