Temperature adjusting device and biological automatic preparation equipment

Abstract

The utility model discloses a temperature adjusting device and biological automatic preparation equipment, the temperature adjusting device comprises a material tray, a refrigeration part and a heat dissipation assembly, the refrigeration part is provided with a cold surface and a hot surface which are opposite to each other, the refrigeration part is arranged on the bottom surface of the material tray, and the heat dissipation assembly is arranged on the material tray. The cold surface is in direct or indirect contact with the bottom surface of the material tray; the heat dissipation assembly is arranged on the hot face of the refrigeration component.

Description

Technical Field

[0001] This application relates to the field of reagent cryopreservation technology, and in particular to a temperature control device and an automated biological preparation equipment. Background Technology

[0002] In automated bioprocessing experiments and production, raw materials such as DNA, RNA, and enzymes are typically stored temporarily at low temperatures (e.g., around 4°C) after thawing for later use, or they may be temporarily stored at low temperatures as products before being transferred for cryopreservation. Reagents and intermediate products generated during the reaction process also need to be temporarily stored at low temperatures. However, the experimental space in automated bioprocessing is limited, thus requiring a compact temperature control device capable of rapid cooling to store raw materials, reagents, intermediate products, and final products at low temperatures. Utility Model Content

[0003] To solve at least one of the above-mentioned technical problems, this application provides a temperature control device and an automated biological preparation equipment, which can realize the low-temperature preservation of raw materials, products, enzymes and other substances in the automated biological preparation equipment. The technical solution adopted is as follows.

[0004] In a first aspect, the temperature regulating device provided in this application includes a material tray, a refrigeration component, and a heat dissipation component. The refrigeration component has a cold surface and a hot surface. The refrigeration component is disposed on the bottom surface of the material tray so that the cold surface is in direct or indirect contact with the bottom surface of the material tray. The heat dissipation component is disposed on the hot surface of the refrigeration component.

[0005] In some embodiments of this application, the heat dissipation component includes a heat sink module, and the hot surface of the cooling component is attached to the surface of the heat sink module.

[0006] In some embodiments of this application, the heat dissipation assembly further includes a second enclosure structure and a cooling fan. The second enclosure structure is disposed around the outer peripheral side of the heat sink module, and the cooling fan is disposed at one end of the heat sink module away from the cooling component. The second enclosure structure extends at least to the outer periphery of the cooling fan.

[0007] In some embodiments of this application, the heat dissipation assembly further includes a flow guiding structure, which is disposed on the side of the cooling fan away from the heat sink module and extends toward the air outlet direction of the cooling fan.

[0008] In some embodiments of this application, the airflow guiding structure includes an airflow guiding plate, which is inclined along the side away from the cooling fan.

[0009] In some embodiments of this application, the airflow guiding structure includes two side plates and an airflow guiding plate disposed between the two side plates, wherein the two side plates and the airflow guiding plate enclose an air outlet channel.

[0010] In some embodiments of this application, the heat dissipation assembly includes at least two parallel cooling fans and at least two heat sink modules, each heat sink module corresponding to one of the cooling fans. The airflow guiding structure corresponds to one of the cooling fans, and the airflow guiding plate is inclined in a direction away from the other cooling fan, so that the air outlet of the air outlet channel is away from the other cooling fan.

[0011] In some embodiments of this application, the heat dissipation assembly further includes a heat insulation sheet disposed on the top surface of the heat dissipation module, the bottom surface of the material tray is used to connect with the top surface of the second enclosure structure, the heat insulation sheet is located between the material tray and the second enclosure structure, and the heat insulation sheet is also provided with a clearance through hole so that the cold surface of the refrigeration component is exposed in the clearance through hole.

[0012] In some embodiments of this application, the material tray includes a body and a flange. The flange is disposed on the outer peripheral side of the body and at one end of the body near the second enclosure structure. The flange is fixedly connected to the top surface of the second enclosure structure.

[0013] In some embodiments of this application, the flange portion is continuously disposed along the circumferential direction of the body portion.

[0014] In some embodiments of this application, the material tray is provided with a placement groove, and the inner wall of the placement groove is used to contact the outer wall surface of the reagent tube.

[0015] In some embodiments of this application, the material tray is provided with a plurality of placement slots, and the plurality of placement slots are arranged in an array.

[0016] In some embodiments of this application, the cooling component is a semiconductor refrigeration chip.

[0017] In some embodiments of this application, the temperature regulating device further includes a cooling plate disposed between the refrigeration component and the bottom surface of the material tray. The cooling plate has a first surface and a second surface facing each other. The first surface is in contact with the cold surface, and the second surface is in contact with the bottom surface of the material tray.

[0018] In some embodiments of this application, the second surface of the cooling plate is provided with a flow guide groove, the edge of the cooling plate is provided with a flow confluence port, and the flow guide groove is connected to the flow confluence port.

[0019] In some embodiments of this application, the cooling plate includes a plurality of the flow channels, which are arranged parallel to each other on the surface of the cooling plate.

[0020] In some embodiments of this application, the guide channel includes a transverse channel and a plurality of longitudinal channels. The extension direction of the transverse channel intersects the extension direction of the longitudinal channels, and the plurality of longitudinal channels are all connected to the transverse channel. The transverse channel is connected to the confluence port.

[0021] In some embodiments of this application, the edge of the cooling plate is further provided with a temperature measuring port, which is spaced apart from the manifold.

[0022] In some embodiments of this application, the temperature measuring port is equipped with a temperature sensor, which is used to detect the temperature of the cooling plate.

[0023] In some embodiments of this application, the material tray is movably connected to the cooling plate.

[0024] In some embodiments of this application, the cooling plate includes a plate body and a first enclosure structure. The plate body is configured to contact the bottom surface of the material tray. The first enclosure structure is disposed on the outer periphery of the plate body along a direction perpendicular to the plate body. The first enclosure structure protrudes from the second surface of the plate body to enclose and form an accommodating space with the plate body. At least a portion of the material tray can be accommodated in the accommodating space.

[0025] In some embodiments of this application, the heat dissipation assembly further includes a heat insulation sheet disposed on the top surface of the heat dissipation module, the bottom surface of the first enclosure structure is used to connect with the top surface of the second enclosure structure, and the heat insulation sheet is located between the first enclosure structure and the second enclosure structure.

[0026] The heat insulation sheet is also provided with a clearance through hole so that the cold surface of the refrigeration component is exposed in the clearance through hole.

[0027] In some embodiments of this application, the material tray includes a body portion and a flange portion, the flange portion being disposed on the outer peripheral side of the body portion, the accommodating space being used to accommodate the body portion, and the flange portion being disposed at one end of the body portion away from the accommodating space.

[0028] In some embodiments of this application, the flange portion is continuously disposed along the circumferential direction of the body portion.

[0029] In some embodiments of this application, the temperature regulating device further includes a bottom frame disposed on the bottom surface of the second enclosure structure, and the bottom frame protrudes from the outer peripheral side of the second enclosure structure.

[0030] Secondly, this application also provides an automated biological preparation device, including an operating platform and the temperature regulating device provided in the first aspect above. The operating platform is provided with an installation opening, and the temperature regulating device is disposed on the operating platform so that at least a portion of the heat dissipation component is located in the installation opening.

[0031] The embodiments of this application have at least the following beneficial effects: Utilizing the cold surface of the refrigeration component to cool and lower the material tray achieves a low-temperature state for the tray, providing a low-temperature environment for the stored materials and thus achieving the purpose of cryogenic preservation, meeting the needs of automated biological preparation experiments or production. By having the bottom surface of the material tray in contact with the cold surface of the refrigeration component, the heat transfer efficiency between solids is greater than that between a solid and a gas, which helps improve the cooling efficiency of the refrigeration component on the material tray. By placing the heat dissipation component on the hot surface of the refrigeration component, heat dissipation from the hot surface is achieved, enabling the refrigeration component to operate continuously and stably, and improving its heat dissipation efficiency. By placing the material tray and the heat dissipation component on opposite sides of the refrigeration component, the entire temperature control device structure becomes more compact, facilitating miniaturization and reducing the space occupied by the temperature control device in biological preparation equipment. Attached Figure Description

[0032] The aspects and advantages described and / or added to the embodiments of this application will become apparent and readily understood in conjunction with the following drawings. It should be noted that the embodiments illustrated in the following drawings are exemplary and are used only to explain this application, and should not be construed as limiting this application.

[0033] Figure 1 A schematic diagram of the structure of a first example of a temperature regulating device provided in an embodiment of this application;

[0034] Figure 2 This is a schematic diagram of the structure of the cooling plate of the temperature regulating device provided in the embodiments of this application;

[0035] Figure 3 A cross-sectional view of a first example structure of a temperature regulating device provided in an embodiment of this application;

[0036] Figure 4 An exploded view of a first example of a temperature regulating device provided in an embodiment of this application;

[0037] Figure 5 A schematic diagram of a second example of a temperature regulating device provided in the embodiments of this application;

[0038] Figure 6 A cross-sectional view of a second example structure of the temperature regulating device provided in the embodiments of this application;

[0039] Figure 7 An exploded view of a second example of a temperature regulating device provided in an embodiment of this application;

[0040] Figure 8 This is a schematic diagram of the structure of the automated biological preparation equipment provided in the embodiments of this application.

[0041] Reference numerals: 100, Temperature regulating device; 110, Material tray; 111, Body; 112, Flange; 113, Placement slot; 120, Refrigeration component; 130, Heat dissipation assembly; 131, Heat sink module; 1311, Heat sink; 132, Second enclosure structure; 133, Cooling fan; 134, Heat insulation sheet; 1341, Clearance through hole; 135, Airflow guiding structure; 1351, Side plate; 1352, Airflow guide plate; 1353, Air outlet channel; 140, Cooling plate; 1401, First surface; 1402, Second surface; 141, Airflow guide channel; 1411, Transverse channel; 1412, Longitudinal channel; 142, Convergence port; 144, Temperature measuring port; 145, Plate body; 1451, Accommodation space; 146, First enclosure structure; 150, Base frame;

[0042] 200. Temperature control device; 210. Material tray; 211. Body; 212. Flange; 213. Placement slot; 220. Refrigeration component; 230. Heat dissipation assembly; 231. Heat sink module; 2311. Heat sink; 232. Second enclosure structure; 233. Cooling fan; 234. Heat insulation sheet; 2341. Clearance through hole; 235. Airflow guiding structure; 2351. Airflow guide plate; 240. Base frame;

[0043] 300. Automated biological preparation equipment; 310. Operating platform; 311. Mounting opening;

[0044] 400. Reagent tube. Detailed Implementation

[0045] The following is combined with Figures 1 to 8 The embodiments of this application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0046] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships is based on the orientation or positional relationships shown in the accompanying drawings and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In automated bioprocessing experiments and production, raw materials such as DNA, RNA, and enzymes are typically stored temporarily at low temperatures (e.g., around 4°C) after thawing for later use, or they may be temporarily stored at low temperatures as products before being transferred for cryopreservation. Reagents and intermediate products generated during the reaction process also need to be temporarily stored at low temperatures. However, the experimental space in automated bioprocessing is limited, thus requiring a compact temperature control device capable of rapid cooling to store raw materials, reagents, intermediate products, and final products at low temperatures.

[0049] In related technologies, such as the thermostat provided in the document with publication number CN219518914U, although a cooling plate is provided to cool the reagent or product, the heat generated on the hot surface of the cooling plate is easy to accumulate. Moreover, due to the compact design requirements of the thermostat, the heat on the hot surface of the cooling plate is difficult to be discharged and dissipated in time, which is not conducive to improving the cooling effect of the thermostat.

[0050] Example 1

[0051] Based on the above issues, please refer to Figures 1 to 4This application proposes a temperature regulating device 100, including a material tray 110, a cooling component 120, a heat dissipation assembly 130, and a flow guiding structure 135. The cooling component 120 has opposing cold and hot surfaces and is disposed on the bottom surface of the material tray 110, such that the cold surface is in direct or indirect contact with the bottom surface of the material tray 110. The heat dissipation assembly 130 is disposed on the hot surface of the cooling component 120, and the flow guiding structure 135 is disposed on the side of the heat dissipation assembly 130 away from the hot surface of the cooling component 120, extending towards the heat dissipation direction of the heat dissipation assembly 130. With this arrangement, the cold surface of the cooling component 120 can be used to cool and lower the temperature of the material tray 110, thereby maintaining the material tray 110 at a low temperature. This provides a low-temperature environment for the stored materials, achieving the purpose of low-temperature preservation and meeting the needs of automated biological preparation experiments or production. By having the bottom surface of the material tray 110 contact the cold surface of the refrigeration component 120, and utilizing the characteristic that the heat transfer efficiency between solids is greater than that between a solid and a gas, the cooling efficiency of the refrigeration component 120 on the material tray 110 can be improved. By placing the heat dissipation component 130 on the hot surface of the refrigeration component 120, heat dissipation from the hot surface of the refrigeration component 120 can be achieved, thereby enabling the refrigeration component 120 to operate continuously and stably, and improving its heat dissipation efficiency. Furthermore, the flow guiding structure 135 guides the airflow generated by the heat dissipation component 130, directing the airflow away from the heat dissipation component 130. This helps to quickly expel high-temperature air from the heat dissipation component 130, preventing the accumulation of high-temperature air around the heat dissipation component 130, thus improving its heat dissipation efficiency and overall cooling effect. By placing the material tray 110 and the heat dissipation component 130 on opposite sides of the cooling component 120, the entire temperature regulation device 100 can be made more compact, which helps to achieve the miniaturization design of the temperature regulation device 100 and reduce the space occupied by the temperature regulation device 100 in the biological preparation equipment.

[0052] Exemplarily, the material tray 110 can be used to store substances such as DNA, RNA, enzymes, reaction reagents, intermediate products, and final products. Exemplarily, these substances are stored in reagent tubes, which are stored in the material tray 110. Therefore, the temperature control device 100 provided in this application can be used in the feeding, unloading, intermediate product storage, and reaction reagent (e.g., enzyme) storage stages of bio-mechanical preparation experiments and production processes. It is understood that the capacity of the material tray 110 is flexibly set according to the storage requirements and reagent tube sizes in the above-mentioned stages, and this application does not limit it in this regard.

[0053] For example, the specific cooling power of the cooling component 120 can be flexibly configured according to the target temperature of the material tray 110. For instance, the raw materials, products, reagents, etc., used by the material tray 110 for automated biological preparation experiments can be maintained at a low temperature of about 4°C, which helps to maintain the activity of the organisms. Of course, when the material tray 110 holds other reagents, the suitable storage temperature of the other reagents may be higher or lower than 4°C. Therefore, the cooling temperature of the cooling component 120 can be flexibly selected or set according to the needs of the substances held by the material tray 110 and the actual needs of experimental production. This application does not limit this setting.

[0054] For example, the cooling component 120 can be a thermoelectric cooler, which utilizes the Peltier effect of semiconductor materials. When direct current passes through a thermocouple composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the thermocouple, achieving the purpose of cooling. It features small size, no moving parts, and high reliability. The thermoelectric cooler is usually a sheet-like structure with two opposing surfaces. One surface is a cold surface, used to connect to the component requiring cooling, and the other surface is a hot surface through which heat is dissipated. Using a thermoelectric cooler as the cooling component 120 helps to reduce the longitudinal dimension (i.e., the thickness direction of the thermoelectric cooler) of the temperature regulating device 100, thereby helping to reduce the volume of the temperature regulating device 100 and making the structure of the temperature regulating device 100 more compact.

[0055] It is understandable that direct contact between the material tray 110 and the cold surface of the refrigeration unit 120 means that no other heat transfer components are provided between the material tray 110 and the refrigeration unit 120, so that heat can be transferred between them through solid-to-solid contact. Indirect contact means that other heat transfer components (such as a cooling plate 140) can be provided between the material tray 110 and the cold surface of the refrigeration unit 120, but regardless of the arrangement of the heat transfer components, the material tray 110, the cold surface of the refrigeration unit 120, and the heat transfer components still follow the solid-to-solid contact heat transfer method. The following will use the indirect contact connection between the material tray 110 and the cold surface of the refrigeration unit 120 as an example for explanation.

[0056] To accommodate more reagent tubes, a larger material tray 110 is typically used, resulting in a correspondingly larger base area. However, the cooling component 120 has a smaller area relative to the base of the material tray 110, limiting the contact area between them and thus restricting the cooling range. Furthermore, uneven cooling may also occur. Therefore, please refer to... Figures 2 to 4In some embodiments, the temperature regulating device 100 further includes a cooling plate 140, which is disposed between the refrigeration component 120 and the bottom surface of the material tray 110. The cooling plate 140 has a first surface 1401 and a second surface 1402 facing each other. The first surface 1401 is in contact with the cold surface, and the second surface 1402 is in contact with the bottom surface of the material tray 110. By providing the cooling plate 140, the temperature of the bottom surface of the material tray 110 can be evenly distributed by the heat equalization effect of the cooling plate 140, and the cooling effect of the refrigeration component 120 can be evenly transferred to the material tray 110, thereby improving the cooling efficiency of the material tray 110 and achieving the effect of maintaining the material tray 110 at a low temperature.

[0057] Understandably, depending on the actual size of the material tray 110 and the cooling requirements, multiple cooling components 120 can be selected and distributed on the first surface 1401 of the cooling plate 140 (e.g., at equal intervals) to improve the cooling efficiency of the material tray 110.

[0058] Optionally, the cooling plate 140 can be made of metal or alloy materials with high thermal conductivity, such as aluminum, aluminum alloy, or stainless steel, and this application does not limit this. Optionally, the shape of the cooling plate 140 can be set according to the shape of the bottom of the material tray 110. The cooling plate 140 can have approximately the same shape and area as the bottom of the material tray 110, thereby improving the heat transfer effect between the two.

[0059] During the use of the temperature regulating device 100, on the one hand, the cooling component 120 cools the material tray 110; on the other hand, the material tray 110 is exposed to the air. Therefore, after the material tray 110 has been cooled for a period of time, water vapor in the air easily forms condensate when it comes into contact with the material tray 110 and the outer surface of the reagent tubes. If the condensate drips directly, it may cause pollution or adverse effects on the automated biological preparation experiment or production process. Therefore, in some embodiments, the cooling plate 140 has a guide groove 141 on the side facing the material tray 110, and a confluence port 142 is provided on the edge of the cooling plate 140, with the guide groove 141 connected to the confluence port 142. By utilizing the cooling plate 140 guide channel 141 and the confluence port 142, condensate can be collected, gathered, and discharged. This solves the problem of condensate dripping directly from the material tray 110, preventing contamination of other materials or equipment in the experimental or production system. It also prevents condensate from dripping directly onto the refrigeration component 120 or the heat dissipation component 130 and causing damage, thereby improving the convenience and reliability of the temperature control device 100.

[0060] Optionally, a drainage channel, drain pipe, or other structure can be connected to the manifold 142 to discharge condensate.

[0061] In some embodiments, the cooling plate 140 has a plurality of guide channels 141, which are arranged parallel to each other on the surface of the cooling plate 140, and a confluence port 142 is disposed on at least one side of the extending direction of the guide channels 141. When the cooling plate 140 has a large area, the use of multiple guide channels 141 can help the condensate on the cooling plate 140 to quickly collect and discharge, thereby improving the collection and discharge efficiency of condensate. For example, when the cooling plate 140 is rectangular, the guide channels 141 can extend along one side of the rectangle, and the multiple guide channels 141 can be spaced apart along another adjacent side of the rectangle, so that the guide channels 141 are orderly and uniformly distributed on the surface of the cooling plate 140.

[0062] In some embodiments, the guide channel 141 includes a transverse channel 1411 and a plurality of longitudinal channels 1412. The extending direction of the transverse channel 1411 intersects the extending direction of the longitudinal channels 1412, and the plurality of longitudinal channels 1412 are all connected to the transverse channel 1411. The transverse channel 1411 is connected to the confluence port 142. By utilizing the different extending directions of the transverse channel 1411 and the longitudinal channels 1412, condensate can be collected first along the direction of the longitudinal channels 1412, and then converge along the direction of the transverse channel 1411. This allows condensate to converge in two directions on the second surface 1402 of the cooling plate 140, improving the condensate collection speed. By setting the transverse channel 1411 to be simultaneously connected to the plurality of longitudinal channels 1412, the condensate from the plurality of longitudinal channels 1412 can be quickly collected and guided to the confluence port 142, thereby improving the condensate discharge speed. For example, when the cooling plate 140 is set as a rectangle, the longitudinal groove 1412 can be set along the length direction of the rectangle, and the transverse groove 1411 is set along the width direction of the rectangle. That is, the extension directions of the transverse groove 1411 and the longitudinal groove 1412 are perpendicular to each other, so that the transverse groove 1411 and the longitudinal groove 1412 can evenly cover the second surface 1402 of the cooling plate 140, thereby making full use of the space of the second surface 1402 of the cooling plate 140, and also making the arrangement of the transverse groove 1411 and the longitudinal groove 1412 more orderly.

[0063] In some embodiments, the edge of the cooling plate 140 is further provided with a temperature measuring port 144, which is spaced apart from the manifold 142. The temperature measuring port 144 can be used to detect the temperature of the cooling plate 140, thereby knowing the temperature of the material tray 110. By controlling the temperature of the refrigeration component 120 and the cooling plate 140, the conditions for low-temperature storage of the material tray 110 can be met.

[0064] In some embodiments, the temperature measuring port 144 is equipped with a temperature sensor for detecting the temperature of the cooling plate 140. The temperature sensor continuously or intermittently detects the temperature of the cooling plate 140 in real time, and can also use a control structure to perform feedback control on the refrigeration component 120 based on the detected temperature, thereby adjusting the cooling power of the refrigeration component 120 according to the detected temperature, so that the cooling plate 140 and the material tray 110 can be stably maintained within the set target temperature range.

[0065] In some embodiments, the material tray 110 and the cooling plate 140 are movably connected. That is, the material tray 110 can be placed directly on or removed from the surface of the cooling plate 140, thereby transferring the reagent tubes placed in the material tray 110 together and improving the efficiency of material transfer. Therefore, the material tray 110 and the cooling plate 140 do not need to be fixedly connected, but rather movably connected. Based on this, in order to avoid problems such as displacement or tipping of the material tray 110 on the cooling plate 140, in some embodiments, the cooling plate 140 includes a plate body 145 and a first enclosure structure 146. The plate body 145 is configured to contact the bottom surface of the material tray 110, and the first enclosure structure 146 is disposed on the outer periphery of the plate body 145. Along a direction perpendicular to the plate body 145, the first enclosure structure 146 protrudes from the second surface 1402 of the plate body 145 to enclose the plate body 145 and form an accommodating space 1451, in which at least a portion of the material tray 110 can be accommodated. The enclosure space 1451 formed by the first enclosure structure 146 and the plate 145 allows at least a portion of the material pallet 110 to be stored in the enclosure space 1451, thereby increasing the connection area between the material pallet 110 and the cooling plate 140. The enclosure effect of the first enclosure structure 146 helps to prevent the material pallet 110 from shifting or tipping over from the cooling plate 140, thus improving the stability of the material pallet 110.

[0066] For example, the first enclosure structure 146 may be a frame or strip protruding from the outer periphery of the second surface 1402. The first enclosure structure 146 and the plate 145 may be integrally formed or connected by separate installation. Optionally, the inlet 142 and the temperature measuring port 144 of the cooling plate 140 may be spaced apart in the first enclosure structure 146. The inlet 142 and the temperature measuring port 144 both penetrate through the inner and outer sides of the first enclosure structure 146, thereby connecting the accommodating space 1451 and the space outside the cooling plate 140.

[0067] In some embodiments, the material pallet 110 includes a body portion 111 and a flange portion 112. The flange portion 112 is disposed on the outer peripheral side of the body portion 111, and the accommodating space 1451 is used to accommodate the body portion 111. The flange portion 112 is disposed at one end of the body portion 111 away from the accommodating space 1451. The flange portion 112 protruding from the outer peripheral side of the body portion 111 facilitates the transfer of the material pallet 110. For example, when using a manual or robotic arm to pick up or place the material pallet 110, the robotic arm can be inserted into the lower surface of the flange portion 112. When the robotic arm is lifted, the entire material pallet 110 can be lifted and transferred. Alternatively, clamps, grippers, or the like can be used to clamp the flange portion 112, thereby enabling the picking and placing of the material pallet 110.

[0068] In some embodiments, the flange portion 112 is continuously arranged along the circumference of the body portion 111. In this way, regardless of the direction from which the robot arm or gripper grasps the material tray 110, it can connect with the flange portion 112 to lift or lower the material tray 110.

[0069] In some embodiments, the heat dissipation assembly 130 includes a heat sink module 131, and the hot surface of the cooling component 120 is attached to the surface of the heat sink module 131. By attaching the hot surface of the cooling component 120 to the surface of the heat sink module 131, a solid-to-solid contact heat transfer is formed between the cooling component 120 and the heat sink module 131, thereby improving the heat dissipation efficiency of the cooling component 120.

[0070] For example, the heat sink module 131 includes a plurality of spaced-apart heat sinks 1311. An airflow channel for heat dissipation can be formed between two adjacent heat sinks 1311. By providing a plurality of heat sinks 1311, the contact area between the heat sinks 1311 and the air can be increased, thereby improving the heat dissipation efficiency. The heat transferred from the cooling component 120 to the heat sink module 131 through solid-to-solid contact can be diffused into the air by the heat sinks 1311, and the heat is carried away by the airflow through the airflow channel.

[0071] In some embodiments, the heat dissipation assembly 130 further includes a second enclosure structure 132 and a cooling fan 133. The second enclosure structure 132 surrounds the outer peripheral side of the heat sink module 131, and the cooling fan 133 is disposed at one end of the heat sink module 131 away from the cooling component 120. The second enclosure structure 132 extends at least to the outer periphery of the cooling fan 133, and a flow guiding structure 134 is disposed on the side of the cooling fan 133 away from the heat sink module 131. The second enclosure structure 132 can enclose the heat sink 1311 in an enclosure space, which is separated from the space outside the second enclosure structure 132. When the cooling fan 133 dissipates heat from the enclosure space, it helps to form a directional airflow in the enclosure space. For example, when the cooling fan 133 blows air in a direction away from the heat sink module 131, the enclosure space within the second enclosure structure 132 forms a negative pressure due to the enclosure effect of the second enclosure structure 132. This helps to expel the high-temperature gas present in the heat sink module 131 (e.g., in the heat dissipation channel between adjacent heat sinks 1311), thereby achieving the effect of heat dissipation and cooling. The guiding structure 135 guides the high-temperature airflow emitted from the cooling fan 133, directing the airflow away from the cooling fan 133. This helps to quickly expel the high-temperature air from the heat sink module 131, improving the heat dissipation efficiency of the heat sink module 131 and thus improving the heat dissipation effect of the heat dissipation component 130.

[0072] For example, the second enclosure structure 132 can be a baffle, block, etc. By setting baffles on various sides of the outer periphery of the heat sink module 131, the baffles can create a spatial separation effect. The second enclosure structure 132 can be formed by splicing multiple baffles, or it can take the form of a hollow frame structure. Optionally, the second enclosure structure 132 can extend to a position flush with the cooling fan 133, or extend further thereafter, so that the cooling fan 133 is completely located within the enclosure space formed by the second enclosure structure 132. Of course, in other examples, the second enclosure structure 132 may not completely enclose the cooling fan 133, in which case a portion of the cooling fan 133 will be exposed outside the second enclosure structure 132.

[0073] Since the second enclosure structure 132 is used to enclose the heat sink module 131 and the cooling fan 133, the temperature of the second enclosure structure 132 itself usually increases as the heat of the heat sink module 131 increases. To avoid the temperature rise of the second enclosure structure 132 affecting the cooling effect of the cooling plate 140, in some embodiments, the heat dissipation assembly 130 also includes a heat insulation sheet 134. The heat insulation sheet 134 is disposed on the top surface of the heat sink module 131, and the bottom surface of the first enclosure structure 146 is used to connect with the top surface of the second enclosure structure 132. The heat insulation sheet 134 is located between the first enclosure structure 146 and the second enclosure structure 132. The heat insulation sheet 134 also has a clearance through hole 1341 so that the cold surface of the cooling component 120 is exposed in the clearance through hole 1341. By connecting the bottom surface of the first enclosure structure 146 with the top surface of the second enclosure structure 132, the cooling plate 140 and the heat dissipation assembly 130 can be fixed. Furthermore, since the cooling plate 140 primarily cools the material tray 110 through the plate body 145, the use of the first enclosure structure 146 for fixation reduces the impact on the cooling and condensate collection functions of the cooling plate 140. Further, the use of the heat insulation sheet 134 to isolate the first enclosure structure 146 and the second enclosure structure 132 prevents heat transfer from the second enclosure structure 132 to the first enclosure structure 146, thus avoiding overheating of the cooling plate 140 and reducing its cooling effect. On the other hand, it also isolates the top surface of the heat sink module 131 from the first surface 1401 of the cooling plate 140, preventing heat transfer from the heat sink module 131 to the first surface 1401 of the cooling plate 140 and reducing its cooling effect. By providing a clearance through hole 1341 to the heat insulation plate 134, the cooling component 120 can be exposed through the clearance through hole 1341, so that the first surface 1401 of the cooling plate 140 only contacts the cold surface of the cooling component 120 and does not contact the top surface of the heat sink module 131, thereby improving the cooling effect of the cooling plate 140.

[0074] Optionally, the first enclosure structure 146, the heat insulation sheet 134, and the second enclosure structure 132 of the cooling plate 140 can be simultaneously fixed with bolts. This achieves both the connection between the cooling plate 140 and the heat dissipation assembly 130 and reduces heat exchange between the cooling plate 140 and the second enclosure structure 132, ensuring the cooling effect of the cooling plate 140. For example, the heat insulation sheet 134 can be made of a non-metallic material with low thermal conductivity to reduce heat transfer and achieve a heat insulation effect.

[0075] In some embodiments, the airflow guiding structure 135 includes two side plates 1351 and a guide plate 1352 disposed between the two side plates 1351, the two side plates 1351 and the guide plate 1352 forming an air outlet channel 1353. By providing the guide plate 1352, the airflow direction can be designed by designing the extension direction of the guide plate 1352. Exemplarily, the guide plate 1352 can be a straight plate or a curved plate. The airflow guiding structure 135 can be connected to the inner wall surface of the second enclosure structure 132 or connected to the cooling fan 133.

[0076] When the material tray 110 needs to be configured with a large capacity, a heat dissipation component 130 that matches the shape and size of the material tray 110 is required. For example, multiple heat sink modules 131 and cooling fans 133 are provided to improve the cooling effect. Therefore, in some embodiments, the heat dissipation component 130 includes at least two parallel cooling fans 133 and at least two heat sink modules 131, with each heat sink module 131 corresponding to a cooling fan 133. A flow guide structure 135 is provided corresponding to one of the cooling fans 133, and a flow guide plate 1352 is inclined in a direction away from the other cooling fan 133 so that the air outlet of the air outlet channel 1353 is away from the other cooling fan 133. By using multiple heat sink modules 131 and multiple cooling fans 133, the material tray 110 can be comprehensively cooled, improving the cooling effect of the material tray 110. By arranging multiple cooling fans 133 side by side, the cooling fans 133 can form a strip-shaped arrangement. Based on this, by setting the airflow guide structure 135 at one of the cooling fans 133, the airflow guidance effect of the adjacent cooling fans 133, which do not have the airflow guide structure 135, is different from that of the cooling fans 133 with the airflow guide structure 135. As a result, an air pressure difference will be formed between the two adjacent cooling fans 133, thereby forming an airflow between the two adjacent cooling fans 133. Using this lateral airflow, air can be introduced on one side and discharged on the other side of the entire heat dissipation assembly 130, thereby forming a directional airflow and further improving the heat dissipation effect of the heat dissipation assembly 130.

[0077] In some embodiments, the temperature regulating device 100 further includes a base frame 150, which is disposed on the bottom surface of the second enclosure structure 132 and protrudes from the outer peripheral side of the second enclosure structure 132. By providing the base frame 150, the second enclosure structure 132 can be connected to the automated biological preparation equipment. For example, the automated biological preparation equipment is provided with an operating base. The portion of the base frame 150 protruding from the outer peripheral side of the second enclosure structure 132 can be provided with screw holes or other structures, and bolts can be used to mount the base frame 150 onto the operating base, thereby fixing the temperature regulating device 100. Optionally, the base frame 150 and the second enclosure structure 132 can also be connected by bolts, clips, or other means. Of course, the base frame 150 and the second enclosure structure 132 can also be integrally formed.

[0078] In some embodiments, the material tray 110 is provided with a placement groove 113, the inner wall of which is used to contact the outer wall of the reagent tube. By providing the placement groove 113, storage space can be provided for the reagent tube, and when the reagent tube is inserted into the placement groove 113, the placement groove 113 can also fix the reagent tube, preventing it from tipping over. By making the outer wall of the reagent tube contact the inner wall of the placement groove 113, heat transfer can occur between the reagent tube and the material tray 110 in a solid-to-solid contact manner, improving the cooling effect of the material tray 110 on the reagent tube.

[0079] In some embodiments, the material tray 110 is provided with a plurality of placement slots 113, which are arranged in an array. The array arrangement of the placement slots 113 improves the orderliness of the multiple placement slots 113 within the material tray 110, thereby contributing to the accuracy of automated equipment (e.g., a robotic arm) when handling reagent tubes. By providing multiple placement slots 113 within the material tray 110, multiple reagent tubes can be provided in a single loading operation, or multiple reagent tubes can be retrieved in a single unloading operation, or more experimental reagents can be provided at once, thereby reducing the number of loading and unloading operations and improving the efficiency of experiments or production.

[0080] Secondly, please refer to Figure 8 This application also provides an automated biological preparation device, including an operating platform and the temperature regulating device 100 provided in the first aspect. The operating platform has an installation opening, and the temperature regulating device 100 is disposed on the operating platform such that at least a portion of the heat dissipation assembly 130 is located within the installation opening. By placing a portion of the heat dissipation assembly 130 within the installation opening, heat generated during the cooling process can be dissipated below the operating platform surface, thereby reducing the impact on the operating platform surface. Furthermore, the size of the entire temperature regulating device 100 above the operating platform surface can be shortened, making the entire automated biological preparation device more compact.

[0081] Example 2

[0082] Please see Figures 5 to 8 In the second embodiment, the temperature regulating device 200 has a structure that is basically the same as that in the first embodiment. The difference between the two embodiments lies at least in whether or not a cooling plate is provided. Of course, there can also be different arrangements on the flow guiding structure 235. In the second embodiment, the temperature regulating device 200 does not have a cooling plate. In this case, the material tray 210 and the cold surface of the refrigeration component 220 can be in direct contact, and the material tray 210 and the refrigeration component 220 still follow the law and effect of solid-to-solid heat transfer. The differences between the temperature regulating device 200 in the second embodiment and the first embodiment will be described below. Where not described, the second embodiment can adopt the same solution as the first embodiment.

[0083] In some embodiments, the heat dissipation assembly 230 also includes a heat sink module 231, a second enclosure structure 232, a cooling fan 233, and a heat insulation sheet 234. The hot surface of the cooling component 220 is attached to the surface of the heat sink module 231. The second enclosure structure 232 surrounds the outer peripheral side of the heat sink module 231. The cooling fan 233 is disposed at the end of the heat sink module 231 away from the cooling component 220. The second enclosure structure 232 extends at least to the outer periphery of the cooling fan 233. A flow guiding structure 235 is disposed on the side of the cooling fan 233 away from the heat sink module 231. By utilizing the guiding effect of the flow guiding structure 235 on the high-temperature airflow emitted from the cooling fan 233, the airflow can be guided to flow in a direction away from the cooling fan 233, thereby helping to quickly expel the high-temperature air from the heat sink module 231, improving the heat dissipation efficiency of the heat sink module 231, and thus improving the heat dissipation effect of the heat dissipation assembly 230.

[0084] In some embodiments, a heat insulation sheet 234 is disposed on the top surface of the heat sink module 231, and the bottom surface of the material tray 210 is used to connect with the top surface of the second enclosure structure 232. The heat insulation sheet 234 is located between the material tray 210 and the second enclosure structure 232. The heat insulation sheet 234 is also provided with a clearance through hole 2341 so that the cold surface of the cooling component 220 is exposed through the clearance through hole 2341. Since the cooling plate is eliminated, the bottom surface of the material tray 210 can be directly connected to the top surface of the second enclosure structure 232. Similarly, the second enclosure structure 232 may also have the problem of temperature rise during use. If the material tray 210 is in direct contact with the second enclosure structure 232, there will be a problem of mutual heat conduction between the second enclosure structure 232 and the material tray 210, thereby affecting the cooling effect of the material tray 210. Therefore, a heat insulation sheet 234 is provided between the top surface of the second enclosure structure 232 and the bottom surface of the material tray 210. This heat insulation sheet 234 isolates the material tray 210 from the second enclosure structure 232, preventing heat transfer from the second enclosure structure 232 to the material tray 210, thus avoiding overheating and reducing the cooling effect of the material tray 210. On the other hand, it also isolates the top surface of the heat sink module 231 from the bottom surface of the material tray 210, preventing heat transfer from the heat sink module 231 to the bottom surface of the material tray 210 and reducing the cooling effect of the material tray 210. By providing a clearance through-hole 2341 in the heat insulation sheet 234, the cooling component 220 can be exposed through the clearance through-hole 2341, ensuring that the bottom surface of the material tray 210 only contacts the cold surface of the cooling component 220 and not the top surface of the heat sink module 231, thereby improving the cooling effect of the material tray 210.

[0085] In some embodiments, the material tray 210 includes a body portion 211 and a flange portion 212. The flange portion 212 is disposed on the outer peripheral side of the body portion 211 and at one end of the body portion 211 near the second enclosure structure 232, and is fixedly connected to the top surface of the second enclosure structure 232. The protruding flange portion 212 increases the contact area between the material tray 210 and the second enclosure structure 232, improving the connection strength and stability between them. For example, the flange portion 212 and the second enclosure structure 232 can be connected to each other using bolts to ensure a stable connection between them.

[0086] In this example, the material tray 210 can be used to hold experimental reagents or enzymes. Since enzymes can be reused multiple times as catalysts, the material tray 210 used to hold enzymes does not need to be frequently replaced or removed. Therefore, the fixed connection between the material tray 210 and the second enclosure structure 232 can better meet the requirement of a stable connection between the material tray 210 and the second enclosure structure 232.

[0087] In some embodiments, the flange portion 212 is continuously provided along the circumference of the body portion 211. This increases the total area of ​​the flange portion 212, thereby increasing the connection area between the flange portion 212 and the second enclosure structure 232, which helps to improve the installation reliability of the material pallet 210 on the second enclosure structure 232.

[0088] In some embodiments, the airflow guiding structure 235 includes a guide plate 2351, which is inclined along the side opposite to the cooling fan 233. In this way, the guide plate 2351 can guide the cooling airflow blown from the cooling fan 233 to diffuse outwards, thereby improving the cooling effect of the airflow. Optionally, two guide plates 2351 can be provided, respectively disposed on opposite sides of the cooling fan 233, with the two guide plates 2351 being far apart from each other along the airflow direction, thereby achieving the diffusion and guiding effect of the cooling airflow.

[0089] Other structures not described in Embodiment 2, such as the placement slot 213 and the bottom frame 240, can be referred to Embodiment 1 for their specific design, and will not be repeated here.

[0090] In the description of this specification, the use of terms such as "an embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0091] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A temperature regulating device, characterized by: The application relates to a temperature adjusting device for a material tray. The temperature adjusting device comprises a material tray, a refrigeration component, a heat dissipation assembly and a guide structure. The refrigeration component is arranged on the bottom surface of the material tray and has a cold surface and a hot surface. The heat dissipation assembly is arranged on the hot surface of the refrigeration component. The guide structure is arranged on the side of the heat dissipation assembly away from the hot surface of the refrigeration component and extends towards the heat dissipation direction of the heat dissipation assembly. The heat dissipation assembly comprises a heat dissipation fin module, and the hot surface of the refrigeration component is attached to the surface of the heat dissipation fin module.

2. The temperature regulating device of claim 1, wherein: The heat dissipation assembly further comprises a second enclosing structure and a heat dissipation fan.

3. The temperature regulating device of claim 2, wherein: The second enclosing structure is arranged on the outer circumferential side of the heat dissipation fin module.

4. The temperature regulating device of claim 3, wherein: The heat dissipation fan is arranged on the end of the heat dissipation fin module away from the refrigeration component.

5. The temperature regulating device of claim 3, wherein: The second enclosing structure at least extends to the outer periphery of the heat dissipation fan.

6. The temperature regulating device of claim 5, wherein: The guide structure is arranged on the side of the heat dissipation fan away from the heat dissipation fin module.

7. The temperature regulating device of claim 3, wherein: The guide structure comprises a guide plate which is arranged obliquely on the side away from the heat dissipation fan.

8. The temperature regulating device of claim 7, wherein: The guide structure comprises two side plates and a guide plate arranged between the two side plates.

9. The temperature regulating device of claim 8, wherein: The two side plates and the guide plate form an air outlet channel.

10. The temperature regulating device of claim 1, wherein: The heat dissipation assembly comprises at least two heat dissipation fans and at least two heat dissipation fin modules.

11. The temperature regulating device of claim 10, wherein: The heat dissipation fin modules correspond to the heat dissipation fans one by one.

12. The temperature regulating device of claim 1, wherein: The guide structure corresponds to one of the heat dissipation fans.

13. The temperature regulating device of claim 3, wherein: The guide plate is arranged obliquely in the direction away from the other heat dissipation fan.

14. The temperature regulating device of claim 13, wherein: The guide plate is arranged obliquely in the direction away from the other heat dissipation fan. The heat dissipation assembly further comprises a heat insulation sheet arranged on the top surface of the heat dissipation fin module. The bottom surface of the material tray is used to connect with the top surface of the second enclosing structure. The heat insulation sheet is located between the material tray and the second enclosing structure. The heat insulation sheet is provided with a through hole. The material tray comprises a body part and a flange part. The flange part is arranged on the outer circumferential side of the body part. The flange part is arranged on the end of the body part close to the second enclosing structure. The flange part is fixedly connected with the top surface of the second enclosing structure. The flange part is continuously arranged along the circumference of the body part. The material tray is provided with a placing groove. The inner wall of the placing groove is used to contact with the outer wall of a reagent tube. The material tray is provided with a plurality of placing grooves. The refrigeration component is a semiconductor refrigeration fin. The temperature adjusting device further comprises a cooling plate arranged between the refrigeration component and the bottom surface of the material tray. The cooling plate has opposite first and second surfaces. The first surface is arranged in contact with the cold surface. The second surface is arranged in contact with the bottom surface of the material tray. The second surface of the cooling plate is provided with a guide groove. The edge of the cooling plate is provided with a flow collecting port. The guide groove is communicated with the flow collecting port.

15. The temperature regulating device of claim 14, wherein: The cooling plate comprises a plurality of the flow guide grooves, which are arranged in parallel and spaced apart on the surface of the cooling plate.

16. The temperature regulating device of claim 15, wherein: The flow guide groove comprises a transverse groove and a plurality of longitudinal grooves, the extension direction of the transverse groove intersects with the extension direction of the longitudinal grooves, and the longitudinal grooves are all communicated with the transverse groove, and the transverse groove is communicated with the flow collecting port.

17. The temperature regulating device of claim 14, wherein: The edge of the cooling plate is further provided with a temperature measuring port, which is arranged in spaced apart manner with the flow collecting port.

18. The temperature regulating device of claim 17, wherein: The temperature measuring port is provided with a temperature sensor, which is used for detecting the temperature of the cooling plate.

19. The temperature regulating device of claim 13, wherein: The material tray is movably connected with the cooling plate.

20. The temperature regulating device of claim 19, wherein: The cooling plate comprises a plate body and a first enclosing structure, the plate body is arranged in contact with the bottom surface of the material tray, the first enclosing structure is arranged on the outer periphery of the plate body, and the first enclosing structure is arranged in protrusion from the second surface of the plate body in the direction perpendicular to the plate body, so as to form an accommodation space together with the plate body, and at least a part of the material tray can be accommodated in the accommodation space.

21. The temperature regulating device of claim 20, wherein: The heat dissipation assembly further comprises a heat insulation sheet, the heat insulation sheet is arranged on the top surface of the heat dissipation sheet module, the bottom surface of the first enclosing structure is used for connecting with the top surface of the second enclosing structure, and the heat insulation sheet is located between the first enclosing structure and the second enclosing structure. The heat insulation sheet is further provided with a avoiding through hole, so that the cold surface of the refrigeration component is exposed to the avoiding through hole.

22. The temperature regulating device of claim 20, wherein: The material tray comprises a body part and a flange part, the flange part is arranged on the outer peripheral side surface of the body part, the accommodation space is used for accommodating the body part, and the flange part is arranged on the end of the body part away from the accommodation space.

23. The temperature regulating device of claim 22, wherein: The flange part is continuously arranged along the circumferential direction of the body part.

24. The temperature regulating device of claim 3 or 21, wherein: The temperature adjusting device further comprises a bottom frame, which is arranged on the bottom surface of the second enclosing structure and protrudes from the outer peripheral side surface of the second enclosing structure.

25. An automated biological production apparatus, comprising: The temperature adjusting device comprises an operating base and a temperature adjusting device as claimed in any one of claims 1 to 24, the operating base is provided with a mounting opening, and the temperature adjusting device is arranged on the operating base, so that at least a part of the heat dissipation assembly or the flow guide structure is located in the mounting opening.

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