Chip testing seat cleaning device, cleaning head of cleaning device and chip testing equipment

Abstract

The utility model discloses a cleaning head of a chip test socket cleaning device. The cleaning head comprises a cleaning piece main body; the cleaning part is detachably connected with the cleaning part main body, the cleaning part comprises a brush head, a brush head rod and a threaded rod, one end of the brush head rod is connected with the brush head, the other end of the brush head rod is connected with the threaded rod, the threaded rod is in threaded connection with the cleaning part main body, and the brush head is connected with the brush head rod. The cleaning piece is provided with a channel penetrating through the brush head, the brush head rod and the threaded rod, and the channel is used for allowing gas to flow. According to the cleaning head of the chip testing seat cleaning device, when the cleaning head of the chip testing seat cleaning device needs to be replaced, the cleaning head is taken down, meanwhile, the cleaning piece is taken down from the cleaning piece body in a rotating mode, the cleaning piece body does not need to be replaced, and replacement can be completed only by replacing a new cleaning piece. The cleaning piece body can be matched with cleaning pieces of various specifications to meet the cleaning requirement, only the cleaning piece part needs to be replaced during replacement, and therefore the cleaning cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip testing equipment technology, and in particular to a chip test socket cleaning device, a cleaning head of the cleaning device, and chip testing equipment. Background Technology

[0002] Semiconductor chips are core components of modern electronic devices, boasting advantages such as high speed, high density, and low power consumption. To ensure chip performance and reliability, chips undergo various tests before leaving the factory, including functional testing, aging testing, and fault analysis. These tests require specialized test sockets. With increased usage time and repeated use, test sockets accumulate impurities such as dust, dirt, grease, and oxides. Failure to clean the test sockets promptly can impact chip test pass rates and even lead to chip damage or failure. Therefore, cleaning the test sockets is crucial.

[0003] Currently, due to the pursuit of high-quality testing in chip testing, the same machine has many test positions. If cleaning is required, the machine needs to be shut down for maintenance, which not only requires more manpower and resources, but also affects the production capacity of the equipment. Utility Model Content

[0004] The main purpose of this invention is to propose a cleaning head for a chip test socket cleaning device, which aims to solve the technical problem that cleaning chip test sockets currently requires more manpower and resources and affects equipment production capacity.

[0005] To achieve the above objectives, this utility model proposes a cleaning head for a chip test socket cleaning device, the cleaning head of which includes:

[0006] Cleaning component body;

[0007] A cleaning component is detachably connected to the main body of the cleaning component. The cleaning component includes a brush head, a brush head rod, and a threaded rod. One end of the brush head rod is connected to the brush head, and the other end of the brush head rod is connected to the threaded rod. The threaded rod is threadedly connected to the main body of the cleaning component. The cleaning component has a channel passing through the brush head, the brush head rod, and the threaded rod, and the channel is used for gas flow.

[0008] In some embodiments, the cleaning component body is provided with a plurality of mounting holes, the plurality of mounting holes being located on the side of the cleaning component body away from the cleaning component, and magnets being installed in the plurality of mounting holes respectively.

[0009] In some embodiments, the magnet is bonded to the mounting hole using a high-temperature adhesive.

[0010] In some embodiments, the cleaning component body is provided with a protrusion located at the peripheral edge of the cleaning component body.

[0011] In some embodiments, the cleaning component body is provided with a positioning hole, which is located on the side of the cleaning component body away from the cleaning component.

[0012] In some embodiments, the cleaning component body is provided with a slot, which is an annular slot formed on the outer side of the cleaning component body.

[0013] In some embodiments, the cleaning component body has a through hole, which is connected to the channel.

[0014] This utility model also proposes a chip test socket cleaning device, including a cleaning head of the chip test socket cleaning device as described above.

[0015] This utility model also proposes a chip testing device, comprising:

[0016] A chip test socket, wherein a sensing element is provided inside the chip test socket;

[0017] A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket;

[0018] And the chip test socket cleaning device described above.

[0019] The cleaning head of this chip test socket cleaning device is used in conjunction with the cleaning device to clean the chip test socket. The cleaning head is installed on the chip test socket cleaning device, and the channel of the cleaning component is connected to the air tube of the cleaning device to remove contaminants on the chip test socket through the vacuum channel. When the chip test socket cleaning device needs to replace the cleaning head, the cleaning head is removed, and the cleaning component is rotated off from the main body of the cleaning component. The main body of the cleaning component does not need to be replaced; only the new cleaning component is needed to complete the replacement. The main body of the cleaning component of this chip test socket cleaning device can be adapted to various specifications of cleaning components to meet cleaning needs. When replacing, only the cleaning component needs to be replaced, without involving the replacement of the main body of the cleaning component, reducing resource waste and thus reducing cleaning costs. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the cleaning head of the chip test socket cleaning device in one embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the cleaning component of the cleaning head in one embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the main body of the cleaning head in one embodiment of the present invention;

[0023] Figure 4This is an exploded view of the cleaning head of the chip test socket cleaning device in one embodiment of the present invention. Detailed Implementation

[0024] The solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0027] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0028] This utility model proposes a cleaning head for a chip test socket cleaning device, referring to... Figures 1 to 4 The cleaning head of the chip test socket cleaning device includes:

[0029] Cleaning component body 100;

[0030] The cleaning component 200 is detachably connected to the cleaning component body 100. The cleaning component 200 includes a brush head 210, a brush head rod 220, and a threaded rod 230. One end of the brush head rod 220 is connected to the brush head 210, and the other end of the brush head rod 220 is connected to the threaded rod 230. The threaded rod 230 is threadedly connected to the cleaning component body 100. The cleaning component 200 is provided with a channel 240 that passes through the brush head 210, the brush head rod 220, and the threaded rod 230. The channel 240 is used for gas flow.

[0031] In this embodiment, the cleaning head of the chip test socket cleaning device is detachably mounted on the chip test socket cleaning device, which is mounted on a transfer robot. During the cleaning process, the transfer robot moves to the location of the chip test socket cleaning device and transports it to the chip test socket that needs cleaning. When cleaning chip test sockets of different specifications, the cleaning head of the chip test socket cleaning device needs to be replaced. The main body 100 of the cleaning component is removed, and the cleaning component 200 is rotated out of the main body 100 and replaced with a new cleaning component 200, which completes the replacement. This is very convenient. Using the detachable cleaning component 200 can adapt to various specifications of chip test sockets to meet cleaning needs, and the cleaning head replacement is simple. Only the cleaning component 200 needs to be replaced, without involving the replacement of the main body 100 of the cleaning component, reducing resource waste. Optionally, the main body 100 of the cleaning component can be made of stainless steel or other materials that are not easy to rust and are easy to clean, ensuring its durability and ease of use. The cleaning component 200 can be made of soft materials to ensure its softness and cleaning efficiency. Of course, other materials can also be used for the cleaning component 200 depending on actual needs. A sealing ring 231 is provided at the end of the threaded rod 230 that connects to the main body 100 of the cleaning component. The sealing ring 231 is used to prevent gas from leaking from the connection between the threaded rod 230 and the main body 100 of the cleaning component, thereby ensuring the stability and sealing of the cleaning head. Optionally, the sealing ring 231 can be made of rubber, silicone or other polymer materials to ensure its wear resistance, high temperature resistance and sealing performance.

[0032] The cleaning component 200's channel 240 is connected to the air tube of the cleaning device. Dirt and impurities are vacuum-absorbed by the brush head 210 for cleaning. The channel 240 preferably has a circular cross-section, but is not limited to a circular cross-section; other shapes are also possible. The channel 240 is preferably located at the center of the brush head 210 to ensure uniform gas flow within it. Alternatively, in other embodiments, an ultrasonic motor can be used to drive the brush head 210 to vibrate and achieve cleaning. An ultrasonic motor utilizes the inverse piezoelectric effect of piezoelectric materials and ultrasonic vibration to convert the microscopic deformation of the material into macroscopic rotor motion through mechanical resonance amplification and frictional coupling. This vibration can be transmitted to the brush head 210 via a mechanical structure or frictional coupling, causing it to generate high-frequency micro-vibrations, thereby achieving a cleaning effect.

[0033] The cleaning head of this chip test socket cleaning device is used in conjunction with the cleaning device to clean the chip test socket. The cleaning head is installed on the chip test socket cleaning device. The channel 240 of the cleaning component 200 is connected to the air tube of the cleaning device to remove contaminants on the chip test socket through the vacuum channel. When the chip test socket cleaning device needs to replace the cleaning head, the cleaning head is removed, and the cleaning component 200 is rotated off from the cleaning component body 100. The cleaning component body 100 does not need to be replaced; only the new cleaning component 200 needs to be replaced. The cleaning component body 100 of this chip test socket cleaning device can be adapted to various specifications of cleaning components 200 to meet cleaning needs. When replacing, only the cleaning component 200 needs to be replaced, thereby reducing cleaning costs.

[0034] In some embodiments, refer to Figure 3 The main body 100 of the cleaning component is provided with a plurality of mounting holes 110, which are located on the side of the main body 100 of the cleaning component away from the cleaning component 200, and magnets 111 are respectively installed in the plurality of mounting holes 110.

[0035] In this embodiment, the cleaning component body 100 is magnetically attracted to the cleaning device by the magnet 111, so that the cleaning component body 100 can be firmly installed on the cleaning device. When the cleaning head needs to be replaced, the cleaning component body 100 can also be easily removed from the cleaning device. The shape and size of the mounting hole 110 are adapted to the shape and size of the magnet 111.

[0036] In some embodiments, the magnet 111 is bonded to the mounting hole 110 by a high-temperature adhesive.

[0037] In this embodiment, the magnet 111 is bonded to the mounting hole 110 using a high-temperature adhesive. This ensures the magnet 111 is securely installed within the mounting hole 110, and the high-temperature adhesive also increases the attraction between the magnet 111 and the mounting hole 110, making the magnet 111 more stably installed. Optionally, the high-temperature adhesive can be a two-component adhesive. The magnet 111 is placed inside the mounting hole 110, and then the two-component high-temperature adhesive is mixed in a certain proportion and applied to the contact surface between the magnet 111 and the mounting hole 110. Once the high-temperature adhesive cures, the magnet 111 is firmly bonded to the mounting hole 110. Of course, depending on actual needs, the high-temperature adhesive can also be made of other types of polymer materials, as long as it can firmly bond the magnet 111 to the mounting hole 110. The contact surface between the magnet 111 and the mounting hole 110 needs to be cleaned to ensure the bonding effect of the high-temperature adhesive. Meanwhile, when applying high-temperature adhesive to the contact surface between magnet 111 and mounting hole 110, it is necessary to ensure the uniformity and thickness of the coating to guarantee the bonding effect of the high-temperature adhesive.

[0038] In some embodiments, refer to Figure 3 The cleaning component body 100 is provided with a protrusion 120, which is located on the peripheral edge of the cleaning component body 100.

[0039] In this embodiment, when the cleaning head needs to be replaced, the transfer robot moves the cleaning device to the cleaning head placement rack in the cleaning head replacement area. When the protrusion 120 of the cleaning part body 100 touches the sensor of the cleaning head placement rack, it indicates that there is a cleaning head at this position. Then the transfer robot drives the cleaning device to separate from the cleaning head, and then the cleaning part 200 is replaced. Optionally, the protrusion 120 can be a sensing pin, which can be set according to the actual situation.

[0040] In some embodiments, refer to Figure 3 The cleaning component body 100 is provided with a positioning hole 130, which is located on the side of the cleaning component body 100 away from the cleaning component 200.

[0041] In this embodiment, by inserting the positioning pin of the cleaning device into the positioning hole 130 of the cleaning component body 100, the cleaning device can be firmly connected to the cleaning component body 100. Optionally, the number and size of the positioning holes 130 can be adjusted according to actual needs. At the same time, the positioning holes 130 can also be circular, square, or other shapes, as long as they can be adapted to the positioning pin of the cleaning device.

[0042] In some embodiments, refer to Figure 3 The cleaning component body 100 is provided with a slot 140, which is an annular slot formed on the outer side of the cleaning component body 100.

[0043] In this embodiment, when the cleaning head needs to be replaced, the slot 140 of the cleaning component body 100 engages with the cleaning head placement rack in the replacement area. Then, the transfer robot moves the cleaning device upward to separate it from the cleaning head, thereby replacing the cleaning component 200. After replacement, the transfer robot moves the cleaning device downward to successfully engage the cleaning device and the cleaning head. At this point, the transfer robot moves laterally out of the cleaning device to complete the head replacement operation. Preferably, the slot 140 is an annular slot to achieve quick engagement between the cleaning head and the cleaning head placement rack.

[0044] In some embodiments, refer to Figure 3 The main body 100 of the cleaning component has a through hole 150, which is connected to the channel 240.

[0045] In this embodiment, the through hole 150 of the cleaning component body 100 is connected to the channel 240, increasing the flow of gas inside the cleaning component body 100. The gas can flow more smoothly through the channel 240, thereby enabling the cleaning component 200 to achieve a better cleaning effect. Optionally, the size of the through hole 150 can be adjusted according to the actual needs of the cleaning head and the gas flow rate to meet specific requirements.

[0046] This utility model also proposes a chip test socket cleaning device, including a cleaning head as described above. The specific structure of the cleaning head of this chip test socket cleaning device is the same as described in the above embodiments. Since this chip test socket cleaning device adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0047] The chip testing equipment further proposed in this utility model includes a chip test socket, a transfer robot, and a chip test socket cleaning device. The specific structure of the chip test socket cleaning device is as described in the above embodiments. Since this chip testing equipment adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The chip test socket is equipped with a sensing element inside, and the transfer robot is used to transfer the chip test socket cleaning device into the chip test socket.

[0048] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.

Claims

1. A cleaning head for a chip test socket cleaning device, characterized in that, include: Cleaning component body; A cleaning component is detachably connected to the main body of the cleaning component. The cleaning component includes a brush head, a brush head rod, and a threaded rod. One end of the brush head rod is connected to the brush head, and the other end of the brush head rod is connected to the threaded rod. The threaded rod is threadedly connected to the main body of the cleaning component. The cleaning component has a channel passing through the brush head, the brush head rod, and the threaded rod, and the channel is used for gas flow.

2. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The main body of the cleaning component has multiple mounting holes, which are located on the side of the main body away from the cleaning component, and magnets are installed in each of the multiple mounting holes.

3. The cleaning head of the chip test socket cleaning device according to claim 2, characterized in that, The magnet is bonded to the mounting hole using high-temperature adhesive.

4. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a protrusion, which is located on the peripheral edge of the cleaning component body.

5. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a positioning hole, which is located on the side of the cleaning component body away from the cleaning component.

6. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The cleaning component body is provided with a slot, which is an annular slot formed on the outer side of the cleaning component body.

7. The cleaning head of the chip test socket cleaning device according to claim 1, characterized in that, The main body of the cleaning component has a through hole, which is connected to the channel.

8. A chip test socket cleaning device, characterized in that, The cleaning head of the chip test socket cleaning device as described in any one of claims 1-7.

9. A chip testing device, characterized in that, include: A chip test socket, wherein a sensing element is provided inside the chip test socket; A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket; And the chip test socket cleaning device as described in claim 8.

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