LED display system-level packaging structure
By using vertical packaging and conductive pillar electrical contact, the space occupation problem of LED display system-level packaging structure in horizontal layout is solved, realizing a more compact packaging design and improving packaging efficiency.
Patent Information
- Application Number
- CN202423323979.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing LED display system-level packaging structures occupy a large space when laid out horizontally, making miniaturization difficult.
A vertical packaging structure is adopted, in which the control chip and the LED display structure are electrically contacted through conductive pillars, and the function of the traditional carrier board is replaced by a rewiring layer to achieve vertical stacking and electrical connection.
It achieves miniaturization of the LED display system-level packaging structure, avoiding excessive space occupation and improving packaging efficiency and overall compactness.
Smart Images
Figure CN223928742U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relates to a LED display system level package structure. BACKGROUND
[0002] For the LED this kind of semiconductor device, the package link is the intermediate link of connecting upstream chip and downstream application, has mechanical protection, electric signal connection, optical parameter control and heat dissipation and so on key function. The quality of package link directly decides the final optical performance and reliability of LED product.
[0003] In the related art, the LED display system level package structure is arranged horizontally when packaging, and specifically, as shown in the figure, the LED display structure 10 and the control wafer 20 are fixed horizontally on the same carrier plate 30, and then the gold wire 40 is used to connect the LED display structure 10 and the control wafer 20. Figure 1
[0004] In this packaging mode, a large horizontal space is occupied, so that the size of the overall structure is large. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a LED display system level package structure, which can be miniaturized as a whole through vertical packaging and avoid occupying too much space.
[0006] To achieve the above utility model purposes, the utility model provides the following technical scheme:
[0007] A LED display system level package structure, the LED display system level package structure comprises:
[0008] A control wafer;
[0009] A control wafer layer insulating material, which covers the control wafer;
[0010] An LED display structure vertically stacked on the control wafer and the control wafer layer insulating material;
[0011] Wherein, the control wafer layer insulating material is penetrated by a conductive column structure, and the conductive column structure is electrically connected with the control wafer and the LED display structure respectively.
[0012] In a possible implementation, a first electrode is arranged on the side surface of the control wafer away from the LED display structure, and the first electrode is in contact with a first rewiring layer.
[0013] In a possible implementation, the first re-wiring layer comprises at least one first circuit layer and a first circuit layer insulation material surrounding the at least one first circuit layer.
[0014] The at least one first circuit layer is in contact with the bottom of the conductive column structure and the first electrode respectively.
[0015] In a possible implementation, the at least one first circuit layer is also in contact with the second electrode away from the control wafer.
[0016] In a possible implementation, the LED display structure is provided with a third electrode on a side surface close to the control wafer, and the third electrode is in contact with a second re-wiring layer.
[0017] In a possible implementation, the second re-wiring layer comprises at least one second circuit layer and a second circuit layer insulation material surrounding the at least one second circuit layer.
[0018] The at least one second circuit layer is in contact with the third electrode away from the control wafer, and the at least one second circuit layer is in contact with the top of the conductive column structure close to the control wafer.
[0019] In a possible implementation, the control wafer is provided with a first electrode on a side surface away from the LED display structure, and the first electrode is in contact with a first re-wiring layer, and the thickness of the first re-wiring layer is not greater than the thickness of the control wafer layer insulation material.
[0020] and / or,
[0021] The LED display structure is provided with a third electrode on a side surface close to the control wafer, and the third electrode is in contact with a second re-wiring layer, and the thickness of the second re-wiring layer is not greater than the thickness of the control wafer layer insulation material.
[0022] In a possible implementation, the LED display structure is wrapped with a surface protection material.
[0023] In a possible implementation, the LED display structure comprises:
[0024] a single LED wafer; or,
[0025] an array of LED wafers; or,
[0026] an LED package.
[0027] In a possible implementation, the height of the conductive column structure is not less than the height of the control wafer.
[0028] Compared with the prior art, the LED display system-level packaging structure has the following beneficial effects:
[0029] The LED display system-level packaging structure comprises: a control wafer; a control wafer layer insulating material, which covers the control wafer; an LED display structure, which is vertically stacked on the control wafer and the control wafer layer insulating material; wherein the control wafer layer insulating material is penetrated by a conductive column structure, and the conductive column structure is electrically connected with the control wafer and the LED display structure respectively; the LED display structure and the control wafer are packaged in a packaging body together, so that the LED display can be realized by a single packaging body, and the whole can be miniaturized by the vertically packaged packaging structure, thereby avoiding occupying too much space.
[0030] Further, the functions of the traditional carrier board are replaced by the first re-wiring layer and the second re-wiring layer, so that the whole can be further miniaturized.
[0031] It should be noted that the LED display system-level packaging structure only needs to realize at least one of the above technical effects. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is a structure schematic diagram of an LED display system-level packaging structure provided in the related art;
[0033] Figure 2 is a structure schematic diagram of an LED display system-level packaging structure provided in the embodiment of the present application;
[0034] Figure 3 is a structure schematic diagram of another LED display system-level packaging structure provided in the embodiment of the present application;
[0035] Figure 4 is a structure schematic diagram of another LED display system-level packaging structure provided in the embodiment of the present application.
[0036] Marked in the figure: 10-LED display structure, 11-surface protection material, 12-third electrode, 20-control wafer, 21-control wafer layer insulating material, 22-conductive column structure, 23-first electrode, 30-carrier board, 40-gold wire, 50-first re-wiring layer, 51-second electrode, 60-second re-wiring layer. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0038] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "vertical", "upper", "lower", "top", "side", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0039] In the description of the utility model, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0040] In order to solve the problem that the packaging structure of the horizontal mode in the related art affects miniaturization, in the embodiment of the application, a vertical packaging packaging structure is provided, which can make the whole miniaturization and avoid occupying too much space.
[0041] Next, the technical scheme provided by the embodiment of the application will be introduced and described.
[0042] In combination with reference Figures 2 to 4 The embodiment of the application provides an LED display system level packaging structure, which comprises:
[0043] The control wafer 20; the control wafer layer insulating material 21, the control wafer layer insulating material 21 covers the control wafer 20; the LED display structure 10 vertically stacked on the control wafer 20, the control wafer layer insulating material 21; wherein the control wafer layer insulating material 21 is provided with the conductive column structure 22, and the conductive column structure 22 is electrically connected with the control wafer 20 and the LED display structure 10 respectively.
[0044] In the present application, the control wafer 20 and the LED display structure 10 present a kind of vertical encapsulation packaging structure, and the electrical contact between the two is realized by the conductive column structure 22.
[0045] The control wafer layer insulating material 21 is used to insulate and protect the control wafer 20, and the bottom of the control wafer layer insulating material 21 can be lower than the bottom of the control wafer 20 or flush with the bottom of the control wafer 20, and the top of the control wafer layer insulating material 21 can be higher than the top of the control wafer 20 or flush with the top of the control wafer 20. Further, the control wafer layer insulating material 21 can be made of one or more of resin, silicone, rubber, silicon dioxide, silicon nitride, aluminum oxide and other materials.
[0046] The conductive column structure 22 is arranged in the control wafer layer insulating material 21, and the top and bottom of the conductive column structure 22 can be used to electrically contact the control wafer 20 and the LED display structure 10, and the number of the conductive column structure 22 can be one or more, which is not limited in the present application. Further, the conductive column structure 22 can be made of one or more of copper, silver, aluminum, titanium, gold and other materials. The conductive column structure 22 can be made by electroplating or filling.
[0047] Further, the height of the conductive column structure 22 is not less than the height of the control wafer 20, so as to avoid the problem that the low conductive column affects the electrical connection between the control wafer 20 and the LED display structure 10.
[0048] In one possible implementation, the side surface of the control wafer 20 away from the LED display structure 10 is provided with a first electrode 23, and the first electrode 23 is in contact with the first rewiring layer 50.
[0049] As shown in Figures 2 to 4 The bottom of the control wafer 20 is provided with a first rewiring layer 50, which is used to replace the function of the carrier plate 30 in the prior art, and is connected with the electrode of the control wafer 20. The first rewiring layer 50 is located below the control wafer 20 and is not higher than the control wafer 20.
[0050] Furthermore, the first redistribution layer 50 includes: at least one first circuit layer and a first circuit layer insulating material surrounding the at least one first circuit layer; the side of the at least one first circuit layer near the control chip 20 is in contact with the bottom of the first electrode 23 and the conductive pillar structure 22, respectively. Through this first redistribution layer 50, the first electrode 23 on the surface of the control chip 20 is made conductive to the conductive pillar structure 22.
[0051] Furthermore, at least one side of the first wiring layer away from the control chip 20 is in contact with the second electrode 51. This second electrode 51 can be specifically implemented as a surface mount technology (SMT) electrode, and through this first redistribution layer 50, it can also be used for electrical connection of electrodes in the SMT process.
[0052] Furthermore, the thickness of the first redistribution layer 50 is no greater than the thickness of the insulating material 21 of the control wafer layer. By controlling the thickness of the first redistribution layer 50, the problem of excessive thickness of the overall structure is avoided.
[0053] In one possible implementation, a third electrode 12 is provided on the side surface of the LED display structure 10 near the control chip 20, and this third electrode 12 is in contact with the second redistribution layer 60.
[0054] like Figures 2 to 4 As shown, a second redistribution layer 60 is provided at the bottom of the LED display structure 10. This second redistribution layer 60 is used to replace the function of the carrier board 30 in the prior art and is connected to the electrodes of the LED display structure 10. This second redistribution layer 60 is located below the LED display structure 10 and not higher than the LED display structure 10.
[0055] Furthermore, the second redistribution layer 60 includes: at least one second circuit layer and a second circuit layer insulating material surrounding the at least one second circuit layer; the side of the at least one second circuit layer away from the control chip 20 is in contact with the third electrode 12, and the side of the at least one second circuit layer near the control chip 20 is in contact with the top of the conductive pillar structure 22. Through this second redistribution layer 60, the electrodes on the surface of the LED display structure 10 are made conductive to the conductive pillar structure 22.
[0056] Furthermore, the thickness of the second redistribution layer 60 is no greater than the thickness of the insulating material 21 of the control wafer layer. By controlling the thickness of the second redistribution layer 60, the problem of excessive thickness of the overall structure is avoided.
[0057] It can be understood that the first rewiring layer 50 or the second rewiring layer 60 can be prepared by the following method: applying an insulating material on the top of a package or a wafer, making a hole at the electrode, then plating a conductive material on the top of the electrode by electroplating, and then using exposure, development and etching to carve out the circuit, then applying a conductive material and making a hole, then plating a conductive material on the lower circuit layer by electroplating, and then using exposure, development and etching to carve out the circuit, and thus reciprocating to make a multi-layer circuit layer. In addition, the hole making process can use development exposure or mask method.
[0058] In a possible implementation, the outer periphery of the LED display structure 10 is wrapped with a surface protection material 11.
[0059] The surface protection material 11 is used for insulating protection and optical function of the LED display structure 10, which can be transparent or colored protection material, the bottom of which can be lower than or flush with the bottom of the LED display structure 10, and the top of which can be higher than or flush with the top of the LED display structure 10. Further, the surface protection material 11 can specifically use one or more of epoxy resin, silicone, polyurethane glue, acrylic glue, polyvinyl chloride glue and the like.
[0060] For example, referring to Figure 2 The LED display structure 10 can be an LED wafer array.
[0061] For example, referring to Figure 3 The LED display structure 10 can be a single LED wafer.
[0062] For example, referring to Figure 4 The LED display structure 10 can be an LED package.
[0063] In summary, the technical scheme provided by the embodiment of the present application, the LED display system-in-package structure comprises: a control wafer; a control wafer layer insulating material, the control wafer layer insulating material covering the control wafer; an LED display structure vertically stacked on the control wafer and the control wafer layer insulating material; wherein the control wafer layer insulating material penetrates through a conductive column structure, and the conductive column structure is in electrical contact with the control wafer and the LED display structure; the LED display structure and the control wafer are packaged together in a package, realizing LED display in a single package, and through the vertically packaged packaging structure, the whole can be miniaturized, avoiding occupying too much space.
[0064] All the optional technical solutions above can be combined in any manner to form optional embodiments of the present application, that is, any number of embodiments can be combined to meet the requirements of different application scenarios, which are all within the protection scope of the present application and will not be described one by one here.
[0065] It should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. An LED display system-in-package structure, characterized in that, The LED display system-in-package structure comprises: a control wafer; a control wafer layer insulating material covering the control wafer; an LED display structure vertically stacked on the control wafer and the control wafer layer insulating material; wherein the control wafer layer insulating material is penetrated by a conductive column structure, and the conductive column structure is in electrical contact with the control wafer and the LED display structure respectively.
2. The package structure according to claim 1, wherein: a first electrode is arranged on a side surface of the control wafer away from the LED display structure, and the first electrode is in contact with a first re-wiring layer.
3. The package structure according to claim 2, wherein: the first re-wiring layer comprises at least one first circuit layer and a first circuit layer insulating material surrounding the at least one first circuit layer; a side of the at least one first circuit layer close to the control wafer is in contact with the first electrode and a bottom of the conductive column structure respectively.
4. The package structure according to claim 3, wherein: a side of the at least one first circuit layer away from the control wafer is also in contact with a second electrode.
5. The package structure according to claim 1, wherein: a third electrode is arranged on a side surface of the LED display structure close to the control wafer, and the third electrode is in contact with a second re-wiring layer.
6. The package structure according to claim 5, wherein: the second re-wiring layer comprises at least one second circuit layer and a second circuit layer insulating material surrounding the at least one second circuit layer; a side of the at least one second circuit layer away from the control wafer is in contact with the third electrode, and a side of the at least one second circuit layer close to the control wafer is in contact with a top of the conductive column structure.
7. The package structure according to claim 1, wherein: a first electrode is arranged on a side surface of the control wafer away from the LED display structure, and the first electrode is in contact with a first re-wiring layer, and a thickness of the first re-wiring layer is not greater than a thickness of the control wafer layer insulating material; and / or a third electrode is arranged on a side surface of the LED display structure close to the control wafer, and the third electrode is in contact with a second re-wiring layer, and a thickness of the second re-wiring layer is not greater than the thickness of the control wafer layer insulating material.
8. The package structure according to claim 1, wherein: a surface protection material is wrapped around an outer periphery of the LED display structure. The LED display structure comprises:
9. The package structure of claim 1, wherein, a single LED wafer; or an array of LED wafers; or an LED package.
10. The package structure according to claim 1, wherein: a height of the conductive column structure is not less than a height of the control wafer.