Chip pin forming device

Abstract

The utility model provides a chip pin forming device, and belongs to the field of chip processing. The forming device comprises a rack, a material bearing block, an upper die, a lower die, a lower pressing rod and the like. Wherein a fixed seat is arranged on the rack; and the material bearing block is used for mounting a chip, is movably connected with the fixed seat and can move up and down under the action of external force. The lower die is fixedly connected with the fixing base and located on one side of the material bearing block, and the upper die is connected with the rack and can move up and down under the action of external force. After the chip is mounted on the material bearing block, the pin is positioned between the upper die and the lower die; and the upper die and the lower pressing rod are respectively positioned on two sides of the chip main body part. The lower end of the lower pressing rod abuts against the upper surface of the other side of the material bearing block, so that the two sides of the material bearing block are evenly stressed, and the material bearing block is prevented from being stuck. Due to the fact that the die is adopted for pressing, the shape error of the formed pin is small, and the quality is stable. And the material bearing block can adaptively move downwards, so that the probability of chip damage can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip processing, and more specifically, to a chip pin forming device. Background Technology

[0002] Packaging is a crucial step in chip manufacturing. Depending on the manufacturing process, it is categorized into different packaging types, such as leaded packages and leadless packages. For chips with leads, the leads are located on one or both sides of the chip body, and the shape of the leads is bent according to actual needs; the process of bending the leads into the required shape is called lead forming.

[0003] Traditional lead forming methods involve manual bending, which can easily lead to large errors in the bending shape and inconsistent quality. Utility Model Content

[0004] The purpose of this invention is to provide a chip pin forming device, which uses an upper mold and a lower mold with specific shapes to press and form the pins, thereby reducing bending shape errors and improving quality stability.

[0005] This utility model is implemented as follows:

[0006] A chip pin forming apparatus, the forming apparatus comprising:

[0007] The frame includes a mounting base;

[0008] A support block is used to mount chips; the support block is located above the fixing base, and an elastic element is provided between the support block and the fixing base, so that the support block can move up and down relative to the fixing base;

[0009] The lower mold is disposed on one side of the material receiving block;

[0010] The upper mold is connected to the frame and located above the lower mold, and the upper mold can move up and down relative to the lower mold;

[0011] A lower pressure rod, which is fixedly connected to the upper mold;

[0012] After the chip is installed on the material support block, the pins of the chip are located between the upper mold and the lower mold. The upper mold and the lower pressure rod are located on both sides of the chip body. When the upper mold is pressed down, the lower pressure rod can abut against the upper part of the material support block.

[0013] Furthermore, a pressure block is provided on the side of the lower pressure rod near the upper mold. When the lower end of the lower pressure rod abuts against the upper surface of the material support block, a gap is provided between the pressure block and the upper surface of the material support block. The gap can be used to accommodate the side of the chip away from its pins, so as to limit the upward tilting of the side of the chip away from its pins by the pressure block.

[0014] Furthermore, the upper surface of the receiving block is provided with a mounting groove for accommodating the main body of the chip, with the side of the chip away from its pins and the pins of the chip located outside the mounting groove.

[0015] Furthermore, the fixing base and / or the material support block are provided with mounting holes, the elastic element is disposed in the mounting holes, and the free end of the elastic element abuts against the material support block.

[0016] Furthermore, the upper part of the fixing base is provided with a groove, and the lower part of the material receiving block is provided with a boss. The boss is disposed in the groove and can slide along the depth direction of the groove.

[0017] Furthermore, a positioning pin is provided below the side of the chip away from its pins, and a positioning pin clearance hole is also provided on the upper surface of the material support block. When the main body of the chip is installed on the material support block, the positioning pin is inserted into the positioning pin clearance hole.

[0018] Furthermore, it also includes a drive mechanism, which is mounted on the frame and connected to the upper mold, for driving the upper mold to move up and down.

[0019] Furthermore, the drive mechanism includes a cam, which is rotatably connected to the frame and engages with the upper mold.

[0020] Furthermore, the upper mold is a punch, and the lower mold is a die.

[0021] The beneficial effects of this utility model are:

[0022] The chip pin forming device of this invention, as designed above, fixes the main body of the chip onto a support block during use; at this time, the ends of the pins are located between the upper and lower molds. The upper and lower molds have shapes that match the formed pins. When the upper mold moves downward, the pins are pressed and formed between the upper and lower molds, thus forming the corresponding shape. Due to the use of mold pressing, the shape error of the formed pins is small, and the quality is relatively stable.

[0023] When the upper die presses down, the support block can move downwards adaptively; when the upper die returns to its original position, the support block can return to its original position under the action of the elastic element. However, if the support block remains stationary, the force between the pins and the chip body will be very large when the upper die presses down, which could potentially damage the chip. Therefore, the ability of the support block to move downwards adaptively reduces the probability of chip damage.

[0024] Furthermore, since the aforementioned molding device primarily presses and shapes the pins on one side of the chip, if there is no pressure rod when the upper mold presses down, the force on the side of the support block will be uneven, which may cause the support block to jam on the fixed seat. Therefore, the installation of the pressure rod ensures that the force on both sides of the support block is even, preventing the support block from jamming. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the molding device provided in Example 1.

[0027] Figure 2 This is a schematic diagram of the molding device provided in Embodiment 2 when the upper mold is pressed down;

[0028] Figure 3 This is a schematic diagram of the molding device provided in Embodiment 2 when the upper mold moves upward;

[0029] Icons: 1-Forming device; 11-Material support block; 112-Mounting hole; 113-Boss; 12-Fixing base; 121-Positioning pin clearance hole; 122-Groove; 13-Lower mold; 14-Upper mold; 15-Lower pressure rod; 16-Pressure block; 2-Chip; 21-Pin; 22-Main body; 23-Heat sink. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Example

[0031] like Figure 1 This embodiment provides a chip pin forming device 1, which is mainly used to press the pins 21 of chip 2 into a preset shape;

[0032] Specifically, the molding device 1 includes a frame, a support block 11, an upper mold 14, a lower mold 13, and a lower pressure rod 15, etc.; wherein, the frame is used to fix other components, and a fixing seat 12 is also provided on the frame; the support block 11 is used to install the chip 2, the support block 11 is located above the fixing seat 12, and an elastic element (such as a compression spring) is provided between the support block 11 and the fixing seat 12; the support block 11 can move downward relative to the fixing seat 12 under the action of external force, and can move upward under the action of the elastic element.

[0033] The lower mold 13 is fixedly connected to the fixed base 12 and located on one side of the support block 11. The upper mold 14 is connected to the frame and can move up and down under the action of external force. When the chip 2 is installed on the support block 11, the pin 21 is located between the upper mold 14 and the lower mold 13. The upper mold 14 and the pressing rod 15 are located on both sides of the main body of the chip 2. In this embodiment, the upper mold 14 adopts a punch and the lower mold 13 adopts a die. When the upper mold 14 presses down, since the pin 21 is located between the upper mold 14 and the lower mold 13, the pin 21 is pressed into shape. In addition, the lower end of the pressing rod 15 abuts against the upper surface of the other side of the support block 11, so that the two sides of the support block 11 are evenly stressed and prevented from being jammed.

[0034] The chip 2 corresponding to the molding device 1 described above can be a power device, specifically a TO-263 surface mount type. This chip includes a main body 22, pins 21, and a heat sink 23, with the pins 21 and heat sink 23 located on opposite sides of the main body. In other embodiments, other types of chips may also be used.

[0035] Furthermore, the upper part of the fixing base 12 is provided with a groove 122, and the lower part of the material support block 11 is provided with a boss 113. The boss 113 is disposed in the groove 122 and can slide along the depth direction of the groove 122. The cooperation between the groove 122 and the boss 113 provides a guiding effect for the movement of the material support block 11. In addition, both the groove 122 and the boss 113 are provided with mounting holes 112, and an elastic element (not shown in the figure) is disposed in the mounting hole 112; the upper end of the elastic element abuts against the material support block 11, and the lower end abuts against the fixing base 12; the elastic force of the elastic element can cause the material support block 11 to move upward. In other embodiments, the boss 113 may also be provided on the fixing base 12, and the groove 122 may be provided on the material support block 11, or other guiding structures in the prior art may also be used.

[0036] To facilitate the installation and fixing of chip 2, the support block 11 is provided with a mounting groove. In use, the main body of chip 2 is embedded into the mounting groove, with the side of the chip away from its pins and the chip's pins located outside the mounting groove, such as the pins 21 of the aforementioned power device and the heat sink 23 located outside the mounting groove; after processing, chip 2 can be removed from the mounting groove.

[0037] In addition, a positioning pin (not shown in the figure) is provided on the lower side of the chip 2 away from the pin 21, and a positioning pin clearance hole 121 is provided on the upper surface of the support block. When the main body of the chip 2 is installed on the support block 11, the positioning pin is inserted into the positioning pin clearance hole 121.

[0038] To drive the upper die 14 and the lower pressure rod 15 to move, a drive mechanism (not shown in the figure) is also provided. In this embodiment, the drive mechanism adopts a cam mechanism, with the cam positioned above the punch and rotatably connected to the frame. The cam rotates under the drive of a motor, thereby driving the upper die 14 to move up and down. Since the drive mechanism can directly adopt the cam mechanism in the prior art, it will not be described in detail. In other embodiments, the drive mechanism can also adopt a cylinder or other structure.

[0039] Taking the aforementioned power device as an example, the working principle of the chip pin forming device 1 provided in this embodiment is as follows:

[0040] When it is necessary to press-form pin 21, the upper mold 14 and the lower pressure rod 15 are first moved upwards, and the main body of chip 2 is installed in the mounting groove of the support block 11. At this time, the side of the chip away from its pin 21 and the pin 21 of chip 2 are located outside the mounting groove, and the pin 21 is located below the upper mold 14. After installation, the drive mechanism is started, and the upper mold 14 and the lower pressure rod 15 move downwards synchronously. When the upper mold 14 touches the pin 21, the lower end of the lower pressure rod 15 abuts against the support block 11. When the upper mold 14 and the lower pressure rod 15 continue to press down, the support block 11 and chip 2 move downwards together, so that the pin 21 is pressed and formed between the upper mold 14 and the lower mold 13. Example

[0041] Please refer to Figure 2 and Figure 3 The chip pin forming device provided in this embodiment mainly has a pressure block 16 set at the lower end of the pressure rod 15.

[0042] Please refer to Figure 1 When the upper mold 14 is pressed down, the pin 21 is subjected to a downward force, which may cause the heat sink 23 to tilt upward; and the chip 2 tilts upward, which directly causes the relative position of the pin 21 to be unstable, and thus the bending angle of the pin 21 to be unstable.

[0043] Please refer to Figure 2Therefore, in this embodiment, the pressing rod 15 has a pressing block 16 on the side facing the upper mold. When the lower end of the pressing rod 15 abuts against the material receiving block 11, a certain gap is formed between the lower end of the pressing block 16 and the upper surface of the material receiving block 11. This gap is slightly larger than the thickness of the heat sink 23, and is used to accommodate the heat sink 23. When one side of the heat sink 23 of the chip 2 tends to tilt upwards, the lower end of the pressing block 16 abuts against the upper surface of the heat sink 23, thereby preventing the side of the chip 2 away from its pins (heat sink 23) from tilting upwards. If the pressing rod 15 acts directly on the heat sink 23, it may cause the heat sink 23 to deform. Therefore, the pressing block 16 is used to prevent the side of the chip 2 from tilting upwards and to minimize the force on the heat sink 23, thus preventing deformation of the heat sink 23.

[0044] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip pin forming apparatus, characterized in that, The molding apparatus includes: The frame includes a mounting base; A support block is used to mount chips; the support block is located above the fixing base, and an elastic element is provided between the support block and the fixing base, so that the support block can move up and down relative to the fixing base; The lower mold is disposed on one side of the material receiving block; The upper mold is connected to the frame and located above the lower mold, and the upper mold can move up and down relative to the lower mold; A lower pressure rod, which is fixedly connected to the upper mold; After the chip is installed on the material support block, the pins of the chip are located between the upper mold and the lower mold. The upper mold and the lower pressure rod are located on both sides of the chip body. When the upper mold is pressed down, the lower pressure rod can abut against the upper part of the material support block.

2. The chip pin forming apparatus according to claim 1, characterized in that: A pressure block is provided on the side of the lower pressure rod near the upper mold. When the lower end of the lower pressure rod abuts against the upper surface of the material support block, a gap is provided between the pressure block and the upper surface of the material support block. The gap can be used to accommodate the side of the chip away from its pins, so as to limit the upward tilting of the side of the chip away from its pins by the pressure block.

3. The chip pin forming apparatus according to claim 1 or 2, characterized in that: The upper surface of the material receiving block is provided with a mounting groove for accommodating the main body of the chip, with the side of the chip away from its pins and the pins of the chip located outside the mounting groove.

4. The chip pin forming apparatus according to claim 1 or 2, characterized in that: The fixing base and / or the material support block are provided with mounting holes, the elastic element is disposed in the mounting holes, and the free end of the elastic element abuts against the material support block.

5. The chip pin forming apparatus according to claim 1, characterized in that: The upper part of the fixing base is provided with a groove, and the lower part of the material receiving block is provided with a boss. The boss is disposed in the groove and can slide along the depth direction of the groove.

6. The chip pin forming apparatus according to claim 1, characterized in that: A positioning pin is provided on the side of the chip away from its pins. The upper surface of the support block is also provided with a positioning pin clearance hole. When the main body of the chip is installed on the support block, the positioning pin is inserted into the positioning pin clearance hole.

7. The chip pin forming apparatus according to claim 1, characterized in that: It also includes a drive mechanism, which is mounted on the frame and connected to the upper mold, for driving the upper mold to move up and down.

8. The chip pin forming apparatus according to claim 7, characterized in that: The drive mechanism includes a cam, which is rotatably connected to the frame and engages with the upper mold.

9. The chip pin forming apparatus according to claim 1, characterized in that: The upper mold is a punch, and the lower mold is a die.

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