Support plate for coating equipment, support plate assembly and coating equipment

Abstract

The embodiment of the utility model provides a carrier plate for coating equipment, a carrier plate assembly and the coating equipment, and the carrier plate comprises a carrier plate main body which is provided with an upper surface and a lower surface which are used for bearing a base material; the edge thinning part is formed on the periphery of the carrier plate main body, and the thickness of the edge thinning part is smaller than that of the carrier plate main body. Through the structure of the support plate provided by the embodiment of the invention, the non-uniformity of heating deformation of the support plate can be effectively reduced, the buckling deformation of the support plate in a working cycle is reduced, and the fragment rate requirement and the coating uniformity requirement of normal production are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of manufacturing equipment, in particular, the embodiments of the present application relate to a carrier plate for a coating equipment, a carrier plate assembly and a coating equipment. BACKGROUND

[0002] For large-size coating equipment (such as plasma-enhanced chemical vapor deposition (PECVD), hot wire chemical vapor deposition (CVD) and the like), large-size carrier plates are often used. The carrier plate is repeatedly subjected to high and low temperature cycles during the coating process. Uneven heat absorption and heat dissipation during heating result in poor temperature uniformity, causing thermal deformation, and even a large amplitude of warping deformation, which increases the difficulty of taking and placing the substrate (for example, a battery piece), for example, resulting in the inability to take or place the piece, and in severe cases, even damaging the tool fixture. The occurrence of these situations has a negative impact on the success rate of taking and placing the substrate on the carrier plate, the breakage rate and the whole line downtime rate and the like. In addition, due to the poor temperature uniformity of the carrier plate, the coating uniformity is also reduced.

[0003] Currently, there are three main solutions to the problem of thermal deformation caused by uneven heating temperature of large-size carrier plates: a. using a metal material with low thermal expansion coefficient, which can solve the problem of thermal deformation, but the material cost and processing cost are extremely high; b. thickening the whole carrier plate, which can improve the thermal deformation to a certain extent, but cannot completely solve the problem, and increases the plate thickness, which increases the heat absorption amount, increases the energy consumption and factory operation cost; c. increasing the correction mechanism, which increases the complexity of the machine, increases the additional cost and maintenance difficulty, and has a certain downtime rate, which has a certain impact on the production line rate.

[0004] Therefore, how to effectively improve the thermal deformation caused by uneven temperature during heating of the carrier plate has become a technical problem to be solved. INVENTION CONTENTS

[0005] The purpose of the embodiments of the present application is to provide a carrier plate for a coating equipment, a carrier plate assembly and a coating equipment. The carrier plate provided by the embodiments of the present application can effectively reduce the deformation problem caused by heating of the carrier plate and reduce the warping deformation amount of the carrier plate in the working cycle, and meet the breakage rate requirement of normal production and the coating uniformity requirement.

[0006] In a first aspect, the embodiments of the present application provide a carrier plate for a coating equipment, the carrier plate comprising: a carrier plate body having an upper surface for carrying a substrate; an edge thinning site formed at an outer periphery of the carrier plate body, the thickness of the edge thinning site being less than the thickness of the carrier plate body.

[0007] The edges of the carrier plate designed in the embodiments of this application are thinned. This thinned-edge carrier plate can better adjust the heat absorption and heat dissipation efficiency of the corresponding carrier plate edge during heating, so that the temperature of the carrier plate edge is basically the same as the temperature of other areas on the carrier plate body, thereby improving the overall temperature uniformity of the carrier plate and effectively improving the deformation problem caused by uneven heating of the carrier plate during the heating process.

[0008] In some embodiments, the edge thinning portion is obtained by thinning at least a portion of the edge of the carrier plate on one side and / or both sides.

[0009] Some embodiments of this application can be used to thin the entire edge of the carrier plate or part of the edge of the carrier plate on one or both sides to obtain the edge thinning part according to actual needs. The edge parts of the carrier plate obtained by different processing methods can meet the carrier plate deformation suppression requirements in different scenarios.

[0010] In some embodiments, the edge thinning portion is distributed across the entire edge of the carrier plate; or, the edge thinning portion is segmented and disposed in a portion of the edge of the carrier plate.

[0011] Some embodiments of this application provide edge thinning portions along the entire outer periphery of the carrier plate, which can minimize deformation. Other embodiments of this application provide edge thinning portions intermittently along the outer periphery of the carrier plate, which can reduce deformation while reducing the workload of thinning processing.

[0012] In some embodiments, the edge thinning portion has a planar, sloping, or arc-shaped cut surface.

[0013] Some embodiments of this application include edge thinning portions such as stepped thinning portions, ramp thinning portions, or arc-shaped thinning portions. The shapes of different thinning portions can adapt to the deformation requirements of different scenarios, thereby improving the versatility of the technical solution.

[0014] In some embodiments, the carrier plate further includes a stress relief portion disposed on the edge portion of the carrier plate body.

[0015] In some embodiments of this application, the carrier plate is also provided with a stress relief section to relieve stress at stress concentration points and reduce deformation.

[0016] In some embodiments, the carrier plate further includes: a plurality of substrate placement units, which are dispersed on the upper surface of the carrier plate body; wherein the stress relief portion is disposed in the outer neighborhood of the edge substrate placement unit, and the edge substrate placement unit is the plurality of outermost substrate placement units located on the carrier plate body.

[0017] Some embodiments of this application also provide a stress relief section in the vicinity of the substrate placement unit located at the edge of the carrier plate, thereby improving the stress concentration problem caused by the substrate placement unit.

[0018] In some embodiments, the substrate placement unit is a rectangular placement groove, and the stress relief portion is adjacent to the right-angle portion of the rectangular placement groove.

[0019] In some embodiments of this application, the stress relief section is located at the corner of the rectangular placement slot, which can minimize the deformation problem caused by stress concentration at the corner.

[0020] In some embodiments, the stress relief section is a blind groove or a through groove.

[0021] Secondly, some embodiments of this application provide a carrier assembly, the carrier assembly comprising: a plurality of interconnected carriers as described in any embodiment of the first aspect.

[0022] Thirdly, some embodiments of this application provide a coating apparatus, the coating apparatus comprising: a carrier plate as described in any embodiment of the first aspect; or, a carrier plate assembly as described in any embodiment of the second aspect; a heating device for heating the carrier plate or the carrier plate assembly during coating; and a process parameter control unit configured to adjust the heating parameter value of the heating device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 One of the top views of a carrier plate for a coating apparatus provided in an embodiment of this application;

[0025] Figure 2 A second top view of a carrier plate for a coating apparatus provided in an embodiment of this application;

[0026] Figure 3 A third top view of a carrier plate for a coating apparatus provided in an embodiment of this application;

[0027] Figure 4 Fourth top view of a carrier plate for a coating apparatus provided in an embodiment of this application;

[0028] Figure 5 A front view of a carrier plate for a coating apparatus provided in an embodiment of this application;

[0029] Figure 6 Fifth top view of a carrier plate for a coating apparatus provided in an embodiment of this application. Detailed Implementation

[0030] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] To improve the temperature uniformity of the carrier plate during heating and to mitigate the deformation or even warping caused by heating large-sized carrier plates, some embodiments of this application provide a carrier plate formed by thinning the edges of the carrier plate. The thinned carrier plate has a thinned edge portion and a carrier plate body. This structure significantly improves the temperature uniformity of the carrier plate during heating, reduces heating deformation or warping, improves coating uniformity, extends the service life of the carrier plate, and reduces usage, maintenance, and turnover operating costs.

[0033] Please refer to Figure 1 , Figure 1 The carrier plate 100 provided in the embodiments of this application for a coating apparatus includes: a carrier plate body 110 and an edge thinning portion disposed on the outer periphery of the carrier plate body. It should be noted that... Figure 1 Only the approximate area where the edge thinning is located is shown; this approximate area is located by... Figure 1 The area enclosed by the first dashed line 101 and the second solid line 102 is at least a portion of the area, which is the outer periphery of the carrier plate body 110.

[0034] The carrier plate body 110 has an upper surface for supporting the substrate. It is understood that... Figure 1 This is a top view of the carrier plate, therefore using... Figure 1 Only the upper surface of the carrier plate 100 can be observed; it is understood that the carrier plate 100 also has a lower surface.

[0035] In this embodiment of the application, the edge thinning portion is formed on the outer periphery of the carrier plate body (for example, the edge thinning portion 120 is distributed on the outer periphery of the carrier plate body). Figure 1In at least a portion of the area enclosed by the first dashed line 101 and the second solid line 102, the thickness of the edge-thinned portion in this embodiment is less than the thickness of the carrier plate body 110; that is, the thickness at each point on the edge-thinned portion is less than the thickness of the carrier plate body. In some embodiments of this application, the carrier plate body 110 is provided with grooves for accommodating the substrate, and the thickness of the carrier plate body 110 at this location refers to the thickness of the areas on the carrier plate body other than the grooves and the edge-thinned portion. In some embodiments of this application, the carrier plate body 110 is provided with grooves for accommodating the substrate, and the thickness of the carrier plate body 110 at this location refers to the thickness of the areas corresponding to these grooves. In some embodiments of this application, the thickness of the carrier plate body 110 refers to the thickness of most areas on the carrier plate 100 (i.e., excluding the areas corresponding to the edge-thinned portions).

[0036] The edges of the carrier plate designed in the embodiments of this application are thinned. This thinned-edge carrier plate can better adjust the heat absorption and heat dissipation efficiency of the corresponding carrier plate edge during heating, so that the temperature of the carrier plate edge is basically consistent with other areas, improving the overall temperature uniformity, and thus effectively improving the deformation problem caused by uneven heating of the carrier plate during the heating process.

[0037] In some embodiments, the edge thinning is achieved by thinning at least a portion of the edge of the carrier plate (the edge of the carrier plate may be made of...). Figure 1 The edge thinning portion is obtained by thinning one or both sides of the entire area enclosed by the first dashed line 101 and the second solid line 102 (or the relatively outer area of ​​that area). For example, in some embodiments of this application, the edge thinning portion is obtained by thinning the upper or lower surface of the edge of the carrier plate; in some embodiments of this application, the edge thinning portion is obtained by thinning both the upper and lower surfaces of the edge of the carrier plate; in some embodiments of this application, the edge thinning portion is obtained by thinning the upper and lower surfaces of the edge of the carrier plate in segments; or the edge thinning portion is obtained by thinning the upper or lower surface of the edge of the carrier plate in segments.

[0038] It is easy to understand that some embodiments of this application can thin one or both sides of the carrier plate according to actual needs, thereby achieving the effect of suppressing carrier plate deformation in the corresponding scenario.

[0039] In some embodiments, the edge thinning portion is distributed across the entire edge of the carrier plate (e.g., Figure 2 The edge lines of the edge thinning portion 120 are the second solid line 102 and the third solid line 103, respectively, and the edge thinning portion is distributed throughout the entire edge of the carrier plate; or, the edge thinning portion is segmented and arranged along the edge of the carrier plate (e.g., Figure 3The illustration shows multiple edge thinning portions 120 segmented along the edge of the carrier plate. In some embodiments of this application, such as... Figure 2 As shown (this figure and) Figure 1 The difference lies in the fact that the figure indicates the distribution of the edge thinning portion at the edge of the carrier plate. The edge thinning portion 120 is located within the entire length range enclosed by the first dashed line 101 and the second solid line 102, that is, the edge thinning portion is distributed throughout the entire outer peripheral edge. In some embodiments of this application, multiple edge thinning portions 120 are segmented and arranged at the edge of the carrier plate enclosed by the first dashed line 101 and the second solid line 102.

[0040] It should be noted that, Figure 2 and Figure 3 The main body of the carrier plate corresponds to the remaining parts of the carrier plate 100 except for the edge thinning part.

[0041] It is easy to understand that some embodiments of this application obtain edge-thinned portions by thinning the entire outer periphery of the carrier plate edge, which can minimize deformation. Other embodiments of this application obtain edge-thinned portions by intermittently thinning the outer periphery of the carrier plate edge, which can reduce deformation while reducing the workload of thinning.

[0042] In some embodiments of this application, the carrier plate 100 further includes: a stress relief section ( Figures 1-3 (Not shown), the stress relief portion is provided on the edge portion of the carrier plate body 110. It should be noted that the edge portion of the carrier plate body and the edge of the carrier plate where the edge thinning portion 120 is located are adjacent areas.

[0043] Some embodiments of this application can relieve stress in areas of stress concentration by providing stress relief parts on the carrier plate, thereby reducing deformation. It should be noted that in some embodiments of this application, the stress relief parts are located in areas of relatively concentrated stress on the carrier plate body.

[0044] For example, in some embodiments of this application, the carrier plate 100 further includes: a plurality of substrate placement units ( Figures 1-3 (Not shown), and multiple substrate placement units are dispersedly disposed on the upper surface of the carrier plate body 110, with corresponding stress relief portions disposed in the outer neighborhood of the edge substrate placement units. The edge substrate placement units are the outermost multiple substrate placement units located on the carrier plate body 110. Some embodiments of this application further provide stress relief portions in the neighborhood of the substrate placement units located at the edge of the carrier plate, thereby improving the stress concentration problem caused by the substrate placement units.

[0045] It should be noted that, in some embodiments of this application, the substrate placement unit is a rectangular placement groove, and the stress relief part is adjacent to the right-angle portion of the rectangular placement groove to reduce stress concentration at the right-angle portion and improve deformation. In some embodiments of this application, the stress relief part is a blind groove or a through groove.

[0046] It is easy to understand that some embodiments of this application place the stress relief part at the corner of the rectangular placement groove to minimize the deformation problem caused by stress concentration at the corner.

[0047] It should be noted that in some embodiments of this application, the edge thinning portion 120 has a planar (the portion of which connects with the upper surface of the unthinned carrier plate body to form a stepped structure), a slope (not shown in the figure), or an arc (not shown in the figure) cut surface. That is to say, the edge thinning portion in some embodiments of this application can be a stepped thinning portion, a sloped thinning portion, or an arc-shaped thinning portion. The different shapes of the thinning portions can adapt to the deformation requirements of different scenarios, improving the versatility of the technical solution.

[0048] The following example uses a stepped edge thinning section, combined with... Figures 4-6 The carrier board provided in some embodiments of this application is further illustrated by example. Figures 4-6 The carrier plate is used to support the solar cells, and the corresponding substrate placement unit is a rectangular solar cell placement slot. Figures 4-6 The stress relief section is a narrow groove, and this narrow groove is a blind groove, with thinned edges (and...). Figure 5 The portion obtained from the thinning process is distributed across the entire edge of the carrier plate.

[0049] like Figure 4 As shown in the figure, this figure illustrates the structure of a carrier plate according to some embodiments of this application. Multiple cell placement slots (as an example of a substrate placement unit) are provided on the carrier plate body, and multiple narrow slots are provided on the edge of the carrier plate body (as an example of a stress relief section; the front view of the narrow slot is shown below). Figure 5 As shown, and Figure 4 The two cross-sectional views also show the cross-sectional view of the narrow slot, which is set along the entire outer periphery of the edge of the carrier plate as shown in the figure. Figure 5 The edge thinning portion 120 shown is an example of a stepped edge thinning portion, i.e., the edge thinning portion has a planar cut surface. Figure 5 Is with Figure 4 The view of the section corresponding to section AA or section BB. Figure 5 The image also shows the carrier plate body 110 and the heat source, through... Figure 5 The heat source can be used to illustrate the heating process of the carrier plate 100.

[0050] In other words, the battery cell coating carrier provided in the embodiments of this application is as follows: Figures 4-6 As shown, the edge of the carrier plate is thinned to adjust the heat absorption and dissipation efficiency of the heated edge, making the edge temperature consistent with other areas and improving overall temperature uniformity. However, this invention is not limited to carrier plates used for battery cell coating; other designs that use edge thinning to adjust the temperature field uniformity of heated parts are also within the scope of protection of this invention.

[0051] like Figures 4-5 The thinning of the solar cell coating carrier plate shown is achieved through single-sided thinning (i.e., thinning is performed on the upper surface of the carrier plate edge, and the cut surface of the thinned portion is a plane, which forms a stepped structure with the uncut carrier plate). However, the embodiments of this application are not limited to single-sided thinning. In some other embodiments of this application, double-sided thinning can also be performed on the carrier plate edge (i.e., thinning is performed on both the upper and lower surfaces simultaneously). Moreover, the embodiments of this application do not limit the single-sided or double-sided thinning of the carrier plate edge to be along the entire carrier plate edge (e.g., ...). Figures 4-6 As shown), the substrate edge is thinned in sections (e.g.) Figure 2 Designs that improve overall temperature uniformity, such as thinning the edges of each small carrier plate that makes up the carrier plate assembly or thinning the edges in segments, are all within the protection scope of this utility model.

[0052] It should be noted that, as Figures 4-6 As shown, the stress relief section designed in the embodiments of this application can be a "narrow groove" structure. For example, the width of the narrow groove is about 1 to 5 mm. However, this utility model is not limited to the width of the "narrow groove," and all narrow groove designs that release the stress generated by heating through narrow grooves or otherwise aim to achieve a similar stress relief effect are within the protection scope of this utility model. For example, the "narrow groove" designed in the embodiments of this application has a groove depth of about 1 to 3 mm. However, the embodiments of this application are not limited to the depth of the "narrow groove," nor are they limited to whether the "narrow groove" is a blind groove or a through groove (penetrating the material thickness). Moreover, all narrow groove designs that release the stress generated by heating through narrow grooves or otherwise aim to achieve a similar stress relief effect are within the protection scope of this utility model. Figure 4 and Figure 6 As shown, the "narrow slot" designed in this application embodiment is located at the corresponding positions (i.e., right-angled parts) of the corners (roughly rectangular) of its multiple battery cell placement slots. Figure 4 , Figure 5 , Figure 6 The "narrow groove" shown is not limited to the location shown in the figure. All stress-relieving narrow grooves designed using this method are within the protection scope of this utility model.

[0053] Some embodiments of this application provide a carrier assembly comprising: a plurality of interconnected carriers as described in any of the above embodiments.Figure 6 As shown in the diagram, the carrier plate assembly is used to support the solar cells. Figure 6 Cross-sectional views of sections AA and BB are also provided as examples; these cross-sectional views can be found in detail elsewhere. Figure 5 As shown, Figure 5 The enlarged cross-sectional view shows the edge thinning section and the narrow groove (as an example of a stress relief section) corresponding to the stepped edge thinning section.

[0054] Based on the above examples, it is easy to understand that, compared with the carrier boards of the prior art, the carrier board design provided in some embodiments of this application includes: edge thinning, that is, for the carrier board assembly or a single solid carrier board, thinning processing is performed at the overall edge position relative to the thickness of the material; narrow slots are opened, placing the small carrier board of the carrier board assembly or the multiple battery cells of the single solid carrier board at the corresponding positions of the corners of the slot (generally rectangular) (e.g. Figure 4 , Figure 5 , Figure 6 The "narrow groove" shown is a narrow groove of a certain length, for example, the groove width is about 1 to 5 mm and the groove depth is 1 to 3 mm.

[0055] The following examples, based on the principles, illustrate the technical objectives of thinning the carrier plate and setting narrow slots in the embodiments of this application.

[0056] First, the heating temperature of the carrier plate is affected not only by the uniformity of the heat source, but also by the uniformity of heat absorption and heat dissipation of the carrier plate.

[0057] First, the specific heat capacity formula Q=cmΔT (Q: heat, c: specific heat capacity, m: mass, ΔT: temperature change) means that the heat absorbed per unit volume is directly proportional to the mass within that unit volume; therefore, ΔT=Q / (cm) means that the temperature change within a unit volume is directly proportional to the heat absorbed per unit volume and inversely proportional to the mass within that unit volume.

[0058] Second, the heat dissipation formula Q=KFΔT (Q: heat, K: heat transfer coefficient, F: heat dissipation area, ΔT: temperature change) means that the heat dissipated per unit volume is directly proportional to the heat dissipation area; therefore, ΔT=Q / (KF) means that the temperature change per unit volume is directly proportional to the heat dissipated per unit volume and inversely proportional to the heat dissipation area per unit volume.

[0059] Third, the heat absorption uniformity of the carrier plate is affected by the structural uniformity of the carrier plate. In the design, the structural features of the carrier plate should be arranged as evenly as possible to ensure that the heat absorption efficiency at each uniformly distributed location is basically the same, thus improving temperature uniformity. During heat dissipation, the heat dissipation efficiency is relatively consistent in the middle position, except for the edges, while the edges have a much higher heat dissipation efficiency due to the increased lateral heat dissipation area. The embodiments of this application thin the edges of the carrier plate, relatively reducing the heat absorption volume (i.e., mass) of the thinned area, resulting in more heat accumulation in that area compared to other regions. However, because the edges dissipate heat faster, the cooling rate is faster than in the middle position, removing more heat. Therefore, through calculation and experimental verification and repeated correction, the overall heating temperature uniformity can be improved by adjusting the thickness and area of ​​the thinned region.

[0060] Fourth, when the carrier plate is heated, the material expands due to heat. Because the heat received per unit volume and temperature vary among parts during heating, and because parts have certain structural features (such as holes and slots) for functional purposes, and the parts are not necessarily homogeneous materials, stress concentration can occur. This causes the parts to naturally seek out weak points in the material's stiffness to release some stress, resulting in deformations different from uniform expansion. The embodiments of this application illustrate this. Figures 4-6 The "narrow groove" shown (as a specific example of a stress relief section) can release a portion of the stress from stress concentration. Furthermore, by using multiple separate narrow grooves, the stress can be released individually, reducing stress concentration, lowering stress magnitude, and minimizing potential uneven deformation or warping. It also allows for normal springback after heating and cooling. Therefore, through calculations and experimental verification and repeated corrections, the overall uniformity of stress relief can be improved by adjusting the width, depth, length, number, and area of ​​the narrow groove region.

[0061] It should be noted that while some embodiments of this application may use metal carrier plates, this invention is not limited to the use of metal carrier plates. All designs employing this method for edge thinning to improve temperature uniformity and narrow slot stress relief are within the protection scope of this invention. The carrier plates and corresponding heat sources in the embodiments of this application are vertically mounted, but this invention is not limited to vertically mounted carrier plates. All designs employing this method for edge thinning to improve temperature uniformity and narrow slot stress relief are within the protection scope of this invention.

[0062] Some embodiments of this application provide a coating apparatus, the coating apparatus comprising: a carrier plate as described in any of the above embodiments; or, a carrier plate assembly as provided in the above embodiments; a heating device for heating the carrier plate or the carrier plate assembly during coating; and a process parameter control unit configured to adjust the heating parameter value of the heating device.

[0063] For example, the coating equipment in the embodiments of this application is a hot filament CVD equipment, but this utility model is not limited to hot filament CVD equipment, nor is it limited to use in other photovoltaic industry equipment or other new energy industry equipment.

[0064] Compared with carriers of related technologies, the carriers of some embodiments of this application exhibit higher temperature uniformity, better coating uniformity, higher cell efficiency, and greater economic benefits for enterprises. The carriers of the embodiments of this application show less deformation unevenness, are easy to spring back after deformation, and are less prone to deformation and warping after cooling, significantly reducing carrier maintenance and turnover costs, and lowering plant operating costs. The carriers of the embodiments of this application are easy to level after deformation, with good leveling effect, and can be used directly after leveling. The structural features added to the embodiments of this application are simple and compact, with low processing difficulty and low cost.

[0065] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0066] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0067] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0068] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0069] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A carrier plate for a coating equipment, characterized in that, The carrier plate comprises: a carrier plate body having an upper surface for carrying substrates; an edge thinning site formed on the outer periphery of the carrier plate body; wherein the thickness of the edge thinning site is less than the thickness of the carrier plate body.

2. The carrier panel of claim 1, wherein, The edge thinning site is obtained by thinning the single side and / or double side of at least a partial region of the carrier plate edge.

3. The carrier panel of claim 2, wherein, The edge thinning site is distributed throughout the carrier plate edge; or the edge thinning site is arranged in sections in a partial region of the carrier plate edge.

4. The carrier panel of any of claims 1-2, wherein, The edge thinning site has a planar, sloping or arc-shaped cut surface.

5. The carrier plate of claim 1, wherein, The carrier plate further comprises: a stress release portion arranged on the edge portion of the carrier plate body.

6. The carrier panel of claim 5, wherein, The carrier plate further comprises: a plurality of substrate placement units arranged in sections on the upper surface of the carrier plate body; wherein the stress release portion is arranged in the vicinity of the outer side of the edge substrate placement unit, which is the outermost substrate placement unit on the carrier plate body.

7. The carrier panel of claim 6, wherein, The substrate placement unit is a rectangular placement groove, and the stress release portion is adjacent to the right-angle portion of the rectangular placement groove.

8. The carrier panel of any one of claims 5-7, wherein, The stress release portion is a blind groove or a through groove.

9. A carrier plate assembly, characterized by The carrier plate assembly comprises a plurality of carrier plates as claimed in any one of claims 1-8 connected to each other.

10. A coating apparatus, characterized by, The coating device comprises: a carrier plate as claimed in any one of claims 1-8; or a carrier plate assembly as claimed in claim 9; and a heating device for heating the carrier plate or the carrier plate assembly during coating; and a process parameter control unit configured to adjust the heating parameter value of the heating device.

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