Radiation detection system module and radiation detection device

Abstract

The utility model provides a radiation detection system module and a radiation detection device. The radiation detection system module comprises a substrate, and a signal acquisition and conversion unit, a power supply control unit and a packaging material layer which are located on the substrate. Wherein the signal acquisition and conversion unit is used for acquiring a radiation signal, converting the radiation signal into an electric signal and outputting the electric signal. The power supply control unit comprises a power supply chip and an electronic device assembly, and the electronic device assembly is electrically connected between the power supply chip and the signal acquisition and conversion unit so as to convert a first power supply state input by an external power supply into a second power supply state and then output the second power supply state to the acquisition unit. The packaging material layer wraps the signal acquisition and conversion unit and the power supply control unit so as to package the signal acquisition and conversion unit and the power supply control unit on the substrate together. According to the radiation detection system module, the overall integration level is improved on the premise that the radiation signal is accurately detected, so that the overall size and cost are reduced. The radiation detection device is suitable for miniaturized application scenes.

Description

Technical Field

[0001] This application belongs to the field of radiation detection technology and relates to a radiation detection system module and a radiation detection device. Background Technology

[0002] Radiation detection technology observes microscopic phenomena of specific objects using radiation detectors. It utilizes the interaction between particles and matter to transform nuclear radiation and microscopic particle phenomena into observable macroscopic phenomena. Traditional radiation detectors are divided into three main categories: gas ionization detectors, semiconductor detectors, and scintillation detectors.

[0003] With the development of fields such as nuclear physics and experimental physics, the performance requirements for radiation detectors are becoming increasingly stringent. However, due to technological limitations, traditional detectors suffer from problems such as complex peripheral circuits and large size, making it difficult to meet the application needs of various fields. For example, this limits their application in wearable or portable devices.

[0004] Therefore, how to provide a radiation detection system module and radiation detection device to improve the integration of radiation detection equipment and achieve miniaturization has become an important technical problem that needs to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a radiation detection system module and a radiation detection device to solve the problem of the large size of radiation detection equipment in the prior art.

[0007] To achieve the above and other related objectives, this application provides a radiation detection system module, comprising:

[0008] substrate;

[0009] A signal acquisition and conversion unit is located on the substrate. The signal acquisition and conversion unit is used to acquire radiation signals and convert the radiation signals into electrical signals for output.

[0010] A power control unit is located on the substrate. The power control unit includes a power chip and electronic components. The electronic components are electrically connected between the power chip and the signal acquisition and conversion unit. The power control unit is used to convert a first power supply signal input from an external power source into a second power supply signal and then output it to the signal acquisition unit.

[0011] An encapsulation material layer is located on the substrate, and the encapsulation material layer covers the signal acquisition and conversion unit and the power control unit. The encapsulation material layer is used to encapsulate the signal acquisition unit and the power control unit together on the substrate.

[0012] Optionally, the signal acquisition and conversion unit includes a radiation detector chip and a front-end electronic amplifier chip, wherein the front-end electronic amplifier chip is electrically connected to the radiation detector chip.

[0013] Optionally, the signal acquisition and conversion unit includes a power input port, and the power control unit is at least electrically connected between the power input port and the front-end electronic amplifier chip.

[0014] Optionally, the electronic device assembly is at least electrically connected between the power supply chip and the front-end electronic amplifier chip.

[0015] Optionally, the electronic device assembly is arranged around the power chip and the front-end electronic amplifier chip.

[0016] Optionally, the radiation detector chip includes a PIN detector, the front-end electronics amplifier chip includes a sensitive charge amplifier chip, and the power supply chip includes a low-dropout linear regulator chip.

[0017] Optionally, the radiation detection system module further includes a shielding layer, which covers the periphery of the encapsulation material layer, and the substrate has a grounding conductive layer, with the shielding layer electrically connected to the grounding conductive layer.

[0018] Optionally, the radiation detection system module further includes at least one conductive post located within the encapsulation material layer and electrically connected between the shielding layer and the grounding conductive layer.

[0019] Optionally, the radiation signal includes at least one of X-rays and gamma rays, and the energy range of the radiation signal is 50 keV-3 MeV.

[0020] This application also provides a radiation detection device, comprising:

[0021] The radiation detection system module described above,

[0022] A power supply module is electrically connected to the power control unit, which is used to convert the power supply signal input to the power supply module.

[0023] The signal processing and display module is electrically connected to the output terminal of the radiation detection system module. The signal processing and display module is used to process the electrical signal output by the radiation detector system and display the radiation detection results.

[0024] As described above, the radiation detection system module of this application integrates the signal acquisition and conversion unit and the power control unit into a single package (i.e., the radiation detection system module is a system-level package). This improves the overall integration while ensuring accurate detection of radiation signals, thereby reducing the overall size and manufacturing cost. This facilitates the miniaturization of the radiation detection system module and basically meets the needs of various radiation detection scenarios. The radiation detection device of this application has a simple overall structure and small size, is easy to use, and is suitable for miniaturized application scenarios. Attached Figure Description

[0025] Figure 1 The diagram shown is a partial structural schematic of a radiation detection system module provided in an embodiment of this application.

[0026] Figure 2 The diagram shown is a cross-sectional view of a radiation detection system module provided in an embodiment of this application.

[0027] Figure 3 The diagram shows the internal electrical connections of a radiation detection system module provided in an embodiment of this application.

[0028] Figure 4 The diagram shown is a structural schematic of the radiation detection device provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 10-Radiation detection system module; 11-Substrate; 12-Signal acquisition and conversion unit; 121-Radiation detector chip; 122-Front-end electronic amplifier chip; 13-Power control unit; 131-Power chip; 132-Electronic device assembly; 14-Encapsulation material layer; 15-Shielding layer; 16-Conductive pillar; 20-Power supply module; 21-First power supply; 22-Second power supply; 30-Signal processing and display module. Detailed Implementation

[0031] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application.

[0032] Please see Figures 1 to 4It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0033] This application provides a radiation detection system module 10. Please refer to [link / reference]. Figure 1 , Figure 1 A partial structural schematic diagram of the radiation detection system module is shown (the encapsulation material layer is not shown). The radiation detection system module 10 includes a substrate 11, a signal acquisition and conversion unit 12, a power control unit 13, and an encapsulation material layer 14. Please refer to the accompanying documentation. Figure 2 , Figure 2 A cross-sectional schematic diagram of the radiation detection system module is shown.

[0034] Specifically, the signal acquisition and conversion unit 12 is located on the substrate 11. The signal acquisition and conversion unit 12 is used to acquire radiation signals (…). Figure 2 (As indicated by the dashed arrow in the middle), and converts the radiated signal into an electrical signal before outputting it. The power control unit 13 is located on the substrate 11. The power control unit 13 includes a power chip 131 and an electronic component 132. The electronic component 132 is electrically connected between the power chip 131 and the signal acquisition and conversion unit 12. The power control unit 13 is used to convert the first power supply signal input from the external power supply into a second power supply signal and output it to the signal acquisition unit 12. The encapsulation material layer 14 is located on the substrate 11. The encapsulation material layer 14 covers the signal acquisition and conversion unit 12 and the power control unit 13, and the encapsulation material layer 14 is used to encapsulate the signal acquisition unit 12 and the power control unit 13 together on the substrate. Please refer to [reference needed]. Figure 3 , Figure 3 A schematic diagram of the internal electrical connections of the radiation detection system module is shown.

[0035] In optional embodiments, such as Figure 1 and Figure 3As shown, the signal acquisition and conversion unit 12 includes a radiation detector chip 121 and a front-end electronic amplifier chip 122, which is electrically connected to the radiation detector chip 121. The radiation detector chip 121 acquires radiation signals based on its interaction with radiating particles (e.g., photoelectric effect or Compton scattering) and converts the acquired radiation signals into electrical signals for output. The front-end electronic amplifier chip 122 amplifies and processes the weak electrical signals output by the radiation detector chip 121 before outputting them. The type, size, and structure of the radiation detector chip 121 can be selected based on the actual application scenario of the radiation detection system module 10 (e.g., the type of radiation to be detected, the detection area), and a suitable front-end electronic chip can be matched accordingly. Multiple pads are arranged in an array on the substrate 11 in the area used to fix the radiation detector chip 121. This reduces soldering voids at the bottom of the radiation detector chip 121 when it is soldered onto the substrate 11, improving soldering quality and ensuring effective electrical connection. The front-end electronic amplifier chip 122 is electrically connected to the conductive layer on the substrate 11 via gold wires to ensure good electrical connection, high welding quality, and long-term reliability (gold wires have strong oxidation resistance).

[0036] In optional embodiments, such as Figure 3 As shown, the signal acquisition and conversion unit 12 includes a power input port, and the power control unit 13 is electrically connected between the power input port and the front-end electronic amplifier chip 122 to convert and control the electrical parameters (i.e., the first power supply signal) output to the radiation detection system module via the power input port (to obtain the second power supply signal), thereby meeting the power supply requirements of the front-end electronic amplifier chip 122.

[0037] In an optional embodiment, the electronic component 132 is at least electrically connected between the power supply chip 131 and the front-end electronic amplifier chip 122. The electronic component 132 is used to form a peripheral circuit that implements a preset function. For example, the electronic component 132 can form a peripheral circuit for regulating voltage and current; or, the electronic component 132 can form a peripheral circuit located between some input / output ports for filtering and smoothing current (to reduce signal noise); or, the electronic component 132 can be used to form a peripheral circuit for circuit protection, etc. Further, the electronic component 132 includes at least one of active and passive components, for example, the electronic component 132 includes resistors, capacitors, etc.

[0038] In an optional embodiment, the electronic component 132 is arranged around the power chip 131 and the front-end electronic amplifier chip 122. This surrounding arrangement of the electronic component 132 allows for a more compact internal structure within the package, reducing the overall size of the radiation detection system module 10.

[0039] In an optional embodiment, the radiation detector chip 121 includes a PIN detector, the front-end electronics amplifier chip 122 includes a sensitive charge amplifier chip, and the power supply chip 131 includes a low-dropout regulator (LDO) chip.

[0040] In this embodiment, a power control unit 13 is provided on the path through which the external power supply inputs voltage (or current) to the front-end electronic amplifier chip 122. The power control unit 13 adjusts and converts the voltage input from the external power supply, outputting a lower but more precise and stable low voltage to meet the precise power supply requirements of the front-end electronic amplifier chip 122. For example, if the first power supply signal output by the external power supply includes a relatively high first voltage value (e.g., 5V), while the front-end electronic amplifier chip 122 requires a lower second voltage value (e.g., 3.3V), directly connecting the external power supply to the front-end electronic amplifier chip 122 would not meet its power supply requirements, affecting its actual operating performance. By providing the power control unit 13, the input voltage of the first voltage value included in the first power supply signal can be converted into an output voltage of the second voltage value and output to the front-end electronic amplifier chip 122, thus meeting its voltage requirements. Furthermore, besides converting high voltage to low voltage, external power supplies may not guarantee stable and accurate output voltage due to various factors. The power control unit 13, however, maintains a constant output voltage even when the input voltage of the external power supply changes. Therefore, given the high requirements for voltage stability and accuracy of the front-end electronic amplifier chip 122, the power control unit 13 can simultaneously provide a very stable output voltage, meeting the power supply stability and accuracy requirements of the front-end electronic amplifier chip 122. Taking the front-end electronic amplifier chip 122 as a sensitive charge amplifier chip as an example, since sensitive charge amplifier chips are typically used to amplify weak charge signals, unstable or inaccurate power supply voltage may cause changes in the amplifier's gain, thus affecting the signal amplification ratio and the accuracy of the measurement results. Therefore, the configuration of the power control unit 13 is crucial for the detection accuracy of the radiation detection system module 10.

[0041] Based on the above, it can be seen that the first power supply signal differs from the second power supply signal not only in voltage value but also in voltage fluctuation state. Furthermore, in rare cases, the first power supply signal input to the power control unit may meet the power supply requirements of the signal acquisition and conversion unit; in such cases, the second power supply signal may be the same as the first power supply signal. It should be noted that this embodiment only illustrates the use of the power chip to convert the voltage state of the external power input to the front-end electronic amplifier chip. It is not excluded that the power chip could be used to convert the power supply state of the external power input to the radiation detector chip, or the signal acquisition and conversion unit (or even other functional units that may be included within the radiation detection system module). Specific examples are not provided here.

[0042] In this embodiment, the operation of the radiation detection system module 10 is illustrated by taking the radiation detector chip 121 as a PIN detector, the front-end electronic amplifier chip 122 as a sensitive charge amplifier chip, and the power supply chip 131 as a low-dropout linear regulator chip. The PIN detector is typically composed of a P-type highly doped layer, an N-type intrinsic region, and another N-type highly doped layer connected sequentially. When a radiating particle penetrates the encapsulation material layer 14 and reaches the PIN detector, it absorbs the energy of the radiating particle and generates electron-hole pairs during its passage through the N-type intrinsic region. Under the action of an external electric field, the electrons and holes migrate towards the N-type highly doped layer and the P-type highly doped layer, respectively, and collect the charge signal generated by the migration of electrons and holes on the P-type highly doped layer side. The PIN detector outputs this charge signal to the sensitive charge amplifier chip. After receiving the weak charge signal, the sensitive charge amplifier chip accumulates the weak charge signal on the internal feedback capacitor and converts the accumulated charge signal into a voltage signal before outputting it. Furthermore, during the operation of the sensitive charge amplifier chip, the low-dropout linear regulator chip ensures the stability and accuracy of the input voltage value of the sensitive charge amplifier, thereby ensuring the accuracy of the output voltage of the sensitive charge amplifier chip that reflects the radiation signal (including physical information).

[0043] In this embodiment, the signal acquisition and conversion unit 12 and the power control unit 13 are integrated and packaged into a single package (i.e., the radiation detection system module 10 is a system-level package). The signal acquisition and conversion unit 12 is used for acquiring and outputting radiation signals, while the power control unit 13 controls and converts the power supply signal input from the external power source to the signal acquisition and conversion unit 12 to meet the actual power supply requirements of the signal acquisition unit 12, ensuring the accuracy of the output signal and guaranteeing the accurate detection of radiation signals by the radiation detection system module 10. Furthermore, by integrating the radiation detector chip 121, the front-end electronic amplifier chip 122, the power chip 131, and peripheral circuits (composed of the electronic component 132) into a single package, the overall integration of the radiation detection system module 10 is improved. This avoids the situation where the individual functional structures (e.g., the power chip 131 and peripheral circuits) are separately packaged outside the packages of the radiation detector chip 121 and the front-end electronic amplifier chip 122, resulting in a larger overall system module size. It also reduces the overall packaging cost, contributing to the miniaturization of the radiation detection system module 10. In a specific example, with the PIN detector having a detection area of ​​25 square millimeters, the radiation detection system module 10 has a size of only 253.5 cubic millimeters (where the length, width, and height are 13 millimeters, 13 millimeters, and 1.5 millimeters, respectively). Meanwhile, since the power chip 131 and its peripheral circuitry are integrated within the packaging material layer 14, no additional complex nuclear electronics design is required for actual product applications, reducing the difficulty of developing subsequent product series. Because multiple functional structures need to be integrated on the substrate 11, setting alignment marks in a predetermined area of ​​the substrate 11 (e.g., at a corner) helps improve the accuracy and yield of the packaging process.

[0044] In an optional embodiment, the radiation detection system module 10 is packaged using a planar grid array (LGA) method, which facilitates the subsequent printing circuit board assembly (PCBA) of the radiation detection system module 10 and improves ease of use.

[0045] In an optional embodiment, the encapsulation material layer 14 includes a polymer encapsulation material layer. For example, the material of the encapsulation material layer 14 includes epoxy resin and polyimide. The good insulation properties of the polymer encapsulation material layer 14 can effectively protect the chip and electronic components covered by the encapsulation material layer 14 from interference from the external environment. At the same time, it can also reduce the electrical interference between the various functional structures inside the encapsulation material layer 14, and ensure the working stability and reliability of the radiation detection system module 10.

[0046] In an optional embodiment, the radiation detection system module 10 further includes a shielding layer 15, which covers the periphery of the encapsulation material layer 14. The substrate 11 has a grounding conductive layer, and the shielding layer 15 is electrically connected to the grounding conductive layer. The shielding layer 15 protects the individual chips inside the radiation detection system module 10 from interference from external electromagnetic fields in the detection environment, improving the anti-interference capability of the radiation detection system module 10 and ensuring the accuracy of radiation signal detection. Grounding the shielding layer 15 can guide signals that may interfere with radiation detection from the external environment to the ground, further ensuring the interference signal shielding effect of the shielding layer 15. This allows the radiation detection system module 10 to meet performance requirements such as low noise, high signal-to-noise ratio, good sensitivity, and stable performance. The material of the shielding layer 15 includes metal. The thickness and material of the encapsulation material layer 14 and the shielding layer 15 are reasonably designed based on the detection scenario of the radiation detection system module and are not specifically limited here.

[0047] In optional embodiments, such as Figure 1 As shown, the radiation detection system module 10 further includes at least one conductive post 16, which is located within the encapsulation material layer 14 and electrically connected between the shielding layer 15 and the grounding conductive layer. For example, the conductive post 16 is a copper post. Copper has good conductivity, is easy to process, and is inexpensive, making it suitable for effective electrical connection between the shielding layer 15 and the grounding conductive layer within the substrate 11. It should be noted that this embodiment assumes two conductive posts 16 are arranged diagonally along the substrate 11 within the encapsulation material layer 14. In practical applications, one or more conductive posts 16 can be provided to ensure a good electrical connection between the shielding layer 15 and the grounding conductive layer. During the fabrication of the radiation detection system module 10, after each functional chip is fixed onto the substrate 11, the encapsulation material layer 14 is used to cover each functional chip and the conductive post 16. After the encapsulation material layer 14 has cured and set, the conductive post 16 is exposed by grinding, and then the shielding layer 15 is formed to ensure the electrical connection between the shielding layer 15 and the conductive post 16.

[0048] In an optional embodiment, the radiation signal includes at least one of X-rays and gamma rays. The energy range of the radiation signal is 50 keV-3 MeV (inclusive), for example, 100 keV, 500 keV, or 1 MeV. The type of radiation detector chip 121 used to acquire the radiation signal in the radiation detection system module 10 can be adjusted based on the type and energy of the radiation signal.

[0049] In optional embodiments, the radiation detection system module 10 is applied in fields including personal handheld devices, wearable devices, mobile terminals, drones, medical and industrial technologies.

[0050] The radiation detection system module of this application integrates the signal acquisition and conversion unit and the power control unit into a single package (i.e., the radiation detection system module is a system-level package). While ensuring accurate detection of radiation signals, it improves the overall integration, thereby reducing the overall size and manufacturing cost. This helps to achieve miniaturization of the radiation detection system module and basically meets the needs of various radiation detection scenarios.

[0051] This application also provides a radiation detection device. Please refer to [link to relevant documentation]. Figure 4 , Figure 4 A schematic diagram of the radiation detection device is shown. The radiation detection device includes the radiation detection system module 10, the power supply module 20, and the signal processing and display module 30 as described above.

[0052] Specifically, the power supply module 20 is electrically connected to the power control unit 13. The power control unit 13 is used to convert the power supply signal input to the power supply module 20. The signal processing and display module 30 is electrically connected to the output terminal of the radiation detection system module 10. The signal processing and display module 30 is used to process the electrical signal output by the radiation detector system and display the radiation detection results.

[0053] In an optional embodiment, the power supply module 20 includes a first power supply 21 and a second power supply 22. The first power supply 21 is used to output a power supply signal to the front-end electronic amplifier chip 122. The power control unit 13 is used to control and convert the voltage output by the first power supply unit before outputting it to the front-end electronic amplifier chip 122. The second power supply 22 is used to output a power supply signal to the radiation detector chip 121 to meet the bias operating conditions of the radiation detector chip 121 and realize the detection of the radiation signal.

[0054] The radiation detection device of this application embodiment has a simple overall structure and small size, is easy to use, and is suitable for miniaturized application scenarios.

[0055] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A radiation detection system module, characterized by, The radiation detection system module comprises: a substrate; a signal acquisition and conversion unit located on the substrate, the signal acquisition and conversion unit being used for acquiring a radiation signal and converting the radiation signal into an electrical signal and then outputting the electrical signal; a power supply control unit located on the substrate, the power supply control unit comprising a power supply chip and an electronic device assembly, the electronic device assembly being electrically connected between the power supply chip and the signal acquisition and conversion unit, the power supply control unit being used for converting a first power supply signal input by an external power supply into a second power supply signal and then outputting the second power supply signal to the signal acquisition and conversion unit; a packaging material layer located on the substrate and covering the signal acquisition and conversion unit and the power supply control unit, the packaging material layer being used for collectively packaging the signal acquisition and conversion unit and the power supply control unit on the substrate.

2. The radiation detection system module of claim 1, wherein: The signal acquisition and conversion unit comprises a radiation detector chip and a front-end electronic amplifier chip, and the front-end electronic amplifier chip is electrically connected to the radiation detector chip.

3. The radiation detection system module of claim 2, wherein: The signal acquisition and conversion unit comprises a power supply input port, and the power supply control unit is electrically connected at least between the power supply input port and the front-end electronic amplifier chip.

4. The radiation detection system module of claim 3, wherein: The electronic device assembly is electrically connected at least between the power supply chip and the front-end electronic amplifier chip.

5. The radiation detection system module of claim 4, wherein: The electronic device assembly is arranged around the power supply chip and the front-end electronic amplifier chip.

6. The radiation detection system module of claim 2, wherein: The radiation detector chip comprises a PIN detector, the front-end electronic amplifier chip comprises a sensitive charge amplifier chip, and the power supply chip comprises a low-dropout linear voltage regulator chip.

7. The radiation detection system module of claim 1, wherein: The radiation detection system module further comprises a shielding layer, the shielding layer being wrapped around the periphery of the packaging material layer, the substrate having a ground conductive layer therein, and the shielding layer being electrically connected to the ground conductive layer.

8. The radiation detection system module of claim 7, wherein: The radiation detection system module further comprises at least one conductive column, the conductive column being located in the packaging material layer and being electrically connected between the shielding layer and the ground conductive layer.

9. The radiation detection system module of any of claims 1-8, wherein: The radiation signal comprises at least one of X-ray and γ-ray, and the energy range of the radiation signal is 50KeV-3MeV.

10. A radiation detection device, characterized by, The radiation detection system module as claimed in any one of claims 1-9, a power supply module electrically connected to the power supply control unit, the power supply control unit being used for converting a power supply signal input by the power supply module; a signal processing and display module electrically connected to the output end of the radiation detection system module, the signal processing and display module being used for processing the electrical signal output by the radiation detection system and displaying a radiation detection result. ​

Images