Lead bending tool for metal flat packaging of hybrid integrated circuit

By designing a lead wire bending fixture with a clamping tool and a rolling wheel force application structure, the problems of poor lead wire bending consistency and damage to ceramic insulators were solved, achieving efficient and safe lead wire bending operations.

CN223932469UActive Publication Date: 2026-02-24QINGDAO AEROSPACE SEMICON RES INST
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Patent Information

Application Number
CN202520346623.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2026-02-24
Estimated Expiration
2035-02-28

AI Technical Summary

Technical Problem

Existing lead bending fixtures suffer from poor lead bending consistency, low efficiency, and are prone to damaging ceramic insulators.

Method used

A lead wire bending fixture was designed, comprising a clamping fixture, an upper movable mold, and a lower fixed mold. It adopts a rolling wheel force application structure and a rubber pad with appropriate hardness and thickness, combined with a liftable clamping and fixing mold, to improve the lead wire bending efficiency and consistency, and protect the lead wire ceramic insulator.

Benefits of technology

It achieves high efficiency and consistency in lead wire bending and protection of ceramic insulators. It is simple to operate, low in cost, compact in structure and easy to use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a lead bending tool for metal flat packaging of a hybrid integrated circuit. The lead bending tool comprises a clamping tool, an upper movable die is movably arranged below the clamping tool; a lower fixed mold is oppositely combined below the upper movable mold; the lower fixed mold and the upper movable mold are used for clamping an integrated circuit piece; a side insertion hole D is transversely formed in the upper movable mold; a bending bracket is inserted into the side insertion hole D; a pressing roller is arranged on the lower side of the bending bracket and is used for pressing the lead; a lengthened hollow column C is arranged on the upper top surface of the clamping tool; the device is reasonable in design, compact in structure and convenient to use.
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Description

Technical Field

[0001] This utility model relates to a lead bending fixture for metal flat packages of hybrid integrated circuits. Background Technology

[0002] Currently, most lead wire bending fixtures use two metal fixed molds to clamp the lead wire, and then use metal rods or metal blocks to apply force to bend the lead wire. This method results in poor lead wire bending consistency, low efficiency, and easy damage to the ceramic (glass) insulators of the lead wire. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a lead bending fixture for a hybrid integrated circuit metal flat package.

[0004] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0005] To facilitate manual bending, a lead bending fixture for hybrid integrated circuit metal flat packages includes a clamping fixture; an upper movable mold is movable below the clamping fixture.

[0006] A fixed mold is fitted below the movable mold above;

[0007] The lower fixed mold and the upper movable mold are used to clamp integrated circuit components;

[0008] A side insertion hole D is provided horizontally in the upper movable mold;

[0009] A bent bracket is inserted into the side socket D;

[0010] A pressing roller is provided on the lower side of the bending bracket for pressing down the lead wire;

[0011] An elongated hollow column C is provided on the top surface of the clamping fixture;

[0012] A screw hole C is provided at the top of the upper movable mold;

[0013] An upper connecting bolt passes underneath the extended hollow column C;

[0014] The upper connecting bolt is threaded into the upper screw hole C.

[0015] As a further improvement to the above technical solution:

[0016] To achieve a fixed connection, a base component is provided below the lower fixing mold;

[0017] A lower mold stop is provided in the middle of the base component; a lower mold connecting hole B is provided at the lower mold stop.

[0018] A base connection hole A is provided on the base component;

[0019] The clamping fixture is a gantry frame, and a bottom threaded hole A is provided at the bottom of the gantry frame to be connected to the base connection hole A by bolts;

[0020] The bottom of the fixed mold is set in the base connection hole A;

[0021] The bottom surface of the fixed mold below is provided with a lower screw hole B that is connected to the lower mold connection hole B by bolts.

[0022] To facilitate the positioning of the integrated circuit, a lower positioning stop is provided on the upper surface of the lower fixed mold to position the lower part of the integrated circuit component. Lower lateral grooves are provided on both sides of the lower positioning stop to expose the leads of the integrated circuit component.

[0023] For ease of installation, a process groove is provided on the top of the upper movable mold;

[0024] An upper positioning stop is provided at the bottom of the upper movable mold;

[0025] Upper lateral grooves are provided on both sides of the upper positioning stop.

[0026] To facilitate automatic pressing, a pressing roller is provided on the lower side of the middle part of the bending bracket;

[0027] The bending support includes a crossbar D and an inclined handgrip connected to the crossbar D;

[0028] The crossbar D is used to insert into the side insertion holes D from both sides respectively.

[0029] This utility model features an integrated liftable clamping and fixing mold with a rolling wheel force application structure and rubber pads of appropriate hardness and thickness, which improves the bending efficiency of the lead wire, ensures consistency, and effectively protects the ceramic (glass) insulator of the lead wire.

[0030] This utility model is reasonably designed, low in cost, sturdy and durable, safe and reliable, simple to operate, time-saving and labor-saving, cost-saving, compact in structure and easy to use. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the base component of this utility model.

[0032] Figure 2 This is a schematic diagram of the base component structure of this utility model.

[0033] Figure 3 This is a schematic diagram of the lower fixed mold structure of this utility model.

[0034] Figure 4 This is a schematic diagram of the upper movable mold structure of this utility model.

[0035] Figure 5This is a schematic diagram of the clamping fixture structure of this utility model.

[0036] Figure 6 This is a schematic diagram of the bending bracket structure of this utility model.

[0037] Figure 7 This is a schematic diagram of the structure of this utility model.

[0038] The components include: 1. Base; 2. Lower fixed mold; 3. Upper movable mold; 4. Clamping fixture; 5. Bending bracket; 6. Upper connecting bolt; 7. Base connecting hole A; 8. Lower mold stop; 9. Lower mold connecting hole B; 10. Lower positioning stop; 11. Lower lateral groove; 12. Lower screw hole B; 13. Side insertion hole D; 14. Upper screw hole C; 15. Process groove; 16. Upper positioning stop; 17. Upper lateral groove; 18. Crossbar D; 19. Lower pressure roller; 20. Bottom threaded hole A; 21. Extended hollow column C; 22. Integrated circuit component; 23. Angled hand-held bracket. Detailed Implementation

[0039] like Figure 1-7 As shown, the lead bending fixture for the hybrid integrated circuit metal flat package of this embodiment includes a clamping fixture 4; an upper movable mold 3 is movable below the clamping fixture 4, which moves up and down to facilitate the placement, bending and removal of the integrated circuit.

[0040] The lower fixed mold 2 is fitted below the upper movable mold 3;

[0041] The lower fixed mold 2 and the upper movable mold 3 are used to clamp the integrated circuit component 22;

[0042] A side insertion hole D13 is provided horizontally in the upper movable mold 3;

[0043] A bent bracket 5 is inserted into the side socket D13;

[0044] A pressing roller 19 is provided on the lower side of the bending bracket 5 for pressing down the lead wire, which facilitates the fixed connection. Its rolling setting reduces friction, thereby reducing wear on the lead wire.

[0045] An extended hollow column C21 is provided on the top surface of the clamping fixture 4; it serves as a guide.

[0046] A screw hole C14 is provided on the top of the upper movable mold 3;

[0047] An upper connecting bolt 6 passes underneath the extended hollow column C21;

[0048] The upper connecting bolt 6 is threaded into the upper screw hole C14 to achieve connection and support. By adjusting the bolt screw length, it can meet the needs of integrated circuits of different heights.

[0049] A base component 1 is provided below the fixed mold 2 to serve as a fixed support.

[0050] As a specific technological innovation, a lower mold stop 8 is provided in the middle of the base component 1; a lower mold connecting hole B9 is provided at the lower mold stop 8; thereby achieving positioning and avoiding obstruction.

[0051] A base connection hole A7 is provided on the base component 1;

[0052] The clamping fixture 4 is a gantry frame, which facilitates the assembly and disassembly of the upper mold. The bottom of the gantry frame is provided with a bottom threaded hole A20 that is connected to the base connection hole A7 by bolts.

[0053] The bottom of the lower fixed mold 2 is set in the base connection hole A7;

[0054] The bottom surface of the lower fixed mold 2 is provided with a lower screw hole B12 that is connected to the lower mold connection hole B9 by bolts.

[0055] A lower positioning stop 10 is provided on the upper surface of the lower fixed mold 2 for positioning the lower part of the integrated circuit component 22. Lower lateral grooves 11 are provided on both sides of the lower positioning stop 10 for exposing the leads of the integrated circuit component 22.

[0056] A process groove 15 is provided on the top of the upper movable mold 3;

[0057] An upper positioning stop 16 is provided at the bottom of the upper movable mold 3;

[0058] Upper lateral grooves 17 are provided on both sides of the upper positioning stop 16;

[0059] A downward pressure roller 19 is provided on the lower side of the middle part of the bending bracket 5;

[0060] The bending bracket 5 includes a crossbar D18 and an inclined hand grip 23 connected to the crossbar D18;

[0061] The crossbar D18 is used to insert into the side insertion holes D13 from both sides respectively.

[0062] The downward roller 19 is located at the corner of the crossbar D18 and the inclined hand holder 23, so that the crossbar D18 can be inserted into the hole as much as possible. The inclined hand holder 23 is set at an angle, thereby generating downward and inward component forces, preventing the crossbar D18 from moving outward during the downward pressing process, thus keeping the force inward at all times. At the same time, it is convenient for people to operate with both hands.

[0063] The working principle is as follows: The lower fixed mold 2 and the clamping fixture 4 are installed on the base component 1. The upper movable mold 3 is installed on the clamping fixture 4 through the upper connecting bolt 6, and its range of motion is adjusted. The integrated circuit component 22 is placed in the lower positioning stop 10, and the crossbar D18 of the bending bracket 5 is inserted into the side insertion hole D13. Both hands press down on the inclined hand-held brackets 23 on both sides, and exert force downward together, so that the downward pressing roller 19 presses down on the lead wire, thereby realizing bending. It is convenient, flexible, and versatile, and is suitable for manual small-batch processing of lead wires.

[0064] This utility model is described in detail for the purpose of making the disclosure clearer, and the prior art will not be listed one by one.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. It is obvious to those skilled in the art that multiple technical solutions of this utility model can be combined. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model. All technical contents not described in detail in this utility model are publicly known technologies.

Claims

1. A lead bending fixture for a hybrid integrated circuit metal flat package, characterized in that: Includes a clamping fixture (4); below the clamping fixture (4) is an upper movable mold (3); Below the upper movable mold (3) is the lower fixed mold (2); The lower fixed mold (2) and the upper movable mold (3) are used to clamp the integrated circuit device (22); A side insertion hole D (13) is provided horizontally in the upper movable mold (3); A bent bracket (5) is inserted into the side insertion hole D (13); A pressing roller (19) is provided on the lower side of the bending bracket (5) for pressing down the lead wire; An elongated hollow column C(21) is provided on the top surface of the clamping fixture (4); A screw hole C (14) is provided on the top of the upper movable mold (3); An upper connecting bolt (6) passes under the extended hollow column C(21); The upper connecting bolt (6) is threaded into the upper screw hole C (14).

2. The lead bending fixture for hybrid integrated circuit metal flat packages according to claim 1, characterized in that: A base component (1) is provided below the fixed mold (2); A lower mold stop (8) is provided in the middle of the base part (1); a lower mold connecting hole B (9) is provided at the lower mold stop (8); A base connection hole A (7) is provided on the base component (1); The clamping fixture (4) is a gantry frame, and a bottom threaded hole A (20) is provided at the bottom of the gantry frame to be connected to the base connection hole A (7) by bolts; The bottom of the lower fixed mold (2) is set in the base connection hole A (7); The bottom surface of the lower fixed mold (2) is provided with a lower screw hole B (12) that is connected to the lower mold connection hole B (9) by bolts.

3. The lead bending fixture for hybrid integrated circuit metal flat packages according to claim 2, characterized in that: A lower positioning stop (10) is provided on the upper surface of the lower fixed mold (2) for positioning the lower part of the integrated circuit device (22). Lower lateral grooves (11) are provided on both sides of the lower positioning stop (10) for exposing the leads of the integrated circuit device (22).

4. The lead bending fixture for hybrid integrated circuit metal flat packages according to claim 3, characterized in that: A process groove (15) is provided on the top of the upper movable mold (3); An upper positioning stop (16) is provided at the bottom of the upper movable mold (3); Upper lateral grooves (17) are provided on both sides of the upper positioning stop (16); The bending bracket (5) includes a crossbar D (18) and an inclined hand grip (23) connected to the crossbar D (18); The crossbar D(18) is used to be inserted into the side insertion holes D(13) from both sides respectively; The downward roller (19) is located at the corner of the crossbar D (18) and the inclined handrail (23).