Wafer taking device and wafer feeding equipment

Abstract

The utility model provides a wafer taking device and wafer feeding equipment, and relates to the technical field of wafer testing. The wafer taking device comprises a base, a tooth fork, a force measuring instrument, a driving mechanism and a controller, the tooth fork is installed on the base in a sliding mode, the tooth fork is arranged to fork a wafer in a controlled mode, one end of the force measuring instrument is connected with the tooth fork, and the other end of the force measuring instrument is connected with the base. The force measuring instrument is set to give an alarm when the counter-acting force borne by the tooth fork when the tooth fork makes contact with the wafer is larger than a preset value. The driving mechanism is connected with the base and is arranged to controllably drive the tooth fork to move, and the controller is arranged to control the driving mechanism to stop driving the tooth fork to move when the force measuring instrument gives an alarm. According to the technical scheme, hard connection between the tooth fork and the base is omitted, the force measuring instrument is additionally arranged between the tooth fork and the base, the force measuring instrument is used for monitoring the counter-acting force borne by the tooth fork, and the tooth fork and the wafer can be prevented from being broken and damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer test technical field especially relates to a wafer material taking device and wafer feeding equipment. BACKGROUND

[0002] The current wafer material taking structure is composed of two parts of prongs and mechanical hands, the prongs and the mechanical hands are directly fixed through screws and belong to hard connection. When the wafer is warped, displaced or the parameter setting is wrong, etc., the prongs and the wafer or other structural parts may collide when the wafer material taking structure takes materials, and then the wafer or the prongs may be broken and damaged. SUMMARY

[0003] One object of the utility model is to provide a wafer material taking device to solve the technical problem that the prongs or the wafer are broken and damaged when the prongs collide with the wafer in the prior art.

[0004] A further object of the utility model is to more stably fork the wafer.

[0005] Another object of the utility model is to provide a wafer feeding equipment with a wafer material taking device.

[0006] In particular, the utility model provides a wafer material taking device, which comprises:

[0007] A base;

[0008] Prongs slidably mounted on the base, the prongs are arranged to controllably fork the wafer;

[0009] A force measuring instrument, one end of which is connected with the prongs, and the other end is connected with the base, the force measuring instrument is arranged to alarm when the reaction force received by the prongs when contacting the wafer is greater than a preset value;

[0010] A driving mechanism connected with the base and arranged to controllably drive the prongs to move;

[0011] A controller connected with the force measuring instrument and the driving mechanism respectively, the controller is arranged to control the driving mechanism to stop driving the prongs to move when the force measuring instrument alarms.

[0012] Optionally, the force measuring instrument is arranged along the extension direction of the prongs.

[0013] Optionally, the base comprises a vertical part and a horizontal part connected with each other, the prongs are mounted on the horizontal part of the base, and one end of the prongs is connected with the vertical part of the base.

[0014] Optionally, the utility model further comprises:

[0015] A slide rail is installed on the horizontal part of the base;

[0016] A mounting plate is installed on the slide rail, and the fork is installed on the mounting plate.

[0017] Optionally, the mounting plate is provided with at least one first air port, and a first vacuum air channel is arranged in the mounting plate and communicates with the first air port, the fork is provided with a second vacuum air channel communicating with the first vacuum air channel, and the fork is provided with at least one second air port communicating with the second vacuum air channel, so that the fork can adsorb the wafer by vacuumizing when the second air port contacts the wafer.

[0018] Optionally, the wafer loading equipment further comprises:

[0019] A connecting rod is connected with the mounting plate and the force measuring instrument respectively, and the mounting plate is arranged to slide relative to the connecting rod when the fork is subjected to force;

[0020] An elastic member is sleeved on the connecting rod and abuts against the force measuring instrument and the mounting plate at two ends, and the elastic member is arranged to be compressed when the mounting plate slides relative to the connecting rod.

[0021] Optionally, the wafer loading equipment further comprises:

[0022] A position sensor is installed on the base, and the position sensor has a groove;

[0023] A position sensing sheet is connected with the fork and partially located in the groove of the position sensor;

[0024] The position sensor is arranged to alarm when the position sensing sheet moves away from a target position following the fork;

[0025] The controller is further arranged to control the driving mechanism to stop driving the fork to move when the position sensor alarms.

[0026] Optionally, the wafer loading equipment further comprises:

[0027] The driving mechanism is a robot, and the force measuring instrument is a thrust meter.

[0028] In particular, the wafer loading equipment further comprises the wafer taking device.

[0029] The utility model discloses a wafer taking device, including base, prongs, force measuring instrument, drive mechanism and controller, the prongs are slidably installed on the base, and the prongs are set to fork controlledly take wafer, one end of force measuring instrument is connected with the prongs, and the other end is connected with the base, and force measuring instrument is set to when the reaction force that the prongs received is greater than the preset value, alarm is carried out. Drive mechanism is connected with the base, and is set to drive prongs to move controlledly, and the controller is set to when force measuring instrument alarms, control drive mechanism stops driving prongs to move. The above-mentioned technical scheme cancels the hard connection of prongs and base, adds force measuring instrument between the prongs and base, utilizes force measuring instrument to monitor the reaction force that the prongs received, can avoid prongs and wafer fragmentation damage.

[0030] Further, the utility model discloses a mounting plate is equipped with at least one first air port, and its inside is equipped with the first vacuum air passage with first air port intercommunication, the inside of prongs is equipped with the second vacuum air passage with first vacuum air passage intercommunication, and it is equipped with at least one second air port with second vacuum air passage intercommunication on it, to carry out vacuumizing when second air port and wafer contact, thereby making prongs adsorb wafer. The above-mentioned technical scheme passes through vacuum adsorption wafer, makes prongs can more stably fork take wafer, avoids wafer slip and fall.

[0031] According to the detailed description of the specific embodiments of the utility model in the following combined with the attached drawing, the above-mentioned and other purposes, advantages and characteristics of the utility model will be more clear to the person skilled in the art. BRIEF DESCRIPTION OF DRAWINGS

[0032] Some specific embodiments of the utility model will be described in the following with reference to the attached drawing in the example mode but not the limiting mode. The same reference signs in the drawing mark the same or similar components or parts. The person skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawing:

[0033] Fig. 1 It is the schematic structural drawing of one angle of wafer taking device according to one embodiment of the utility model;

[0034] Fig. 2 It is the schematic enlarged view of force measuring instrument in wafer taking device according to one embodiment of the utility model;

[0035] Fig. 3 It is the schematic structural drawing of another angle of wafer taking device according to one embodiment of the utility model.

[0036] Reference signs:

[0037] 100 - wafer pick-up device, 200 - wafer, 300 - basket, 10 - fork, 20 - base, 21 - vertical part, 22 - horizontal part, 30 - force measuring instrument, 40 - controller, 50 - slide rail, 60 - mounting plate, 61 - vacuum nozzle, 71 - elastic member, 72 - connecting rod, 81 - position sensor, 82 - position sensing sheet, 811 - groove, 90 - driving mechanism. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0039] In the description of the present application, it is to be understood that the terms "upper", "lower", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0040] The terms "first", "second", etc. are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.

[0041] Unless otherwise specifically defined and limited, the terms "connection", "installation", and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0042] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments of the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0043] Fig. 1 is a schematic structural view of a wafer taking device 100 according to an embodiment of the present application from another angle, Fig. 2 is a schematic enlarged view of a force measuring instrument 30 in the wafer taking device 100 according to an embodiment of the present application, Fig. 3 is a schematic structural view of a wafer taking device 100 according to an embodiment of the present application from another angle. As Figs. 1 to 3 shown, in one specific embodiment, the wafer taking device 100 comprises a base 20, a prong 10, a force measuring instrument 30, a driving mechanism 90 and a controller 40. The prong 10 is slidably mounted on the base 20, and is arranged to take the wafer 200 in a controlled manner. One end of the force measuring instrument 30 is connected to the prong 10, and the other end is connected to the base 20. The force measuring instrument 30 is arranged to alarm when the reaction force received by the prong 10 when it is in contact with the wafer 200 is greater than a preset value. The driving mechanism 90 is connected to the base 20, and is arranged to drive the prong 10 to move in a controlled manner. The controller 40 is connected to the force measuring instrument 30 and the driving mechanism 90 respectively, and is arranged to control the driving mechanism 90 to stop driving the prong 10 to move when the force measuring instrument 30 alarms.

[0044] This embodiment cancels the hard connection between the prong 10 and the base 20, and adds the force measuring instrument 30 between the prong 10 and the base 20. The force measuring instrument 30 is used as an adapter, and the reaction force received by the prong 10 is monitored by the force measuring instrument 30. When the prong 10 is in hard contact with an obstacle or the wafer 200, the obstacle or the wafer 200 will give the prong 10 a reaction force, which will trigger the alarm of the force measuring instrument 30, and an alarm signal will be sent. The controller 40 controls the driving mechanism 90 to stop driving the prong 10 to move according to the alarm signal, so that the prong 10 and the wafer 200 can be prevented from being damaged and broken.

[0045] In some embodiments, the wafer 200 is placed in the basket 200, and when the wafer 200 is taken, the controller 40 controls the prong 10 to extend into the basket 200 to take the wafer 200.

[0046] In some embodiments, the force measuring instrument 30 is arranged along the extension direction of the prong 10, so that the reaction force received by the prong 10 along its extension direction can be measured, and the reaction force received by the prong 10 can be more accurately measured.

[0047] In some embodiments, the force measuring instrument 30 is a thrust meter. Here, the size of the preset value that can trigger the thrust meter to send a signal can be freely adjusted, and the thrust meter uses a real-time mode. In other embodiments, the force measuring instrument 30 can also select other instruments that can measure the reaction force received by the prong 10.

[0048] In some embodiments, the base 20 comprises a vertical part 21 and a horizontal part 22 connected with each other, the prongs 10 are mounted on the horizontal part 22 of the base 20, and one end of the prongs 10 is connected with the vertical part 21 of the base 20. It can be understood that the base 20 is in L shape. In other embodiments, the shape of the base 20 can also be determined according to specific design requirements.

[0049] In some embodiments, the wafer taking device 100 further comprises a slide rail 50 and a mounting plate 60, the slide rail 50 is mounted on the horizontal part 22 of the base 20. The mounting plate 60 is mounted on the slide rail 50, and the prongs 10 are mounted on the mounting plate 60. When the prongs 10 are subjected to a reaction force, they can move along the slide rail 50 to press the thrust meter. Here, the mounting plate 60 is also in L shape.

[0050] In a preferred embodiment, the mounting plate 60 is provided with at least one first air port, and the inside of the mounting plate 60 is provided with a first vacuum air channel communicating with the first air port. The inside of the prongs 10 is provided with a second vacuum air channel communicating with the first vacuum air channel, and the prongs 10 are provided with at least one second air port communicating with the second vacuum air channel, so as to be vacuumized when the second air port contacts the wafer 200, thereby enabling the prongs 10 to adsorb the wafer 200. Here, the first air port, the first vacuum air channel, the second vacuum air channel and the second air port are sequentially communicated to form a vacuum adsorption channel, a vacuum air nozzle 61 is mounted on the first air port, and the vacuum air nozzle 61 is connected with an external vacuumizing device. When it is needed to adsorb the wafer 200, the vacuumizing device is used to vacuumize the vacuum adsorption channel, thereby adsorbing the wafer 200.

[0051] This embodiment enables the prongs 10 to more stably fork the wafer 200 by vacuumizing the wafer 200, thereby avoiding the wafer 200 from falling off.

[0052] In some embodiments, the number of the second air ports is multiple, and the multiple second air ports are uniformly arranged at the end of the prongs 10.

[0053] In some embodiments, the wafer taking device 100 further comprises a connecting rod 72 and an elastic member 71, the connecting rod 72 is connected with the mounting plate 60 and the force measuring instrument 30 respectively, and the mounting plate 60 is arranged to slide relative to the connecting rod 72 when the prongs 10 are subjected to a force. The elastic member 71 is sleeved on the connecting rod 72, and the two ends of the elastic member 71 are respectively abutted with the force measuring instrument 30 and the mounting plate 60, and the elastic member 71 is arranged to be in compression state when the mounting plate 60 slides relative to the connecting rod 72. Here, the elastic member 71 can be a spring, and can also be other components having the same elastic performance as the spring.

[0054] In some embodiments, the wafer taking device 100 further comprises a position sensor 81 and a position sensing sheet 82. The position sensor 81 is mounted on the base 20, and the position sensor 81 has a groove 811. The position sensing sheet 82 is connected with the fork 10, and part of the position sensing sheet 82 is located in the groove 811 of the position sensor 81. The position sensor 81 is arranged to alarm when the position sensing sheet 82 moves away from the target position following the movement of the fork 10, and the controller 40 is further arranged to control the driving mechanism 90 to stop driving the fork 10 to move when the position sensor 81 alarms.

[0055] The embodiment adds the position sensor 81 and the elastic member 71 on the basis of adding the thrust meter, and when the end of the fork 10 is subjected to the reaction force, the elastic member 71 is compressed to displace, and the position sensing sheet 82 moves following the fork 10, so as to trigger the position sensor 81 to send an alarm signal. When the reaction force acting on the fork 10 reaches the preset value set by the thrust meter, the thrust meter also triggers an alarm signal, and the alarm signals of the two can be used as the signal for the controller 40 to control the fork 10 to stop moving. When the thrust meter fails, the fork 10 can also be controlled to stop moving according to the signal sent by the position sensor 81, so as to realize double insurance. Here, under normal circumstances, the position sensing sheet 82 is located at the middle position of the groove 811 of the position sensor 81, and when the position sensing sheet 82 moves away from the middle position of the groove 811 following the movement of the fork 10, the position sensor 81 alarms.

[0056] In some embodiments, the driving mechanism 90 is a robot hand. The fork 10 moves under the driving of the robot hand. The controller 40 controls the robot hand to stop moving and reset after receiving the alarm signal.

[0057] The embodiment further provides a wafer 200 feeding device, which comprises the wafer taking device 100 according to any one of the above embodiments. For the wafer taking device 100, details are not repeated here.

[0058] The embodiment cancels the hard connection between the fork 10 and the base 20 by adding the thrust meter between the fork 10 and the base 20. When the fork 10 collides with an obstacle or the wafer 200, the thrust meter triggers an alarm signal. After receiving the alarm signal, the controller 40 controls the robot hand to stop moving and reset, so as to avoid the robot hand continuing to move and causing the wafer 200 or the fork 10 to break, reduce the risk of the wafer 200 or the fork 10 breaking, and reduce the loss caused thereby. In addition, the structure of the utility model has a low cost, and only the thrust meter and the slide rail 50 need to be added for installation and use.

[0059] Up to now, the person skilled in the art should recognize that, although the multiple exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can still be directly determined or deduced according to the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. A wafer picking device, characterized by, The device comprises: a base; a fork slidably mounted on the base, the fork being arranged to pick up a wafer in a controlled manner; a force measuring instrument connected at one end to the fork and at the other end to the base, the force measuring instrument being arranged to alarm when the reaction force received by the fork when in contact with the wafer is greater than a preset value; a driving mechanism connected to the base and arranged to drive the fork to move in a controlled manner; a controller connected to the force measuring instrument and the driving mechanism respectively, the controller being arranged to control the driving mechanism to stop driving the fork to move when the force measuring instrument alarms.

2. The wafer picking device according to claim 1, wherein the force measuring instrument is arranged along the extension direction of the fork.

3. The wafer picking device according to claim 1, wherein the base comprises a vertical part and a horizontal part connected to each other, the fork is mounted on the horizontal part of the base, and one end of the fork is connected to the vertical part of the base.

4. The wafer handling device of claim 3, wherein, The device further comprises: a slide rail mounted on the horizontal part of the base; a mounting plate mounted on the slide rail, and the fork is mounted on the mounting plate.

5. The wafer picking device according to claim 4, wherein at least one first air port is provided on the mounting plate, and a first vacuum air channel is provided inside the mounting plate and communicates with the first air port, a second vacuum air channel is provided inside the fork and communicates with the first vacuum air channel, and at least one second air port is provided on the fork and communicates with the second vacuum air channel, so that the fork can be used to adsorb the wafer by vacuumizing the second air port when it is in contact with the wafer.

6. The wafer handling device of claim 4, wherein, The device further comprises: a connecting rod connected to the mounting plate and the force measuring instrument respectively, and the mounting plate is arranged to slide relative to the connecting rod when the fork is subjected to a force; a resilient member sleeved on the connecting rod and abutting against the force measuring instrument and the mounting plate at both ends, and the resilient member is arranged to be compressed when the mounting plate slides relative to the connecting rod.

7. The wafer handling device of claim 6, wherein, The device further comprises: a position sensor mounted on the base, and the position sensor has a groove; a position sensing sheet connected to the fork and partially located in the groove of the position sensor; the position sensor is arranged to alarm when the position sensing sheet moves away from a target position following the fork; the controller is further arranged to control the driving mechanism to stop driving the fork to move when the position sensor alarms.

8. The wafer picking device according to any one of claims 1-5, wherein, The device further comprises: the driving mechanism is a robot.

9. The wafer picking device according to any one of claims 1-5, wherein the force measuring instrument is a thrust meter.

10. A wafer loading apparatus characterized by comprising: The device comprises the wafer picking device according to any one of claims 1-9.

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