Intelligent electronic refrigeration radiator for computer CPU

Abstract

The utility model discloses an intelligent electronic refrigeration radiator for a computer CPU (central processing unit), which comprises a cooling fan, a cooling aluminum profile is mounted on one side of the cooling fan, a heat insulation bakelite chip is mounted on one side of the cooling aluminum profile, an electronic refrigeration plate is arranged in the heat insulation bakelite chip, and a heat dissipation aluminum profile is mounted on the other side of the electronic refrigeration plate. A heat dissipation copper sheet is installed on one side of the heat insulation bakelite sheet, and a temperature control electron is arranged on the inner side of the heat dissipation copper sheet. The utility model relates to the technical field of computer CPU heat dissipation. According to the intelligent electronic refrigeration radiator for the computer CPU, when the temperature of the CPU reaches the set temperature, the electronic refrigeration function is started through the temperature control inductive switch, the CPU is rapidly cooled through electronic refrigeration, and the situation that the temperature of the CPU is too high or the CPU works at the high temperature for a long time is prevented; the electronic refrigeration function is closed through the temperature control inductive switch and is converted into air cooling heat dissipation, the refrigeration efficiency can be better improved, and the service life of the CPU is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of computer CPU heat dissipation technology, specifically to an intelligent electronic cooling heat sink for computer CPUs. Background Technology

[0002] The CPU is the core component of a computer, responsible for executing instructions in computer programs and performing data processing, calculations, control, and other operations. It can be regarded as the brain of the computer, controlling all its functions. The CPU generates a lot of heat when it runs. If it cannot be effectively cooled, the temperature may become too high, which may cause the system to slow down or become unstable, or even damage the hardware. Therefore, the cooling system is very important in a computer.

[0003] However, current air-cooled CPU coolers are ineffective at high temperatures, while water-cooled coolers are expensive. Therefore, those skilled in the art have developed an intelligent electronic cooling heatsink for computer CPUs to address the problems mentioned in the background section. Utility Model Content

[0004] In view of the shortcomings of the prior art, this utility model provides an intelligent electronic cooling heat sink for computer CPUs to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: an intelligent electronic cooling heat sink for a computer CPU, comprising a cooling fan, a heat dissipation aluminum profile installed on one side of the cooling fan, a heat-insulating bakelite sheet installed on one side of the heat dissipation aluminum profile, an electronic cooling plate disposed inside the heat-insulating bakelite sheet, and a heat dissipation copper sheet installed on one side of the heat-insulating bakelite sheet, with a temperature control electronic device disposed inside the heat dissipation copper sheet.

[0006] Preferably, the back surface of the heat-insulating bakelite sheet has two symmetrically formed round holes of mm.

[0007] Preferably, the front surface of the heat-insulating bakelite sheet has two symmetrically arranged round holes of mm.

[0008] Preferably, the rear surface of the heat-insulating bakelite sheet is provided with a milled groove.

[0009] Preferably, the temperature control electronics are used to monitor the CPU temperature and control the operation of the electronic cooling plate and the cooling fan.

[0010] Preferably, the hot end of the electronic cooling plate is located near the heat dissipation aluminum profile, and the cold end of the electronic cooling plate is located near the temperature control electronics.

[0011] Beneficial effects

[0012] This invention provides an intelligent electronic cooling heat sink for computer CPUs. Compared with the prior art, it has the following advantages:

[0013] This intelligent electronic cooling radiator for computer CPUs activates electronic cooling via a temperature-controlled sensor switch when the CPU temperature reaches a set temperature. This electronic cooling rapidly lowers the CPU temperature, preventing it from overheating or operating at high temperatures for extended periods. When the CPU temperature drops below the set temperature, the electronic cooling function is deactivated via the temperature-controlled sensor switch, switching to air cooling. This design improves cooling efficiency and extends the CPU's lifespan. Compared to water-cooled radiators, it has a simpler manufacturing process and structure, and is more economical. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a smart electronic cooling heat sink for a computer CPU.

[0015] Figure 2 A front view of a cooling fan in an intelligent electronic cooling radiator for a computer CPU.

[0016] Figure 3 This is a schematic diagram of the structure of a heat dissipation aluminum profile in an intelligent electronic cooling heat sink for computer CPUs.

[0017] Figure 4 This is a schematic diagram of the structure of a heat-insulating bakelite sheet in an intelligent electronic cooling heat sink for a computer CPU.

[0018] In the diagram: 1. Temperature control electronics; 2. Copper heat sink; 3. Electronic cooling board; 4. Heat-insulating bakelite sheet; 5. Heat-dissipating aluminum profile; 6. Cooling fan. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides a technical solution: an intelligent electronic cooling heat sink for a computer CPU, including a cooling fan 6, a heat dissipation aluminum profile 5 installed on one side of the cooling fan 6, a heat-insulating bakelite sheet 4 installed on one side of the heat dissipation aluminum profile 5, an electronic cooling plate 3 disposed inside the heat-insulating bakelite sheet 4, and a heat dissipation copper sheet 2 installed on one side of the heat-insulating bakelite sheet 4, and a temperature control electronic device 1 disposed inside the heat dissipation copper sheet 2.

[0021] exist Figure 4 In the middle: Two 2mm round holes are symmetrically opened on the rear surface of the heat insulation bakelite sheet 4, and two 2mm round holes are symmetrically opened on the front surface of the heat insulation bakelite sheet 4. A milled groove is opened on the rear surface of the heat insulation bakelite sheet 4. The heat insulation bakelite sheet 4 can isolate the heat source from the surrounding components, thus preventing the heat from the overheated area from being conducted to other components, avoiding unnecessary temperature rise, ensuring the stability of the heat dissipation system, and reducing failures caused by overheating.

[0022] exist Figure 1 In the middle: Temperature control electronics 1 is used to monitor the CPU temperature and control the operation of electronic cooling plate 3 and cooling fan 6. Through temperature control electronics 1, the electronic components of the heat dissipation system can be monitored and adjusted. The CPU temperature is monitored in real time through sensors. The functions of temperature control electronics 1 include detecting the CPU temperature and transmitting the data to the control system. Through the intelligent control system, the detected temperature changes will control the speed of cooling fan 6 or the working mode of electronic cooling plate 3. The system will automatically adjust the heat dissipation intensity according to the load to prevent the CPU from overheating and maintain good performance.

[0023] exist Figure 4 In the middle section, the hot end of the electronic cooling plate 3 is located near the heat dissipation aluminum profile 5, and the cold end of the electronic cooling plate 3 is located near the temperature control electronics 1. This arrangement achieves cooling through the thermoelectric effect, which reduces the temperature by generating a phenomenon where one side absorbs heat and the other side releases heat when current passes through the thermoelectric material.

[0024] During operation (or use), the intelligent electronic cooling radiator for computer CPUs activates when the CPU reaches a specified temperature, such as 45 degrees Celsius. This triggers a temperature control switch, causing the electronic cooling chip 3 to start cooling. The cooling is conducted to the CPU via the heat sink 2, achieving rapid cooling. The cooling fan 6 further enhances the cooling effect, accelerating the heat exchange process and quickly removing heat. The electronic cooling chip 3 rapidly cools the CPU, preventing it from overheating or operating at high temperatures for extended periods. When the CPU temperature drops below the set temperature, such as below 40 degrees Celsius, the temperature control switch shuts off the electronic cooling function and switches to air cooling. The temperature control electronics 1 adjusts the speed of the cooling fan 6 and the operating status of the electronic cooling chip 3 in real time based on the CPU temperature, thus maintaining the CPU temperature within a safe range. This design improves cooling efficiency and extends the CPU's lifespan. Compared to water-cooled radiators, it has a simpler manufacturing process and structure, and is more economical.

[0025] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

Claims

1. An intelligent electronic cooling radiator for a computer CPU, characterized by: Including heat dissipation fan (6), one side of heat dissipation fan (6) is equipped with heat dissipation aluminum profile (5), one side of heat dissipation aluminum profile (5) is equipped with heat insulation bakelite piece (4), the inside of heat insulation bakelite piece (4) is provided with electronic refrigeration plate (3), and one side of heat insulation bakelite piece (4) is equipped with heat dissipation copper piece (2), the inside of heat dissipation copper piece (2) is provided with temperature control electronics (1).

2. An intelligent electronic cooling radiator for computer CPU according to claim 1, characterized in that: The rear surface of the heat insulation bakelite piece (4) is symmetrically provided with two 2mm round holes.

3. An intelligent electronic cooling radiator for computer CPU according to claim 1, characterized in that: The front surface of the heat insulation bakelite piece (4) is symmetrically provided with two 2mm round holes.

4. An intelligent electronic cooling radiator for computer CPU according to claim 1, characterized in that: The rear surface of the heat insulation bakelite piece (4) is provided with a milling groove.

5. An intelligent electronic cooling radiator for computer CPU according to claim 1, characterized in that: The temperature control electronics (1) is used to monitor the temperature of the CPU and control the electronic refrigeration plate (3) and the heat dissipation fan (6).

6. An intelligent electronic cooling radiator for computer CPU according to claim 1, characterized in that: The hot end of the electronic refrigeration plate (3) is arranged close to the heat dissipation aluminum profile (5), and the cold end of the electronic refrigeration plate (3) is arranged close to the temperature control electronics (1).

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