Wafer press-fitting assembly and wafer processing system

Abstract

The utility model relates to the technical field of wafer fixing structures, and particularly discloses a wafer press-fitting assembly and a wafer processing system. The wafer press-fitting assembly comprises a tray; the tray comprises a tray main body, a seat body and a plurality of pressing pieces; the base body is arranged on the tray main body, and the base body can elastically ascend and descend; the seat body is used for placing a wafer; the plurality of pressing pieces are arranged on the periphery of the base body in a surrounding mode and used for pressing the wafer. According to the scheme, the interval between the base body and the pressing piece can be increased by pressing the base body downwards so that the wafer can be placed, the base body rebounds to be matched with the pressing piece to press and fix the wafer after being placed, the wafer can be rapidly fixed, and the tedious step of adjusting a plurality of pressing pieces is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer fixing structure, and in particular to a wafer press-fitting assembly and a wafer processing system. BACKGROUND

[0002] Electron beam lithography (EBL) is a technology that uses an electron beam to directly draw or project a pattern on a wafer coated with an electron resist, and can achieve nanometer-level or even sub-nanometer-level fine pattern preparation. It is widely used in high-end chip manufacturing, quantum devices, micro-electro-mechanical systems and other fields with high precision requirements.

[0003] In the EBL processing process, stable bearing and precise fixing of the wafer (especially large-size wafers of 4-8 inches or more) are prerequisites for ensuring exposure accuracy. In the existing scenarios involving wafer detection and processing, the ways of fixing wafers by the tray generally include edge fixing and compression. The edge fixing refers to the tray being provided with wafer grooves of a fixed size, so that the wafer can be directly placed in the wafer groove, but the wafer is not completely fixed, which is not suitable for high-precision processing scenarios. The compression refers to the tray being provided with adjustable compression pieces (such as wafer pressing pieces), and in order to ensure the stability of the wafer after installation, a plurality of compression pieces need to be provided on the tray; after the wafer is placed, the plurality of compression pieces need to be adjusted, so that the installation process is complicated. CONTENT OF THE INVENTION

[0004] Therefore, the present application aims to provide a wafer press-fitting assembly and a wafer processing system to solve some or all of the above problems.

[0005] To achieve the above technical purposes, the first aspect of the present application provides a wafer press-fitting assembly, comprising: a tray;

[0006] The tray comprises a tray body, a seat body and a plurality of compression pieces;

[0007] The seat body is arranged on the tray body, and the seat body can be elastically lifted and lowered;

[0008] The seat body is used for placing a wafer;

[0009] The plurality of compression pieces are arranged around the outer periphery of the seat body and are used for compressing the wafer.

[0010] Further, the compression piece is provided with an adjusting screw;

[0011] When the adjusting screw is rotated, it can drive the compression piece to lift and lower.

[0012] Further, it further comprises a lower pressing claw;

[0013] The lower pressing hand is used to press down the seat body.

[0014] Further, the lower pressing hand is provided with a pressing disc and a plurality of pressing columns.

[0015] The plurality of pressing columns are circumferentially distributed on the pressing disc.

[0016] Further, the pressing disc is provided with a plurality of pressing column grooves.

[0017] The pressing column is detachably arranged in the pressing column groove.

[0018] Further, the pressing column groove is an arc-shaped groove.

[0019] The pressing column can be adjusted in position along the pressing column groove.

[0020] Further, the plurality of pressing column grooves are circumferentially distributed in concentric circles.

[0021] Further, the pressing column is provided with two nuts.

[0022] The pressing disc is clamped between the two nuts.

[0023] Further, the bottom of the pressing column is provided with a buffer pad.

[0024] The second aspect of the application provides a wafer processing system comprising the wafer pressing assembly of any one of the above.

[0025] From the above technical solutions, the application provides a wafer pressing assembly and a wafer processing system; wherein the wafer pressing assembly comprises: a tray; the tray comprises a tray body, a seat body and a plurality of pressing pieces; the seat body is arranged on the tray body, and the seat body can be elastically lifted; the seat body is used to place a wafer; and the plurality of pressing pieces are circumferentially arranged outside the seat body and used to press the wafer.

[0026] The present application can increase the spacing between the seat body and the pressing piece by pressing down the seat body to place the wafer, and the seat body can rebound after the wafer is placed to cooperate with the pressing piece to press and fix the wafer, thereby realizing fast fixing of the wafer and avoiding the cumbersome steps of adjusting the plurality of pressing pieces. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can obtain other drawings according to these drawings without any creative effort.

[0028] Figure 1A schematic view of a tray in a wafer press-fit assembly provided by an embodiment of the present application;

[0029] Figure 2 A schematic view of a lower press hand in a wafer press-fit assembly provided by an embodiment of the present application;

[0030] In the figure:

[0031] 10, tray; 11, tray body; 12, seat body; 13, press piece;

[0032] 20, lower press hand; 21, press plate; 22, press column; 23, press column groove; 24, nut; 25, buffer pad. DETAILED DESCRIPTION

[0033] The technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0034] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be replaceably connected, or it can be integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] Please refer to Figure 1In the first aspect of the embodiments of the present application, a wafer press-fit assembly is provided, comprising: a tray 10; the tray 10 comprises a tray body 11, a seat body 12 and a plurality of press pieces 13; the seat body 12 is arranged on the tray body 11, and the seat body 12 can be elastically lifted and lowered; the seat body 12 is used for placing a wafer; and the plurality of press pieces 13 are arranged around the outer periphery of the seat body 12 and are used for pressing the wafer.

[0037] In the present solution, the tray body 11 serves as the basic bearing structure of the entire assembly and provides mounting support for other components. The seat body 12 is assembled on the tray body 11 and is connected to the tray body 11 through elastic return members; the elastic return members can be a plurality of uniformly distributed springs. When the seat body 12 is subjected to downward pressure, the elastic components are compressed, and the seat body 12 is lowered accordingly; when the pressure disappears, the elastic components push the seat body 12 to reset and rise by relying on their own elastic restoring force, so that the seat body 12 has the characteristic of being elastically lifted and lowered.

[0038] The press piece 13 can be a reverse L-shaped structure, which includes a column body and a pressing piece arranged on the column body. An adjusting bolt is arranged on each press piece 13. A guide column for connecting the column body of the press piece 13 is arranged on the tray body 11; the adjusting bolt and the press piece 13 and the guide column adopt a threaded cooperation structure; and a compression spring is arranged between the press piece 13 and the guide column. When the adjusting bolt is rotated, the threaded rotation converts the rotary motion into linear lifting motion, and the compression spring can drive the press piece 13 to move up and down in the vertical direction, thereby realizing the adjustment of the height of the press piece 13.

[0039] In actual application, corresponding to wafers of different specifications, the staff can first accurately calibrate the press pieces 13 to a preset height and ensure that the heights of the press pieces 13 are equal. Then, the staff presses down the seat body 12, and the wafer can be loaded between the seat body 12 and the press pieces 13. After the pressure on the seat body 12 is removed, the seat body 12 resets and rises, thereby fixing the wafer between the seat body 12 and the press pieces 13.

[0040] Through the tray 10 provided in the present embodiment, the staff does not need to perform tedious fine adjustment steps on the plurality of press pieces 13 when installing the wafer, and the wafer can be clamped and fixed to meet the requirements of high-precision processing.

[0041] Please refer to Figure 1 and Figure 2 In one embodiment, it further comprises: a pressing paw 20; the pressing paw 20 is used for pressing down the seat body 12.

[0042] In the embodiment, the quick-change connector is arranged on the pressing jaw 20, which can cooperate with the quick-change connector of the mechanical arm to realize the quick connection of the mechanical arm and the pressing jaw 20. The mechanical arm can drive the pressing jaw 20 to move to realize the automatic pressing of the seat body 12. It should be noted that the mechanical arm can be a six-axis mechanical arm, which can drive the pressing jaw 20 to press or rise along the vertical direction, and the driving mode belongs to the prior art, so it is not described herein.

[0043] In a more specific embodiment, the pressing jaw 20 is provided with a pressing disc 21 and a plurality of pressing columns 22; the plurality of pressing columns 22 are distributed in a circle on the pressing disc 21. Through the plurality of pressing columns 22, the seat body 12 can be contacted by multiple points to drive the seat body 12 to descend stably, and the pressing columns 22 can avoid the wafer to be loaded or unloaded to avoid interference with the in-out path of the wafer.

[0044] In one embodiment, the pressing disc 21 is provided with a plurality of pressing column grooves 23; the pressing column 22 is detachably arranged in the pressing column groove 23.

[0045] In the embodiment, the pressing column 22 can be selectively installed on different pressing column grooves 23 according to the size of the wafer and other requirements, so that the pressing jaw 20 can adapt to multiple wafers.

[0046] As an implementation, the pressing column groove 23 is an arc-shaped groove; the pressing column 22 can adjust the position along the pressing column groove 23.

[0047] When the position of the pressing column 22 needs to be finely adjusted, the staff can adjust the position along the arc-shaped structure of the pressing column groove 23 without completely detaching the pressing column 22 from the pressing column groove 23, thereby improving the efficiency of adjusting the pressing column 22.

[0048] Specifically, in the embodiment, two nuts 24 are arranged on the pressing column 22; the pressing disc 21 is clamped between the two nuts 24. When the two nuts 24 are tightened, the pressing disc 21 is fixed and clamped, and the position of the pressing column 22 is fixed. When the position of the pressing column 22 needs to be finely adjusted, one nut 24 can be loosened, then the pressing column 22 is moved along the arc-shaped pressing column groove 23, and the nut 24 is tightened after being moved to the appropriate position. When the position of the pressing column 22 needs to be adjusted due to the change of the size of the wafer, one nut 24 can be loosened, then the pressing column 22 is removed from the pressing column groove 23, and is installed in the pressing column groove 23 at the corresponding position according to the size of the wafer.

[0049] In one embodiment, the plurality of pressing column grooves 23 are distributed in a concentric circle shape, which improves the flexibility of the arrangement of the pressing column 22 and facilitates the adaptation to wafers of different diameters.

[0050] In one embodiment, the bottom of the pressing column 22 is provided with a buffer pad 25, which can reduce the damage of the pressing column 22 to the wafer and ensure the fixing effect of the wafer.

[0051] The second aspect of the present application provides a wafer processing system, comprising the wafer press assembly of any one of the above.

[0052] In the wafer processing system provided by the embodiment, the existing EBL processing equipment and the existing multi-axis manipulator can be configured. After being connected with the pressing gripper 20, the multi-axis manipulator can drive the pressing gripper 20 to automatically press the seat body 12, thereby improving the precision and efficiency of wafer press assembly.

[0053] The above is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent replacements to some of the technical features, but any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer press-pack assembly, characterized by Comprising: a tray (10); the tray (10) comprises a tray body (11), a seat body (12) and a plurality of pressing pieces (13); the seat body (12) is arranged on the tray body (11), and the seat body (12) can be elastically lifted and lowered; the seat body (12) is used for placing a wafer; a plurality of the pressing pieces (13) are arranged around the outer periphery of the seat body (12) and are used for pressing the wafer.

2. The wafer press-pack assembly of claim 1, wherein, An adjusting bolt is arranged on the pressing piece (13); when the adjusting bolt is rotated, the pressing piece (13) can be lifted and lowered.

3. The wafer press-pack assembly of claim 1, wherein, Further comprising: a pressing hand claw (20); the pressing hand claw (20) is used for pressing down the seat body (12).

4. The wafer press-pack assembly of claim 3, wherein, A pressing disc (21) and a plurality of pressing columns (22) are arranged on the pressing hand claw (20); a plurality of the pressing columns (22) are circumferentially distributed on the pressing disc (21).

5. The wafer press-pack assembly of claim 4, wherein, A plurality of pressing column grooves (23) are arranged on the pressing disc (21); the pressing column (22) is detachably arranged in the pressing column groove (23).

6. The wafer press-pack assembly of claim 5, wherein, The pressing column groove (23) is an arc-shaped groove; the pressing column (22) can adjust the position along the pressing column groove (23).

7. The wafer press-pack assembly of claim 6, wherein, A plurality of the pressing column grooves (23) are circumferentially distributed in a concentric circle shape.

8. The wafer press-pack assembly of claim 6, wherein, Two nuts (24) are arranged on the pressing column (22); the pressing disc (21) is clamped between the two nuts (24).

9. The wafer press-pack assembly of claim 4, wherein, A buffer pad (25) is arranged at the bottom of the pressing column (22).

10. A wafer processing system, characterized by, The wafer pressing assembly comprises any one of claims 1 to 9.

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