Miniaturized transmit-receive common microstrip antenna unit

Abstract

The utility model relates to a miniaturized transmit-receive common microstrip antenna unit, which comprises a first dielectric substrate, a second dielectric substrate and metalized via holes, the first dielectric substrate is located above the second dielectric substrate; a radiation metal patch is arranged above the first dielectric substrate, and a grounding metal patch is arranged between the first dielectric substrate and the second dielectric substrate; the upper end of the metalized via hole sequentially penetrates through the second dielectric substrate, the grounding metal patch and the first dielectric substrate and then is connected with the radiation metal patch, and the lower end of the metalized via hole is connected with the microstrip feeder; according to the miniaturized transmit-receive sharing microstrip antenna unit provided by the utility model, the cost is further reduced through two modes of transmit-receive sharing and radiation metal patch hollowing-out, and miniaturization and integration are realized at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to microstrip antenna technical field, especially in a kind of miniaturization transceiving common microstrip antenna unit. BACKGROUND

[0002] Many advantages of microstrip antenna, such as light weight, small size, low cost, planar structure, can be compatible with integrated circuit etc., microstrip antenna obtains extensive research and development, so that microstrip antenna obtains a variety of applications.

[0003] With the popularity of more and more consumer wireless electronic product terminals, the antenna as the core component faces more severe challenges, and cost reduction and miniaturization design become the trend UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of miniaturization transceiving common microstrip antenna unit, to overcome the deficiency in prior art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] The application discloses a kind of miniaturization transceiving common microstrip antenna unit, including first dielectric substrate and second dielectric substrate and metallized via;The first dielectric substrate is located above second dielectric substrate;Radiation metal patch is equipped on the top of the first dielectric substrate, and ground metal patch is equipped between the first dielectric substrate and second dielectric substrate;The upper end of the metallized via sequentially passes through second dielectric substrate, ground metal patch and first dielectric substrate and is connected with radiation metal patch, and the lower end of the metallized via is connected with microstrip feed line.

[0007] As preferred, the radiation metal patch is equipped with several hollow structures above, and the shape of the hollow structure is polygon.

[0008] As preferred, the shape of the radiation metal patch is square, the number of the hollow structure is 4, and the hollow structure is located on two diagonal lines or the midpoint connection line of two opposite sides of the radiation metal patch.

[0009] As preferred, the metallized via includes first metallized via, second metallized via and third metallized via, and the microstrip feed line includes transmitting microstrip feed line and receiving microstrip feed line;Two ends of the first metallized via are connected with radiation metal patch and transmitting antenna microstrip feed line, and two ends of the third metallized via are connected with radiation metal patch and receiving microstrip feed line;Two ends of the second metallized via are connected with radiation metal patch and ground metal patch.

[0010] As preferred, the second metallized via is located at the geometric center point of the radiating metal patch; the line connecting the contact points of the first metallized via, the second metallized via and the radiating metal patch is located on the diagonal line of the radiating metal patch; the line connecting the contact points of the third metallized via, the second metallized via and the radiating metal patch is located on the diagonal line of the radiating metal patch.

[0011] As preferred, the length of the line connecting the contact points of the first metallized via, the second metallized via and the radiating metal patch is equal to the length of the line connecting the contact points of the third metallized via, the second metallized via and the radiating metal patch; the line connecting the contact points of the first metallized via, the second metallized via and the radiating metal patch is perpendicular to the line connecting the contact points of the third metallized via, the second metallized via and the radiating metal patch.

[0012] As preferred, the length of the line connecting the contact points of the first metallized via, the second metallized via and the radiating metal patch is equal to the length of the line connecting the contact points of the third metallized via, the second metallized via and the radiating metal patch; the line connecting the contact points of the first metallized via, the second metallized via and the radiating metal patch is perpendicular to the line connecting the contact points of the third metallized via, the second metallized via and the radiating metal patch.

[0013] As preferred, it is applied to the frequency band of 5725MHz-5875MHz.

[0014] The beneficial effects of the present application are as follows:

[0015] The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0016] The features and advantages of the present application will be described in detail with reference to the embodiments and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0018] Figure 2 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0019] Figure 3 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0020] Figure 4 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0021] Figure 5 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0022] Figure 6 The present application provides a miniaturized transceiving microstrip antenna unit, which is further reduced in cost through transceiving sharing and radiating metal patch hollowing, and is integrated and miniaturized at the same time.

[0023] Figure 7 the connection formed by the contact points of the first metallized via, the second metallized via and the radiating metal patch and the connection formed by the contact points of the third metallized via, the second metallized via and the radiating metal patch;

[0024] Figure 8 two diagonal lines of the radiating metal patch; DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the present application more clear and intelligible, the present application will be further described in detail below with the help of drawings and examples. However, it should be understood that the specific examples described herein are only used to explain the present application and are not used to limit the scope of the present application. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0026] Referring to Figure 1 and Figure 2 , the present application is a miniaturized transceiving microstrip antenna unit which is composed of three metal layers and two dielectric layers; the three metal layers are, from top to bottom, a radiating metal patch, a grounding metal patch and an antenna microstrip feed line layer; the structure has the advantages of low profile of the microstrip antenna and convenience for integration with a radio frequency IC; the microstrip feed line and the radiating metal patch are placed on both sides of the PCB, which can ensure that the antenna radiation pattern will not be affected by the parasitic radiation of the microstrip feed line; as shown in Figure 6 , the antenna pattern has a small gain difference in each direction.

[0027] One end of the microstrip feed line is connected to the metal radiating patch through a metallized via, and the other end is connected to the radio frequency output and radio frequency input pins of the radio frequency IC; the transceiving antenna feed line structure is the same;

[0028] The radiating metal patch is square, and has a hollow structure thereon; the hollow structure can be a rhombus, a square or other forms of polygon; the number of hollow structures is four, which are located on two diagonal lines of the radiating metal patch or on the midpoint connecting lines of two opposite sides of the radiating metal patch; as shown in Figure 3 , Figure 4 , Figure 5 The metal radiating patch is hollowed out, which changes the current path on the radiating metal patch, so that for the design of the antenna for a specific frequency band, the antenna area can be reduced under the premise that the antenna characteristics meet the requirements.

[0029] The metallized via holes include a first metallized via hole, a second metallized via hole and a third metallized via hole; the first metallized via hole connects the transmitting antenna microstrip feed line and the radiating metal patch; the third metallized via hole connects the receiving antenna microstrip feed line and the radiating metal patch; the first metallized via hole and the third metallized via hole are not electrically connected with the grounding metal patch; and the second metallized via hole is electrically connected with the grounding metal patch.

[0030] Referring to Figures 7-8 The connecting line formed by the contact points of the first metallized via hole and the second metallized via hole with the radiating metal patch is located on the diagonal line of the radiating metal patch; the connecting line formed by the contact points of the third metallized via hole and the second metallized via hole with the radiating metal patch is located on the diagonal line of the radiating metal patch; the length of the connecting line formed by the contact points of the first metallized via hole and the second metallized via hole with the radiating metal patch is equal to the length of the connecting line formed by the contact points of the third metallized via hole and the second metallized via hole with the radiating metal patch; and the connecting line formed by the contact points of the first metallized via hole and the second metallized via hole with the radiating metal patch is perpendicular to the connecting line formed by the contact points of the third metallized via hole and the second metallized via hole with the radiating metal patch.

[0031] The length of the connecting line formed by the contact points of the first metallized via hole and the second metallized via hole with the radiating metal patch is about 1 / 6 of the length of the diagonal line of the radiating metal patch; and the length of the connecting line formed by the contact points of the third metallized via hole and the second metallized via hole with the radiating metal patch is about 1 / 6 of the length of the diagonal line of the radiating metal patch. The length can be adjusted to match the impedance of the transmitting and receiving antenna.

[0032] The above only describes the preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A compact transceiving microstrip antenna unit, characterized by: It comprises a first dielectric substrate and a second dielectric substrate and a metalized via; the first dielectric substrate is above the second dielectric substrate; A radiation metal patch is arranged above the first dielectric substrate, and a grounding metal patch is arranged between the first dielectric substrate and the second dielectric substrate; The upper end of the metalized via is connected with the radiation metal patch in sequence through the second dielectric substrate, the grounding metal patch and the first dielectric substrate, and the lower end of the metalized via is connected with a microstrip feed line.

2. A compact transceiving microstrip antenna unit as claimed in claim 1, characterized in that: A plurality of hollow structures are arranged above the radiation metal patch, and the hollow structures are in polygonal shape.

3. A miniaturized transceiving microstrip antenna unit as claimed in claim 2, characterized in that: The radiation metal patch is in square shape, the number of the hollow structures is four, and the hollow structures are arranged on two diagonal lines or on the midpoint connecting lines of two opposite sides of the radiation metal patch.

4. A compact transceiving microstrip antenna element as claimed in claim 1, characterized in that: The metalized via comprises a first metalized via, a second metalized via and a third metalized via, and the microstrip feed line comprises a transmitting microstrip feed line and a receiving microstrip feed line; The first metalized via is connected with the radiation metal patch and the transmitting microstrip feed line at both ends, and the third metalized via is connected with the radiation metal patch and the receiving microstrip feed line at both ends. The second metalized via is connected with the radiation metal patch and the grounding metal patch at both ends.

5. A miniaturized transceiving microstrip antenna unit as claimed in claim 4, characterized in that: The second metalized via is located at the geometric center point of the radiation metal patch, the connecting line of the contact points of the first metalized via, the second metalized via and the radiation metal patch is located on the diagonal line of the radiation metal patch, and the connecting line of the contact points of the third metalized via, the second metalized via and the radiation metal patch is located on the diagonal line of the radiation metal patch.

6. A miniaturized transceiving microstrip antenna unit as claimed in claim 5, characterized in that: The length of the connecting line of the contact points of the first metalized via, the second metalized via and the radiation metal patch is equal to the length of the connecting line of the contact points of the third metalized via, the second metalized via and the radiation metal patch. The connecting line of the contact points of the first metalized via, the second metalized via and the radiation metal patch is perpendicular to the connecting line of the contact points of the third metalized via, the second metalized via and the radiation metal patch.

7. A miniaturized transceiving microstrip antenna unit as claimed in claim 5, characterized in that: The length of the connecting line of the contact points of the first metalized via, the second metalized via and the radiation metal patch is 1 / 6 of the length of the diagonal line of the radiation metal patch, and the length of the connecting line of the contact points of the third metalized via, the second metalized via and the radiation metal patch is 1 / 6 of the length of the diagonal line of the radiation metal patch.

8. A miniaturized transceiving microstrip antenna unit as recited in claim 1, characterized by: It is applied to the frequency band of 5725MHz-5875MHz.

Images