Heat dissipation structure suitable for large-current heating loop

Abstract

The utility model relates to a heat dissipation structure suitable for a large-current heating loop. The heat dissipation structure comprises a PCB substrate; the conductive copper foil is laid on the PCB substrate; a through hole is formed in the conductive copper foil; the U-shaped insertion sheet is inserted into the through hole and is used for increasing the heat dissipation area of the conductive copper foil; and the via hole welding point is positioned at the connecting part of the through hole and the U-shaped insertion sheet and is used for realizing welding and fixing of the U-shaped insertion sheet and the conductive copper foil, so that heat of the conductive copper foil is conducted to the U-shaped insertion sheet through the via hole welding point. According to the heat dissipation structure provided by the utility model, heat generated by the conductive copper foil can be quickly and effectively dissipated, the phenomenon that the conductive copper foil is overheated is avoided, and the heat dissipation efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic equipment heat dissipation, specifically relates to a heat dissipation structure suitable for high current heat generating loop. BACKGROUND

[0002] In the field of modern motor drive technology, the motor drive circuit plays a vital role, which is responsible for providing accurate and stable power for the motor to ensure the normal operation of the motor. With the wide application of motors in various industrial equipment, electric vehicles, household appliances and many other fields, the performance requirements of motor drive circuit are also increasing.

[0003] Currently, the motor drive circuit generally needs to pass through a large current to meet the power demand of the motor, however, this feature brings a severe challenge to the design of the circuit board. Since there is a certain limit to the conductivity of the copper foil of the circuit board, when a large current passes through under limited layout conditions, the copper foil will inevitably generate heat. If this heat cannot be effectively dissipated in time, the copper foil will overheat, which will cause the rapid aging of the circuit board, reduce the reliability and service life of the circuit board, and even cause a fire.

[0004] Therefore, the utility model provides a heat dissipation structure suitable for high current heat generating loop to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] In view of the above problems, the purpose of the utility model is to provide a heat dissipation structure suitable for high current heat generating loop, which can quickly and effectively dissipate the heat generated by the conductive copper foil, avoid the copper foil overheating phenomenon, and greatly improve the heat dissipation efficiency.

[0006] The utility model provides a heat dissipation structure suitable for high current heat generating loop, which comprises:

[0007] PCB substrate;

[0008] Conductive copper foil, which is laid on the PCB substrate, and the conductive copper foil is provided with a through hole;

[0009] U-shaped insert piece, which is inserted into the through hole, for increasing the heat dissipation area of the conductive copper foil;

[0010] Via hole welding point, located at the connecting part of the through hole and the U-shaped insert piece, for realizing the welding and fixation of the U-shaped insert piece and the conductive copper foil, so that the heat of the conductive copper foil is conducted to the U-shaped insert piece through the via hole welding point.

[0011] Preferably, the U-shaped insert piece is made of a high-thermal-conductivity metal material; and the U-shaped insert piece comprises a plurality of U-shaped insert pieces, and the plurality of U-shaped insert pieces are distributed in an equidistant array.

[0012] Preferably, the U-shaped plug piece comprises a pin inserted into the through hole, a bottom plate fixedly connected with the pin and located on the conductive copper foil, an extension plate formed by bending and extending from both ends of the bottom plate away from the conductive copper foil, and a heat dissipation hole formed on the extension plate; the via hole welding point is located at the connecting part of the through hole and the pin.

[0013] Preferably, the bottom plate is rectangular in shape, and the heat dissipation hole is circular in shape.

[0014] Preferably, the U-shaped plug piece and the conductive copper foil are welded and fixed by wave soldering.

[0015] Compared with the related art, the heat dissipation structure suitable for a large-current heat generating circuit provided by the present application comprises a PCB substrate, a conductive copper foil laid on the PCB substrate and provided with a through hole, a U-shaped plug piece inserted into the through hole for increasing the heat dissipation area of the conductive copper foil, and a via hole welding point located at the connecting part of the through hole and the U-shaped plug piece for realizing the welding and fixing of the U-shaped plug piece and the conductive copper foil, so that the heat of the conductive copper foil is conducted to the U-shaped plug piece through the via hole welding point. In the above structure, the heat dissipation area is significantly increased through the ingenious combination of the U-shaped plug piece and the conductive copper foil, the heat generated by the conductive copper foil can be quickly and effectively dissipated, the overheating phenomenon of the copper foil is avoided, the heat dissipation efficiency is greatly improved, the circuit board aging problem caused by overheating of the conductive copper foil is prevented, the reliability and service life of the circuit board are improved, the safety hidden danger caused by overheating is reduced, and the stable operation of the electronic equipment is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 FIG. 1 is a perspective view of the heat dissipation structure suitable for a large-current heat generating circuit according to the present application. DETAILED DESCRIPTION

[0017] The present application provides a heat dissipation structure suitable for a large-current heat generating circuit, aiming to solve the problem of poor heat dissipation effect of the existing conductive copper foil, easy overheating phenomenon leading to rapid aging of the circuit board, and thus reduced reliability and service life of the circuit board.

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] Please refer to the drawingsFigure 1 The utility model provides a heat dissipation structure suitable for large current heat generating loop, including:

[0020] PCB substrate 1;

[0021] Conductive copper foil 2, it is laid on the PCB substrate 1;And the conductive copper foil 2 is equipped with through -hole 3;

[0022] U type insert piece 4, it is inserted in the through -hole 3, for increasing the heat dissipation area of conductive copper foil 2;

[0023] Via hole welding point 5, it is located the connecting portion of through -hole 3 with U type insert piece 4, for realizing the welding fixation of U type insert piece 4 with conductive copper foil 2, so that the heat of conductive copper foil 2 is conducted to U type insert piece 2 through via hole welding point 5.

[0024] In the above structure, through the ingenious combination of U type insert piece 4 and conductive copper foil 2, the heat dissipation area is significantly increased, the heat generated by conductive copper foil 2 can be quickly and effectively dissipated, the overheating phenomenon of conductive copper foil 2 is avoided, the heat dissipation efficiency is greatly improved, the circuit board aging problem caused by overheating of conductive copper foil 2 is prevented, and the reliability and service life of the circuit board are improved, the safety hidden danger caused by overheating is reduced, and the stable operation of the electronic equipment is ensured. In addition, the conductive copper foil 2 and the U type insert piece 4 are integrated on the PCB substrate 1, without the need for an additional large heat dissipation device, a large amount of space is saved, and the structure is relatively simple, the number of parts and assembly cost is reduced, and the cost advantage is obvious.

[0025] It should be noted that the U type insert piece 4 and the conductive copper foil 2 are welded and fixed by wave soldering. If the heat generated by the conductive copper foil 2 is low, the U type insert piece 4 can be replaced with a common single insert piece with a smaller area to save material cost and processing cost.

[0026] In the embodiment, the U type insert piece 4 is made of a metal material with high thermal conductivity;And the U type insert piece 4 includes a plurality of, a plurality of U type insert pieces 4 are distributed in an equidistant array. In addition, the spacing distance of a plurality of U type insert pieces can be adjusted according to actual conditions to achieve the optimal heat dissipation effect.

[0027] Specifically, the U type insert piece 4 includes a pin 41 inserted into the through hole 3, a bottom plate 42 fixedly connected with the pin 41 and located on the conductive copper foil 2, an extension plate 43 formed by bending and extending from both ends of the bottom plate 42 to a side away from the conductive copper foil 2, and a heat dissipation hole 44 formed on the extension plate 43;The via hole welding point 5 is located at the connecting portion of the through hole 3 and the pin 41.

[0028] In the embodiment, the bottom plate 42 is rectangular in shape, and the heat dissipation holes 44 are circular in shape. Of course, the shapes of the bottom plate 42 and the heat dissipation holes 44 are not limited to this, and can be designed according to actual conditions.

[0029] Compared with the related art, the heat dissipation structure suitable for a large-current heat generating circuit provided by the utility model, comprising: a PCB substrate; a conductive copper foil laid on the PCB substrate; and the conductive copper foil is provided with a through hole; a U-shaped insert piece inserted into the through hole for increasing the heat dissipation area of the conductive copper foil; a via hole welding point located at the connecting part of the through hole and the U-shaped insert piece for realizing the welding and fixation of the U-shaped insert piece and the conductive copper foil, so that the heat of the conductive copper foil is conducted to the U-shaped insert piece through the via hole welding point. In the above structure, the heat dissipation area is significantly increased through the ingenious combination of the U-shaped insert piece and the conductive copper foil, the heat generated by the conductive copper foil can be quickly and effectively dissipated, the copper foil overheating phenomenon is avoided, the heat dissipation efficiency is greatly improved, the circuit board aging problem caused by the overheating of the conductive copper foil is prevented, and the reliability and service life of the circuit board are improved, the safety hidden danger caused by the overheating is reduced, and the stable operation of the electronic equipment is ensured.

[0030] The above-mentioned embodiments should be understood as illustrative rather than limiting the scope of the utility model, and the protection scope of the utility model is subject to the claims. For those skilled in the art, some non-essential improvements and adjustments of the utility model without departing from the essence and scope of the utility model still belong to the protection scope of the utility model.

Claims

1. A heat dissipating structure suitable for a large current heat generating circuit, characterized by, The heat dissipation structure suitable for a large-current heat generating circuit comprises: a PCB substrate; a conductive copper foil laid on the PCB substrate, and the conductive copper foil is provided with a through hole; a U-shaped insert piece inserted into the through hole for increasing the heat dissipation area of the conductive copper foil; a via hole welding point located at the connecting part of the through hole and the U-shaped insert piece for realizing the welding fixation of the U-shaped insert piece and the conductive copper foil, so that the heat of the conductive copper foil is conducted to the U-shaped insert piece through the via hole welding point.

2. The heat dissipation structure according to claim 1, wherein The U-shaped insert piece is made of a metal material with high thermal conductivity, and the U-shaped insert piece comprises a plurality of U-shaped insert pieces which are distributed in an equidistant array.

3. The heat dissipation structure according to claim 2, wherein The U-shaped insert piece comprises a pin inserted into the through hole, a bottom plate fixedly connected with the pin and located on the conductive copper foil, an extension plate formed by bending and extending from both ends of the bottom plate to a side away from the conductive copper foil, and a heat dissipation hole provided on the extension plate; and the via hole welding point is located at the connecting part of the through hole and the pin.

4. The heat dissipation structure according to claim 3, wherein The shape of the bottom plate is rectangular, and the shape of the heat dissipation hole is circular.

5. The heat dissipating structure according to claim 1, wherein The U-shaped insert piece and the conductive copper foil are welded and fixed by wave soldering.

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