Novel silicon wafer electroplating device

Abstract

The utility model discloses a novel silicon wafer electroplating device. The electroplating device comprises an anode plate, a plurality of cathode pieces, a cover plate assembly, a product carrying table, a circulating liquid box and a rotating assembly, the cover plate assembly is rotationally connected with one end of the circulating liquid tank through a rotating assembly; a liquid inlet hole of a liquid preparation cavity of the cover body is communicated with a liquid inlet pipe and a liquid separation hole is formed in the lower wall; the product carrying table is fixed in the circulating liquid box, limiting oblique angles are arranged around a material carrying groove of the product carrying table, and a flow guide channel at the lower end of the product carrying table is communicated with a liquid drainage hole of the circulating liquid box; the anode plate is connected below the first convex column of the cover body; the plurality of cathode pieces are elastically connected to two sides below the cover body in a floating manner; the cover plate assembly is opened, and the product is placed in the material carrying groove; the cover plate assembly is closed, the anode plate is located above the product, the cathode piece elastically contacts two sides of the product, and the anode plate and the cathode piece are electrified to form a loop and generate electroplating on the surface of the product. The electroplating device has the effects of high electroplating efficiency, high electroplating quality and high product percent of pass.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer electroplating, and in particular to a novel silicon wafer electroplating apparatus. Background Technology

[0002] In photovoltaic products, silicon wafers are a crucial component. Photovoltaic silicon wafers require surface electroplating. Currently, during the electroplating process, the silicon wafer is horizontally moved within the plating tank, forming a closed circuit when energized. This method has several drawbacks: First, the continuous movement of the silicon wafer increases the probability of breakage, leading to a low product yield. Second, the hard, non-adjustable contact between the silicon wafer and the cathode further increases the likelihood of fragmentation. Third, poor alignment between the cathode and the wafer results in uneven conductivity, affecting both the electroplating quality and efficiency. Utility Model Content

[0003] To address one or more of the above problems, this utility model provides a novel silicon wafer electroplating apparatus.

[0004] According to one aspect of the present invention, the novel silicon wafer electroplating apparatus includes: an anode plate, a plurality of cathode components, a plurality of conductive screws, and a cover plate assembly, a product stage, a circulating liquid tank, and a rotating assembly, all of which are made of insulating material.

[0005] The cover body of the cover plate assembly is fixedly connected to the rotating shaft via the upper connecting arm. The upper wall of the liquid distribution chamber of the cover body is provided with a liquid inlet hole and the lower wall is provided with a liquid distribution hole. The upper end of the liquid inlet hole is fixedly connected to the liquid inlet pipe.

[0006] The product platform is fixed inside the circulating liquid tank. The material loading trough of the product platform is provided with limiting angles around it. The lower end of the product platform is provided with a guide channel connecting the liquid collection trough and the inner cavity of the circulating liquid tank.

[0007] The circulating liquid tank has a protruding overflow pipe on one side of the opening, and the liquid collection tank on its lower wall is located below the product platform. The lower end of the drain hole in the center of the liquid collection tank is fixedly connected to the drain pipe.

[0008] The rotating component's shaft is hinged to one end of the circulating fluid tank;

[0009] The anode plate is located below the first protruding post of the four rectangular arrays of the cover and is fixedly connected by four conductive screws, with the upper end of the conductive screws electrically connected to the anode wire.

[0010] Several cathode components are elastically floating and connected to both sides of the lower surface of the cover. The upper end of the cathode component is electrically connected to the cathode wire, and the contact end of its lower end is located below both sides of the anode plate.

[0011] The rotation of the shaft opens the cover assembly, placing the product into the loading tank; the rotation of the shaft closes the cover assembly, with the anode plate positioned above the product and the cathode component elastically contacting both sides of the product. The two are energized to form a circuit and electroplating occurs on the product surface.

[0012] In some embodiments, the upper end of the cylindrical boss of the cathode is a small-diameter upper guide post and the lower end is an inverted conical contact end. The upper end of the upper guide post passes through the lower cover of the cover and is threaded to a limiting nut. A spring is sleeved on the upper guide post, with its upper end fitting against the lower cover and its lower end fitting against the boss.

[0013] In some embodiments, several second protrusions are symmetrically connected to both sides of the lower end of the cover. The second protrusions are longer than the first protrusions. The second protrusions and the boss are in a sliding fit with the same diameter. The spring is located in the shaft hole of the second protrusion.

[0014] In some embodiments, the cover includes an upper cover and a lower cover, and four conductive screws pass through the first through hole of the anode plate, the shaft hole of the first protrusion, the third through hole of the lower cover, and the second through hole of the upper cover to connect and fix nuts.

[0015] Alternatively, the third through hole may be a countersunk hole, and the conductive screw may be a countersunk screw.

[0016] In some embodiments, the lower cover protrudes from both ends of the upper cover to form wing plates, and the lower ends of the wing plates are integrally connected to a second protruding post.

[0017] Several cathode components are symmetrically and vertically elastically floated and connected to the lower surface of the wing plate of the cover.

[0018] In some embodiments, the liquid dispensing chamber is a plurality of elongated oval slots arranged in a circumferential array, with the lower end of the elongated oval slots open;

[0019] Alternatively, a number of radially arranged grooves may be provided between the central groove and the annular groove of the liquid collection tank.

[0020] In some implementations, the overflow pipe is vertically adjustable and threaded onto one side of the inner cavity of the circulating fluid tank.

[0021] In some embodiments, two ear plates are symmetrically provided on the side plates at both ends of the circulating liquid tank, and the two ends of the rotating shaft are rotatably connected to the ear plates, with one end extending outward to connect to the driving power.

[0022] Alternatively, the two ends of the shaft can be rotatably connected to the lugs via oil-free bearings or deep groove ball bearings.

[0023] In some implementations, the product platform has a rectangular end foot protruding in the middle of the lower end of the four sides and a rectangular inlet with a flow guide channel on both sides.

[0024] In some embodiments, the insulating material for the cover plate assembly, product platform, circulating liquid tank, and rotating assembly is PP polypropylene synthetic plastic.

[0025] The beneficial effects of this novel silicon wafer electroplating device are as follows: First, during electroplating, the product will not float after immersion due to the pressure of the cover plate assembly. The product is fixed in the product carrier during the electroplating process. The silicon wafer product with this structure is fixed and does not need to be moved, reducing the probability of product breakage and effectively improving the product qualification rate. Second, the silicon wafer product and the cathode component have elastic floating contact. When the cover plate assembly is pressed down, the elastically floating cathode component can float vertically, which can adjust the pressure of the contact surface, reduce the reaction force of the product, reduce the risk of fragmentation, and improve the electroplating efficiency. Third, the product carrier is provided with grooves and limit angles to prevent the product from sliding back, forth, left, and right, effectively ensuring the position of the product and ensuring effective contact between the two. At the same time, the cathode components are symmetrically arranged on both sides to effectively ensure the reliability of the contact between the two, ensure uniform conductivity, and improve the electroplating quality and efficiency. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of a novel silicon wafer electroplating apparatus according to one embodiment of the present invention;

[0027] Figure 2 for Figure 1 A three-dimensional exploded view of the novel silicon wafer electroplating device shown.

[0028] Figure 3 for Figure 1 A three-dimensional schematic diagram of the lower cover is shown;

[0029] Figure 4 for Figure 1 A three-dimensional schematic diagram of the top cover shown;

[0030] Figure 5 for Figure 1 A partial cross-sectional view of the cover plate assembly shown;

[0031] Cover assembly 1, cover body 10, liquid dispensing chamber 100, liquid inlet hole 101, liquid distribution hole 102, upper cover 103, lower cover 104, elongated groove 105, liquid inlet pipe 11, upper connecting arm 12, first protrusion 13, second protrusion 14, spring 15.

[0032] Product platform 2, material trough 20, limiting angle 21, flow guide channel 22, rectangular end foot 23, rectangular hole 24;

[0033] Circulating liquid tank 3, liquid collection tank 30, central groove 300, drain hole 301, annular groove 302, radial groove 303, overflow pipe 31, drain pipe 32, ear plate 33;

[0034] Rotating assembly 4, rotating shaft 40, anti-rotation section 401, snap ring 41;

[0035] Anode plate 5;

[0036] Cathode component 6, boss 61, contact end 62, upper guide post 63, limit nut 64;

[0037] Conductive screw 7, fixing nut 71;

[0038] Anode wire 8; Cathode wire 9. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to the accompanying drawings. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to the directions in the accompanying drawings, while the terms "inner" and "outer" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0040] Figures 1 to 5 The figure schematically illustrates a novel silicon wafer electroplating apparatus according to one embodiment of the present invention. As shown, the novel silicon wafer electroplating apparatus includes: an anode plate 5, several cathode components 6, several conductive screws 7, and a cover plate assembly 1, a product stage 2, a circulating liquid tank 3, and a rotating assembly 4, all made of insulating material; the insulating material of the cover plate assembly 1, the product stage 2, the circulating liquid tank 3, and the rotating assembly 4 is preferably PP polypropylene synthetic plastic.

[0041] The cover body 10 of the cover plate assembly 1 is fixedly connected to the rotating shaft 40 through the upper connecting arm 12. The upper wall of the liquid distribution chamber 100 of the cover body 10 is provided with an inlet hole 101 and the lower wall is provided with a distribution hole 102. The upper end of the inlet hole 101 is fixedly connected to the inlet pipe 11. The electroplating solution flows into the circulating liquid tank 3 from the inlet pipe 11, the inlet hole 101, the liquid distribution chamber 100, and the distribution hole 102.

[0042] The product platform 2 is fixed inside the circulating liquid tank 3. The material loading trough 20 of the product platform 2 is provided with limiting bevels 21 around its perimeter. The lower end of the product platform 2 is provided with a guide channel 22 that connects the liquid collection tank 30 and the inner cavity of the circulating liquid tank 3. The dimensions of the material loading trough 20 of the product platform 2 are preferably fitted with the product outline and the cover 10 with clearance.

[0043] The circulating liquid tank 3 has a protruding overflow pipe 31 on one side of its opening. The collection tank 30 on its lower wall is located below the product platform 2. The lower end of the drain hole 301 in the center of the collection tank 30 is fixedly connected to a drain pipe 32. The electroplating solution is discharged through the guide channel 22, the collection tank 30, and the drain hole 301. Preferably, the diameter of the overflow pipe 31 is larger than the diameter of the drain pipe 32 to ensure that the electroplating solution in the circulating liquid tank 3 is at a set height. Preferably, the vertical height of the overflow pipe 31 is adjustable via a threaded connection to one side of the inner cavity of the circulating liquid tank 3, ensuring that its set height can be quickly adjusted according to process requirements.

[0044] The rotating shaft 40 of the rotating component 4 is hinged to one end of the circulating liquid tank 3;

[0045] The anode plate 5 is located below the first protrusion 13 of the four rectangular arrays of the cover 10 and is fixedly connected by four conductive screws 7. The upper end of the conductive screws 7 is electrically connected to the anode wire 8.

[0046] Several cathode components 6 are elastically floatingly connected to both sides of the lower surface of the cover 10. The upper end of the cathode component 6 is electrically connected to the cathode wire 9, and the contact end 62 at its lower end is located below both sides of the anode plate 5. Preferably, there are 8 cathode components 6, 4 on each side.

[0047] The rotation of the shaft 40 opens the cover plate assembly 1, placing the product into the material tank 20; the rotation of the shaft 40 closes the cover plate assembly 1, with the anode plate 5 positioned above the product and the cathode component 6 elastically contacting both sides of the product. The two are energized to form a circuit and electroplating occurs on the surface of the product.

[0048] The products are directly placed into the product carrier 2 via an automated feeding machine. After the products are placed into the product carrier 2, the cover plate assembly 1 is closed, the cathode component 6 is pressed onto the products, and then the electroplating solution enters the product carrier 2 from the liquid inlet pipe 11 of the cover plate assembly 1. Then, an immersion area is formed in the circulating liquid tank 3. When the immersion height completely submerges the anode plate 5 and the cathode component 6, the wires of the anode and cathode are connected to form a circuit, and electroplating occurs on the surface of the products.

[0049] The beneficial effects of this novel silicon wafer electroplating device are as follows: First, during electroplating, due to the pressure of the cover plate assembly 1, the product will not float after immersion. During the electroplating process, the product is fixed in the product carrier 2. The silicon wafer product with this structure is fixed and does not need to be moved, reducing the probability of product breakage and effectively improving the product qualification rate. Second, the silicon wafer product and the cathode component are in elastic floating contact. When the cover plate assembly 1 is pressed down, the cathode component 6 in elastic floating contact can float vertically, which can adjust the pressure of the contact surface, reduce the reaction force of the product, reduce the risk of fragmentation, and improve the efficiency of electroplating. Third, the product carrier 2 is provided with a groove and a limiting angle 21 to prevent the product from sliding back, forth, left, and right, effectively ensuring the position of the product and ensuring effective contact between the two. At the same time, the cathode components 6 are symmetrically arranged on both sides, effectively ensuring the reliability of the contact between the two, ensuring uniform conductivity, and improving the electroplating quality and efficiency.

[0050] Furthermore, the cathode component 6 includes a cylindrical boss 61, with a small-diameter upper guide post 63 at the upper end and an inverted conical contact end 62 at the lower end. The upper end of the upper guide post 63 passes through the through holes on both sides of the lower cover 104 of the cover body 10 and is threaded to a limiting nut 64. A spring 15 is sleeved on the upper guide post 63, with its upper end fitting against the lower cover 104 and its lower end fitting against the boss 61. The beneficial effects are: the spring 15 has good compression and recovery capabilities, and the sliding guidance of the upper guide post 63 and the boss 61 further effectively ensures the accuracy of vertical floating, effectively adjusts the pressure of the contact surface, reduces the reaction force of the product, reduces the risk of fragmentation, and improves the efficiency of electroplating.

[0051] Preferably, several vertical second protrusions 14 are symmetrically connected to both sides of the lower end of the cover 10. The second protrusions 14 are longer than the first protrusions 13. The second protrusions 14 and the boss 61 are in a sliding fit with the same diameter. The spring 15 is located in the shaft hole of the second protrusion 14. The beneficial effect is that this setting protects the spring 15, and at the same time effectively realizes the setting of the cathode part 6 higher than the anode plate 5, realizing a good electroplating circuit.

[0052] Furthermore, the cover 10 includes an upper cover 103 and a lower cover 104. Four conductive screws 7 pass through the first through hole of the anode plate 5, the shaft hole of the first protrusion 13, the third through hole of the lower cover 104, and the second through hole of the upper cover 103 to connect and fix nuts 71, thereby fixing the anode plate 5, the lower cover 104, and the upper cover 103 together. Preferably, the third through hole is a countersunk hole, and the conductive screws 7 are countersunk screws. Its beneficial effect is that the structure of this arrangement is compact and the overall size is small.

[0053] Preferably, the width of the lower cover 104 is the same as that of the upper cover 103, and its length is greater than that of the upper cover 103. The lower cover 104 protrudes from both sides of the upper cover 103 to form wing plates, and the lower end of the wing plate is integrally connected to the second protruding post 14.

[0054] Several cathode components 6 are symmetrically and vertically elastically floatingly connected to the lower surface of the wing plate of the lower cover 104, and springs 15 are provided between the lower end of the cathode components 6 and the wing plate. The beneficial effect is that this arrangement further reduces the size of the equipment, while effectively achieving the elastic floating effect.

[0055] Furthermore, the liquid preparation chamber 100 is a series of elongated oval slots 105 arranged in a circular array, with the lower end of each slot open; the beneficial effect of this arrangement is that it ensures the uniformity of the liquid spray.

[0056] The collection tank 30 includes a central tank 300 and an annular tank 302, with a plurality of radially arranged grooves 303 in a circular array between the central tank 300 and the annular tank 302. Its beneficial effect is that this arrangement effectively ensures rapid discharge of the electroplating solution.

[0057] Furthermore, two ear plates 33 are symmetrically provided on the side plates at both ends of the circulating liquid tank 3. The two ends of the rotating shaft 40 are rotatably connected to the ear plates 33, and one end of the shaft extends outward to connect to the driving power. The driving power is preferably a direct-drive servo motor or a transmission wheel driven by a servo motor. Its beneficial effects are: this setting is beneficial to automated control, the overall intermediate process is small, and it is also beneficial to control the position accuracy of the downward pressure.

[0058] Preferably, the two ends of the rotating shaft 40 are rotatably connected to the lugs 33 via oil-free bearings or deep groove ball bearings, and a retaining spring 41 is provided on the outside of the bearing. The beneficial effect is that this arrangement further ensures the smoothness of rotation and reduces frictional resistance.

[0059] Preferably, one end of each of the two upper connecting arms 12 is symmetrically fixed to the upper cover 103, and the other end is provided with an arc-shaped groove that matches the rotating shaft 40. The rotating shaft 40 is provided with an anti-rotation section 401. The beneficial effect is that this setting effectively ensures the convenience of installation and the positional accuracy.

[0060] The inlet pipe 11 is located between the two upper arms 12.

[0061] Furthermore, the product platform 2 has protruding rectangular end feet 23 at the lower center of its four sides, and the rectangular end feet 23 have rectangular inlets for the flow channels 22 on both sides.

[0062] The product platform 2 also features a rectangular array of four rectangular holes 24 in the center. The beneficial effect of this design is that it ensures rapid discharge of the electroplating solution without clogging or accumulation.

[0063] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A novel silicon wafer electroplating apparatus, characterized in that, Includes: an anode plate (5), several cathode components (6), several conductive screws (7), and a cover plate assembly (1) made of insulating material, a product platform (2), a circulating liquid tank (3), and a rotating assembly (4); The cover body (10) of the cover plate assembly (1) is fixedly connected to the rotating shaft (40) via the upper arm (12). The upper wall of the liquid distribution chamber (100) of the cover body (10) is provided with a liquid inlet hole (101) and the lower wall is provided with a liquid distribution hole (102). The upper end of the liquid inlet hole (101) is fixedly connected to the liquid inlet pipe (11). The product platform (2) is fixed in the inner cavity of the circulating liquid tank (3). The material loading trough (20) of the product platform (2) is provided with limiting angles (21) around its perimeter. The lower end of the product platform (2) is provided with a guide channel (22) that connects the liquid collection trough (30) and the inner cavity of the circulating liquid tank (3). The circulating liquid tank (3) has a protruding overflow pipe (31) on one side of the opening, and the liquid collection tank (30) on its lower wall is located below the product platform (2). The lower end of the drain hole (301) in the center of the liquid collection tank (30) is fixedly connected to the drain pipe (32). The rotating shaft (40) of the rotating assembly (4) is hinged to one end of the circulating liquid tank (3); The anode plate (5) is located below the first protrusion (13) of the four rectangular array of the cover (10) and is fixedly connected by four conductive screws (7). The upper end of the conductive screws (7) is electrically connected to the anode wire (8). Several cathode components (6) are elastically floatingly connected to both sides of the lower surface of the cover (10). The upper end of the cathode component (6) is electrically connected to the cathode wire (9), and the contact end (62) at the lower end is located below both sides of the anode plate (5). The rotating shaft (40) rotates to open the cover plate assembly (1) and place the product into the material tank (20); the rotating shaft (40) rotates to close the cover plate assembly (1), the anode plate (5) is located above the product and the cathode part (6) elastically contacts both sides of the product, the two are energized to form a circuit and electroplating is generated on the surface of the product.

2. The novel silicon wafer electroplating apparatus according to claim 1, characterized in that, The upper end of the cylindrical boss (61) of the cathode component (6) is a small-diameter upper guide post (63) and the lower end is an inverted conical contact end (62). The upper end of the upper guide post (63) passes through the lower cover (104) of the cover body (10) and is threaded to a limiting nut (64). The spring (15) is sleeved on the upper guide post (63), with its upper end attached to the lower cover (104) and its lower end attached to the boss (61).

3. The novel silicon wafer electroplating apparatus according to claim 2, characterized in that, The lower end of the cover (10) is symmetrically connected with several second protrusions (14). The second protrusions (14) are longer than the first protrusions (13). The second protrusions (14) and the boss (61) are in a sliding fit with equal diameter. The spring (15) is located in the shaft hole of the second protrusion (14).

4. The novel silicon wafer electroplating apparatus according to claim 1, characterized in that, The cover (10) includes an upper cover (103) and a lower cover (104). Four conductive screws (7) pass through the first through hole of the anode plate (5), the shaft hole of the first protrusion (13), the third through hole of the lower cover (104), and the second through hole of the upper cover (103) to connect and fix nuts (71). Alternatively, the third through hole may be a countersunk hole, and the conductive screw (7) may be a countersunk screw.

5. The novel silicon wafer electroplating apparatus according to claim 4, characterized in that, The lower cover (104) protrudes from both ends of the upper cover (103) to form wing plates, and the lower end of the wing plate is integrally connected to the second protruding post (14). Several cathode components (6) are symmetrically and vertically elastically floatingly connected to the lower surface of the wing plate of the cover (104).

6. The novel silicon wafer electroplating apparatus according to claim 4, characterized in that, The liquid preparation chamber (100) is a series of elongated oval slots (105) arranged in a circular array, with the lower end of the elongated oval slots (105) open; Alternatively, a number of radially arranged grooves (303) are provided between the central groove (300) and the annular groove (302) of the liquid collection tank (30).

7. The novel silicon wafer electroplating apparatus according to claim 6, characterized in that, The overflow pipe (31) is vertically height adjustable and threaded to one side of the inner cavity of the circulating liquid tank (3).

8. The novel silicon wafer electroplating apparatus according to claim 1, characterized in that, The circulating liquid tank (3) has two ear plates (33) symmetrically arranged on the side plates at both ends. The two ends of the rotating shaft (40) are rotatably connected to the ear plates (33), and one end of the shaft extends outward to connect to the driving power. Alternatively, the two ends of the rotating shaft (40) are rotatably connected to the ear plate (33) via oil-free bearings or deep groove ball bearings.

9. The novel silicon wafer electroplating apparatus according to claim 1, characterized in that, The product platform (2) has a rectangular end foot (23) protruding at the middle of the lower end of the four sides and a rectangular inlet of the guide channel (22) on both sides.

10. The novel silicon wafer electroplating apparatus according to any one of claims 1 to 9, characterized in that, The insulating material of the cover plate assembly (1), product platform (2), circulating liquid tank (3), and rotating assembly (4) is PP polypropylene synthetic plastic.

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