Semiconductor electroplating probe

Abstract

The utility model discloses a semiconductor electroplating probe which comprises a probe main body, a copper sleeve is arranged on one side of the probe main body, a plastic outer ring is sleeved on the outer sides of the probe main body and the copper sleeve, a mounting groove I is formed in the center of one side of the copper sleeve, and a mounting groove II is formed in the position, corresponding to one side in the mounting groove I, in the copper sleeve. A third mounting groove is formed in the side, corresponding to the interior of the second mounting groove, of the interior of the copper sleeve. According to the semiconductor electroplating probe, the multi-layer sealing structure design is adopted, the semiconductor electroplating probe comprises the first mounting groove, the second mounting groove and the third mounting groove in the copper sleeve, and the arc-shaped sealing groove and the annular sealing groove in the inner wall of the plastic outer ring, the sealing structures are matched with one another to form a plurality of sealing barriers, leakage of gas or liquid is effectively prevented, and the service life of the semiconductor electroplating probe is prolonged. An arc-shaped protruding block and a square protruding block are arranged in the second installation groove and the third installation groove respectively, and the protruding blocks can penetrate into the first sealing gasket and the second sealing gasket to be tightly attached to the first sealing gasket and the second sealing gasket.

Description

Technical Field

[0001] This utility model relates to the field of probe technology, specifically a semiconductor electroplating probe. Background Technology

[0002] In the field of semiconductor manufacturing and packaging, probes are key components that connect testing equipment to semiconductor chips, and their performance directly affects the accuracy and reliability of test data.

[0003] In traditional probe designs, the sealing structure is often relatively simple, relying only on a few sealing gaskets or sealing rings to achieve the seal between the probe and the copper sleeve or plastic outer ring. When faced with the challenges of long-term high-load operation or extreme environmental conditions, the sealing performance of this design is prone to decline, leading to gas or liquid leakage, which in turn affects the testing accuracy and service life of the probe. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor electroplating probe to solve the problem mentioned in the background art that the sealing structure in traditional probe designs is often relatively simple, relying only on a small number of sealing gaskets or sealing rings to achieve the seal between the probe and the copper sleeve and plastic outer ring. When facing the challenges of long-term high-load operation or extreme environmental conditions, the sealing performance is prone to decline, leading to gas or liquid leakage, which in turn affects the testing accuracy and service life of the probe.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor electroplating probe, comprising a probe body, a copper sleeve disposed on one side of the probe body, a plastic outer ring sleeved on the outer side of the probe body and the copper sleeve, a mounting groove 1 being formed at the center of one side of the copper sleeve, a mounting groove 2 being formed inside the copper sleeve corresponding to one side of the mounting groove 1, a mounting groove 3 being formed inside the copper sleeve corresponding to one side of the mounting groove 2, one side of the probe body penetrating into the interior of the mounting groove 1, mounting groove 2 and mounting groove 3, a plurality of arc-shaped sealing grooves being formed on one side of the inner wall of the plastic outer ring, an arc-shaped sealing gasket being fixedly connected to the inner wall of the arc-shaped sealing groove, a plurality of sealing gaskets 2 being fixedly connected to the outer end of one side of the probe body, and a plurality of sealing gaskets 1 being fixedly connected to the outer end of one side of the probe body.

[0006] Compared with the prior art, the beneficial effects of this utility model are:

[0007] This semiconductor electroplating probe employs a multi-layered sealing structure design, including mounting grooves one, two, and three inside the copper sleeve, as well as arc-shaped and annular sealing grooves on the inner wall of the plastic outer ring. These sealing structures work together to form multiple sealing barriers, effectively preventing gas or liquid leakage. Arc-shaped and square protrusions are respectively installed in mounting grooves two and three, penetrating into the interior of sealing gaskets one and two, respectively, for a tight fit. This design not only increases the contact area between the sealing gaskets and the copper sleeve but also further enhances the tightness and stability of the seal through the shape and distribution of the protrusions. Two sealing rings are fitted onto the probe body surface, penetrating into the annular sealing groove inside the copper sleeve for a tight fit. This double sealing ring design not only improves the durability of the seal but also effectively prevents leakage caused by wear of the sealing rings during long-term high-load operation of the probe. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of this utility model;

[0009] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0010] Figure 3 This utility model Figure 1 A magnified view of part A in the diagram;

[0011] Figure 4 This utility model Figure 1 A magnified view of part B in the diagram.

[0012] In the diagram: 1. Probe body; 2. Copper sleeve; 3. Plastic outer ring; 4. Mounting groove one; 5. Mounting groove two; 6. Sealing gasket one; 7. Sealing gasket two; 8. Sealing gasket one; 9. Arc-shaped protrusion; 10. Annular sealing groove; 11. Sealing ring; 12. Mounting groove three; 13. Sealing gasket two; 14. Square protrusion; 15. Arc-shaped sealing groove; 16. Arc-shaped sealing gasket; 17. Movable groove; 18. Slide groove; 19. Movable block; 20. Return spring; 21. Arc-shaped fixing block. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Please see Figure 1-4This utility model provides a technical solution: a semiconductor electroplating probe, including a probe body 1, a copper sleeve 2 on one side of the probe body 1, a plastic outer ring 3 on the outer side of the probe body 1 and the copper sleeve 2, an installation groove 4 at the center of one side of the copper sleeve 2, an installation groove 5 on one side of the copper sleeve 2 corresponding to the installation groove 4, and an installation groove 12 on one side of the copper sleeve 2 corresponding to the installation groove 5. One side of the probe body 1 extends through the interior of the installation groove 4, the installation groove 5, and the installation groove 12. Several arc-shaped sealing grooves 15 are formed on one side of the inner wall of the plastic outer ring 3. Arc-shaped sealing gaskets 16 are fixedly connected to the inner wall of the arc-shaped sealing grooves 15. Several sealing gaskets 13 are fixedly connected to the outer end of one side of the probe body 1, and several sealing gaskets 8 are fixedly connected to the outer end of one side of the probe body 1.

[0015] Several arc-shaped protrusions 9 are fixedly connected to one side of the inner wall of the mounting groove 2 5. One side of the arc-shaped protrusions 9 penetrates into the interior of the sealing gasket 1 8 and is tightly attached to the sealing gasket 1 8.

[0016] Several square protrusions 14 are fixedly connected to one side of the inner wall of the mounting groove 3 12. One side of the square protrusions 14 penetrates into the interior of the sealing gasket 2 13 and is in close contact with the sealing gasket 2 13.

[0017] An annular sealing groove 10 is provided inside the copper sleeve 2, corresponding to the mounting groove 2 5 on one side. Two sealing rings 11 are fitted and fixedly connected to one side of the probe body 1. The side of the two sealing rings 11 away from the probe body 1 extends into the interior of the annular sealing groove 10 and is tightly attached to the annular sealing groove 10.

[0018] Several sealing gaskets 2 7 are fixedly connected to the inner wall of the plastic outer ring 3 on one side, and several sealing gaskets 1 6 are fixedly connected to the surface of the copper sleeve 2 on one side, with the outer side of sealing gasket 1 6 in contact with the inner side of sealing gasket 2 7.

[0019] The probe body 1 has several movable grooves 17 at its center. Movable blocks 19 are provided inside the movable grooves 17. An arc-shaped fixing block 21 is fixedly connected to the center of the top of the movable block 19. The top of the arc-shaped fixing block 21 extends through the interior of the arc-shaped sealing groove 15 and contacts the inner wall of the arc-shaped sealing gasket 16.

[0020] The probe body 1 has sliding grooves 18 on both sides of the movable groove 17. The two sides of the movable block 19 pass through the interior of the two sliding grooves 18 and are slidably connected to the sliding grooves 18. A reset spring 20 is fixedly connected to the center of the bottom of the movable block 19. The bottom of the reset spring 20 is fixedly connected to the bottom of the movable groove 17.

[0021] In summary, this semiconductor electroplating probe employs a multi-layered sealing structure design, including mounting groove 4, mounting groove 5, and mounting groove 12 inside the copper sleeve 2, and arc-shaped sealing groove 15 and annular sealing groove 10 on the inner wall of the plastic outer ring 3. These sealing structures work together to form multiple sealing barriers, effectively preventing gas or liquid leakage. Arc-shaped protrusions 9 and square protrusions 14 are respectively provided in mounting groove 5 and mounting groove 12. These protrusions can penetrate into the interior of sealing gasket 8 and sealing gasket 13, and fit tightly with them. This design not only increases the contact area between the sealing gasket and the copper sleeve 2, but also further enhances the tightness and stability of the seal through the shape and distribution of the protrusions. Two sealing rings 11 are fitted on the surface of the probe body 1. These two sealing rings 11 can penetrate into the annular sealing groove 10 inside the copper sleeve 2 and fit tightly with it. This double sealing ring 11 design not only improves the durability of the seal, but also effectively prevents leakage caused by wear of the sealing rings 11 during long-term high-load operation of the probe.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor electroplating probe comprising a probe body (1), characterized in that: The side of the probe body (1) is provided with a copper sleeve (2), the outer side of the probe body (1) and the copper sleeve (2) is sleeved with a plastic outer ring (3), the center of the side of the copper sleeve (2) is provided with a mounting groove one (4), the inside of the copper sleeve (2) is provided with a mounting groove two (5) corresponding to the position of the side in the mounting groove one (4), the inside of the copper sleeve (2) is provided with a mounting groove three (12) corresponding to the side in the mounting groove two (5), the side of the probe body (1) penetrates to the inside of the mounting groove one (4), the mounting groove two (5) and the mounting groove three (12), the inner wall of the side of the plastic outer ring (3) is provided with a plurality of arc sealing grooves (15), the inner wall of the arc sealing groove (15) is fixedly connected with an arc sealing pad (16), the outer end of the side of the probe body (1) is fixedly connected with a plurality of sealing gaskets two (13), the outer end of the side of the probe body (1) is fixedly connected with a plurality of sealing gaskets one (8).

2. The semiconductor electroplating probe of claim 1, wherein: The side of the inner wall of the mounting groove two (5) is fixedly connected with a plurality of arc-shaped protrusions (9), one side of the arc-shaped protrusion (9) penetrates into the inside of the sealing gasket one (8) and is in close contact with the sealing gasket one (8).

3. The semiconductor electroplating probe of claim 1, wherein: The side of the inner wall of the mounting groove three (12) is fixedly connected with a plurality of square protrusions (14), one side of the square protrusion (14) penetrates into the inside of the sealing gasket two (13) and is in close contact with the sealing gasket two (13).

4. The semiconductor electroplating probe of claim 1, wherein: The inside of the copper sleeve (2) is provided with an annular sealing groove (10) corresponding to the position of the side of the mounting groove two (5), the surface of the probe body (1) is sleeved and fixedly connected with two sealing rings (11) corresponding to the position of the side, the side away from the probe body (1) of the two sealing rings (11) penetrates into the inside of the annular sealing groove (10) and is in close contact with the annular sealing groove (10).

5. The semiconductor electroplating probe of claim 1, wherein: The inner wall of the other side of the plastic outer ring (3) is fixedly connected with a plurality of sealing pads two (7), the surface of the side of the copper sleeve (2) is fixedly connected with a plurality of sealing pads one (6), the outer side of the sealing pad one (6) is in contact with the inner side of the sealing pad two (7).

6. The semiconductor electroplating probe of claim 1, wherein: The center of the probe body (1) is provided with a plurality of movable grooves (17), the inside of the movable groove (17) is provided with a movable block (19), the top of the movable block (19) is fixedly connected with an arc-shaped fixed block (21), the top of the arc-shaped fixed block (21) penetrates into the inside of the arc-shaped sealing groove (15) and is in contact with the inner wall of the arc-shaped sealing pad (16), the inside of the probe body (1) is provided with a sliding groove (18) corresponding to the two sides of the movable groove (17).

7. A semiconductor electroplating probe according to claim 6, wherein: The two sides of the movable block (19) penetrate into the inside of the two sliding grooves (18) and are in sliding connection with the sliding grooves (18), the center of the bottom of the movable block (19) is fixedly connected with a return spring (20), the bottom of the return spring (20) is fixedly connected with the bottom in the movable groove (17).

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