Conductive silica gel composite material

Abstract

The utility model discloses a conductive silica gel composite material. Comprising a conductive silica gel layer, a conductive double-sided adhesive layer arranged on the upper end face of the conductive silica gel layer in a coating mode, a nano carbon copper layer arranged on the upper end face of the conductive double-sided adhesive layer in a coating mode, a first release film layer arranged on the upper end face of the nano carbon copper layer in a bonding mode, and a second release film layer or an FIP conductive silica gel layer arranged on the lower end face of the conductive silica gel layer in a bonding mode. The utility model has the advantages that good gap filling, sealing and electric conduction can be realized on the surface of a product by utilizing the good electric conduction, shielding and sealing performance of the FIP conductive silica gel formed on site and matching with the characteristic that different sizes and shapes can be designed by the conventional conductive silica gel layer, and meanwhile, the excellent double-conduction performance and shielding effectiveness of the nano carbon copper layer are utilized, so that the sealing performance of the product is greatly improved. Therefore, the whole composite material has good conductivity, shielding, bonding, sealing and buffering performance.

Description

Technical Field

[0001] This utility model relates to the field of composite materials, specifically a conductive silicone composite material. Background Technology

[0002] In recent years, with the popularity of automotive electronic products, especially electric vehicle electronic products, and the increasing growth of the low-altitude economy, product structures are becoming more integrated, smaller, and more diverse and irregular. This has placed new demands and challenges on the performance and function of conductive shielding and thermal dissipation materials.

[0003] Conductive silicone rubber possesses excellent conductive and shielding properties, but conventional conductive silicone rubber lacks surface adhesion, making it difficult to attach to product module surfaces. FIP conductive silicone rubber can be used for automated batch dispensing, and after curing, it bonds well to the surfaces of metal and plastic products, while also providing gap-filling and sealing properties. However, its conductivity and shielding performance are slightly inferior to conductive silicone rubber strips, and its design specifications, shapes, and structures are limited. Nano-copper-carbon possesses high dual conductivity and high shielding effectiveness, but similarly lacks surface adhesion, limiting its applications, and it also lacks gap-filling and sealing effects. Therefore, existing conductive silicone rubber composite tapes cannot simultaneously possess gap-filling, sealing, conductivity, and shielding properties.

[0004] Therefore, it is necessary to provide a conductive silicone composite material. Summary of the Invention

[0005] The present invention provides a conductive silicone composite material that effectively solves the problem that existing composite materials cannot simultaneously possess filling performance, sealing performance, conductivity and shielding performance.

[0006] The technical solution adopted in this utility model is:

[0007] A conductive silicone composite material includes a conductive silicone layer, a conductive double-sided adhesive layer coated on the upper end face of the conductive silicone layer, a nano-carbon copper layer coated on the upper end face of the conductive double-sided adhesive layer, a first release film layer bonded to the upper end face of the nano-carbon copper layer, and a second release film layer or FIP conductive silicone layer bonded to the lower end face of the conductive silicone layer.

[0008] Furthermore, the thickness of the nano-carbon copper layer is 0.03 mm to 5.0 mm.

[0009] Furthermore, the thickness of the conductive double-sided adhesive layer ranges from 0.02 mm to 1.0 mm.

[0010] Furthermore, the minimum thickness of the FIP conductive silicone layer is 0.1 mm.

[0011] Furthermore, the thickness of the conductive silicone layer ranges from 0.3 mm to 15 mm.

[0012] The beneficial effects of the utility model are: it can utilize the good conductivity and shielding properties of the field-molded FIP conductive silicone, as well as its sealing properties. Combined with conventional conductive silicone layers, it can be designed with different sizes and shapes to achieve good gap filling, sealing and conductivity of the product surface. At the same time, by utilizing the excellent dual conductivity and shielding effectiveness of the nano carbon copper layer, the overall composite material achieves good conductivity, shielding, adhesion, sealing and buffering properties. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the conductive silicone composite material provided in the embodiments of this application, excluding the FIP conductive silicone layer.

[0014] Figure 2 This is a schematic diagram illustrating the application of the conductive silicone composite material provided in the embodiments of this application on a product module.

[0015] The diagram is labeled as follows: 1. Conductive silicone layer; 2. Conductive double-sided adhesive layer; 3. Nano carbon copper layer; 4. Release film layer 1; 5. Release film layer 2; 6. FIP conductive silicone layer; 100. Product module. Detailed Implementation

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0017] like Figure 1 and Figure 2 As shown, the embodiments of this application provide a conductive silicone composite material, including a conductive silicone layer 1, a conductive double-sided adhesive layer 2 coated on the upper end face of the conductive silicone layer 1, a nano-carbon copper layer 3 coated on the upper end face of the conductive double-sided adhesive layer 2, a first release film layer 4 bonded to the upper end face of the nano-carbon copper layer 3, and a second release film layer 5 bonded to the lower end face of the conductive silicone layer 1 or an FIP conductive silicone layer 1.

[0018] It should be noted that the end face where the nano-carbon copper is bonded to the No. 1 release film has been treated with adhesive backing.

[0019] In actual use, the FIP conductive silicone layer 1 is formed on-site. First, the semi-finished products formed from the conductive silicone layer 1, nano-carbon copper layer 3, conductive double-sided adhesive layer 2, release film layer 4 (first release), and release film layer 5 (second release) are used individually. Then, the FIP conductive silicone layer 1 is formed on the product module 100 using on-site forming technology. After the FIP conductive silicone layer 1 has cured, release film layer 4 (first release) and release film layer 5 (second release) are removed. Then, the lower end face of the conductive silicone layer 1 is attached to the FIP conductive silicone layer 1. This allows the two product modules 100 that need to be bonded to be bonded to the nano-carbon copper layer 3 and the FIP conductive silicone layer 1, respectively.

[0020] In the above design, the good conductivity and shielding properties of the field-molded FIP conductive silicone, along with its sealing properties, can be utilized. Combined with the conventional conductive silicone layer 1, it can be designed with different sizes and shapes to achieve good gap filling, sealing, and conductivity on the product surface. At the same time, the excellent dual conductivity and shielding effectiveness of the nano carbon copper layer 3 are utilized to enable the overall composite material to achieve good conductivity, shielding, adhesion, sealing, and buffering properties.

[0021] Specifically, the thickness of the nano-carbon copper layer 3 is 0.03 mm to 5.0 mm.

[0022] In the above design, the resistance of the nano-carbon copper is <100mΩ (25.4mm*25.4mm), and the permeability μ'@3MHZ is >50. Specifically, the thickness of the conductive double-sided adhesive layer 2 ranges from 0.02mm to 1.0mm. This design provides excellent conductivity and shielding performance.

[0023] Specifically, the minimum thickness of the FIP conductive silicone layer 1 is 0.1 mm.

[0024] In the above design, the FPI conductive silicone filler includes, but is not limited to, carbon-nickel, aluminum-silver, copper-silver, and nickel-silver alloys. After curing, the hardness is 10–90 Shore A, the tensile strength is 1.2–5.0 MPa, the volume resistivity is 0.001–1.0 Ω*cm, the shielding effectiveness is ≥90 dB (10 MHz–15 GHz), and the thermal conductivity is 0.3–1.0 W / m*K. The FIP conductive silicone layer 1 effectively fills, seals, and conducts electricity in product gaps.

[0025] Specifically, the thickness of the conductive silicone layer 1 ranges from 0.3 mm to 15 mm.

[0026] In the above design, the conductive silicone layer 1 can be designed with different sizes, shapes, and structures. It has a hardness of 10–90 Shore A, a volume resistivity of 0.001–1.0 Ω*cm, a shielding effectiveness ≥90 dB (10MHz–15GHz), a tensile strength of 1.2–5.0 MPa, and a thermal conductivity of 0.3–1.0 W / m*K. This effectively achieves compatibility with different products and ensures conductivity.

[0027] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A conductive silicone composite material, characterized in that: It includes a conductive silicone layer (1), a conductive double-sided adhesive layer (2) coated on the upper surface of the conductive silicone layer (1), a nano carbon copper layer (3) coated on the upper surface of the conductive double-sided adhesive layer (2), a first release film layer (4) bonded to the upper surface of the nano carbon copper layer (3), and a second release film layer (5) bonded to the lower surface of the conductive silicone layer (1) or a FIP conductive silicone layer (1).

2. The conductive silicone composite material according to claim 1, characterized in that: The thickness of the nano-carbon copper layer (3) is 0.03 mm to 5.0 mm.

3. The conductive silicone composite material according to claim 1, characterized in that: The thickness of the conductive double-sided adhesive layer (2) ranges from 0.02 mm to 1.0 mm.

4. The conductive silicone composite material according to claim 1, characterized in that: The minimum thickness of the FIP conductive silicone layer (1) is 0.1 mm.

5. The conductive silicone composite material according to claim 1, characterized in that: The thickness of the conductive silicone layer (1) ranges from 0.3 mm to 15 mm.

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