Transfer mechanism used after SMT patch curing

Abstract

The utility model relates to the technical field of SMT patch processing, and discloses a transfer mechanism after SMT patch curing, which comprises a box body, a plurality of rectangular grooves, supporting seats and L-shaped frames are symmetrically arranged on the left side and the right side of the inner wall of the box body, and a pressing plate is slidably mounted between every two opposite rectangular grooves. Through cooperative arrangement of the pressing plate, the spring, the movable groove, the lifting handle, the fixed plate and the rubber seat, the pressing plate and the rubber seat are driven to press an SMT patch workpiece under the action of the elastic force of the spring, when the workpiece needs to be taken out, the lifting handle is lifted to drive the pressing plate and the rubber seat to move upwards, the lifting handle can be moved to the position above the L-shaped frame, and then the workpiece is taken out. The lifting handle, the pressing plate and the rubber base are supported by the L-shaped frame, then the pressing effect on the workpiece is relieved, the steps are simple, the time for workers to take out the workpiece is shortened, and the production efficiency is indirectly improved.

Description

Technical Field

[0001] This utility model relates to the field of SMT chip assembly technology, and in particular to a transfer mechanism for SMT chip curing. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). PCB stands for Printed Circuit Board, and SMT stands for Surface Mount Technology. It is one of the most popular technologies and processes in the electronics assembly industry. Surface Mount Technology is a circuit assembly technology that mounts leadless or short-lead surface mount components on the surface of a printed circuit board or other substrates and assembles them by reflow soldering or dip soldering.

[0003] For example, Chinese utility model patent application number 202321379502.0 discloses a transfer and storage device for SMT components, including a box. Slot seats are symmetrically and evenly fixed on both sides of the inner wall of the box. A sliding groove is formed on the outer surface of the slot seat on the side away from the inner wall of the box. A slider is provided between the sliding groove and the placement rack. Threaded holes are formed at equal intervals on the bottom wall of the placement rack. A mounting stud is provided between the threaded hole and the limiting seat. An adjusting screw is installed through the upper surface of the limiting seat. The advantage of this utility model is that: due to the torsion spring shaft being twisted, the limiting plate shifts, and the slider loses its limiting function. The placement rack is pulled out through the push-pull groove. Referring to the specifications of the SMT component, the limiting seat is screwed into the threaded hole through the mounting stud. After the SMT component is placed stably, the adjusting screw is turned. When the adjusting screw extends, it drives a silicone pressure plate to press against the upper end of the SMT component. The application of this device effectively avoids the above problems and improves the practicality of the equipment.

[0004] The aforementioned patent describes a method for transferring SMT (Surface Mount Technology) workpieces. It involves installing studs at the four corners of the workpiece and then turning an adjusting screw to press a silicone pressure plate onto the workpiece, thus clamping and fixing it in place. However, when removing the SMT workpiece, at least two studs must be removed first, making the process cumbersome and labor-intensive. Furthermore, since most SMT workpieces are thin, they tend to be close to the placement rack, making removal inconvenient. This method needs improvement. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a transfer mechanism for SMT chip curing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a transfer mechanism for SMT chip curing, comprising a housing, wherein several rectangular slots, support seats, and L-shaped frames are symmetrically arranged on the left and right sides of the inner wall of the housing, a pressure plate is slidably installed between each pair of opposite rectangular slots, rubber seats are fixedly connected to the four corners of the bottom of the pressure plate, a pressing component is provided on the top of the pressure plate, and lifting components are provided on the left and right sides of the front of the pressure plate, a placement frame is slidably installed between each pair of opposite support seats, a baffle is fixedly connected to the bottom of the placement frame, and a lifting component is provided at the bottom of the placement frame. The number of rectangular slots, support seats, and L-shaped frames are matched appropriately, and the height of the rubber seats is greater than the height of the placement frame, so that when the pressure plate is pressed down, the lifting handle will not collide with the placement frame.

[0007] As a further description of the above technical solution:

[0008] The clamping assembly includes four springs fixedly connected to the four corners of the pressure plate, and a fixing plate is fixedly connected to the top of each spring. The fixing plate is fixedly connected to the inner wall of the box.

[0009] As a further description of the above technical solution:

[0010] The lifting assembly includes a movable groove fixedly opened on one side of the front of the pressure plate. A lifting handle is slidably installed inside the movable groove. The size of the movable groove is adapted to the L-shaped frame, so that when the pressure plate is lifted, the lifting handle can be placed on the L-shaped frame, and when the pressure plate needs to be pressed down, the lifting handle can be removed from the L-shaped frame.

[0011] As a further description of the above technical solution:

[0012] The lifting assembly includes a U-shaped frame fixedly installed at the bottom of the placement rack. An operating rod is slidably installed inside the U-shaped frame. One end of the operating rod is fixedly connected to a lifting column. A top plate is fixedly connected to the top of the lifting column. The lifting column moves through a baffle. The top of the top plate is flush with the top of the inner wall of the placement rack, so that the SMT component can be placed flat in the placement rack.

[0013] As a further description of the above technical solution:

[0014] A high-permeability metal plate is fixedly connected to the back of the placement rack, and a permanent magnet is fixedly connected to the front of the inner wall of the box at the position corresponding to the high-permeability metal plate.

[0015] As a further description of the above technical solution:

[0016] The front of the box is hinged to a door, and a door handle is fixedly connected to the front of the door.

[0017] As a further description of the above technical solution:

[0018] The four corners of the bottom of the box are movably mounted with rollers, which facilitate the movement of the transfer mechanism.

[0019] As a further description of the above technical solution:

[0020] A push rod is fixedly connected to one side of the box, which allows staff to easily push the transfer mechanism.

[0021] This utility model has the following beneficial effects:

[0022] 1. Compared with existing technologies, this SMT component curing transfer mechanism, through the coordinated arrangement of a pressure plate, spring, movable groove, lifting handle, fixed plate, and rubber seat, uses the spring force to drive the pressure plate and rubber seat to press the SMT component. When it is necessary to remove the component, the lifting handle is lifted, which moves the pressure plate and rubber seat upwards and moves the lifting handle above the L-shaped frame. This allows the L-shaped frame to support the lifting handle, pressure plate, and rubber seat, thereby releasing the pressing effect on the component. The process is simple, reduces the time for workers to remove the component, and indirectly improves production efficiency.

[0023] 2. Compared with the existing technology, the SMT chip curing transfer mechanism, through the coordinated arrangement of the operating lever, lifting column, and top plate, allows the operating lever to be lifted upwards when the SMT chip needs to be removed, thereby driving the lifting column and top plate to move upwards, so that the top plate pushes the chip upwards, increasing the distance between the chip and the placement rack, making it easier for the staff to remove it. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the overall structure of a transfer mechanism after SMT chip curing proposed in this utility model.

[0025] Figure 2 This is a three-dimensional schematic diagram of the overall internal structure of a transfer mechanism for SMT chip curing proposed in this utility model.

[0026] Figure 3 This is a three-dimensional schematic diagram of the internal structure of the box of a transfer mechanism for SMT chip curing proposed in this utility model.

[0027] Figure 4 This is a schematic diagram of the pressing and lifting components of a transfer mechanism for SMT chip curing according to the present invention.

[0028] Figure 5 This is a schematic diagram of the placement rack and lifting assembly structure of a transfer mechanism for SMT chip curing proposed in this utility model.

[0029] Figure 6 This is a schematic diagram of the placement rack and baffle structure of a transfer mechanism for SMT chip curing proposed in this utility model;

[0030] Figure 7 This is a schematic diagram of the lifting component structure of a transfer mechanism after SMT chip curing proposed in this utility model.

[0031] Legend:

[0032] 1. Box body; 2. Rectangular groove; 3. Support base; 4. L-shaped frame; 5. Pressure plate; 6. Rubber seat; 7. Push rod; 8. Placement rack; 9. Baffle; 10. Roller; 11. Spring; 12. Fixing plate; 13. Movable groove; 14. Lifting handle; 15. U-shaped frame; 16. Operating lever; 17. Lifting column; 18. Top plate; 19. High magnetic permeability metal plate; 20. Permanent magnet; 21. Box door; 22. Door handle. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Reference Figure 1-7 This utility model provides a transfer mechanism for SMT chip curing: it includes a box body 1, with several rectangular slots 2, support seats 3 and L-shaped frames 4 symmetrically arranged on the left and right sides of the inner wall of the box body 1. A pressure plate 5 is slidably installed between each pair of opposite rectangular slots 2. Rubber seats 6 are fixedly connected to the four corners of the bottom of the pressure plate 5. A pressing component is provided on the top of the pressure plate 5. Lifting components are provided on the left and right sides of the front of the pressure plate 5. A placement frame 8 is slidably installed between each pair of opposite support seats 3. A baffle 9 is fixedly connected to the bottom of the placement frame 8. A lifting component is provided at the bottom of the placement frame 8. A box door 21 is hinged to the front of the box body 1. A door handle 22 is fixedly connected to the front of the box door 21. Rollers 10 are movably installed at the four corners of the bottom of the box body 1. A push rod 7 is fixedly connected to one side of the box body 1.

[0035] The clamping assembly includes four springs 11 fixedly connected to the four corners of the pressure plate 5. A fixing plate 12 is fixedly connected to the top of the springs 11, and the fixing plate 12 is fixedly connected to the inner wall of the housing 1.

[0036] By setting up the clamping assembly, under the elastic force of the spring 11, the pressure plate 5 and the rubber seat 6 are driven to clamp the SMT component. When it is necessary to remove the component, the lifting handle 14 is lifted, which drives the pressure plate 5 and the rubber seat 6 to move upward. The lifting handle 14 can be moved above the L-shaped frame 4, so that the L-shaped frame 4 supports the lifting handle 14, the pressure plate 5 and the rubber seat 6, thereby releasing the clamping effect on the component. The process is simple, reduces the time for workers to remove the component, and indirectly improves production efficiency.

[0037] The lifting assembly includes a movable groove 13 fixedly opened on one side of the front of the pressure plate 5, and a lifting handle 14 is slidably installed inside the movable groove 13.

[0038] The lifting assembly includes a U-shaped frame 15 fixedly installed at the bottom of the placement frame 8. An operating rod 16 is slidably installed inside the U-shaped frame 15. One end of the operating rod 16 is fixedly connected to a lifting column 17. A top plate 18 is fixedly connected to the top of the lifting column 17. The lifting column 17 movably passes through the baffle 9.

[0039] By setting up the lifting assembly, when it is necessary to remove the SMT placement workpiece, the operating lever 16 is lifted upward, thereby driving the lifting column 17 and the top plate 18 to move upward, so that the top plate 18 pushes the workpiece upward, increasing the distance between the workpiece and the placement rack 8 pieces, making it easier for the staff to remove it.

[0040] A high-permeability metal plate 19 is fixedly connected to the back of the placement rack 8. A permanent magnet 20 is fixedly connected to the front of the inner wall of the box 1 at the position corresponding to the high-permeability metal plate 19. Through the cooperation of the permanent magnet 20 and the high-permeability metal plate 19, the magnetic attraction force of the permanent magnet 20 can fix the placement rack 8 and prevent the placement rack 8 from moving during the movement of the transfer mechanism.

[0041] Working principle: When it is necessary to transfer SMT component parts, first open the box door 21 through the door handle 22, then pull out the placement rack 8, put the SMT component parts into the placement rack 8, and then push the placement rack 8 back to its original position. Under the action of the permanent magnet 20, the high magnetic permeability metal plate 19 and the placement rack 8 are attracted by the permanent magnet 20, thereby preventing the placement rack 8 from moving along the support base 3 during the transfer mechanism movement.

[0042] Then, the staff holds the lifting handle 14 with both hands and pulls it upward. After the height of the lifting handle 14 exceeds the L-shaped frame 4, the two lifting handles 14 are moved towards each other along the movable groove 13. At this time, the L-shaped frame 4 loses its support for the lifting handle 14. Then the lifting handle 14 is lowered, and under the action of the spring 11, the pressure plate 5 moves downward, which drives the rubber seat 6 to move downward, thereby pressing the four corners of the SMT placement workpiece inside the placement rack 8. Then the box door 21 is closed, and the box body 1 is pushed by the push rod 7 for transfer.

[0043] When it is necessary to remove the SMT component, open the door 21, grasp the left and right lifting handles 14, lift the lifting handles 14 upwards, causing the pressure plate 5 and rubber seat 6 to move upwards. After the height of the lifting handles 14 exceeds the L-shaped frame 4, move the two lifting handles 14 in the opposite direction. After the lifting handles 14 move above the L-shaped frame 4, lower the lifting handles 14, so that the L-shaped frame 4 provides over-support for the lifting handles 14 and the pressure plate 5. At this time, the rubber seat 6 releases the clamping effect on the SMT component.

[0044] Then, take out the placement rack 8, lift the operating lever 16 upward, and drive the lifting column 17 and the top plate 18 upward, thereby lifting the SMT placement workpiece in the placement rack 8 upward, so that the staff can take it out easily.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transfer mechanism for SMT chip curing, comprising a housing (1), characterized in that: The inner walls of the box (1) are symmetrically provided with several rectangular slots (2), support seats (3) and L-shaped frames (4) on both sides. A pressure plate (5) is slidably installed between each pair of opposite rectangular slots (2). Rubber seats (6) are fixedly connected to the four corners of the bottom of the pressure plate (5). A pressing component is provided on the top of the pressure plate (5). Lifting components are provided on both sides of the front of the pressure plate (5). A placement frame (8) is slidably installed between each pair of opposite support seats (3). A baffle (9) is fixedly connected to the bottom of the placement frame (8). A lifting component is provided at the bottom of the placement frame (8).

2. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: The clamping assembly includes four springs (11) fixedly connected to the four corners of the pressure plate (5). A fixing plate (12) is fixedly connected to the top of each spring (11), and the fixing plate (12) is fixedly connected to the inner wall of the box (1).

3. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: The lifting assembly includes a movable groove (13) fixedly opened on one side of the front of the pressure plate (5), and a lifting handle (14) is slidably installed inside the movable groove (13).

4. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: The lifting assembly includes a U-shaped frame (15) fixedly installed at the bottom of the placement frame (8). An operating rod (16) is slidably installed inside the U-shaped frame (15). One end of the operating rod (16) is fixedly connected to a lifting column (17). A top plate (18) is fixedly connected to the top of the lifting column (17). The lifting column (17) movably passes through the baffle (9).

5. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: A high-permeability metal plate (19) is fixedly connected to the back of the placement rack (8), and a permanent magnet (20) is fixedly connected to the front of the inner wall of the box (1) at the position corresponding to the high-permeability metal plate (19).

6. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: The front of the box (1) is hinged with a box door (21), and the front of the box door (21) is fixedly connected with a door handle (22).

7. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: Rollers (10) are movably installed at the four corners of the bottom of the box (1).

8. The transfer mechanism after SMT chip curing according to claim 1, characterized in that: A push rod (7) is fixedly connected to one side of the box (1).

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