RFID electronic tag

Abstract

The utility model relates to the field of electronic tags, in particular to a radio frequency identification (RFID) electronic tag, which comprises a base layer, an antenna and a chip, the base layer comprises a high-temperature-resistant layer, the high-temperature-resistant layer is a glass fiber reinforced hydrocarbon and ceramic dielectric layer, the antenna is arranged on the high-temperature-resistant layer, and the chip is connected with the antenna. The glass fiber reinforced hydrocarbon and the ceramic dielectric layer are adopted as the high-temperature-resistant layer of the base layer, so that the high-temperature-resistant label has high TG temperature, can be applied to high-temperature scenes, and keeps good label physical rigidity.

Description

Technical Field

[0001] This utility model relates to the field of electronic tags, and in particular to an RFID electronic tag. Background Technology

[0002] RFID electronic tags use radio frequency identification technology to automatically identify and track objects with electronic tags via radio waves. Conventional electronic tags are mostly used in normal temperature environments, but there is also a demand for electronic tags in some high-temperature environments. However, because the main structure of conventional electronic tags, such as the substrate material, does not have heat resistance, they cannot be used in high-temperature environments. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an RFID electronic tag that can be used in high-temperature scenarios.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: an RFID electronic tag, including a base layer, an antenna and a chip, wherein the base layer includes a high-temperature resistant layer, the high-temperature resistant layer is a glass fiber reinforced hydrocarbon and ceramic dielectric layer, the antenna is disposed on the high-temperature resistant layer, and the chip is connected to the antenna.

[0005] Furthermore, the antenna is a metal antenna.

[0006] Furthermore, the antenna is soldered to the chip.

[0007] Furthermore, a welding position formed by laser welding is provided between the antenna and the chip.

[0008] Furthermore, a welding position formed by resistance welding is provided between the antenna and the chip.

[0009] Furthermore, the welding material for soldering the antenna to the chip is gold, nickel, silver, or copper.

[0010] Furthermore, it also includes a protective layer, with the antenna and chip disposed between the protective layer and the base layer.

[0011] Furthermore, the protective layer is a high-temperature resistant protective layer.

[0012] Furthermore, the protective layer is made of silicone, engineering plastic, or synthetic stone.

[0013] Furthermore, antennas are provided on both sides of the base layer.

[0014] The beneficial effects of this utility model are as follows: by using a glass fiber reinforced hydrocarbon and ceramic dielectric layer as the base layer, the high temperature resistant layer has a high TG temperature, can be applied in high temperature scenarios, and maintains good label physical rigidity. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the flexible electronic tag of the elastic tag according to a specific embodiment of the present utility model.

[0016] Label Explanation:

[0017] 1. Base layer; 2. Antenna; 3. Chip; 4. Protective layer. Detailed Implementation

[0018] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0019] Please refer to Figure 1 An RFID electronic tag includes a base layer 1, an antenna 2, and a chip 3. The base layer 1 includes a high-temperature resistant layer, which is a glass fiber reinforced hydrocarbon and ceramic dielectric layer. The antenna 2 is disposed on the high-temperature resistant layer, and the chip 3 is connected to the antenna 2.

[0020] As can be seen from the above description, the beneficial effects of this utility model are as follows: by using a glass fiber reinforced hydrocarbon and ceramic dielectric layer as the high temperature resistant layer of the base layer 1, it has a high TG temperature, can be applied in high temperature scenarios, and maintains good label physical rigidity.

[0021] Specifically, the glass fiber reinforced hydrocarbon and ceramic dielectric has a glass transition temperature of TG280 degrees, which can meet the requirements of high-temperature applications of 250-300 degrees.

[0022] Furthermore, the antenna 2 is a metal antenna 2.

[0023] As can be seen from the above description, the metal antenna 2 has high conductivity, structural stability, ease of processing and high cost-effectiveness, and can be applied in high-temperature scenarios.

[0024] Furthermore, the antenna 2 is welded to the chip 3.

[0025] As described above, by welding antenna 2 to chip 3, the application in high-temperature environments can be matched according to the TG temperature of the welding material, ensuring good electrical performance of the tag.

[0026] Furthermore, a welding position formed by laser welding is provided between the antenna 2 and the chip 3.

[0027] As can be seen from the above description, based on the arrangement of the welding equipment, laser welding can be used to weld the antenna 2 and the chip 3.

[0028] Furthermore, a welding position formed by resistance welding is provided between the antenna 2 and the chip 3.

[0029] As can be seen from the above description, resistance welding can be used to weld antenna 2 and chip 3 according to the arrangement of welding equipment.

[0030] Furthermore, the welding material for welding the antenna 2 to the chip 3 is gold, nickel, silver, or copper.

[0031] As described above, gold, nickel, silver, or copper are used as welding materials. These welding materials have a high physical melting point, so they can meet the weather resistance requirements of at least 300 degrees Celsius after welding.

[0032] Furthermore, it also includes a protective layer 4, with the antenna 2 and chip 3 disposed between the protective layer 4 and the base layer 1.

[0033] As can be seen from the above description, the antenna 2 and the chip 3 are protected by designing the protective layer 4.

[0034] Furthermore, the protective layer 4 is a high-temperature resistant protective layer 4.

[0035] As can be seen from the above description, the design of using the high-temperature resistant protective layer 4 can ensure the use and protection of the label in high-temperature scenarios.

[0036] Furthermore, the protective layer 4 is made of silicone, engineering plastic, or synthetic stone.

[0037] As described above, materials with high temperature resistance, such as silicone, engineering plastics, or synthetic stone, are used as the protective layer 4 to meet the needs of label use and protection in high-temperature environments.

[0038] Furthermore, antennas 2 are provided on both sides of the base layer 1.

[0039] As can be seen from the above description, the signal coverage range can be expanded and the signal reception capability can be improved by using the dual-sided antenna 2 of the base layer 1.

[0040] Example 1:

[0041] like Figure 1 As shown, an RFID electronic tag includes a base layer 1, an antenna 2, a chip 3, and a protective layer 4. The base layer 1 includes a high-temperature resistant layer, which is a glass fiber reinforced hydrocarbon and ceramic dielectric layer. The antenna 2 is disposed on the high-temperature resistant layer. Optionally, the base layer 1 is entirely composed of a glass fiber reinforced hydrocarbon and ceramic dielectric layer.

[0042] The glass fiber reinforced hydrocarbon and ceramic dielectric layer serves as a high-temperature resistant layer, with a glass transition temperature of TG280 degrees, which can meet the requirements of high-temperature applications of 250-300 degrees.

[0043] The antenna 2 and the chip 3 are located between the protective layer 4 and the base layer 1.

[0044] The antenna 2 is a metal antenna, and it is welded to the chip 3. Specifically, the antenna 2 and the chip 3 are welded using laser welding or resistance welding. The welding material used to weld the antenna 2 and the chip 3 is gold, nickel, silver, or copper. These welding materials have high physical melting points, so they can meet the weathering requirements of at least 300 degrees Celsius after welding.

[0045] The protective layer 4 is a high-temperature resistant protective layer, which is made of high-temperature resistant materials such as silicone, engineering plastics or synthetic stone.

[0046] Example 2:

[0047] The difference between this embodiment and Embodiment 1 is that:

[0048] The base layer 1 has an antenna 2 on one side.

[0049] Example 3:

[0050] The difference between this embodiment and Embodiment 1 is that:

[0051] Antennas 2 are provided on both sides of the base layer 1. The design of antennas 2 on both sides of the base layer 1 can expand the signal coverage range and improve the signal reception capability.

[0052] In summary, the RFID electronic tag provided by this utility model, by using a glass fiber reinforced hydrocarbon and ceramic dielectric layer as the base layer, has a high temperature resistance (TG temperature), can be applied in high-temperature scenarios, and maintains good physical rigidity of the tag.

[0053] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An RFID electronic tag, characterized in that, The device includes a base layer, an antenna, and a chip. The base layer includes a high-temperature resistant layer, which is a glass fiber reinforced hydrocarbon and ceramic dielectric layer. The antenna is disposed on the high-temperature resistant layer, and the chip is connected to the antenna.

2. The RFID electronic tag according to claim 1, characterized in that, The antenna is a metal antenna.

3. The RFID electronic tag according to claim 2, characterized in that, The antenna is soldered to the chip.

4. The RFID electronic tag according to claim 3, characterized in that, The antenna and the chip are provided with a welding position formed by laser welding.

5. The RFID electronic tag according to claim 3, characterized in that, The antenna and the chip are provided with a welding position formed by resistance welding.

6. The RFID electronic tag according to claim 3, characterized in that, The welding material used to weld the antenna to the chip is gold, nickel, silver, or copper.

7. The RFID electronic tag according to claim 1, characterized in that, It also includes a protective layer, with the antenna and chip disposed between the protective layer and the base layer.

8. The RFID electronic tag according to claim 7, characterized in that, The protective layer is a high-temperature resistant protective layer.

9. The RFID electronic tag according to claim 8, characterized in that, The protective layer is made of silicone, engineering plastic, or synthetic stone.

10. The RFID electronic tag according to claim 1, characterized in that, Antennas are installed on both sides of the base layer.

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