Pulse power supply circuit and pulse power supply device

Abstract

The embodiment of the utility model provides a pulse power supply circuit and a pulse power supply device, and relates to the technical field of power supplies. The circuit comprises a numerical control unit, a power tube array unit and an energy storage array unit, the power tube array unit comprises at least two first power tubes, and any two first power tubes are connected in parallel; the numerical control unit is electrically connected with each first power tube, and each first power tube is electrically connected with the energy storage array unit; wherein the energy storage array unit is used for outputting pulse current when the first power tube is closed; and the numerical control unit is used for controlling the duty ratio of each first power tube so as to control the pulse width of the pulse current output by the energy storage array unit. According to the embodiment of the invention, heat generated by the pulse power supply can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power supply, in particular to a pulse power supply circuit and a pulse power supply device. BACKGROUND

[0002] A pulse power supply is a power supply device capable of providing a high-energy pulse (for example, a pulse with a large current or a large power) in a short time. The pulse power supply is widely used in the fields of material processing, biological medicine, etc. At present, when the pulse power supply outputs a high-energy pulse, it often accompanies a significant thermal effect, that is, a large amount of heat is released. For example, in the field of material processing, the pulse power supply generates excessive heat in the process of outputting a high-energy pulse, which reduces the energy utilization efficiency of the pulse power supply and shortens the service life of the pulse power supply.

[0003] Therefore, how to reduce the heat generated by the pulse power supply has become a technical problem to be solved. CONTENT OF THE INVENTION

[0004] The main purpose of the embodiments of the present application is to provide a pulse power supply circuit and a pulse power supply device, which are designed to reduce the heat generated by the pulse power supply and improve the energy utilization efficiency of the pulse power supply.

[0005] To achieve the above-mentioned purpose, the first aspect of the embodiments of the present application provides a pulse power supply circuit, which comprises a numerical control unit, a power tube array unit, and an energy storage array unit.

[0006] The power tube array unit comprises at least two first power tubes, and any two first power tubes are connected in parallel with each other.

[0007] The numerical control unit is electrically connected to each first power tube, and each first power tube is electrically connected to the energy storage array unit.

[0008] The energy storage array unit is configured to output a pulse current when the first power tube is closed, and the numerical control unit is configured to control the duty cycle of each first power tube to control the pulse width of the pulse current output by the energy storage array unit.

[0009] In some embodiments, the maximum value of the pulse current is 1500 amperes, and the number of the first power tubes is 500.

[0010] In some embodiments, the energy storage array unit comprises at least two supercapacitors.

[0011] The number of the supercapacitors is 100, and the maximum value of the output current of each supercapacitor is 15 amperes.

[0012] In some embodiments, the circuit further comprises:

[0013] A power conversion unit is electrically connected to the energy storage array unit, and is configured to convert an input alternating voltage into a direct voltage.

[0014] In some embodiments, the circuit further comprises:

[0015] A clamp unit is electrically connected to the energy storage array unit and the power tube array unit, and is configured to clamp a metal workpiece, and the energy storage array unit outputs a pulse current to process the metal workpiece.

[0016] In some embodiments, the first power tube is an insulated gate bipolar transistor.

[0017] The resistance value of the insulated gate bipolar transistor when closed is less than or equal to 3 milliohms.

[0018] In some embodiments, the circuit further comprises an overcurrent protection unit.

[0019] The overcurrent protection unit is electrically connected to the energy storage array unit.

[0020] The overcurrent protection unit is configured to protect the pulse current output by the energy storage array unit from overcurrent.

[0021] In some embodiments, the circuit further comprises a signal filtering module.

[0022] The signal filtering module is electrically connected between the numerical control unit and each first power tube.

[0023] The numerical control unit is configured to output a duty cycle control signal, the signal filtering module is configured to filter the duty cycle control signal, and the first power tube is configured to switch between open and closed states in response to the filtered duty cycle control signal.

[0024] To achieve the above-mentioned purpose, a second aspect of the embodiments of the present application proposes a pulse power supply device, comprising: a shell and a circuit board, the circuit board having the pulse power supply circuit of the first aspect described above;

[0025] The circuit board is arranged inside the shell.

[0026] In some embodiments, the pulse power supply device further comprises a heat sink.

[0027] The heat sink is arranged inside the shell, and the heat sink is attached to the circuit board.

[0028] The heat sink is configured to dissipate heat from the pulse power supply circuit of the circuit board.

[0029] The pulse power supply circuit and device proposed in this application, considering the problem of excessive heat generation from pulse power supplies, employ a power transistor array unit composed of first power transistors connected in parallel. This parallel connection disperses the current, reducing the load on individual first power transistors and thus decreasing the heat generated. A numerical control unit controls the duty cycle of each first power transistor to control the pulse width of the pulse current output by the energy storage array unit, thereby controlling the current duration and controlling the heat generated by the current over a period of time (e.g., one pulse cycle). In summary, this application can reduce the heat generated by pulse power supplies. Attached Figure Description

[0030] Figure 1 This is a block diagram of the pulse power supply circuit provided in the embodiments of this application;

[0031] Figure 2 This is a circuit schematic diagram of the pulse power supply circuit provided in the embodiments of this application;

[0032] Figure 3 This is a module block diagram of a pulse power supply circuit provided in another embodiment of this application;

[0033] Figure 4 This is a current-pulse-temperature relationship diagram of the pulse power supply circuit provided in the embodiments of this application;

[0034] Figure 5 This is a schematic diagram of the workpiece temperature provided in the embodiments of this application.

[0035] Reference numerals: 10, numerical control unit; 20, power transistor array unit; 21, first power transistor; 30, energy storage array unit; 40, power conversion unit. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0037] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing the embodiments of the application only and is not intended to be limiting of the application.

[0039] First, let's analyze some of the terms used in this application:

[0040] Workpiece: refers to the object of machining in the machining process. It can be a single part or a combination of several parts fixed together.

[0041] PWM (Pulse Width Modulation): a technique for modulating signals by changing the pulse width, mainly used to convert analog signals to digital signals. PWM technology controls the power of the signal by changing the width of the pulse (i.e. the duration of the high or low level).

[0042] Duty cycle: refers to the ratio of the duration of the high level to the entire cycle time within a cycle.

[0043] DSP (Digital Signal Processor): a microprocessor designed specifically for fast implementation of digital signal processing algorithms. DSP is widely used in audio processing, video processing, communication, radar, automotive and other fields. The design of DSP makes it particularly suitable for real-time signal processing tasks, and can efficiently perform operations such as digital filtering, Fourier transform, spectral analysis, etc.

[0044] CPU (Central Processing Unit): the core component of computer hardware, responsible for executing instructions and processing data in programs. CPU processes input data and outputs the processing results. It can handle various types of data such as integers, floating-point numbers, characters, etc.

[0045] MCU (Microcontroller Unit): also known as microcontroller, is an integrated circuit chip that integrates CPU, memory, programmable input / output peripherals, etc. on a single chip. Microcontroller is designed for specific control functions and is widely used in embedded systems and automation control fields.

[0046] PLC (Programmable Logic Controller): a digital operating electronic system. PLC is widely used in manufacturing, process control, automated production lines, etc.

[0047] The pulse power supply circuit and the pulse power supply device provided by the embodiments of the present application are described in detail as follows. First, the pulse power supply circuit in the embodiments of the present application is described.

[0048] Figure 1 is an optional module block diagram of the pulse power supply circuit provided by the embodiments of the present application. The pulse power supply circuit comprises a numerical control unit 10, a power tube array unit 20, and an energy storage array unit 30.

[0049] The power tube array unit 20 comprises at least two first power tubes 21, and any two first power tubes 21 are connected in parallel with each other.

[0050] The numerical control unit 10 is electrically connected to each first power tube 21, and each first power tube 21 is electrically connected to the energy storage array unit 30.

[0051] The energy storage array unit 30 is configured to output a pulse current when the first power tube 21 is closed, and the numerical control unit 10 is configured to control the duty cycle of each first power tube 21 to control the pulse width of the pulse current output by the energy storage array unit 30.

[0052] The beneficial effects of the embodiments of the present application include but are not limited to the following: considering the problem of a large amount of heat generated by the pulse power supply, the power tube array unit 20 is composed of the first power tubes 21 connected in parallel with each other, the current is dispersed in the parallel mode, the load of each first power tube 21 is reduced, and thus the heat generated by each first power tube 21 is reduced. The duty cycle of each first power tube 21 is controlled by the numerical control unit 10 to control the pulse width of the pulse current output by the energy storage array unit 30, and thus the current duration is controlled to control the heat generated by the current in a period of time (such as a pulse period). In summary, the present application can reduce the heat generated by the pulse power supply.

[0053] It should be noted that the pulse power supply circuit is applied to a pulse power supply device (referred to as a pulse power supply). In the field of material processing, the pulse power supply outputs a high-energy pulse current to a workpiece (i.e., a material to be processed) to perform material processing. As shown in Figure 1 The first power tubes 21 in the power tube array unit 20 and the energy storage array unit 30 are respectively connected to the workpiece. The workpiece can include metal materials, semiconductor materials, etc. Other types of materials can also be processed, which are not limited herein. In addition, the specific operation of the pulse power supply outputting a high-energy pulse current to perform material processing includes but is not limited to electroplating, wire electrical discharge machining, micro-arc oxidation, etc.

[0054] In some embodiments, it is noted that the current high-energy pulse power supply will generate significant heat effect in high-energy state, i.e., in the case of large current. For example, the current high-energy pulse power supply will generate a large amount of heat when the current is greater than or equal to 1000A (ampere). This will cause the processed material to deform due to thermal damage, reduce the energy utilization efficiency of the pulse power supply, and shorten the service life of the pulse power supply device, etc.

[0055] The embodiments of the present application aim to reduce the heat generated by the pulse power supply by reducing the pulse width of the pulse current. For example, the duty cycle of each first power tube in the power tube array unit 20 is reduced to reduce the pulse width of the pulse current, i.e., to reduce the duration of the pulse current, thereby reducing the heat generated by the pulse power supply. For example, the embodiments of the present application can ensure that the heat generated by the pulse power supply circuit is low, i.e., there is no significant heat effect, when the current value of the pulse current is greater than or equal to 1000A, which is not achieved by other pulse power supplies. The pulse power supply circuit of the embodiments of the present application will not generate significant heat effect when processing workpieces with high-energy electric pulses, effectively overcoming the above problems caused by heat effect, such as avoiding thermal damage to the workpiece, improving the energy utilization efficiency and service life of the pulse power supply circuit, etc.

[0056] It is noted that the current and pulse width of the pulse power supply circuit can be set according to the requirements. For example, assuming that the pulse power supply circuit uses a current of 100A or less, in the case of small current, the heat generated by the pulse power supply is small, and the duty cycle of each first power tube 21 can be increased by the numerical control unit 10 to increase the pulse width of the pulse current and improve the power of the pulse power supply circuit.

[0057] In some embodiments, the pulse power supply circuit can be applied to the field of material processing, and can also be applied to the fields of biological medicine, industrial automation, etc., which are not limited by the embodiments of the present application. For example, in the field of biological medicine, the pulse power supply circuit can be applied to medical imaging devices, such as magnetic resonance imaging (MRI) devices and computed tomography (CT) devices, to generate high-quality image information.

[0058] It can be understood that the first power transistor 21 is a power transistor. The power transistor is an electronic component used to control a large power. By connecting a plurality of first power transistors 21 in parallel to form a power transistor array unit 20, a higher output power can be achieved to meet the high energy demand application scenarios. Moreover, by sharing the load of the plurality of first power transistors 21 in parallel, the thermal load of each first power transistor 21 can be effectively reduced, the thermal management capability of the pulse power supply circuit can be improved, the thermal effect of the pulse power supply circuit can be controlled, and the heat generated by the pulse power supply circuit can be effectively reduced.

[0059] In some embodiments, the first power transistor 21 can be a MOS transistor (MOSFET, Metal Oxide Semiconductor Field Effect Transistor), which can achieve fast switching control. The first power transistor 21 can also be a bipolar transistor (BJT, Bipolar Junction Transistor), or other types of power transistors, which are not limited by the embodiments of the present application.

[0060] It can be understood that by using a large number of first power transistors 21 in parallel, the current can be distributed among the plurality of first power transistors 21, thereby reducing the load of the single first power transistor 21, reducing the operating temperature of the single first power transistor 21, and reducing the heat generated by the single first power transistor 21. In addition, by using a parallel structure, the unit heat exchange between each first power transistor 21 can be faster.

[0061] It can be understood that the numerical control unit 10 is used to control the duty cycle of each first power transistor 21, which can specifically control each first power transistor 21 to quickly open and close in the case of large current, that is, to reduce the duty cycle of each first power transistor 21, so that the current duration is shortened to reduce the heat generated by the current in a unit of time.

[0062] In some embodiments, the numerical control unit 10 can be a digital signal processor (Digital Signal Processor, DSP). In another embodiment, the numerical control unit 10 can include any one of a CPU (Central Processing Unit, Central Processing Unit), an MCU (Microcontroller Unit, Microcontroller Unit), a PLC (Programmable Logic Controller, Programmable Logic Controller), or other types of control chips, which are not limited herein.

[0063] It can be understood that, by means of the numerical control unit 10 and the power tube array unit 20, high precision and shorter pulse width adjustment can be realized to meet specific application requirements, for example, electric treatment of metal materials (i.e., metal workpieces) while avoiding damage to the metal materials caused by the thermal effect of the pulse power supply circuit.

[0064] In some embodiments, the frequency of the pulse current of the pulse power supply circuit can be set by the numerical control unit 10. The user can adjust the frequency of the pulse power supply circuit according to requirements, which are not limited herein. It can be understood that, for example, the frequency of the pulse power supply A is 100 Hz, and the frequency of the pulse power supply B is 1000 Hz. Since the frequency of the pulse power supply A is lower, the number of pulses output per unit time is smaller, and the heat accumulation speed is slower, so the overall heat generated by the pulse power supply A is smaller. Since the frequency of the pulse power supply B is higher, the number of pulses output per unit time is larger, and the heat accumulation speed is faster, so the overall heat generated by the pulse power supply B is larger. In order to reduce the heat, the frequency can be reduced according to requirements, such as setting the current frequency to 0-50 Hz (hertz).

[0065] In some embodiments, the voltage of the pulse power supply circuit can be set by the numerical control unit 10. For example, the voltage value range includes 0-20 V (volts). The user can adjust the voltage of the pulse power supply circuit according to requirements, which are not limited herein.

[0066] In some embodiments, in the power tube array unit 20, the number of the first power tubes 21 ranges from 100 to 500.

[0067] In some embodiments, the maximum value of the pulse current is 1500 amperes, and the number of the first power tubes 21 is 500.

[0068] The advantage of this embodiment is that a large number of first power tubes 21 are arranged in parallel for the case of a large pulse current, such as a current value of 1500 amperes, for example, 500 first power tubes 21 are arranged in parallel. Since the larger the pulse current is, the more heat is generated, a large number of power tubes (i.e., first power tubes 21) are used for shunt to ensure that the pulse current can output high current, so that the pulse current flowing through each first power tube 21 is smaller, thereby reducing the load of each first power tube 21 and reducing the heat generated by each first power tube 21.

[0069] In some embodiments, for example, the maximum value of the pulse current is 1500 amperes, and the resistance of each first power tube 21 is the same or similar, at this time, the current flowing through each first power tube 21 can be considered the same, and the current of each first power tube 21 is 3 A (amperes).

[0070] Please refer to Figure 2In some embodiments, the energy storage array unit 30 comprises at least two supercapacitors;

[0071] The number of supercapacitors is 100, and the maximum output current of each supercapacitor is 15 amperes.

[0072] The embodiment has the advantages that the supercapacitors with fast charging and discharging capability and high power density are adopted, and are suitable for environments requiring high current output. Moreover, by connecting a large number (such as 100) of supercapacitors in parallel with each other, the pulse power supply can quickly provide the required high power when outputting a short pulse. In summary, the embodiment can quickly charge and discharge and release high energy in a short time, and achieve high power output.

[0073] It should be noted that, in Figure 2 The energy storage array unit 30 can further comprise a resistor connected in parallel with any supercapacitor. The supercapacitors can be polar supercapacitors, and the positive poles of the polar supercapacitors are used to connect the workpiece. In the energy storage array unit 30, the ellipsis between the two supercapacitors indicates that the specific number of supercapacitors is not limited and can be adjusted according to requirements. Similarly, in the power tube array unit 20, the ellipsis between the two first power tubes 21 indicates that the specific number of first power tubes 21 is not limited and can be adjusted according to requirements.

[0074] It should be noted that when capacitors (such as supercapacitors) are connected in parallel, the total current of the capacitors is the sum of the currents of the individual capacitors. For example, assuming that the pulse current output by the pulse power supply circuit as a whole is 1500 amperes, 100 supercapacitors connected in parallel can be provided, and the output current of each supercapacitor is 15 amperes.

[0075] In some embodiments, the numerical control unit 10 is further configured to control each first power tube 21 to be turned on (i.e., closed) at the same time, so that each supercapacitor is discharged at the same time. Alternatively, the numerical control unit 10 controls each first power tube 21 to be turned off at the same time, so that each supercapacitor is charged at the same time. In summary, by controlling each supercapacitor to be charged and discharged at the same time, the pulse current is output.

[0076] Please refer to Figure 2 In some embodiments, in the case where the first power tube 21 is a MOS tube, the numerical control chip has a first port (S port) and a first port (G port). The S port is electrically connected to the source of each MOS tube, and the G port is electrically connected to the gate of each MOS tube. The numerical control chip is further configured to control the change of the gate voltage through the G port, that is, to control the conduction and cutoff of the MOS tube, so as to control the pulse width of the pulse current. The drain of each MOS tube is used to electrically connect the workpiece, so as to output the pulse current to the workpiece for processing.

[0077] In some embodiments, the number of supercapacitors in the energy storage array unit 30 ranges from 50 to 300.

[0078] In some embodiments, the first power tube 21 is an insulated gate bipolar transistor.

[0079] The resistance of the insulated gate bipolar transistor in the closed state is less than or equal to 3 mΩ.

[0080] The advantage of this embodiment is that, while ensuring a large pulse current (e.g., 1500 A) output by the pulse power supply circuit, the use of an insulated gate bipolar transistor with a low on-state voltage drop (i.e., a small resistance value in the closed state) further reduces the heat generated by the pulse power supply circuit and improves the energy utilization efficiency of the pulse power supply circuit.

[0081] It should be noted that an insulated gate bipolar transistor (IGBT) is a power tube with low on-state voltage drop and fast switching speed. The low on-state voltage drop of the insulated gate bipolar transistor means that the voltage drop in the on state (i.e., the resistance value in the closed state) is small, thereby reducing heat generation and energy loss.

[0082] Please refer to Figure 2 and Figure 3 In some embodiments, the pulse power supply circuit further comprises:

[0083] The power conversion unit 40 is electrically connected to the energy storage array unit 30, and the power conversion unit 40 is configured to convert the input AC voltage into a DC voltage.

[0084] The advantage of this embodiment is that the power conversion unit 40 converts the input AC voltage into the required DC voltage, so that the power tube array unit 20 can accurately adjust the waveform of the DC voltage, such as adjusting the pulse width, thereby effectively controlling the voltage and current output by the pulse power supply circuit, and further controlling the thermal effect of the pulse power supply circuit to reduce heat generation.

[0085] It should be noted that in Figure 2 , the power conversion unit 40 has an AC IN port and a DC OUT port. The AC IN port represents an AC input port, and the DC OUT port represents a DC output port. In an embodiment, the DC OUT port includes a positive output terminal and a negative output terminal. If the supercapacitor is a polar supercapacitor, the positive output terminal of the DC OUT port is electrically connected to the positive pole of the polar supercapacitor, and the negative output terminal of the DC OUT port is electrically connected to the negative pole of the polar supercapacitor.

[0086] In some embodiments, the power conversion unit 40 includes an AC-DC converter. In another embodiment, the power conversion unit 40 includes a rectifier, and can also include other types of power conversion devices, which are not limited herein.

[0087] It can be understood that the power conversion unit 40 is used to connect an external power source, for example, the power conversion unit 40 can be connected to a 220V alternating current power source. The main function of the power conversion unit 40 is to convert alternating current (AC) to direct current (DC). For example, the power conversion unit 40 performs rectification, filtering, voltage stabilization and other processes, thereby converting 220V alternating current into direct current of a specific voltage, and then powering the numerical control unit 10 and / or the energy storage array unit 30 through the direct current.

[0088] In some embodiments, the pulse power supply circuit further includes:

[0089] A clamp unit (not shown in the figure) electrically connects the energy storage array unit 30 and the power tube array unit 20, and the clamp unit is used to clippably connect a metal workpiece. The energy storage array unit 30 outputs a pulse current to process the metal workpiece.

[0090] The advantage of this embodiment is that the metal workpiece can be clamped by the clamp unit, and the pulse current is output to the metal workpiece, thereby realizing the processing of the metal workpiece.

[0091] It can be understood that the metal workpiece is processed, which can be specifically that the metal workpiece is locally and rapidly heated, melted or even evaporated by the pulse current, thereby realizing the precision machining of the metal workpiece. Electroplating and other processing methods can also be performed, which are not limited.

[0092] In some embodiments, the metal workpiece includes at least one of nickel, tungsten, aluminum, copper, titanium and alloys thereof, for example, the metal workpiece can be a nickel alloy, and specifically can be a third-generation nickel-based single-crystal high-temperature alloy. It can be understood that the pulse power supply circuit can also process workpieces of other material types, such as semiconductor materials, and the material of the workpiece is not limited in the embodiments of the present application.

[0093] In some embodiments, the size of the metal workpiece is 15*10*1mm (millimeter). Workpieces of different sizes can also be selected according to requirements, which are not limited.

[0094] Specifically, the pulse current of the pulse power supply acting on the workpiece, that is, the pulse current output by the pulse power supply circuit described above, has a value range of 300 to 1500A.

[0095] In some embodiments, the pulse current output by the energy storage array unit can be collected by an oscilloscope to obtain the pulse current value. The pulse current value can also be obtained by other means, such as current collection by a current sensor, a multimeter, etc., which are not limited herein.

[0096] In some embodiments, the pulse power supply circuit further comprises an overcurrent protection unit (not shown in the figure);

[0097] The overcurrent protection unit is electrically connected to the energy storage array unit 30.

[0098] The overcurrent protection unit is configured to protect the pulse current output by the energy storage array unit 30 from overcurrent.

[0099] The advantage of this embodiment is that the overcurrent protection unit is used to protect the pulse current output by the energy storage array unit 30 from overcurrent, thereby avoiding damage to electronic components (such as the first power tube 21) caused by excessive pulse current, and improving the safety and stability of the pulse power supply circuit.

[0100] Specifically, the overcurrent protection unit can be electrically connected between the energy storage array unit 30 and the clamp unit.

[0101] In some embodiments, the pulse power supply circuit further comprises a signal filtering module (not shown in the figure);

[0102] The signal filtering module is electrically connected between the digital control unit 10 and each first power tube 21.

[0103] The digital control unit 10 is configured to output a duty cycle control signal, the signal filtering module is configured to filter the duty cycle control signal, and the first power tube 21 is configured to switch between open and closed states in response to the filtered duty cycle control signal.

[0104] The advantage of this embodiment is that the signal filtering module is used to filter the duty cycle control signal, thereby reducing noise interference in the duty cycle control signal, improving the control accuracy of the duty cycle of the first power tube 21, and more accurately controlling the pulse width of the pulse current, thereby reducing the heat generated by the pulse power supply.

[0105] Specifically, the duty cycle control signal can be a PWM (Pulse Width Modulation) control signal, or other types of control signals, which are not limited herein.

[0106] It should be noted that the switching frequency (i.e., duty cycle) between the on and off states of the first power transistor 21 can be controlled according to the duty cycle control signal. The duty cycle of the first power transistor 21 refers to the ratio of the time the first power transistor 21 is in the on state within one cycle to the total time of the entire cycle. For example, if one cycle is 10 milliseconds and the first power transistor is on for 5 milliseconds, then the duty cycle is 50%.

[0107] like Figure 4 As shown, for example, in the case of a pulse power supply circuit outputting a pulse current, the correspondence between the pulse width of the pulse current and the current value can include the following current-pulse width combinations (see [reference]). Figure 4 The following are the current-pulse width relationship curves: (1) Current (i.e., current value) is 300A (Amperes), pulse width is 0.1ms (Milliseconds); (2) Current is 900A, pulse width is 0.2ms; (3) Current is 1200A, pulse width is 0.3ms; (4) Current is 1350A, pulse width is 0.4ms; (5) Current is 1425A, pulse width is 0.5ms; (6) Current is 1437A, pulse width is 0.6ms; (7) Current is 1449A, pulse width is 0.7ms; (8) Current is 1462A, pulse width is 0.8ms. It can be understood that the above current-pulse width combinations can be set and adjusted according to needs. Furthermore, the same pulse width can correspond to different current value ranges. For example, a pulse width of 0.8ms can also correspond to a current of 1500A.

[0108] Please see Figure 4 and Figure 5 In some embodiments, if a workpiece is processed using pulsed currents with different pulse widths and current values, the workpiece will have different temperatures. The workpiece temperature reflects the heat generated by the pulsed power supply circuit, i.e., the thermal effect of the pulsed power supply circuit. The lower the workpiece temperature, the less heat is generated by the pulsed power supply. For example, a pulsed current is generated by a numerical control unit in the pulsed power supply circuit, thereby outputting the pulsed current to the workpiece, and the current value, frequency, and pulse width of the pulsed current are acquired using an oscilloscope. Simultaneously, the temperature of the workpiece is measured using a thermal imager. Assuming the voltage of the pulsed power supply circuit is 5V and the frequency is 1Hz, the measurement results of the current value, pulse width, and temperature are as follows: Figure 4 As shown in the figure, when the pulse current applied to the workpiece by the pulse power supply is 1462A and the pulse width is 0.8ms, the temperature of the workpiece is only 31.2℃ (degrees Celsius), indicating that the workpiece temperature is low and no obvious thermal effect is observed on the workpiece surface. The temperature measurement results of the thermal imager at this time are as follows. Figure 5 As shown.

[0109] Understandably, in Figure 4In the figure, the curve with square dots is used to represent the relationship between current (i.e. current value) and pulse width. The curve with diamond dots is used to represent the relationship between temperature and pulse width. And since pulse width corresponds to current one-to-one, Figure 4 The temperature in the figure refers to the temperature of the workpiece under a specific pulse width and the current corresponding to the pulse width. For example, the pulse width ranges from 0.1 to 0.8 ms. The current value ranges from 300 to 1500 A. The pulse power supply circuit of the embodiments of the present application can ensure that the temperature of the workpiece is about 30℃ when the workpiece is processed based on the pulse width and current in the above range.

[0110] It can be understood that, Figure 5 In the figure, Ar1 represents the workpiece. When the pulse current of the pulse power supply acting on the workpiece has a current value of 1462 A and the pulse width is 0.8 ms, the temperature of the workpiece Ar1 is 31.2℃. Specifically, the workpiece Ar1 can be a third-generation nickel-based single-crystal superalloy, and the size of the workpiece Ar1 is 15*10*1 mm.

[0111] The embodiments of the present application also provide a pulse power supply device, which comprises: a shell and a circuit board, and the circuit board has the pulse power supply circuit described above;

[0112] The circuit board is arranged in the interior of the shell.

[0113] In some embodiments, the circuit board is a metal printed circuit board, and the substrate of the metal printed circuit board comprises an aluminum-based copper-clad plate.

[0114] It should be noted that the metal printed circuit board has a substrate made of metal. By using the good heat dissipation performance of the large-area metal substrate, the pulse power supply circuit on the metal printed circuit board can be dissipated, thereby improving the safety of the pulse power supply device and enabling normal processing of the workpiece under large current conditions. For example, the substrate of the metal printed circuit board can be an aluminum-based copper-clad plate or an iron-based copper-clad plate.

[0115] In some embodiments, the pulse power supply device further comprises: a heat sink;

[0116] The heat sink is arranged in the interior of the shell, and the heat sink is attached to the circuit board;

[0117] The heat sink is used to dissipate the pulse power supply circuit of the circuit board.

[0118] The advantage of this embodiment is that the heat sink attached to the circuit board dissipates the pulse power supply circuit of the circuit board, thereby improving the safety of the pulse power supply device and enabling normal processing of the workpiece under large current conditions.

[0119] Specifically, the heat sink comprises any one of a heat sink fin, a heat pipe, a heat sink paste, and a heat-conducting pad.

[0120] The specific embodiment of the pulse power supply device is basically the same as the above-described specific embodiment of the pulse power supply circuit, and will not be described here again.

[0121] It should be noted that the non-company electronic components or assemblies appearing in the embodiments of the present application are only examples for introduction, and do not represent actual use.

[0122] The embodiments described in the present application are for more clearly illustrating the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0123] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and can include more or fewer steps than the figures shown, or combine certain steps, or different steps.

[0124] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separate, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0125] Those skilled in the art can understand that all or some of the steps in the above disclosed method, the functions of the modules / units in the system and the device can be implemented as software, firmware, hardware and their appropriate combinations.

[0126] The terms "first", "second", "third", "fourth" and the like (if any) in the specification of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0127] It should be understood that, in the application, "at least one" refers to one or more, and "multiple" refers to two or more. "And / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can represent three cases of only A, only B and A and B existing at the same time, wherein A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can represent a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b and c can be single or multiple.

[0128] In several embodiments provided in the application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative, for example, the division of the above units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. The coupling or direct coupling or communication connection between the displayed or discussed each other can be through some interface, indirect coupling or communication connection between devices or units, which can be electrical, mechanical or other forms.

[0129] The units described above as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or they can be distributed on multiple network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0130] In addition, each functional unit in each embodiment of the application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0131] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, essentially or in other words, the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes multiple instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program storage media.

[0132] The preferred embodiments of the embodiments of the present application are described above with reference to the accompanying drawings, and are not limited to the scope of the embodiments of the present application. Any modifications, equivalent replacements and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present application shall be within the scope of the embodiments of the present application.

Claims

1. A pulsed power supply circuit, characterized by, The circuit comprises a numerical control unit, a power tube array unit, an energy storage array unit and an overcurrent protection unit; The power tube array unit comprises at least two first power tubes, and any two of the first power tubes are connected in parallel with each other; The numerical control unit is electrically connected to each of the first power tubes, and each of the first power tubes is electrically connected to the energy storage array unit; The energy storage array unit is configured to output a pulse current when the first power tubes are closed; and the numerical control unit is configured to control the duty cycle of each of the first power tubes to control the pulse width of the pulse current output by the energy storage array unit. The overcurrent protection unit is electrically connected to the energy storage array unit; The overcurrent protection unit is configured to perform overcurrent protection on the pulse current output by the energy storage array unit.

2. The pulsed power supply circuit of claim 1, wherein, The maximum value of the pulse current is 1500 amperes, and the number of the first power tubes is 500.

3. The pulsed power supply circuit of claim 2, wherein, The energy storage array unit comprises at least two supercapacitors; The number of the supercapacitors is 100, and the maximum value of the output current of each of the supercapacitors is 15 amperes.

4. The pulsed power supply circuit according to any one of claims 1 to 3, characterized in that The circuit further comprises: A power conversion unit electrically connected to the energy storage array unit, the power conversion unit being configured to convert an input alternating voltage into a direct voltage.

5. The pulsed power supply circuit according to any one of claims 1 to 3, characterized in that The circuit further comprises: A clamp unit electrically connected to the energy storage array unit and the power tube array unit, the clamp unit being configured to clippably connect to a metal workpiece, and the energy storage array unit outputs a pulse current to process the metal workpiece.

6. The pulsed power supply circuit of claim 3, wherein, The first power tube is an insulated gate bipolar transistor; The resistance value of the insulated gate bipolar transistor when closed is less than or equal to 3 milliohms.

7. The pulsed power supply circuit according to any one of claims 1 to 3, characterized in that The circuit further comprises a signal filtering module; The signal filtering module is electrically connected between the numerical control unit and each of the first power tubes; The numerical control unit is configured to output a duty cycle control signal, the signal filtering module is configured to filter the duty cycle control signal, and the first power tube is configured to switch between open and closed states in response to the filtered duty cycle control signal.

8. A pulsed power supply device, characterized by comprising: The pulse power supply device comprises a housing and a circuit board, and the circuit board has the pulse power supply circuit according to any one of claims 1 to 7; The circuit board is arranged inside the housing.

9. The pulsed power supply apparatus according to claim 8, characterized by The pulse power supply device further comprises a heat sink; The heat sink is arranged inside the housing, and the heat sink is attached to the circuit board; The heat sink is configured to dissipate heat from the pulse power supply circuit of the circuit board.

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