Connection structure convenient for injection molding and data line

Abstract

The utility model discloses a connection structure convenient for injection molding, and discloses a data line with the connection structure convenient for injection molding, the connection structure convenient for injection molding comprises a circuit board, the circuit board is provided with a first connection surface, a first side surface and a second side surface, the first connection surface is connected with the first side surface and the second side surface, and the second connection surface is connected with the second side surface. The first side face and the second side face are arranged in an offset mode. One end of the cable is provided with a wiring part, the wiring part is connected with the first connecting surface, and the wiring part is located between the first side surface and the second side surface; and the first rubber coating part is arranged on the first side surface and / or the second side surface, and the first rubber coating part is used for wrapping the connection part between the first connection surface and the wiring part. According to the utility model, the problems of poor rubber coating and poor circuit board caused by injection molding rubber coating at the welding part between the circuit board and the cable in the prior art are solved, and the occurrence of badness is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of data cables, and in particular to a connection structure and data cable that are easy to injection mold. Background Technology

[0002] Data cables are widely used in consumer electronics fields such as mobile terminals, audio-visual equipment, PCs, smart homes, and medical electronics. Among them, smartphones are one of the main application areas for data cables. With the continuous expansion of the smartphone market and the continuous advancement of technology, consumer demand for data cables is also constantly increasing. Many innovative products have emerged in the market, such as electronic illuminated data cables with LED lights and digital displays.

[0003] Typically, luminous data cables are equipped with a circuit board, which is connected to a cable. The cable and the circuit board are fixed together by soldering. Then, the circuit board is placed in the cavity of an injection mold. The cavity of the injection mold restricts the position of three sides of the circuit board. Two of the three sides of the circuit board are parallel to each other. Then, injection molding is performed into the injection mold to fix the solder joint between the circuit board and the cable.

[0004] However, the current industry standard for circuit board manufacturing tolerances in the width and length directions is within ±0.1mm, and the dimensions of the injection mold cavity are fixed. The two parallel sides of the circuit board, confined within the injection mold cavity, are prone to processing abnormalities. In other words, if the actual size of the circuit board deviates from its upper limit, the portion of the two parallel sides of the circuit board that exceeds the mold cavity will be squeezed and deformed, or the circuit board may not be able to fit into the mold cavity. If the actual size of the circuit board deviates from its lower limit, plastic will overflow from the gap between the two parallel sides of the circuit board and the mold cavity. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a connection structure that facilitates injection molding, which can solve the problems of poor encapsulation and circuit board defects that occur during injection molding at the solder joints between circuit boards and cables in the prior art, thereby reducing the occurrence of defects.

[0006] This utility model also proposes a data cable with the aforementioned connection structure that facilitates injection molding.

[0007] A connection structure for easy injection molding according to a first aspect of the present invention includes: a circuit board having a first connecting surface, a first side surface, and a second side surface, wherein the first connecting surface connects the first side surface and the second side surface, and the first side surface and the second side surface are offset from each other; a cable having a connector at one end, the connector being connected to the first connecting surface and located between the first side surface and the second side surface; and a first encapsulated portion disposed on the first side surface and / or the second side surface, and the first encapsulated portion being used to wrap the connection between the first connecting surface and the connector.

[0008] According to an embodiment of the present invention, a connection structure that facilitates injection molding has at least the following beneficial effects:

[0009] This invention utilizes a circuit board and a cable. The circuit board has a first connecting surface, a first side surface, and a second side surface. One end of the cable has a connector, which can be welded to the welding part of the first connecting surface. Furthermore, a first encapsulation portion is provided to wrap and fix the connection between the first connecting surface and the connector, preventing wire breakage at the first connecting surface and improving the tensile strength between the connector and the first connecting surface. The first encapsulation portion is positioned on the first side surface and / or the second side surface, with the first and second sides offset. This means that during injection molding, the first connecting surface, the first side surface, and / or the second side surface of the circuit board can cooperate with the upper and lower molds to form the first encapsulation portion. When the actual size of the circuit board deviates from its upper limit, the circuit board will not be deformed by the mold; when the actual size deviates from its lower limit, there will be no gap between the circuit board and the mold causing material overflow, thus reducing defects.

[0010] According to a first aspect of the present invention, a connection structure that facilitates injection molding is provided, wherein the circuit board has a second connection surface, the first connection surface and the second connection surface are disposed opposite to each other in the thickness direction of the circuit board, and the first encapsulated portion connects the first connection surface and the second connection surface.

[0011] The advantages of this invention are: by using the second connecting surface, the first coated part is connected to the second connecting surface, so that the first coated part is connected to both the first and second connecting surfaces at the same time, which increases the connection area between the first coated part and the circuit board. The first coated part can clamp the circuit board, thus making it less likely for the first coated part to come loose from the circuit board.

[0012] According to a first aspect of the present invention, a connection structure that is easy to injection mold is provided, wherein a first coated portion is connected to a second coated portion, the cable has a main body portion, the main body portion and the wiring portion are connected, and the second coated portion wraps around the main body portion and the wiring portion.

[0013] The advantages are: by setting a second rubber coating part, the second rubber coating part is connected to the first rubber coating part. The second rubber coating part wraps and fixes the wiring part and the main body part. On the one hand, it avoids the wiring part being exposed to the outside, and the second rubber coating part plays a role in protecting the wiring part. On the other hand, it improves the connection strength between the wiring part and the main body part.

[0014] According to a first aspect embodiment of the present invention, a connection structure that facilitates injection molding is provided in which the central axes of the first overmolded portion, the second overmolded portion, and the main body portion coincide along a first direction.

[0015] The advantages are: by aligning the central axes of the first coating part, the second coating part, and the main body, the present invention makes it easier to arrange the connection structure at the symmetrical center of the circuit board, which helps to improve the stability of the connection between the circuit board and the cable and reduces the risk of cable detachment.

[0016] According to a first aspect embodiment of the present invention, a connection structure that facilitates injection molding is provided in which the second overmolded portion is provided with a connecting portion, the connecting portion is disposed close to the first overmolded portion, and along the second direction, the width of the connecting portion is greater than the width of the circuit board.

[0017] The advantages of this invention are: by providing a connecting part in the second encapsulation part, in the structure of some data cables, an outer sheath is fitted over the circuit board. The outer sheath can protect the circuit board and the connection structure. In the second direction, the connecting part can match the inside of the outer sheath, which helps to improve the strength of the connection between the circuit board and the cable, and avoids bending at the connection between the circuit board and the cable. At the same time, the width of the connecting part is greater than the width of the circuit board, which avoids interference between the circuit board and the outer sheath when the outer sheath is installed.

[0018] According to a first aspect embodiment of the present invention, a connection structure that facilitates injection molding is provided, wherein the circuit board has a third side surface located on the side of the first side surface away from the second side surface. Along the second direction, the distance between the side of the first encapsulated portion near the second side surface and the second side surface is 0.2-0.5 mm, and the distance between the side of the first encapsulated portion near the third side surface and the third side surface is 0.2-0.5 mm.

[0019] The advantages of this invention are: by having a reserved space between the side of the first encapsulated part closest to the second side and the second side, and a reserved space between the side of the first encapsulated part closest to the third side and the third side, since the processing tolerance of the circuit board is ±0.1mm, that is, the tolerance range is 0.2mm, and the reserved space range is between 0.2-0.5mm, the reserved space avoids the second and third sides being confined to the inner cavity of the upper and lower molds of the injection mold, while ensuring that the first encapsulated part can firmly wrap the connection point of the first connecting surface and the wiring part.

[0020] According to a first aspect embodiment of the present invention, a connection structure that facilitates injection molding is provided, wherein the second overmolded portion is located on the side of the first connection surface near the first side surface, and a gap is formed between the second overmolded portion and the first side surface along a first direction.

[0021] The advantage of this invention is that by creating a gap between the second overmolded part and the first side, during injection molding, the second overmolded part only needs to wrap the first side, and does not need to wrap the second and third sides, thus reducing injection molding defects.

[0022] According to a first aspect embodiment of the present invention, in a connection structure that facilitates injection molding, the height of the first overmolded portion and the height of the second overmolded portion are the same along a third direction.

[0023] The advantages of this invention are: by making the height of the first rubber-coated part the same as the height of the second rubber-coated part, the first rubber-coated part matches the interior of the outer sheath in a third direction, and the first rubber-coated part can support the outer sheath, which helps to improve the strength of the outer sheath and makes it less likely to be damaged when the outer sheath is impacted. At the same time, it avoids bending at the connection between the circuit board and the cable.

[0024] A data cable according to a second aspect of the present invention includes a connection structure that is easy to injection mold as described in any of the above-mentioned embodiments.

[0025] According to an embodiment of the present invention, a connection structure and data cable that are easy to injection mold have at least the following beneficial effects:

[0026] This invention solves the problems of poor coating and circuit board defects caused by injection molding at the solder joint between the circuit board and cable in the prior art by setting a connection structure, thereby reducing the occurrence of data cable defects.

[0027] A data cable according to a second aspect of the present invention includes a plug connected to the side of the circuit board away from the cable.

[0028] The advantage of this invention is that the plug is connected to the side of the circuit board away from the cable, allowing the circuit board to connect to external devices through the plug, thus enabling the data cable to perform data transmission.

[0029] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a connection structure and data cable that are easy to inject mold according to an embodiment of the present utility model;

[0032] Figure 2 for Figure 1 The diagram shows a connection structure and a front view of a data cable that facilitates injection molding.

[0033] Figure 3 for Figure 1 An exploded view of a connection structure and data cable that facilitates injection molding is shown.

[0034] Figure 4 for Figure 3 The diagram shows a cross-sectional view of a connection structure and data cable that are easy to inject mold.

[0035] Reference numerals: 100-Circuit board, 110-First connecting surface, 120-First side, 130-Second side, 140-Third side, 150-Cable, 160-Connecting part, 170-First encapsulated part, 180-Main body, 190-Plug, 200-Second encapsulated part, 210-Connecting part, 220-Outer sheath. Detailed Implementation

[0036] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0037] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0039] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] The following description, in conjunction with the accompanying drawings, describes a connection structure and data cable that are easy to inject mold according to an embodiment of the present invention.

[0041] Reference Figure 1 The present invention aims to provide an embodiment of a connection structure that is easy to injection mold.

[0042] This utility model provides a connection structure that is easy to inject mold, comprising a circuit board 100, a cable 150, and a first encapsulated portion 170. The circuit board 100 has a first connecting surface 110, a first side surface 120, and a second side surface 130. The first connecting surface 110 connects the first side surface 120 and the second side surface 130, and the first side surface 120 and the second side surface 130 are offset from each other. One end of the cable 150 has a connector 160, which is connected to the first connecting surface 110 and is located between the first side surface 120 and the second side surface 130. The first encapsulated portion 170 is arranged on the first side surface 120 and / or the second side surface 130, and is used to wrap the connection between the first connecting surface 110 and the connector 160.

[0043] It should be noted that the first side surface 120 and the second side surface 130 are offset, which can be understood as the first connecting surface 110 being viewed from the front view, with reference to... Figure 2 The first side 120 and the second side 130 are not parallel to each other.

[0044] The wiring portion 160 is located between the first side 120 and the second side 130. It can be understood that when the first connecting surface 110 is viewed from the front view, in this embodiment, the wiring portion 160 can be arranged on the first side 120. Of course, the wiring portion 160 can also be arranged on the second side 130.

[0045] The first adhesive-coated portion 170 is disposed on the first side surface 120 and / or the second side surface 130. This can be understood as follows: when the first connecting surface 110 is viewed from the front view, in this embodiment, the first adhesive-coated portion 170 can be disposed on the first side surface 120 (see reference 130). Figure 2 Of course, in some other embodiments, it can also be arranged on the second side 130, or it can be arranged on both the first side 120 and the second side 130 at the same time.

[0046] It is understood that in this embodiment, by setting up a circuit board 100 and a cable 150, the circuit board 100 has a first connecting surface 110, a first side surface 120, and a second side surface 130. One end of the cable 150 has a connector 160, which can be soldered and fixed to the soldering part of the first connecting surface 110. Furthermore, by setting a first encapsulated part 170, the connection between the first connecting surface 110 and the connector 160 can be wrapped and fixed, preventing wire breakage at the first connecting surface 110 and improving the tensile strength between the connector 160 and the first connecting surface 110. The first encapsulated part... The first side 120 and / or the second side 130 are arranged at an offset. That is, during injection molding, the first connecting surface 110, the first side 120 and / or the second side 130 of the circuit board can cooperate with the upper and lower molds of the mold to form the first encapsulated part 170. When the actual size of the circuit board 100 is biased towards its upper limit size, there will be no problem of the circuit board 100 being squeezed and deformed by the mold. When the actual size of the circuit board 100 is biased towards its lower limit size, there will be no problem of the circuit board 100 and the mold having gaps that cause the glue to overflow, thereby reducing the occurrence of defects.

[0047] In some embodiments of this utility model, the first rubber-coated portion 170 is connected to the second rubber-coated portion 200, the cable 150 has a main body portion 180, the main body portion 180 and the connector portion 160 are connected, and the second rubber-coated portion 200 wraps the main body portion 180 and the connector portion 160.

[0048] It is understandable that by connecting the second rubber-coated part 200 to the first rubber-coated part 170, the second rubber-coated part 200 wraps and fixes the wiring part 160 and the main body part 180. On the one hand, it prevents the wiring part 160 from being exposed to the outside, and the second rubber-coated part 200 plays a role in protecting the wiring part 160. On the other hand, it improves the connection strength between the wiring part 160 and the main body part 180.

[0049] In a further embodiment of the present invention, in the first direction, the central axes of the first rubber-coated portion 170, the second rubber-coated portion 200, and the main body portion 180 coincide.

[0050] It should be noted that the first direction is Figure 1 , Figure 2 and Figure 3 The X direction.

[0051] It is understandable that aligning the central axes of the first rubber-coated portion 170, the second rubber-coated portion 200, and the main body portion 180, that is, arranging the first rubber-coated portion 170, the second rubber-coated portion 200, and the main body portion 180 concentrically, facilitates the arrangement of the connection structure at the symmetrical center of the circuit board 100, which helps improve the stability of the connection between the circuit board 100 and the cable 150 and reduces the risk of the cable 150 falling off.

[0052] In a further embodiment of the present invention, the second coating portion 200 is provided with a connecting portion 210, which is located close to the first coating portion 170. Along the second direction, the width of the connecting portion 210 is greater than the width of the circuit board 100.

[0053] It should be noted that the second direction is Figure 1 , Figure 2 and Figure 3 The Y-direction is perpendicular to the X-direction.

[0054] Understandably, in the structure of some data cables, the circuit board 100 is fitted with an outer sheath 220. The outer sheath 220 can protect the circuit board 100 and the connection structure. In the second direction, the connecting part 210 can match the inside of the outer sheath 220, which helps to improve the strength of the connection between the circuit board 100 and the cable 150 and avoid bending at the connection between the circuit board 100 and the cable 150. At the same time, the width of the connecting part 210 is greater than the width of the circuit board 100 to avoid interference between the circuit board 100 and the outer sheath 220 when the outer sheath 220 is installed.

[0055] In a further embodiment of the present invention, along a third direction, the height of the first adhesive portion 170 and the height of the second adhesive portion 200 are the same.

[0056] It should be noted that the third party is... Figure 1 and Figure 3The Z direction, the Z direction and the X direction are perpendicular to the Y direction.

[0057] It is understandable that by making the height of the first rubber-coated portion 170 the same as the height of the second rubber-coated portion 200, in a third direction, the first rubber-coated portion 170 matches the interior of the outer sheath 220. The first rubber-coated portion 170 can support the outer sheath 220, which helps to improve the strength of the outer sheath 220, making the outer sheath 220 less likely to be damaged when it is impacted. At the same time, it avoids bending at the connection between the circuit board 100 and the cable 150.

[0058] In some embodiments of this utility model, the circuit board 100 has a third side surface 140, which is located on the side of the first side surface 120 away from the second side surface 130. Along the second direction, the distance between the side of the first encapsulated portion 170 close to the second side surface 130 and the second side surface 130 is 0.2-0.5mm, and the distance between the side of the first encapsulated portion 170 close to the third side surface 140 and the third side surface 140 is 0.2-0.5mm.

[0059] It should be noted that the second direction is Figure 1 , Figure 2 and Figure 3 The Y direction is perpendicular to the X direction.

[0060] It is understandable that there is a reserved space between the side of the first encapsulated part 170 near the second side 130 and the second encapsulated part 200 near the third side 140. Since the processing tolerance of the circuit board 100 is ±0.1mm, that is, the tolerance range is 0.2mm, and the range of the reserved space is W, which is between 0.2-0.5mm, the reserved space is used to avoid the second side 130 and the third side 140 being restricted to the inner cavity of the upper and lower molds of the injection mold, while ensuring that the first encapsulated part 170 can firmly wrap the connection between the first connecting surface 110 and the wiring part 160.

[0061] In some embodiments of this utility model, the second adhesive portion 200 is located on the side of the first connecting surface 110 near the first side surface 120, and a gap is formed between the second adhesive portion 200 and the first side surface 120 along the second direction.

[0062] It should be noted that the second direction is Figure 1 , Figure 2 and Figure 3 The Y direction is perpendicular to the X direction.

[0063] It is understandable that by creating a gap between the second overmolded portion 200 and the first side 120, during injection molding, the second overmolded portion 200 only needs to wrap the first side 120, and does not need to wrap the second side 130 and the third side 140, thereby reducing injection molding defects.

[0064] In some embodiments of this utility model, the circuit board 100 has a second connecting surface, the first connecting surface 110 and the second connecting surface are disposed opposite to each other in the thickness direction of the circuit board 100, and the first encapsulated portion 170 connects the first connecting surface 110 and the second connecting surface.

[0065] It is understood that the present invention connects the first coated part 170 to the second connected surface through the second connecting surface, so that the first coated part 170 connects the first connecting surface 110 and the second connecting surface at the same time, thereby increasing the connection area between the first coated part 170 and the circuit board 100. The first coated part 170 can clamp the circuit board 100, thereby making it difficult for the first coated part 170 to detach from the circuit board 100.

[0066] This embodiment also proposes a data cable, including the aforementioned connection structure that facilitates injection molding.

[0067] It is understood that this embodiment solves the problems of poor encapsulation and circuit board 100 defects caused by injection molding at the solder joint between the circuit board 100 and the cable 150 in the prior art by setting a connection structure, thereby reducing the occurrence of data cable defects.

[0068] In some embodiments of this utility model, a plug 190 is also included. The plug 190 is connected to the side of the circuit board 100 away from the cable 150. It is understood that the circuit board 100 is connected to an external device through the plug 190, so that the data cable can realize the data transmission function.

[0069] In the description of this specification, references to terms such as "an embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0070] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A connection structure facilitating injection molding, characterized by, The application relates to a connecting structure for facilitating injection molding. The connecting structure comprises a circuit board (100), a cable (150) and a first encapsulation part (170). The circuit board (100) has a first connecting surface (110), a first side surface (120) and a second side surface (130), the first connecting surface (110) connects the first side surface (120) and the second side surface (130), and the first side surface (120) and the second side surface (130) are arranged offset. One end of the cable (150) has a wiring part (160), the wiring part (160) is connected with the first connecting surface (110), and the wiring part (160) is located between the first side surface and the second side surface (130).

2. A connection structure facilitating injection molding according to claim 1, characterized in that The first encapsulation part (170) is arranged on the first side surface (120) and / or the second side surface (130), and the first encapsulation part (170) is used for encapsulating a connecting position between the first connecting surface (110) and the wiring part (160).

3. The connection structure according to claim 1, wherein The circuit board (100) has a second connecting surface, the first connecting surface (110) and the second connecting surface are arranged opposite in the thickness direction of the circuit board (100), and the first encapsulation part (170) connects the first connecting surface (110) and the second connecting surface.

4. A connection structure according to claim 3, wherein The first encapsulation part (170) is connected with a second encapsulation part (200), the cable (150) has a main body part (180), the main body part (180) is connected with the wiring part (160), and the second encapsulation part (200) encapsulates the main body part (180) and the wiring part (160).

5. The connection structure according to claim 3, wherein In a first direction, the central axes of the first encapsulation part (170), the second encapsulation part (200) and the main body part (180) coincide.

6. The connection structure according to claim 3, wherein The second encapsulation part (200) is located on the side of the first connecting surface (110) close to the first side surface (120), and in the first direction, a gap is formed between the second encapsulation part (200) and the first side surface (120).

7. A connection structure for facilitating injection molding according to claim 5, wherein The second encapsulation part (200) is provided with a connecting part (210), the connecting part (210) is arranged close to the first encapsulation part (170), and in a second direction, the width of the connecting part (210) is greater than the width of the circuit board (100).

8. The connection structure of claim 1, wherein In a third direction, the height of the first encapsulation part (170) is consistent with the height of the second encapsulation part (200).

9. A data line, characterized by The circuit board (100) has a third side surface (140), the third side surface (140) is located on the side of the first side surface (120) away from the second side surface (130), in the second direction, the distance between the side of the first encapsulation part (170) close to the second side surface (130) and the second side surface (130) is 0.2-0.5 mm, and the distance between the side of the first encapsulation part (170) close to the third side surface (140) and the third side surface (140) is 0.2-0.5 mm. The application further discloses a connecting structure for facilitating injection molding. The connecting structure comprises a circuit board (100), a cable (150) and a first encapsulation part (170).

10. The data line of claim 9, wherein, The plug (190) is connected to the circuit board (100) on the side away from the cable (150).

Images