Pressing mechanism, positioning device and machining equipment

By combining the floating connection pressure rod with the flipping component, an adaptive clamping mechanism is achieved, which solves the problems of poor adaptability and cumbersome operation of existing clamping mechanisms, and improves the efficiency and quality of circuit board processing.

CN223928547UActive Publication Date: 2026-02-17SHENZHEN DAZU MICROELECTRONICS TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522594848.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-08
Publication Date
2026-02-17
Estimated Expiration
2035-12-08

AI Technical Summary

Technical Problem

The existing clamping mechanism is designed for a single sheet thickness, which requires changing the clamping rod when processing sheets of different thicknesses. This is cumbersome, and the sheet is easily damaged. It also has poor positioning stability.

Method used

The pressure bar and flipping component are connected by a floating connection. The flipping component drives the pressure bar to rotate to different pressing positions to achieve adaptive pressing. It is compatible with various thickness specifications of sheet materials. Combined with the adsorption platform, it provides dual positioning to ensure that the pressing surface is fully attached to the surface of the sheet material.

Benefits of technology

It can adapt to different thicknesses of boards without changing the pressure bar, which improves processing efficiency and positioning stability, avoids damaging the boards, and improves the quality of circuit board processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the field of circuit board processing, and provides a hold-down mechanism, a positioning device and processing equipment, the processing equipment comprises the positioning device, the positioning device comprises the hold-down mechanism, and the hold-down mechanism comprises a fixed seat, an overturning piece and a pressing rod; the overturning piece is rotatably connected with the fixing seat, the pressing rod is in floating connection with the overturning piece, and the pressing rod is provided with a pressing face; when the overturning piece drives the pressing rod to rotate to different pressing positions relative to the fixing base, the pressing rod can rotate relative to the overturning piece so that the pressing face can keep the preset orientation. The pressing rod is in floating connection with the overturning piece, and the pressing rod can be rotationally adjusted relative to the overturning piece, so that the pressing face is kept in the preset orientation, it is ensured that the pressing face is fully attached to the surface of the circuit board, self-adaptive pressing of the circuit boards with different thicknesses is achieved, the pressing rod does not need to be replaced, the pressing rod can be compatible with the circuit boards with various thickness specifications, operation complexity is reduced, and the working efficiency is improved. And the pressing surface can be fully attached to the surface of the circuit board, so that the circuit board is effectively prevented from being crushed by the pressing rod.
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Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and more specifically, relates to a clamping mechanism, a positioning device, and processing equipment. Background Technology

[0002] In the field of circuit board and other board processing, in order to ensure the positional stability of the board during processing and avoid deviations in processing accuracy due to board displacement, a clamping mechanism is usually used to position and constrain the board.

[0003] Most existing clamping mechanisms are designed for single-thickness plates. However, in actual processing applications, the thicknesses of the plates to be processed vary. Therefore, when processing plates of different thicknesses, it is necessary to change to clamping rods of different sizes to adapt to the different thicknesses. This method is cumbersome and reduces the overall processing efficiency. If the clamping rod is not changed to one that is suitable for the corresponding thickness of the plate, the plate may be damaged due to the mismatch between the clamping rod and the plate thickness, and the plate positioning stability is poor. Utility Model Content

[0004] In order to overcome the problems existing in the above-mentioned related technologies, the main purpose of this application is to provide a clamping mechanism, a positioning device and a processing equipment.

[0005] To achieve the above objectives, this application specifically adopts the following technical solution:

[0006] According to a first aspect of the embodiments of this application, a clamping mechanism is provided, comprising:

[0007] Fixed base;

[0008] A flipper, rotatably connected to the fixed base; and

[0009] A pressure rod, which is floatingly connected to the flipping component, and the pressure rod has a pressing surface;

[0010] When the flipping component drives the pressure rod to rotate relative to the fixed base to different pressing positions, the pressure rod can rotate relative to the flipping component so that the pressing surface maintains a preset orientation.

[0011] Optionally, the flipping component includes a rotating shaft rotatably connected to the fixed base and a fixed block fixedly connected to the rotating shaft. A connecting block is provided on the pressure rod, and the connecting block is hinged to the fixed block.

[0012] Optionally, the fixing block is provided with a limiting groove, and the connecting block is inserted into the limiting groove; or, the connecting block is provided with a limiting groove, and the fixing block is inserted into the limiting groove.

[0013] Optionally, there are multiple fixing blocks and multiple connecting blocks. The multiple fixing blocks are spaced apart along the axial direction of the rotating shaft, and the multiple connecting blocks are spaced apart along the length direction of the pressure rod, and are hinged to the multiple fixing blocks one by one.

[0014] Optionally, the clamping mechanism further includes a drive assembly connected to the flipping member for driving the flipping member to rotate relative to the fixed base.

[0015] Optionally, the drive assembly includes a mounting plate, a drive source, a slider, a connecting rod, and a swing member. The drive source is disposed on the mounting plate. The slider is slidably connected to the mounting plate and fixedly connected to the output shaft of the drive source. The two ends of the connecting rod are respectively hinged to one end of the slider and one end of the swing member, and the other end of the swing member is fixedly connected to the flipping member.

[0016] According to a second aspect of the embodiments of this application, a positioning device is provided, including a support platform and a clamping mechanism as described in any of the above claims, the clamping mechanism being used to clamp a circuit board placed on the support platform.

[0017] Optionally, the support platform is an adsorption platform, which has an adsorption area for adsorbing circuit boards, and the adsorption area is provided with a plurality of adsorption holes spaced apart.

[0018] Optionally, the number of clamping mechanisms is two, and the two clamping mechanisms are arranged at a relative interval.

[0019] Optionally, at least one of the clamping mechanisms is adjustablely positioned on the support platform so that the distance between the two clamping mechanisms is adjustable.

[0020] According to a third aspect of the embodiments of this application, a processing apparatus is provided, including a frame, a processing device, and a positioning device as described in any of the above. The processing device and the positioning device are both disposed on the frame, and the processing device is used to process a circuit board placed on a support platform of the positioning device.

[0021] The beneficial effects of the clamping mechanism, positioning device, and processing equipment provided in this application are as follows: Compared with the prior art, the clamping mechanism of this application floats the pressure rod and the flipping member, so that when the flipping member drives the pressure rod to rotate to different clamping positions to adapt to circuit boards of different thicknesses, the pressure rod can be rotatably adjusted relative to the flipping member, thereby keeping the clamping surface in a preset orientation and ensuring that the clamping surface is fully in contact with the circuit board surface. This achieves adaptive clamping for circuit boards of different thicknesses, and can be compatible with circuit boards of various thicknesses without replacing the pressure rod, reducing operational complexity and improving the overall processing efficiency of the circuit board. In addition, the full contact between the clamping surface and the circuit board surface effectively avoids the pressure rod from damaging the circuit board, and at the same time helps to improve the stability of circuit board positioning, thereby helping to improve the processing quality of the circuit board. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A three-dimensional structural schematic diagram of a clamping mechanism provided in one embodiment of this application;

[0024] Figure 2 A partial structural diagram of the clamping mechanism provided in one embodiment of this application. Figure 1 ;

[0025] Figure 3 for Figure 2 Enlarged structural diagram at point A in the diagram;

[0026] Figure 4 A partial structural diagram of the clamping mechanism provided in one embodiment of this application. Figure 2 ;

[0027] Figure 5 for Figure 4 Enlarged structural diagram at point B in the diagram;

[0028] Figure 6 A partial structural diagram of the clamping mechanism provided in one embodiment of this application. Figure 3 ;

[0029] Figure 7 This is a top view of a positioning device provided in one embodiment of this application;

[0030] Figure 8 This is a three-dimensional structural diagram of a positioning device provided in one embodiment of this application.

[0031] Explanation of key figure labels:

[0032] 100. Pressing mechanism; 10. Flipping component; 11. Rotating shaft; 12. Fixing block; 121. Fixing hole; 122. Limiting groove; 123. Sleeve hole; 124. Clamping groove; 20. Pressure rod; 21. Connecting block; 211. Connecting hole; 30. Drive assembly; 31. Mounting plate; 32. Drive source; 33. Slider; 34. Connecting rod; 35. Swinging component; 40. Fixing seat; 200. Support platform; 201. Adsorption area; 202. Adsorption hole; F. Preset direction. Detailed Implementation

[0033] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0034] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0035] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] It should be noted that the circuit boards in this application include, but are not limited to, printed circuit boards (PCBs), flexible printed circuit boards (FPCs), rigid-flex boards, high-density interconnect boards (HDIs), integrated circuit substrates (IC substrates), metal substrates, glass substrates, and ceramic substrates, and can be classified into single-layer boards and multi-layer boards according to their functions and structures.

[0038] Please refer to the following: Figures 1 to 6 The pressing mechanism 100 provided in the embodiments of this application will now be described.

[0039] Please see Figure 1 The pressing mechanism 100 includes a fixed base 40, a flipping member 10, and a pressing rod 20. The flipping member 10 is rotatably connected to the fixed base 40, so that the flipping member 10 can rotate relative to the fixed base 40. The pressing rod 20 is floatingly connected to the flipping member 10, and the pressing rod 20 has a pressing surface. When the flipping member 10 drives the pressing rod 20 to rotate relative to the fixed base 40 to different pressing positions, the pressing rod 20 can rotate relative to the flipping member 10 so that the pressing surface maintains a preset orientation.

[0040] It should be noted that, in this application, "floating connection" can refer to a connection that can be dynamically adjusted. For example, a floating connection between the pressure rod 20 and the flipping member 10 can mean that the relative positions of the pressure rod 20 and the flipping member 10 can be dynamically adjusted.

[0041] For example, the pressing surface of the pressure rod 20 is the lower surface of the pressure rod 20, and its preset orientation is downward. In this way, the pressure rod 20 can be dynamically adjusted relative to the flipping member 10 so that the pressing surface of the pressure rod 20 remains facing downward.

[0042] For example, the pressure rod 20 can rotate relative to the flipping member 10. Specifically, the pressure rod 20 can rotate freely relative to the flipping member 10 during the process of the flipping member 10 driving the pressure rod 20 to rotate. Under the action of its own gravity, the pressure rod 20 can rotate freely relative to the flipping member 10, so that the pressing surface of the pressure rod 20 always maintains the preset orientation. In this way, the pressing surface can fully fit with the surface of circuit boards of different thicknesses.

[0043] For example, the pressure rod 20 can rotate relative to the flipping member 10. Specifically, depending on the thickness of the circuit board, when the flipping member 10 drives the pressure rod 20 to rotate toward the preset pressing position, when the pressure rod 20 contacts and exerts a force on the circuit board, the circuit board generates a reaction force on the pressure rod 20 to drive the pressure rod 20 to rotate relative to the flipping member 10, so that when the pressure rod 20 rotates to the preset pressing position, the pressing surface is in a preset orientation so as to fully fit with the surface of the circuit board.

[0044] The pressure rod 20 can be rotated relative to the flipping part 10 by manual or electric drive, so that the pressure rod 20 is in different pressing positions, and the pressing surface of the pressure rod 20 can maintain a preset orientation.

[0045] When the circuit board needs to be pressed, the fixed base 40 remains stationary as a basic support component, driving the flipping component 10 to rotate clockwise relative to the fixed base 40. The flipping component 10 drives the pressure rod 20 to rotate synchronously until the pressure rod 20 rotates to the preset pressing position. When the pressure rod 20 is in the preset pressing position, the pressing surface is in contact with the upper surface of the circuit board, pressing the circuit board. When the circuit board needs to be released, the flipping component 10 is driven to rotate counterclockwise relative to the fixed base 40. The flipping component 10 drives the pressure rod 20 to rotate synchronously until the pressure rod 20 rotates to one side of the circuit board, allowing the circuit board to be removed from above. When the pressure rod 20 rotates to different pressing positions according to different thicknesses of circuit boards, the pressure rod 20 can be rotated and adjusted relative to the flipping component 10 to keep the pressing surface of the pressure rod 20 facing downwards, ensuring that the pressure rod 20 can fully contact the upper surface of circuit boards of different thicknesses.

[0046] Compared with related technologies, the clamping mechanism 100 provided in this application rotatably connects the flipping member 10 to the fixed base 40, allowing the flipping member 10 to rotate relative to the fixed base 40, thereby driving the pressure rod 20 to loosen or clamp the circuit board. It can also drive the pressure rod 20 to rotate to different clamping positions to accommodate circuit boards of different thicknesses. When picking up or placing the circuit board, the flipping member 10 can drive the pressure rod 20 to rotate to the outside of the circuit board, that is, the pressure rod 20 is completely detached from the top of the circuit board, without interfering with the picking and placing operation of the circuit board, which facilitates the picking and placing of the circuit board. By floatingly connecting the pressure rod 20 to the flipping component 10, the pressure rod 20 can rotate relative to the flipping component 10 to adjust to different pressing positions to accommodate circuit boards of different thicknesses. This automatically compensates for changes in circuit board thickness, ensuring that the pressing surface of the pressure rod 20 maintains a preset orientation and fully adheres to the circuit board surface. This achieves adaptive pressing for circuit boards of different thicknesses, eliminating the need to replace the pressure rod 20 and making it compatible with circuit boards of various thicknesses. This reduces operational complexity and improves the overall processing efficiency of the circuit boards. Furthermore, the full adherence between the pressing surface and the circuit board surface effectively prevents the pressure rod from damaging the circuit board and improves the stability of circuit board positioning, thereby enhancing the processing quality of the circuit boards. Specifically, when the pressing surface of the pressure rod 20 maintains a preset orientation, the pressing surface is parallel to the surface of the circuit board to be pressed, so that the pressing surface can fully fit with the circuit board, resulting in a larger contact area between the pressure rod 20 and the circuit board, which can better distribute the pressure, that is, better provide uniform pressing force, effectively improving positioning stability. Understandably, when the pressure rod 20 presses against circuit boards of different thicknesses, it effectively avoids the formation of an angle between the pressing surface and the surface of the circuit board to be pressed, which would cause the pressure of the pressure rod 20 on the circuit board to concentrate and thus damage the circuit board.

[0047] Combined with appendix Figures 1 to 5 It is understood that the flipping component 10 includes a rotating shaft 11 and a fixing block 12. The rotating shaft 11 is rotatably connected to the fixing base 40. The fixing block 12 is connected to the rotating shaft 11. The length direction of the pressure rod 20 is parallel to the axial direction of the rotating shaft 11. A connecting block 21 is provided on the pressure rod 20. The connecting block 21 is hinged to the fixing block 12 through a pin, so that the connecting block 21 can rotate relative to the fixing block 12.

[0048] Combined with appendix Figure 3 and Figure 5 Specifically, the connecting block 21 is provided with a connecting hole 211, and the fixing block 12 is provided with a fixing hole 121. The pin passes through the connecting hole 211 and the fixing hole 121 so that the connecting block 21 and the fixing block 12 are hinged. The axial direction of the pin is parallel to the axial direction of the rotating shaft 11. That is, the rotation axis of the pressure rod 20 is parallel to the rotation axis of the rotating shaft 11. When the rotating shaft 11 rotates relative to the fixed seat 40, it drives the pressure rod 20 to rotate synchronously through the fixing block 12 and the connecting block 21.

[0049] The above technical solution achieves a reliable rotational connection between the flipping component 10 and the fixed base 40 by rotatably connecting the rotating shaft 11 and the fixed base 40. It also achieves a reliable rotational connection between the pressure rod 20 and the flipping component 10 by hinged connecting the connecting block 21 on the pressure rod 20 and the fixed block 12 on the rotating shaft 11. The overall structure is compact and has high rigidity, ensuring effective force transmission and operational stability of the mechanism. Furthermore, the structural components are simple, easy to process and assemble, which helps to reduce manufacturing costs.

[0050] Optionally, two fixed seats 40 are provided, spaced apart, with both ends of the rotating shaft 11 rotatably connected to the two fixed seats 40 respectively. Specifically, each fixed seat 40 has a shaft hole, with one end of the rotating shaft 11 movably passing through the shaft hole of one of the fixed seats 40 and the other end of the rotating shaft 11 movably passing through the shaft hole of the other fixed seat 40, allowing the rotating shaft 11 to rotate relative to the fixed seats 40 around its own axis. The two fixed seats 40 support the rotating shaft 11, effectively ensuring the stability of the rotating shaft 11 during rotation.

[0051] Combined with appendix Figure 3 and Figure 5It is understood that, optionally, the fixing block 12 is provided with a limiting groove 122, which is a U-shaped groove, and a portion of the connecting block 21 is inserted into the limiting groove 122. The limiting groove 122 provides a clear range of motion and guidance for the connecting block 21, making the movement trajectory of the pressure rod 20 more precise and stable during the rotation adjustment relative to the flipping part 10. This avoids problems such as unstable clamping or clamping surface offset caused by disordered movement, improves the accuracy of the clamping surface of the pressure rod 20 in contact with the circuit board surface, and ensures the reliability of adaptive clamping for circuit boards of different thicknesses. Alternatively, the connecting block 21 is provided with a limiting groove 122, and a portion of the fixing block 12 is inserted into the limiting groove 122.

[0052] Optionally, the fixing block 12 is provided with a communicating sleeve hole 123 and a clamping groove 124. The fixing block 12 is sleeved on the rotating shaft 11 through the sleeve hole 123 and clamped to the rotating shaft 11 through the clamping groove 124.

[0053] Specifically, the fixing block 12 has locking holes on opposite sides of the clamping groove 124. After the fixing block 12 is fitted onto the rotating shaft 11 through the sleeve hole 123, the fastener is inserted into the locking hole and locked to clamp the fixing block 12 onto the rotating shaft 11. Optionally, the fastener can be, but is not limited to, bolts.

[0054] In the above technical solution, the fixing block 12 is sleeved on the rotating shaft 11 through the sleeve hole 123, and the rotating shaft 11 is clamped by the clamping groove 124, which realizes a reliable and stable connection between the fixing block 12 and the rotating shaft 11, ensuring the stability of the connection between the flipping part 10 and the rotating shaft 11, and thus ensuring that the flipping part 10 can rotate stably relative to the fixing seat 40.

[0055] Combined with appendix Figures 1 to 5 It is understood that there are multiple fixing blocks 12, which are spaced apart along the axial direction of the rotating shaft 11. The number of connecting blocks 21 is equal to the number of fixing blocks 12, so when there are multiple fixing blocks 12, there are also multiple connecting blocks 21. The multiple connecting blocks 21 are spaced apart along the length direction of the pressure rod 20, and each of the multiple connecting blocks 21 is hinged to a corresponding fixing block 12. By hinged to the multiple fixing blocks 12, the stability of the connection between the pressure rod 20 and the flipping component 10 is enhanced.

[0056] Optionally, there are two fixing blocks 12, which are located at both ends of the rotating shaft 11. There are also two connecting blocks 21, which are located at both ends of the pressure rod 20, and the two connecting blocks 21 are hinged to the two fixing blocks 12 respectively.

[0057] Alternatively, the pressure rod 20 and the flipper 10 can also be ball-jointed, allowing the pressure rod 20 to rotate relative to the flipper 10. Exemplarily, the flipper 10 includes a rotating shaft 11 and a ball seat. The ball seat is disposed on the rotating shaft 11 and has a spherical cavity. The pressure rod 20 has a ball head, which is rotatably confined within the cavity of the ball seat. The rotation of the ball head within the cavity causes the pressure rod 20 to rotate relative to the rotating shaft 11, thus maintaining the preset orientation of the pressing surface. Alternatively, the pressure rod 20 and the flipper 10 can also be elastically connected, allowing the pressure rod 20 to rotate relative to the flipper 10. For example, one or more elastic elements are provided between the pressure rod 20 and the flipping member 10. The elastic elements provide a preload force to move the pressure rod 20 away from the flipping member 10. During the rotation of the pressure rod 20 driven by the flipping member 10, when the pressure rod 20 contacts the circuit board, the reaction force of the circuit board compresses the elastic elements, causing the pressure rod 20 to deflect or linearly displace relative to the flipping member 10. At the same time, the pressing surface of the pressure rod 20 remains in contact with the surface of the circuit board under the action of gravity or contact force. This method can not only adapt to circuit boards of different thicknesses, but also has a buffering effect, better protecting the circuit board. The elastic elements can be, but are not limited to, compression springs, disc springs, polyurethane elastic pads, rubber blocks, etc.

[0058] Combined with appendix Figure 1 and Figure 6 It is understood that the clamping mechanism 100 also includes a drive assembly 30, which is connected to the flipping member 10. The drive assembly 30 is used to drive the flipping member 10 to rotate relative to the fixed base 40. Specifically, when the drive assembly 30 drives the flipping member 10 to rotate relative to the fixed base 40, the flipping member 10 drives the pressure rod 20 to rotate synchronously, so that the pressure rod 20 clamps or loosens the circuit board.

[0059] The above technical solution achieves automated operation by driving the flipping component 10 and the pressure rod 20 to rotate relative to the fixed seat 40 through the driving component 30. This eliminates the need for manual operation, reduces the intensity of manual labor, and avoids problems such as uneven clamping force and delayed action caused by manual operation.

[0060] Optionally, the drive assembly 30 is connected to one end of the rotating shaft 11. When the drive assembly 30 drives the rotating shaft 11 to rotate around its own axis relative to the fixed seat 40, the rotating shaft 11 drives the pressure rod 20 to rotate through the fixed block 12 and the connecting block 21.

[0061] Combined with appendix Figures 6 to 8It is understood that the drive assembly 30 includes a mounting plate 31, a drive source 32, a slider 33, a connecting rod 34, and a swing member 35. The drive source 32 is mounted on the mounting plate 31. The slider 33 is slidably connected to the mounting plate 31 along a preset direction F, and the slider 33 is connected to the output shaft of the drive source 32. The two ends of the connecting rod 34 are respectively hinged to one end of the slider 33 and one end of the swing member 35. The other end of the swing member 35 is fixedly connected to the flipping member 10. The preset direction F is perpendicular to the axis of the rotating shaft 11.

[0062] Specifically, one end of the connecting rod 34 is hinged to the slider 33 via a pin, and the other end of the connecting rod 34 is hinged to one end of the swing member 35 via a pin. The other end of the swing member 35 is fixedly sleeved on one end of the rotating shaft 11. When the drive source 32 drives the slider 33 to translate along a preset direction F or in a direction opposite to the preset direction F, the slider 33 drives the swing member 35 to swing around the axis of the rotating shaft 11 via the connecting rod 34. In turn, the swing member 35 drives the rotating shaft 11 to rotate synchronously around its own axis, and the flipping member 10 drives the pressure rod 20 to rotate synchronously, so that the pressure rod 20 presses or releases the circuit board.

[0063] In the above technical solution, when the drive source 32 drives the slider 33 to perform linear motion, the linear motion is converted into the swing motion of the swing member 35 through the connecting rod 34, and then the swing motion is converted into the rotational motion of the flipping member 10 through the swing member 35, thereby realizing the release or pressing action of the pressure rod 20. This method has high transmission efficiency and no risk of slippage, and can ensure that the power of the drive source 32 is stably transmitted to the flipping member 10, thereby stably controlling the action of the pressure rod 20.

[0064] Optionally, the drive source 32 can be, but is not limited to, a cylinder, and when the drive source 32 is a cylinder, the output shaft of the drive source 32 is the piston rod of the cylinder.

[0065] Combined with appendix Figure 7 and Figure 8 This application also provides a positioning device, which includes a support platform 200 and a pressing mechanism 100 of any of the above embodiments. The pressing mechanism 100 is used to press the circuit board placed on the support platform 200, so that the pressing mechanism 100 and the support platform 200 cooperate to achieve positioning of the circuit board.

[0066] The positioning device provided in this application adopts the above-mentioned clamping mechanism 100, thereby having all the beneficial effects of the above-mentioned clamping mechanism 100.

[0067] It is understood that the support platform 200 is an adsorption platform with an adsorption area 201 for adsorbing circuit boards. The adsorption area 201 has multiple spaced adsorption holes 202 for generating negative pressure. Specifically, when the vacuum source evacuates the support platform 200, a negative pressure is generated inside the support platform 200 through the adsorption holes 202, thereby generating an adsorption force in the adsorption area 201 to adsorb the circuit boards.

[0068] The above technical solution, by setting the support platform 200 as an adsorption platform with an adsorption area 201, enables the circuit board to be subjected not only to the mechanical clamping force of the pressure rod 20 during the clamping process, but also to the adsorption force provided by the support platform 200. This achieves dual positioning and fixation of the circuit board, enhances the overall stability of the circuit board during the processing, effectively prevents the circuit board from shifting or vibrating during processing, and thus improves the processing quality of the circuit board.

[0069] There are two clamping mechanisms 100. The two clamping mechanisms 100 are arranged opposite each other along a preset direction F. The two clamping mechanisms 100 can perform clamping operations from both sides of the circuit board, making the circuit board more uniform and balanced in force, and improving the stability and accuracy of the circuit board positioning.

[0070] For example, two clamping mechanisms 100 are respectively located on opposite sides of the adsorption area 201 along a preset direction F. When it is necessary to position the circuit board to be processed on the support platform 200, firstly, the circuit board to be processed is placed in the adsorption area 201. Then, the pressure rods 20 of the two clamping mechanisms 100 respectively clamp the opposite sides of the circuit board. The vacuum pump evacuates the support platform 200, so that the adsorption area 201 generates an adsorption force to adsorb the circuit board, thereby achieving stable positioning of the circuit board under the dual action of adsorption and clamping.

[0071] Optionally, at least one of the two clamping mechanisms 100 is adjustablely positioned on the support platform 200 along a preset direction F, so that the distance between the two clamping mechanisms 100 in the preset direction F is adjustable.

[0072] The above technical solution, by adjusting the position of at least one pressing mechanism 100 on the support platform 200, allows the spacing between the two pressing mechanisms 100 to be flexibly adjusted, thereby effectively accommodating circuit boards of various widths or lengths and improving the versatility and applicability of the positioning device.

[0073] Optionally, one clamping mechanism 100 is fixed to the support platform 200, and the other clamping mechanism 100 is adjustablely positioned on the support platform 200 along a preset direction F. The position of the adjustable clamping mechanism 100 in the preset direction F is adjusted to adjust the distance between the two clamping mechanisms 100 in the preset direction F. Alternatively, both clamping mechanisms 100 are adjustablely positioned on the support platform 200 along the preset direction F, and the distance between the two clamping mechanisms 100 in the preset direction F is adjusted by adjusting the position of one or both clamping mechanisms 100 in the preset direction F.

[0074] Combined with appendix Figure 7 and Figure 8 It is understandable that the fixed seat 40 of the position-adjustable clamping mechanism 100 is movably mounted on the support platform 200 along a preset direction F.

[0075] Optionally, the support platform 200 is provided with a plurality of first adjustment holes, which penetrate the upper surface of the support platform 200 and are distributed at intervals along a preset direction F at one end of the support platform 200. The fixing seat 40 of the position-adjustable clamping mechanism 100 is provided with a first mounting hole, which corresponds to and communicates with one of the first adjustment holes of the support platform 200. A first fastener passes through the first mounting hole of the fixing seat 40 and the corresponding first adjustment hole of the support platform 200 to fix the fixing seat 40 to the support platform 200. By inserting the first fastener through the first mounting hole of the fixing seat 40 and different first adjustment holes of the support platform 200, the fixing seat 40 can be fixed at different positions on the support platform 200 along the preset direction F. The first fastener can be, but is not limited to, screws or bolts.

[0076] It should be noted that when the positions of both clamping mechanisms 100 are adjustable, the support platform 200 is provided with multiple first adjustment holes at both ends along the preset direction F.

[0077] Alternatively, the fixed seat 40 of the position-adjustable clamping mechanism 100 is slidably connected to the edge of the support platform 200 along a preset direction F, and there is a preset frictional force between the fixed seat 40 and the support platform 200. A preset external force needs to be applied to the fixed seat 40 to push it to move along the preset direction F, thereby changing the position of the fixed seat 40 on the support platform 200. Alternatively, the fixed seat 40 is slidably mounted on the support platform 200 along the preset direction F, and a first power assembly is mounted on the support platform 200. The first power assembly is connected to the fixed seat 40, and drives the fixed seat 40 to reciprocate along the preset direction F to automatically adjust the position of the fixed seat 40.

[0078] It should be noted that when one of the clamping mechanisms 100 is fixed relative to the support platform 200, the fixing seat 40 of the clamping mechanism 100 is fixedly mounted on the support platform 200 or on an external component. The external component can be a workbench or frame used to support the support platform 200. Optionally, the fixing seat 40 of the fixed clamping mechanism 100 is fixedly mounted on the support platform 200. For example, the fixing seat 40 of the fixed clamping mechanism 100 is screwed, welded, or integrally formed with the edge of the support platform 200.

[0079] Combined with appendix Figure 7 and Figure 8 It is understood that the drive assembly 30 of the position-adjustable clamping mechanism 100 is movably disposed on the circumferential side of the support platform 200 along a preset direction F.

[0080] Optionally, the support platform 200 is provided with multiple second adjustment holes, which extend through the circumferential side of the support platform 200 and are distributed at intervals along a preset direction F at one end of the support platform 200. The mounting plate 31 of the position-adjustable clamping mechanism 100 is provided with second mounting holes, which correspond to and communicate with one of the second adjustment holes in the support platform 200. Second fasteners pass through the second mounting holes and the corresponding second adjustment holes to fix the drive assembly 30 onto the support platform 200. By using second fasteners to pass through the second mounting holes of the mounting plate 31 and insert into different second adjustment holes in the support platform 200, the drive assembly 30 can be fixed at different positions on the support platform 200, thereby changing the clamping distance between the two clamping mechanisms 100, resulting in a simple structure. The second fasteners can be, but are not limited to, screws or bolts.

[0081] It should be noted that when the positions of the two clamping mechanisms 100 are adjustable, the support platform 200 is provided with multiple second adjustment holes at both ends along the preset direction F.

[0082] Alternatively, the drive assembly 30 of the position-adjustable clamping mechanism 100 is slidably connected to the edge of the support platform 200 along a preset direction F, and there is a preset frictional force between the drive assembly 30 and the support platform 200. A preset external force needs to be applied to the drive assembly 30 to push it to move along the preset direction F, thereby changing the position of the drive assembly 30 on the support platform 200. Alternatively, the drive assembly 30 is slidably mounted on the support platform 200 along the preset direction F, and a second power assembly is mounted on the support platform 200. The second power assembly is connected to the drive assembly 30, and drives the drive assembly 30 to reciprocate along the preset direction F to automatically adjust the position of the drive assembly 30.

[0083] It should be noted that when one of the clamping mechanisms 100 is fixed relative to the support platform 200, the drive assembly 30 of the clamping mechanism 100 is fixedly mounted on the support platform 200 or on an external component. The external component can be a workbench or frame used to support the support platform 200. Optionally, the drive assembly 30 of the fixed-position clamping mechanism 100 is fixedly mounted on the support platform 200; for example, the drive assembly 30 of the fixed-position clamping mechanism 100 is screwed or welded to the edge of the support platform 200.

[0084] This application also provides a processing device, which includes a frame, a processing device, and a positioning device according to any of the above embodiments. Both the processing device and the positioning device are mounted on the frame. The processing device is used to process the circuit board placed on the support platform of the positioning device.

[0085] The processing equipment can be, but is not limited to, laser drilling equipment, laser cutting equipment, automated optical inspection (AOI) equipment, laser direct imaging (LDI) equipment, inkjet printing equipment, etc. The processing equipment provided in this application employs the aforementioned positioning device, thereby possessing all the beneficial effects of the aforementioned positioning device.

[0086] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A compression mechanism, characterized in that, The application relates to a pressing mechanism, which comprises a fixed base, a turnover part rotatably connected with the fixed base, and a pressing rod floatingly connected with the turnover part and provided with a pressing surface. When the turnover part drives the pressing rod to rotate to different pressing positions relative to the fixed base, the pressing rod can rotate relative to the turnover part so that the pressing surface keeps a preset orientation. The turnover part comprises a rotating shaft rotatably connected with the fixed base and a fixed block fixedly connected with the rotating shaft, and the pressing rod is provided with a connecting block hinged with the fixed block. The fixed block is provided with a limiting groove, and the connecting block is inserted into the limiting groove; or the connecting block is provided with a limiting groove, and the fixed block is inserted into the limiting groove. The number of the fixed blocks and the connecting blocks is multiple, the multiple fixed blocks are arranged along the axial direction of the rotating shaft, the multiple connecting blocks are arranged along the length direction of the pressing rod, and the multiple connecting blocks are hinged with the multiple fixed blocks one by one. The pressing mechanism further comprises a driving assembly connected with the turnover part and used for driving the turnover part to rotate relative to the fixed base.

2. The holdback mechanism of claim 1 wherein: The driving assembly comprises a mounting plate, a driving source, a sliding block, a connecting rod and a swinging part, the driving source is arranged on the mounting plate, the sliding block is slidingly connected with the mounting plate and fixedly connected with the output shaft of the driving source, the two ends of the connecting rod are respectively hinged with the sliding block and one end of the swinging part, and the other end of the swinging part is fixedly connected with the turnover part.

3. The holdback mechanism of claim 2 wherein: The application further relates to a support table and the pressing mechanism as claimed in any one of claims 1-6, and the pressing mechanism is used for pressing a circuit board placed on the support table.

4. The holdback mechanism of claim 2 wherein: The support table is an adsorption platform provided with an adsorption area for adsorbing the circuit board, and the adsorption area is provided with multiple adsorption holes distributed at intervals.

5. A compression mechanism according to any one of claims 1 to 4, wherein: The number of the pressing mechanisms is two, and the two pressing mechanisms are arranged at intervals.

6. The holdback mechanism of claim 5 wherein: At least one of the pressing mechanisms is adjustably arranged on the support table, so that the interval between the two pressing mechanisms is adjustable.

7. A positioning device, characterized in that The application further relates to a machine frame, a processing device and the positioning device as claimed in any one of claims 7-10, and the processing device and the positioning device are arranged on the machine frame, and the processing device is used for processing the circuit board placed on the support table of the positioning device.

8. The positioning device of claim 7, wherein: ​ 9. The positioning device of claim 7, wherein: ​ 10. The positioning device of claim 9, wherein: ​ 11. A processing apparatus characterized by comprising: ​