Probe testing mechanism of semiconductor testing and braiding all-in-one machine

Abstract

The utility model discloses a probe testing mechanism of a semiconductor testing and braiding all-in-one machine, which relates to the technical field of semiconductor testing and comprises a mounting plate and a supporting plate, the supporting plate is arranged on the lower side of the mounting plate, and a plurality of connecting rods are distributed between the supporting plate and the mounting plate in an annular array mode. The two ends of each connecting rod are fixedly connected with the corresponding mounting plate and the corresponding supporting plate correspondingly, a rotating rod is rotationally connected to the middle of the supporting plate, the lower end of the rotating rod is fixedly sleeved with a rotating plate, and a transmission mechanism for driving the rotating plate to rotate is arranged on the upper surface of the supporting plate. A plurality of through grooves are formed in the surface of the rotating plate in an annular array mode, and testing heads are arranged in the through grooves in a sliding mode. According to the utility model, different types of probes can be quickly switched, different types of semiconductor testing work can be conveniently carried out, the probes do not need to be disassembled and replaced, and the working efficiency and the practicability of the device can be greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically to a probe testing mechanism for a semiconductor testing tape and reel integrated machine. Background Technology

[0002] In the semiconductor manufacturing process, different types of semiconductor chips need to undergo various electrical performance tests. With the rapid development of semiconductor technology, the types of chips are becoming increasingly diverse, and the testing requirements are becoming more and more complex and varied.

[0003] Traditional semiconductor test tape and reel integrated probe testing mechanisms can only be adapted to specific types of probes. When different types of chips need to be tested, the probe replacement process is cumbersome and time-consuming, which seriously affects testing efficiency and production progress. Utility Model Content

[0004] In view of the problems existing in the probe testing mechanism of the existing semiconductor test tape and reel machine, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a probe testing mechanism for a semiconductor testing tape and reel integrated machine, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A probe testing mechanism for a semiconductor testing tape and reel integrated machine includes a mounting plate and a support plate. The support plate is disposed below the mounting plate. Multiple connecting rods are arranged in a circular array between the support plate and the mounting plate. The two ends of the multiple connecting rods are respectively fixedly connected to the corresponding mounting plate and support plate. A rotating rod is rotatably connected to the middle of the support plate. A rotating plate is fixedly sleeved at the lower end of the rotating rod. A transmission mechanism for driving the rotating plate to rotate is provided on the upper surface of the support plate. Multiple through slots are arranged in a circular array on the surface of the rotating plate. Test heads are slidably disposed inside the multiple through slots. Test chips are disposed inside the test heads. Various types of probes are respectively installed on the lower side of the multiple test heads. A vertical rod is fixedly disposed on the top of the multiple test heads. A protrusion is fixedly disposed on one side of the lower surface of the support plate. The protrusion abuts against the upper end of the corresponding vertical rod. A reset mechanism for driving the test heads to move up and reset is provided on the upper surface of the rotating plate.

[0008] Preferably, the transmission mechanism includes a first bevel gear and a second bevel gear. The first bevel gear is fixedly sleeved on the upper end of the rotating rod. A fixed plate is fixedly provided on one side of the upper surface of the support plate. A transmission rod is rotatably provided on the side of the fixed plate near the rotating rod. The second bevel gear is fixedly sleeved on the end of the transmission rod away from the fixed plate. The first bevel gear and the second bevel gear are meshed and connected. A motor is fixedly provided on the side of the fixed plate away from the transmission rod. The output end of the motor is fixedly connected to one end of the transmission rod.

[0009] Preferably, the reset mechanism includes a slider and a spring. Slide rods are fixedly provided on the upper surface of the rotating plate and on both sides of the corresponding through groove. The slider is slidably sleeved on the wall of the corresponding slide rod. One side of the slider is fixedly connected to the side wall of the corresponding test head. The spring is movably sleeved on the wall of the corresponding slide rod. One end of the spring is fixedly connected to the corresponding slider, and the other end of the spring is fixedly connected to the rotating plate.

[0010] Preferably, each of the sliding rods has an anti-detachment block fixedly installed at its top end.

[0011] Preferably, the lower surface of the protrusion has a streamlined design.

[0012] Preferably, the upper surface of the mounting plate has multiple mounting holes.

[0013] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0014] This invention uses a motor to drive a transmission rod to rotate, which in turn drives a first bevel gear to rotate, which in turn drives a second bevel gear to rotate. This causes a rotating rod to rotate, which in turn drives a rotating plate to rotate. This causes multiple test heads to rotate around the rotating rod as an axis. When a test head rotates to a position below a protrusion, the protrusion presses against the corresponding vertical rod, causing the test head to move downwards. This, in turn, causes the corresponding probe to move downwards, thus completing the selection of that type of probe. This allows for quick switching between different types of probes, facilitating the testing of different types of chips. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0016] Figure 1 This is a schematic diagram of the probe testing mechanism of a semiconductor testing tape and reel integrated machine proposed in this utility model;

[0017] Figure 2 for Figure 1Another structural diagram from another perspective;

[0018] Figure 3 for Figure 1 A schematic diagram of the internal structure.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1. Mounting plate; 2. Connecting rod; 3. Support plate; 4. Protrusion; 5. Rotating rod; 6. Test head; 7. Probe; 8. Vertical rod; 9. Slider; 10. Rotating plate; 11. Spring; 12. Slide rod; 13. First bevel gear; 14. Fixing plate; 15. Motor; 16. Transmission rod; 17. Second bevel gear. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0022] This utility model discloses a probe testing mechanism for a semiconductor testing tape and reel integrated machine.

[0023] Reference Figure 1-3 A probe testing mechanism for a semiconductor testing tape and reel integrated machine includes a mounting plate 1 and a support plate 3. The support plate 3 is disposed below the mounting plate 1. The upper surface of the mounting plate 1 has multiple mounting holes to facilitate mounting the mounting plate 1 onto an actuator. Multiple connecting rods 2 are arranged in a ring array between the support plate 3 and the mounting plate 1. The two ends of the multiple connecting rods 2 are respectively fixedly connected to the corresponding mounting plate 1 and support plate 3. A rotating rod 5 is rotatably connected to the middle of the support plate 3. A rotating plate 10 is fixedly sleeved at the lower end of the rotating rod 5. Multiple through slots are arranged in a ring array on the surface of the rotating plate 10. Test heads 6 are slidably disposed inside the multiple through slots. Test chips are disposed inside the test heads 6. Various types of probes 7 are respectively installed on the lower side of the multiple test heads 6. Vertical rods 8 are fixedly disposed on the top of the multiple test heads 6. A protrusion 4 is fixedly disposed on one side of the lower surface of the support plate 3. The protrusion 4 abuts against the upper end of the corresponding vertical rod 8. The lower surface of the protrusion 4 has a streamlined design to smoothly compress the vertical rod 8.

[0024] Reference Figure 1-3The upper surface of the support plate 3 is provided with a transmission mechanism that drives the rotating plate 10 to rotate. The transmission mechanism includes a first bevel gear 13 and a second bevel gear 17. The first bevel gear 13 is fixedly sleeved on the upper end of the rotating rod 5. A fixed plate 14 is fixedly provided on one side of the upper surface of the support plate 3. A transmission rod 16 is rotatably provided on the side of the fixed plate 14 near the rotating rod 5. The second bevel gear 17 is fixedly sleeved on the end of the transmission rod 16 away from the fixed plate 14. The first bevel gear 13 and the second bevel gear 17 are meshed and connected. A motor 15 is fixedly provided on the side of the fixed plate 14 away from the transmission rod 16. The output end of the motor 15 is fixedly connected to one end of the transmission rod 16.

[0025] Reference Figure 1-3 The upper surface of the rotating plate 10 is provided with a reset mechanism that drives the test head 6 to move upward and reset. The reset mechanism includes a slider 9 and a spring 11. Slide rods 12 are fixedly provided on both sides of the upper surface of the rotating plate 10 and on the corresponding through groove. The slider 9 is slidably sleeved on the rod wall of the corresponding slide rod 12. One side of the slider 9 is fixedly connected to the side wall of the corresponding test head 6. The spring 11 is movably sleeved on the rod wall of the corresponding slide rod 12. One end of the spring 11 is fixedly connected to the corresponding slider 9, and the other end of the spring 11 is fixedly connected to the rotating plate 10. Anti-detachment blocks are fixedly provided at the top of the multiple slide rods 12 to prevent the slider 9 from slipping off the rod wall of the slide rod 12 as much as possible.

[0026] In this invention, during use, the motor 15 drives the transmission rod 16 to rotate, the transmission rod 16 drives the first bevel gear 13 to rotate, the first bevel gear 13 drives the second bevel gear 17 to rotate, thus causing the rotating rod 5 to rotate. The rotating rod 5 drives the rotating plate 10 to rotate, thus causing multiple test heads 6 to rotate around the rotating rod 5 as an axis. When the test head 6 rotates to below the protrusion 4, the protrusion 4 presses against the corresponding vertical rod 8, thus causing the test head 6 to move down, thereby causing the corresponding probe 7 to move down, thus completing the selection of this type of probe 7. This allows for quick switching between different types of probes 7, facilitating the testing of different types of chips.

[0027] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor test strapping all-in-one machine probe test mechanism comprising a mounting plate (1) and a support plate (3), characterized in that, The support plate (3) is arranged on the lower side of the mounting plate (1), a plurality of connecting rods (2) are arranged in an annular array between the support plate (3) and the mounting plate (1), both ends of the plurality of connecting rods (2) are fixedly connected with the corresponding mounting plate (1) and support plate (3) respectively, a rotating rod (5) is rotatably connected to the middle part of the support plate (3), a rotating plate (10) is fixedly sleeved on the lower end of the rotating rod (5), a transmission mechanism for driving the rotating plate (10) to rotate is arranged on the upper surface of the support plate (3), a plurality of through grooves are arranged in an annular array on the surface of the rotating plate (10), a test head (6) is slidably arranged in each of the plurality of through grooves, a test chip is arranged in the test head (6), a plurality of different types of probes (7) are arranged on the lower side of the test head (6) respectively, a vertical rod (8) is fixedly arranged on the top of each of the test heads (6), a protrusion (4) is fixedly arranged on one side of the lower surface of the support plate (3), the protrusion (4) abuts against the upper end of the corresponding vertical rod (8), and a reset mechanism for driving the test head (6) to move upward and reset is arranged on the upper surface of the rotating plate (10).

2. The semiconductor test strapping all-in-one probe test mechanism according to claim 1, characterized by, The transmission mechanism comprises a first bevel gear (13) and a second bevel gear (17), the first bevel gear (13) is fixedly sleeved on the upper end of the rotating rod (5), a fixed plate (14) is fixedly arranged on one side of the upper surface of the support plate (3), a transmission rod (16) is rotatably arranged on the side of the fixed plate (14) close to the rotating rod (5), the second bevel gear (17) is fixedly sleeved on the end of the transmission rod (16) away from the fixed plate (14), the first bevel gear (13) is in meshing connection with the second bevel gear (17), and a motor (15) is fixedly arranged on the side of the fixed plate (14) away from the transmission rod (16).

3. The semiconductor test strapping all-in-one probe test mechanism according to claim 1, characterized by, The reset mechanism comprises a sliding block (9) and a spring (11), a sliding rod (12) is fixedly arranged on the upper surface of the rotating plate (10) and located on both sides of the corresponding through groove, the sliding block (9) is slidably sleeved on the rod wall of the corresponding sliding rod (12), one side of the sliding block (9) is fixedly connected with the side wall of the corresponding test head (6), and the spring (11) is movably sleeved on the rod wall of the corresponding sliding rod (12). One end of the spring (11) is fixedly connected with the corresponding sliding block (9), and the other end of the spring (11) is fixedly connected with the rotating plate (10).

4. The semiconductor test strapping all-in-one probe test mechanism according to claim 3, characterized by, The top end of each of the sliding rods (12) is fixedly provided with an anti-disengagement block.

5. The semiconductor test strapping all-in-one probe test mechanism according to claim 1, characterized by, The lower surface of the protrusion (4) is designed in a streamline shape.

6. The semiconductor test strapping all-in-one probe test mechanism according to claim 1, characterized by, A plurality of mounting holes are arranged on the upper surface of the mounting plate (1).

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