Low-cost liquid cooling structure of high-power-consumption optical module

Abstract

The utility model relates to a low-cost liquid cooling structure of a high-power-consumption optical module, which belongs to the technical field of optical modules and comprises an optical module base, a heat pipe radiator module is arranged on the upper surface of the optical module base, and a radiator module elastic clamp is arranged on the upper surface of the heat pipe radiator module. The heat pipe radiator module comprises a plurality of optical module radiating fins arranged on the upper surface of the optical module base, fixing grooves are formed in the upper surfaces of the optical module radiating fins, and heat pipes are arranged in inner cavities of the fixing grooves. According to the low-cost liquid cooling structure of the high-power-consumption optical module, the advantages of the heat pipe radiator module and the water cooling plate are combined, the efficient heat dissipation effect is guaranteed, economical efficiency and reliability are also considered, the heat conduction speed is remarkably increased through application of the heat pipe, stable operation of the optical module under high power consumption is guaranteed, heat is indirectly transmitted through an interface material, and the service life of the optical module is prolonged. The liquid is prevented from directly contacting with the optical module, and the risk and maintenance cost caused by liquid leakage are eliminated.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical module technical field, concretely is a low cost liquid cooling structure of high -power consumption optical module. BACKGROUND

[0002] The optical module is composed of optoelectronic devices, functional circuits and optical interfaces, and the optoelectronic devices include transmitting and receiving two parts, simply speaking, the function of the optical module is to convert the electrical signal into optical signal at the transmitting end, and after transmission through the optical fiber, the optical signal is converted into electrical signal at the receiving end, and the optical module is classified according to the packaging form, and the common ones include SFP, SFP+, SFF, gigabit interface converter (GB I C) and the like.

[0003] Through the retrieval, it is found that the Chinese patent CN216775385U discloses an optical module liquid cooling radiator, which comprises a water cooling plate, a heat pipe, a pressing plate, an optical module assembly, a power module heat sink and a set of CPU cooling cold plate, the water cooling plate is arranged on one side of the optical module assembly, the optical module assembly is provided with a copper block, the heat pipe is arranged above the optical module assembly, the pressing plate is arranged above the heat pipe, the heating end of the heat pipe is connected with the copper block, the heat dissipation end is connected with the water cooling plate, one end of the water cooling plate is connected with the inlet joint through the inlet joint, the other end is provided with a cooling pipe, the cooling pipe is laid on the power module heat sink, the other end of the cooling pipe is connected with the water inlet end of the CPU cooling cold plate through the pipeline, and the water outlet end of the CPU cooling cold plate is connected with the outlet joint through the connecting pipe and the outlet joint, the utility model uses the heat pipe to cooperate with the water cooling plate to dissipate heat, heat is transferred to the water cooling plate through the heat pipe, and the heat is taken out through the water cooling plate, liquid cooling is safer, and the heat dissipation effect is better.

[0004] Although the above-mentioned utility model can take out heat through the heat pipe cooperating with the water cooling plate to dissipate heat, a plurality of pipelines need to be connected, and a plurality of joints are used between the required pipelines, so that the risk of liquid leakage is increased during use, the reliability during use is reduced, and the maintenance cost is increased. UTILITY MODEL CONTENTS

[0005] In view of the defects of the prior art, the utility model provides a low-cost liquid cooling structure of high-power consumption optical module, which has the advantages of few joints, low risk of liquid leakage, high reliability and the like, solves the problem that a plurality of pipelines need to be connected, a plurality of joints are used between the required pipelines, the risk of liquid leakage is increased during use, the reliability during use is reduced, and the maintenance cost is increased.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a low-cost liquid cooling structure of high-power consumption optical module, comprising an optical module base, the upper surface of the optical module base is provided with a heat pipe radiator module, the upper surface of the heat pipe radiator module is provided with a radiator module elastic clamp;

[0007] The heat pipe radiator module includes a plurality of optical module heat sinks arranged on the upper surface of the optical module base, the upper surface of the optical module heat sink is provided with a fixing groove, the inner cavity of the fixing groove is provided with a heat pipe, the other end of the heat pipe is provided with a heat diffusion sheet, the lower surface of the heat diffusion sheet is provided with a plurality of mounting grooves, the other end of the heat pipe is fixed in the inner cavity of the mounting groove, and the lower surface of the heat diffusion sheet is fixed with an interface material.

[0008] Further, the heat pipe is located on the lower side of the elastic clamp of the radiator module, and the upper surface of the optical module base is provided with a plurality of accommodating holes.

[0009] Further, the number of the accommodating holes is equal to the number of the optical module heat sinks, and the size of the inner cavity of the accommodating hole is matched with the size of the optical module heat sink.

[0010] Further, the optical module heat sink and the heat pipe and the heat diffusion sheet and the heat pipe are connected in a way of brazing and silicon grease adhesion.

[0011] Further, the size of the inner cavity of the mounting groove and the fixing groove is matched with the size of the heat pipe.

[0012] Further, the lower surface of a plurality of the optical module bases is fixed with the same optical module circuit board, and the optical module circuit board is fixed in the inner cavity of the switch case.

[0013] Further, the upper surface of the optical module circuit board and located on the front of the plurality of optical module bases is fixed with a water cooling plate, the upper surface of the water cooling plate is provided with a groove, the inner cavity of the groove is fixed with a U-shaped water pipe, and the interface material is located on the upper side of the water cooling plate.

[0014] Compared with the prior art, the technical scheme has the following beneficial effects:

[0015] The low-cost liquid cooling structure of the high-power optical module combines the advantages of the heat pipe radiator module and the water cooling plate, guarantees efficient heat dissipation effect, and takes into account economy and reliability, the application of the heat pipe significantly improves the heat conduction speed, ensures stable operation of the optical module under high power, indirectly transmits heat through the interface material, avoids direct contact of the liquid with the optical module, and eliminates the risk and maintenance cost caused by liquid leakage. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural schematic view of the utility model;

[0017] Figures 2-3 It is an explosion structural schematic view of the utility model;

[0018] Figures 4-5 It is a heat pipe radiator module structural schematic view of the utility model;

[0019] Figures 4-5 It is the structure schematic view of the water cooling plate, the groove and the U-shaped water pipe of the utility model.

[0020] Figures 4-5 It is the structure schematic view of the optical module circuit board, the switch case and the like of the utility model.

[0021] In the figure: 1 optical module base, 2 heat pipe radiator module, 201 optical module cooling fin, 202 fixed groove, 203 heat pipe, 204 heat diffusion sheet, 205 installation groove, 206 interface material, 3 radiator module elastic clamp, 4 optical module circuit board, 5 switch case, 6 water cooling plate, 7 groove, 8 U-shaped water pipe, 9 containing hole. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor are within the protection scope of the utility model.

[0023] Please refer to Figure 1 The low-cost liquid cooling structure of a high-power optical module in the embodiment includes an optical module base 1, the upper surface of the optical module base 1 is provided with a heat pipe radiator module 2, and the upper surface of the heat pipe radiator module 2 is provided with a radiator module elastic clamp 3.

[0024] In the embodiment, the upper surface of the optical module base 1 is provided with a plurality of containing holes 9, the lower surface of the plurality of optical module bases 1 is fixed with the same optical module circuit board 4, and the optical module circuit board 4 is fixed in the inner cavity of the switch case 5.

[0025] Please refer to Figures 2-3In order to quickly conduct the heat of the light module surface, the heat pipe radiator module 2 in the embodiment includes a plurality of light module cooling fins 201 arranged on the upper surface of the light module base 1. The light module is installed in the inner cavity of the light module base 1. The radiator module elastic clamp 3 can provide sufficient elastic force. After the light module is installed, the heat pipe radiator module 2 is in close contact with the light module, so that the heat of the light module is conducted to the light module cooling fin 201. The upper surface of the light module cooling fin 201 is provided with a fixing groove 202. The inner cavity of the fixing groove 202 is provided with a heat pipe 203. The other end of the heat pipe 203 is provided with a heat diffusion sheet 204. The lower surface of the heat diffusion sheet 204 is provided with a plurality of mounting grooves 205. The other end of the heat pipe 203 is fixed in the inner cavity of the mounting groove 205. The lower surface of the heat diffusion sheet 204 is fixed with an interface material 206. The heat on the surface of the light module cooling fin 201 is adsorbed by the heat pipe 203 of the radiator module and conducted to the heat diffusion sheet 204 at the rear end. The interface material 206 is pasted at the bottom of the heat diffusion sheet 204, which serves as a medium to ensure good contact between the heat pipe radiator module 2 and the water cooling plate 6 after final assembly.

[0026] In the embodiment, the heat pipe 203 is located on the lower side of the radiator module elastic clamp 3. The number of the accommodating holes 9 is equal to the number of the light module cooling fins 201. The size of the inner cavity of the accommodating hole 9 is matched with the size of the light module cooling fin 201. The light module cooling fin 201 and the heat pipe 203, and the heat diffusion sheet 204 and the heat pipe 203 are connected by brazing or silicon grease adhesion.

[0027] The size of the inner cavity of the mounting groove 205 and the fixing groove 202 is matched with the size of the heat pipe 203.

[0028] It should be noted that each light module exists independently and adopts decoupling design to avoid the influence of manufacturing tolerance on heat dissipation effect. The heat diffusion sheet 204 adopts a whole design. All the heat pipes 203 are fixed thereon. Finally, the whole heat pipe radiator module 2 is assembled to the light module base 1, which is convenient for assembly and saves cost.

[0029] Please refer to Figures 4-5 In order to liquid cool the light module, the upper surface of the light module circuit board 4 and the front surface of the plurality of light module bases 1 are fixed with a water cooling plate 6. The upper surface of the water cooling plate 6 is provided with a recess 7. The inner cavity of the recess 7 is fixed with a U-shaped water pipe 8.

[0030] The U-shaped water pipe 8 is brazed or resin-bonded in the inner cavity of the recess 7. The position of the water inlet and the water outlet of the U-shaped water pipe 8 is determined by system design. Finally, the heat of the light module is taken away.

[0031] In the embodiment, the interface material 206 is located on the upper side of the water cooling plate 6, the optical module base 1 is installed on the optical module circuit board 4, and the whole is assembled into the switch case 5. Finally, the water cooling plate 6 is installed into the switch. At this time, the heat pipe radiator module 2 is tightly contacted with the water cooling plate 6 through the interface material 206 on the upper side, all heat is transferred to the water cooling plate 6, and finally the water in the U-shaped water pipe 8 on the water cooling plate 6 is taken away.

[0032] It should be noted that the advantages of the heat pipe radiator module 2 and the water cooling plate 6 are combined, the high-efficiency heat dissipation effect is ensured, the economy and reliability are taken into account, the application of the heat pipe 203 significantly improves the heat conduction speed, ensures the stable operation of the optical module under high power consumption, the heat is indirectly transferred through the interface material 206, the liquid directly contacts the optical module is avoided, and the risk and maintenance cost caused by liquid leakage are eliminated.

[0033] The working principle of the above embodiment is as follows:

[0034] The optical module is installed in the inner cavity of the optical module base 1, the elastic clamp 3 of the radiator module can provide sufficient elastic force, after the optical module is installed, the heat pipe radiator module 2 is tightly contacted with the optical module, the heat generated by the optical module is conducted to the optical module fin 201, then is conducted to the heat diffusion sheet 204 at the rear end by the heat pipe 203 of the radiator module, the interface material 206 is pasted at the bottom of the heat diffusion sheet 204, and serves as a medium for ensuring that the heat pipe radiator module 2 is well contacted with the water cooling plate 6 after the heat pipe radiator module 2 is finally assembled. The optical module base 1 is installed on the optical module circuit board 4, and the whole is assembled into the switch case 5. Finally, the water cooling plate 6 is installed into the switch. At this time, the heat pipe radiator module 2 is tightly contacted with the water cooling plate 6 through the interface material 206 on the upper side, all heat is transferred to the water cooling plate 6, and finally the water in the U-shaped water pipe 8 on the water cooling plate 6 is taken away.

[0035] It should be noted that in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms “include”, “contain” or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement “including a…” does not exclude the presence of additional identical elements in the process, method, article or equipment including the element.

[0036] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application.

Claims

1. A low-cost liquid cooling structure of a high-power optical module, comprising an optical module base (1), characterized in that: The upper surface of the optical module base (1) is provided with a heat pipe radiator module (2), and the upper surface of the heat pipe radiator module (2) is provided with a radiator module elastic clamp (3). The heat pipe radiator module (2) comprises a plurality of optical module cooling fins (201) arranged on the upper surface of the optical module base (1), the upper surface of the optical module cooling fin (201) is provided with a fixing groove (202), the inner cavity of the fixing groove (202) is provided with a heat pipe (203), the other end of the heat pipe (203) is provided with a heat diffusion sheet (204), the lower surface of the heat diffusion sheet (204) is provided with a plurality of mounting grooves (205), the other end of the heat pipe (203) is fixed in the inner cavity of the mounting groove (205), and the lower surface of the heat diffusion sheet (204) is fixed with an interface material (206).

2. The low-cost liquid cooling structure of a high-power optical module according to claim 1, characterized in that: The heat pipe (203) is located on the lower side of the radiator module elastic clamp (3), and the upper surface of the optical module base (1) is provided with a plurality of accommodating holes (9).

3. The low-cost liquid cooling structure of a high-power optical module according to claim 2, characterized in that: The number of the accommodating holes (9) is equal to the number of the optical module cooling fins (201), and the size of the inner cavity of the accommodating hole (9) is matched with the size of the optical module cooling fin (201).

4. The low-cost liquid cooling structure of a high-power optical module according to claim 1, characterized in that: The optical module cooling fin (201) and the heat pipe (203) and the heat diffusion sheet (204) and the heat pipe (203) are connected by brazing and silicon grease adhesion.

5. The low-cost liquid cooling structure of a high-power optical module according to claim 1, characterized in that: The size of the inner cavity of the mounting groove (205) and the fixing groove (202) is matched with the size of the heat pipe (203).

6. The low-cost liquid cooling structure of a high-power optical module according to claim 1, characterized in that: The lower surfaces of a plurality of the optical module bases (1) are fixed with the same optical module circuit board (4), and the optical module circuit board (4) is fixed in the inner cavity of the switch case (5).

7. The low-cost liquid cooling structure of a high-power optical module according to claim 1, characterized in that: The upper surface of the optical module circuit board (4) and located in front of the plurality of optical module bases (1) is fixed with a water cooling plate (6), the upper surface of the water cooling plate (6) is provided with a groove (7), the inner cavity of the groove (7) is fixed with a U-shaped water pipe (8), and the interface material (206) is located on the upper side of the water cooling plate (6).

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