Differential signal amplification device for high-speed data transmission in chip

Abstract

The utility model provides a differential signal amplification device for high-speed data transmission in a chip, which comprises a heat dissipation assembly, and the heat dissipation assembly comprises a heat conduction plate, a heat dissipation fin, a pressure spring, a guide rod, two L-shaped limiting seats, an L-shaped clamping seat, a limiting spring, a pull plate and a pull rod. The heat dissipation fins are evenly and fixedly connected to the upper surface of the heat conduction plate. The pins of the differential signal amplifier are connected into a circuit, in high-speed data transmission, electromagnetic interference and noise can be effectively resisted, signal transmission quality and stability are improved, then the L-shaped limiting seat is arranged outside the shell in a sleeving mode, the L-shaped clamping seat is connected with the limiting protruding block in a clamping mode when the L-shaped limiting seat is pressed downwards, and the signal transmission quality and stability are improved. According to the differential signal amplifier, the L-shaped clamping base is pushed through the limiting spring, the heat dissipation assembly can be connected with the main body assembly, and the heat dissipation assembly is arranged to be detachable, so that the heat dissipation assembly can be quickly mounted or dismounted according to use requirements to meet different use working conditions of the differential signal amplifier.

Description

Technical Field

[0001] This utility model relates to a differential signal amplification device, specifically a differential signal amplification device for high-speed data transmission within a chip, belonging to the technical field of signal amplification devices. Background Technology

[0002] A differential signal amplifier, also known as a differential amplifier, is an important type of electronic amplifier. The working principle of a differential signal amplifier is based on the differential amplification principle. When a differential signal is input to a differential pair, due to the amplitude and phase difference between the two input signals, the differential pair will produce an output signal proportional to the difference in the input signals. This output signal is then amplified by the differential amplifier to obtain the amplified differential signal output.

[0003] In high-speed data transmission, differential signals can effectively resist electromagnetic interference and noise, improving signal transmission quality and stability. Differential signal amplification devices further enhance the signal's anti-interference capability and transmission distance by amplifying the differential signal.

[0004] When a differential signal amplifier operates in a high-temperature environment, especially when the temperature reaches a certain level, its electrical parameters, such as input bias current, input offset voltage, and gain-bandwidth product, will drift. This drift will affect the amplification performance of the differential signal amplifier, leading to increased data transmission errors, reduced operational stability, and reduced data transmission speed. Therefore, a differential signal amplifier device for high-speed data transmission within the chip is proposed. Utility Model Content

[0005] In view of this, the present invention provides a differential signal amplification device for high-speed data transmission inside a chip, so as to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option.

[0006] The technical solution of this utility model embodiment is implemented as follows: a differential signal amplification device for high-speed data transmission inside the chip, including a heat dissipation component, wherein the heat dissipation component includes a heat-conducting plate, heat dissipation fins, a pressure spring, a guide rod, two L-shaped limiting seats, an L-shaped snap-fit ​​seat, a limiting spring, a pull plate, and a pull rod;

[0007] The heat dissipation fins are uniformly and fixedly connected to the upper surface of the heat-conducting plate. The guide rods are symmetrically and slidably connected to the inside of the heat-conducting plate. The pressure spring is sleeved on the outer side wall of the guide rod. The heat-conducting plate is slidably connected to the inner side wall of the two L-shaped limiting seats. One end of the pull rod is fixedly connected to one side of the L-shaped snap-fit ​​seat at equal intervals. The other end of the pull rod is fixedly connected to one side of the pull plate. The limiting spring is sleeved on the outer side wall of the pull rod. An installation groove is provided on one side of the inner wall of the L-shaped limiting seat.

[0008] More preferably, the top end of the pressure spring abuts against the inner top wall of the L-shaped limiting seat, and the bottom end of the pressure spring abuts against the upper surface of the heat-conducting plate.

[0009] More preferably, the L-shaped locking seat is slidably connected to the inner side wall of the mounting groove, and the pull rod is slidably connected to the inside of the L-shaped limiting seat.

[0010] More preferably, one end of the limiting spring abuts against the L-shaped snap-fit ​​seat, and the other end of the limiting spring abuts against the inner sidewall of the mounting groove.

[0011] More preferably, the bottom of the L-shaped card holder is a slope.

[0012] More preferably, a main body assembly is disposed below the heat-conducting plate, the main body assembly including a housing, a circuit board and pins;

[0013] The pins are mounted on both sides of the circuit board, the housing is encapsulated outside the circuit board, and a differential signal amplification circuit is provided on the circuit board.

[0014] More preferably, the lower surface of the heat-conducting plate is attached to the upper surface of the outer shell, and the two L-shaped limiting seats are symmetrically slidably connected to the outer side wall of the outer shell.

[0015] More preferably, two limiting protrusions are symmetrically fixedly connected to both sides of the outer shell, and the L-shaped locking seat is locked to the outer side wall of the limiting protrusions.

[0016] The present invention has the following advantages due to the adoption of the above technical solution:

[0017] I. This utility model connects the pins of the differential signal amplifier into the circuit, which can effectively resist electromagnetic interference and noise in high-speed data transmission, and improve the signal transmission quality and stability. Then, the L-shaped limiting seat is sleeved on the outside of the shell. Pressing down on the L-shaped limiting seat causes the L-shaped locking seat to engage with the limiting protrusion. By pushing the L-shaped locking seat with the limiting spring, the heat dissipation component can be connected to the main component. By making the heat dissipation component detachable, it can be quickly installed or removed according to the usage requirements to meet the different operating conditions of the differential signal amplifier.

[0018] I. This utility model uses a pressure spring to push a heat-conducting plate, which can be tightly attached to the surface of the outer shell. This allows the heat generated during the operation of the differential signal amplifier to be discharged to the outside through heat dissipation fins, thus achieving heat dissipation for the differential signal amplifier and effectively ensuring its long-term stable operation.

[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a structural diagram of the present invention;

[0022] Figure 2 This is a schematic diagram showing the installation position of the heat dissipation component of this utility model;

[0023] Figure 3 This is a structural diagram of the L-shaped card holder of this utility model;

[0024] Figure 4 This is a structural diagram of the L-shaped limiting seat of this utility model;

[0025] Figure 5 This is a structural diagram of the main components of this utility model.

[0026] Reference numerals: 101, heat dissipation assembly; 11, heat conduction plate; 12, heat dissipation fins; 13, pressure spring; 14, guide rod; 15, L-shaped limit seat; 16, L-shaped snap-fit ​​seat; 17, limit spring; 18, pull plate; 19, pull rod; 20, mounting groove; 301, main body assembly; 31, outer shell; 32, circuit board; 33, limit protrusion; 34, pin. Detailed Implementation

[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0028] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0029] like Figures 1-5 As shown, this utility model embodiment provides a differential signal amplification device for high-speed data transmission inside a chip, including a heat dissipation component 101, which is used to dissipate heat from the differential signal amplifier.

[0030] Below the heat-conducting plate 11 is a main body assembly 301, which includes a housing 31, a circuit board 32, and pins 34.

[0031] Pins 34 are mounted on both sides of the circuit board 32, and the housing 31 is encapsulated on the outside of the circuit board 32. The circuit board 32 is provided with a differential signal amplifier circuit. Thus, the housing 31, the circuit board 32 and the pins 34 can form a differential signal amplifier, which can effectively resist electromagnetic interference and noise in high-speed data transmission and improve the signal transmission quality and stability.

[0032] The heat dissipation assembly 101 includes a heat-conducting plate 11, heat dissipation fins 12, a pressure spring 13, a guide rod 14, two L-shaped limiting seats 15, an L-shaped snap-fit ​​seat 16, a limiting spring 17, a pull plate 18, and a pull rod 19.

[0033] Heat dissipation fins 12 are uniformly fixedly connected to the upper surface of heat conduction plate 11. Guide rods 14 are symmetrically slidably connected to the inside of heat conduction plate 11. Pressure spring 13 is sleeved on the outer side wall of guide rod 14. The top end of pressure spring 13 abuts against the inner top wall of L-shaped limit seat 15, and the bottom end of pressure spring 13 abuts against the upper surface of heat conduction plate 11. The lower surface of heat conduction plate 11 is attached to the upper surface of outer shell 31. By pushing heat conduction plate 11 with pressure spring 13, heat conduction plate 11 can be tightly attached to the surface of outer shell 31, thereby dissipating the heat during operation of differential signal amplifier and then discharging it to the outside through heat dissipation fins 12, thus realizing heat dissipation of differential signal amplifier and effectively ensuring long-term stable operation of differential signal amplifier.

[0034] In one embodiment, the heat-conducting plate 11 is slidably connected to the inner sidewalls of the two L-shaped limiting seats 15, one end of the pull rod 19 is fixedly connected to one side of the L-shaped snap-fit ​​seat 16 at equal distances, and the other end of the pull rod 19 is fixedly connected to one side of the pull plate 18. The limiting spring 17 is sleeved on the outer sidewall of the pull rod 19. An installation groove 20 is provided on one side of the inner wall of the L-shaped limiting seat 15. The L-shaped snap-fit ​​seat 16 is slidably connected to the inner sidewall of the installation groove 20. The pull rod 19 is slidably connected to the inside of the L-shaped limiting seat 15. The position of the L-shaped snap-fit ​​seat 16 can be limited by the installation groove 20. By pulling the pull rod 19 by the pull plate 18, the pull rod 19 drives the L-shaped snap-fit ​​seat 16, which can realize the disassembly of the heat dissipation component 101.

[0035] In one embodiment, one end of the limiting spring 17 abuts against the L-shaped snap-fit ​​seat 16, and the other end of the limiting spring 17 abuts against the inner sidewall of the mounting groove 20. Two limiting protrusions 33 are symmetrically fixedly connected to both sides of the outer shell 31. The L-shaped snap-fit ​​seat 16 is snapped into the outer sidewall of the limiting protrusion 33. The L-shaped snap-fit ​​seat 16 is pushed by the limiting spring 17, and the L-shaped snap-fit ​​seat 16 is snapped into the limiting protrusion 33. At this time, the heat dissipation assembly 101 can be connected to the main body assembly 301.

[0036] In one embodiment, the bottom of the L-shaped latching seat 16 is inclined. When the heat dissipation assembly 101 is installed on the outside of the housing 31, the L-shaped limiting seat 15 is first fitted onto the outside of the housing 31, and then the L-shaped limiting seat 15 is pressed down. The L-shaped limiting seat 15 drives the L-shaped latching seat 16. Since the bottom surface of the L-shaped latching seat 16 is inclined, the L-shaped latching seat 16 can be pushed and can be engaged with the limiting protrusion 33 with the cooperation of the limiting spring 17.

[0037] In one embodiment, two L-shaped limiting seats 15 are symmetrically slidably connected to the outer wall of the housing 31. By making the heat dissipation component 101 detachable, the heat dissipation component 101 can be quickly installed or removed according to usage requirements to meet different operating conditions of the differential signal amplifier.

[0038] In operation, this invention connects the differential signal amplifier pin 34 to the circuit, effectively resisting electromagnetic interference and noise during high-speed data transmission, thus improving signal transmission quality and stability. Then, the L-shaped limiting seat 15 is fitted onto the outside of the housing 31. Pressing down on the L-shaped limiting seat 15 causes the L-shaped locking seat 16 to engage with the limiting protrusion 33. Pushing the L-shaped locking seat 16 via the limiting spring 17 connects the heat dissipation assembly 101 to the main assembly 301. During installation, the pressure spring 13 pushes the heat-conducting plate 11, allowing it to fit tightly against the surface of the housing 31, thereby dissipating the heat generated by the differential signal amplifier during operation. The heat is then discharged to the outside through the heat dissipation fins 12, achieving heat dissipation for the differential signal amplifier and effectively ensuring its long-term stable operation.

[0039] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A differential signal amplification device for high-speed data transmission within a chip, comprising a heat dissipation component (101), characterized in that: The heat dissipation assembly (101) includes a heat-conducting plate (11), heat dissipation fins (12), a pressure spring (13), a guide rod (14), two L-shaped limiting seats (15), an L-shaped snap-fit ​​seat (16), a limiting spring (17), a pull plate (18), and a pull rod (19). The heat dissipation fins (12) are uniformly fixedly connected to the upper surface of the heat-conducting plate (11). The guide rod (14) is symmetrically slidably connected to the inside of the heat-conducting plate (11). The pressure spring (13) is sleeved on the outer side wall of the guide rod (14). The heat-conducting plate (11) is slidably connected to the inner side wall of the two L-shaped limiting seats (15). One end of the pull rod (19) is fixedly connected to one side of the L-shaped snap-fit ​​seat (16) at equal intervals. The other end of the pull rod (19) is fixedly connected to one side of the pull plate (18). The limiting spring (17) is sleeved on the outer side wall of the pull rod (19). An installation groove (20) is provided on one side of the inner wall of the L-shaped limiting seat (15).

2. The differential signal amplification device for high-speed data transmission within a chip according to claim 1, characterized in that: The top end of the pressure spring (13) abuts against the inner top wall of the L-shaped limiting seat (15), and the bottom end of the pressure spring (13) abuts against the upper surface of the heat-conducting plate (11).

3. The differential signal amplification device for high-speed data transmission within a chip according to claim 2, characterized in that: The L-shaped snap-fit ​​seat (16) is slidably connected to the inner wall of the mounting groove (20), and the pull rod (19) is slidably connected to the inside of the L-shaped limiting seat (15).

4. The differential signal amplification device for high-speed data transmission within a chip according to claim 3, characterized in that: One end of the limiting spring (17) abuts against the L-shaped snap-fit ​​seat (16), and the other end of the limiting spring (17) abuts against the inner wall of the mounting groove (20).

5. The differential signal amplification device for high-speed data transmission within a chip according to claim 4, characterized in that: The bottom of the L-shaped card holder (16) is sloped.

6. The differential signal amplification device for high-speed data transmission within a chip according to claim 2, characterized in that: Below the heat-conducting plate (11) is a main body assembly (301), which includes a housing (31), a circuit board (32) and pins (34). The pins (34) are mounted on both sides of the circuit board (32), the housing (31) is encapsulated on the outside of the circuit board (32), and a differential signal amplifier circuit is provided on the circuit board (32).

7. The differential signal amplification device for high-speed data transmission within a chip according to claim 6, characterized in that: The lower surface of the heat-conducting plate (11) is attached to the upper surface of the outer shell (31), and the two L-shaped limiting seats (15) are symmetrically slidably connected to the outer side wall of the outer shell (31).

8. The differential signal amplification device for high-speed data transmission within a chip according to claim 6, characterized in that: Two limiting protrusions (33) are symmetrically fixedly connected to both sides of the outer shell (31), and the L-shaped snap-fit ​​seat (16) is snapped into the outer side wall of the limiting protrusion (33).

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