Lighting device for vehicle

Abstract

The utility model provides a lighting device of a vehicle. The lighting device of the vehicle comprises a main shell, a light source and a light source, wherein a lens assembly is arranged on the main shell; the light source module is arranged in the main shell, the light source module comprises at least one light source, a wavelength conversion assembly and a first conduction plate, and the wavelength conversion assembly is located on an emergent light path of the light source; the mirror module is arranged in the main shell, the mirror module at least comprises a spatial light modulator and a second conduction plate, the spatial light modulator modulates light beams emitted by the light source module and projects the light beams to the lens assembly, and the spatial light modulator is thermally connected with the second conduction plate; the cooling module comprises a first heat dissipation plate, a second heat dissipation plate and a heat dissipation cover plate, the first heat dissipation plate and the second heat dissipation plate are connected through a pipeline, the heat dissipation cover plate is connected with the main shell in a sealed mode, the first heat dissipation plate is thermally connected with the first conduction plate, and the second heat dissipation plate is thermally connected with the second conduction plate so that heat of the light source module and the mirror module can be transmitted to the heat dissipation cover plate. The size of the whole lighting device can be reduced.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more particularly to a vehicle lighting device. Background Technology

[0002] As the eyes of a car, headlights provide low beam, high beam, and adaptive driving beam functions. However, because the low beam, high beam, and adaptive driving beam functions require different light intensity distributions on the road surface, many headlights are equipped with multiple light sources, resulting in generally large headlights that occupy a significant amount of vehicle space. Furthermore, the high dust and water resistance requirements of the headlight assembly necessitate a sealed environment, preventing direct contact with the outside. Heat from the light source and other heat-generating components within the lighting unit cannot be effectively dissipated. Existing cooling solutions, with each heat source having its own independent cooling module, are space-consuming and hinder the miniaturization of headlights. Utility Model Content

[0003] This application provides a vehicle lighting device that helps solve the problem of large space occupation by lighting devices. The various aspects involved in this application are described below.

[0004] In a first aspect, this application provides a vehicle lighting device, comprising: a main housing, on which a lens assembly is disposed; a light source module disposed within the main housing, the light source module including at least one light source, a wavelength conversion component, and a first conductive plate, the light source being thermally connected to the first conductive plate, the wavelength conversion component being located in the output light path of the light source; a mirror module disposed within the main housing, the mirror module including at least a spatial light modulator and a second conductive plate, the spatial light modulator modulating the emitted light beam of the light source module and projecting it onto the lens assembly, the spatial light modulator being thermally connected to the second conductive plate; and a cooling module including a first heat sink and a second heat sink connected by a pipe, and a heat sink cover plate, the heat sink cover plate being sealed to the main housing, the first heat sink plate being thermally connected to the first conductive plate, and the second heat sink plate being thermally connected to the second conductive plate, so as to transfer the heat from the light source module and the mirror module to the heat sink cover plate.

[0005] Secondly, this application provides a vehicle, including a vehicle body and a lighting device as described in the first aspect, the lighting device being disposed on the vehicle body.

[0006] In this embodiment, a mirror module is used to adjust the direction and area of ​​the emitted beam from the light source module, enabling the lighting device to project different patterns onto the road ahead of the vehicle. This allows for a smaller, more multifunctional lighting device that integrates functions such as low beam distribution, cornering beam distribution, high beam distribution, or anti-glare high beam imaging. This embodiment also employs an integrated heat dissipation structure, which helps reduce the number of power components and heat dissipation pipes, thus reducing the overall size and number of parts in the lighting device. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below.

[0008] Figure 1 This is a schematic diagram of a vehicle lighting device provided in an embodiment of this application.

[0009] Figure 2 yes Figure 1 A schematic diagram of the main components of the lighting device shown.

[0010] Figure 3 yes Figure 1 A schematic diagram of the optical path of the lighting device shown.

[0011] Figure 4 yes Figure 1 An exploded schematic diagram of the lighting device shown.

[0012] Figure 5 yes Figure 1 A schematic diagram of a wavelength conversion component of the lighting device shown.

[0013] Figure 6 Figure 5 The diagram shows a cross-sectional view of the wavelength conversion component.

[0014] Figure 7 yes Figure 5 The diagram shows the assembly of the wavelength conversion component with the main housing.

[0015] Figure 8 yes Figure 1 A schematic diagram of the cooling module of the lighting device shown.

[0016] Figure 9 yes Figure 1 The diagram shows the assembly effect of the cooling module and the main housing of the lighting device.

[0017] Figure 10 yes Figure 1 An exploded view of the assembly of the cooling module and the main housing of the lighting device shown.

[0018] Figure 11 yes Figure 1 A schematic diagram of the openings in the main housing of the lighting device shown.

[0019] Figure 12 yes Figure 1 A schematic diagram of the supplementary lighting module of the lighting device shown.

[0020] Figure 13 yes Figure 12 An exploded view of the fill light module shown.

[0021] Figure 14 This is a schematic diagram of another vehicle lighting device provided in an embodiment of this application.

[0022] Figure 15 yes Figure 14 A schematic diagram of the main components of the lighting device shown.

[0023] Figure 16 yes Figure 14 A schematic diagram of the optical path of the lighting device shown.

[0024] Figure 17 yes Figure 14 An exploded schematic diagram of the lighting device shown.

[0025] Figure 18 yes Figure 14 A schematic diagram of the cooling module of the lighting device shown.

[0026] Figure 19 yes Figure 14 A schematic diagram of the openings in the main housing of the lighting device shown.

[0027] Figure 20 yes Figure 14 A schematic diagram of the tail cover module of the lighting device shown.

[0028] Figure 21 yes Figure 14 A schematic diagram of the front cover module of the lighting device shown.

[0029] Figure 22 yes Figure 14 An exploded view of the tail cover module of the lighting device shown.

[0030] Figure 23 This is a schematic diagram of the constituent units / partial constituent units of the vehicle provided in the embodiments of this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The same or similar reference numerals are used in the drawings to represent the same or similar modules. It should be understood that the drawings are merely illustrative, and the scope of protection of this application is not limited thereto.

[0032] Automotive headlights, also known as car headlights, act as the eyes of a vehicle, illuminating the road ahead and providing the driver with a wide and bright field of vision to prevent traffic accidents. Headlights can provide low beam and high beam illumination. Some intelligent and advanced vehicles are also equipped with adaptive driving beam (ADB) functionality. Intelligent headlights automatically control the direction and angle of the illumination beam based on driving conditions to avoid glare for oncoming drivers. Headlights with ADB are generally large, expensive, less efficient, and present a significant challenge to the overall design of the vehicle's front end.

[0033] Road safety has always been a crucial issue in automotive lighting, including how to automatically adjust headlight brightness in response to approaching oncoming vehicles and other safety concerns such as increasing ground projection to guide drivers and pedestrians. Because the low beam, high beam, and ADB (Adaptive Drone) functions require different light intensity distributions on the road surface from the vehicle's headlights, many cars are designed with multiple light sources—one for low beam and one for high beam. This results in existing headlights generally being quite large, occupying a significant amount of vehicle space.

[0034] Vehicle lighting systems typically require high levels of dust and water resistance, forming a sealed space that is not directly connected to the outside. This means that heat from the light source and other heat-generating components cannot be effectively conducted to the outside. Current cooling solutions typically use independent cooling modules for each heat source within the lighting system, which takes up significant space and hinders the miniaturization of the overall lamp design.

[0035] Therefore, it is necessary to design a technical solution for a lighting device that has good heat dissipation and occupies little space.

[0036] Based on this, this application proposes a vehicle lighting device. Figure 1 This is a schematic diagram of a vehicle lighting device provided in an embodiment of this application. The following is in conjunction with... Figure 1 , Figure 2 The lighting device for a vehicle according to embodiments of this application will be described in detail. For example... Figure 1 , Figure 2As shown, the vehicle lighting device 100 of this application embodiment may include: a main housing 110, a light source module 120, a mirror module 130, and a cooling module 140.

[0037] The main housing 110 is used to support the various components of the lighting device 100. For example, the main housing 110 is provided with a lens assembly 136.

[0038] The light source module 120 is disposed within the main housing 110. The light source module 120 includes at least one light source 121, a wavelength conversion component 150, and a first conductive plate 122. The light source 121 is thermally connected to the first conductive plate 122, and the wavelength conversion component 150 is located in the output light path of the light source 121. The wavelength conversion component 150 is used to convert the output light of the light source 121 into white light.

[0039] Light source 121 can be a laser light source or a light-emitting diode (LED) light source. A laser light source can be a laser diode (LD) chip, which is a current-driven semiconductor device that emits laser light of a set wavelength when the operating current reaches a threshold current. Laser light sources are used to generate laser light, which can be blue, violet, or ultraviolet light, etc. The following explanation uses light source 121 as an example of a laser light source.

[0040] Since white light is a broadband light, it is difficult to obtain white light that meets the requirements for high brightness in fields such as lighting and projection using bulbs or semiconductor light sources. The wavelength conversion component 150 is located in the output light path of the laser source 121 and is used to convert the laser light into broadband white light. For example, the wavelength conversion component 150 can be a fluorescent color wheel. A blue laser can be irradiated onto the fluorescent color wheel through a high-speed rotating fluorescent color wheel. The laser excites the fluorescent material on the color wheel and converts it into broadband yellow light. The broadband yellow light combines with the blue laser to form white light. This results in broadband light emission, achieving the effect of illumination. In other embodiments, the wavelength conversion component 150 can also be a fixed fluorescent sheet.

[0041] Figure 5 yes Figure 1 A schematic diagram of a wavelength conversion component of the lighting device shown. Figure 5 , Figure 6 As shown, the wavelength conversion component 150 may include: a fluorescent color wheel 151, a permanent magnet 152, a sensing chip 153, a color wheel sensing plate 154, a color wheel sensing cover plate 155, and an adapter 156.

[0042] The fluorescent color wheel 151 can provide beams of different colors to facilitate the synthesis of white light. The sensing chip 153 is located on the fluorescent color wheel sensing plate 154, mainly used to monitor and provide feedback on the real-time position of the color wheel, and to monitor and sense the real-time position of the permanent magnet 152. The color wheel sensing cover plate 155 mainly forms a sealing structure around the mounting of the color wheel sensing plate 154, keeping the entire optomechanical cavity sealed. The fluorescent color wheel adapter 156 is fixed to the fluorescent color wheel 151, and the permanent magnet 152 is fixed to the fluorescent color wheel 151. Specifically, the permanent magnet 152 is fixedly disposed in the positioning groove 157 of the adapter 156.

[0043] Figure 7 This is a schematic diagram showing the specific installation of the wavelength conversion component 150 on the main housing 110. The wavelength conversion component 150 adopts a magnetic induction system. By utilizing the change in the magnetic field provided by the magnet as the position of the fluorescent color wheel rotates, the sensing device can detect the position information of the fluorescent color wheel in real time, enabling precise feedback control of the fluorescent color wheel.

[0044] In this embodiment, the specific working process of the magnetic induction color wheel conversion is as follows: the color wheel induction plate 154 is fixed to the color wheel induction cover plate 155 by screws, and the induction chip 153 set on the color wheel induction plate 154 monitors and senses the real-time position of the permanent magnet 152 set on the fluorescent color wheel 151 through the Hall effect.

[0045] The gap between the sensing chip 153 and the permanent magnet 152 is a first preset distance. For example, after assembly, the first preset distance between the sensing chip 153 and the surface of the permanent magnet 152 can be 1.2 mm. Of course, if the structural space allows, the gap can be smaller than this, for example, 1 mm.

[0046] The performance of permanent magnet 152 is significantly affected by high temperatures; that is, the magnetic field strength of the magnet decreases as the temperature rises. Furthermore, in some implementations, the high temperature resistance of permanent magnet 152 must be greater than or equal to 250℃. Permanent magnet 152 can be a samarium cobalt series or neodymium iron boron series permanent magnet. The specific grade can be selected according to application requirements, as long as the high temperature resistance reaches 250℃.

[0047] Therefore, it is necessary to dissipate the heat from the permanent magnet 152 to maintain it at a suitable operating temperature. In some implementations, such as... Figure 5 As shown, the wavelength conversion assembly 150 may also include a dynamic balancing ring 158. The dynamic balancing ring 158 may be located on the side of the adapter 156 away from the fluorescent color wheel 151. The dynamic balancing ring 158 is composed of multiple fins arranged around the positioning groove 157 to form a heat dissipation channel to dissipate heat from the permanent magnet 152, which helps to keep the permanent magnet at a suitable operating temperature.

[0048] In some specific implementations, any one of the multiple fins has a preset curvature (preset curve) to facilitate rapid heat and airflow. Multiple fins are evenly (equally spaced) arranged around the positioning groove 157 to form a dynamic balance ring 158. The gap between any two adjacent fins is greater than the width of the fins, and the gap between adjacent fins increases radially from the inside out, which helps to form a heat dissipation channel during rotation to cool the permanent magnet 152 and reduce turbulence. Any two adjacent fins protruding from the side of the adapter 156 form a sub-heat dissipation channel (groove), and multiple sub-heat dissipation channels constitute the overall heat dissipation channel. During the operation of the fluorescent color wheel 151, the dynamic balance ring 158 rotates together with the permanent magnet 152, which can drive the air medium to rotate rapidly. The heat of the permanent magnet 152 is quickly conducted away through the heat dissipation channel to reduce the surrounding ambient temperature and ensure its performance.

[0049] In this embodiment, magnetic induction is used to monitor the rotation speed of the fluorescent color wheel in the optical path to obtain white light that meets the high brightness requirements. This helps to quickly respond to control commands and shorten the start-up time of the entire vehicle lighting control system.

[0050] The laser source 121 generates high heat when producing laser light, requiring timely heat dissipation to maintain a stable operating temperature. Therefore, as... Figure 4 As shown, the laser source 121 is directly fixed on the first conductive plate 122. The first conductive plate 122 can be a heat sink substrate, which can quickly transfer the heat from the laser source 121 (laser) during operation to it. The heat sink substrate can be a copper substrate, an aluminum substrate, a diamond substrate, etc.

[0051] The projector's light source system requires absolute dust protection and careful consideration of its overall structural space. Under these constraints, and while maintaining a dust-proof and airtight environment, the heat generated after the color wheel is activated needs to be dissipated quickly and effectively. Otherwise, the color wheel will fail at high temperatures, causing a rapid rise in the air temperature within the sealed space of the entire light source module.

[0052] In some implementations, the fluorescent color wheel 151 is thermally connected to the first conductive plate 122 to quickly transfer the heat generated after the fluorescent color wheel is excited to the first conductive plate 122.

[0053] Digital light processing (DLP) projection technology generates images by modulating digital images onto a light beam. A rectangular arrangement of movable micromirrors decomposes the light beam into pixels, which are then reflected pixel by pixel into or out of the projection path. DLP uses digital micromirror devices (DMDs) to display visual digital information.

[0054] The mirror module 130 is disposed within the main housing 110 and is used to adjust the emitted beam of the light source module 120 and project it toward the vehicle's direction of travel. The mirror module 130 includes at least a spatial light modulator and a second conductive plate 132. The spatial light modulator modulates the emitted beam of the light source module 120 and projects it onto the lens assembly 136. The spatial light modulator can be a digital micromirror element 131. The spatial light modulator is thermally connected to the second conductive plate 132, which can be a heat sink substrate to transfer the heat generated by the components in the mirror module 130 to it.

[0055] Figure 3 yes Figure 1 A schematic diagram of the optical path of the lighting device shown. Figure 3 As shown, the digital micromirror element 131 and the heat sink surface (heat dissipation substrate surface) of the laser light source 121 are parallel to each other.

[0056] Figure 4 yes Figure 1 An exploded view of the lighting device shown. Figure 4 As shown, the digital micromirror element 131 in the mirror module 130 is used to adjust the direction and area (such as range and field of view) of the light beam. The digital micromirror element (DMD) is a surface light modulator used to achieve imaging in the optical path, enabling the lighting device to project different patterns onto the road in front of the vehicle, presenting different signals to pedestrians, such as welcome lights or pedestrian crossings. The lighting source undergoes digital light processing (DLP), allowing for individual adjustment of illuminance for each pixel to achieve different light distributions, such as low beam distribution, cornering beam distribution, city light distribution, high beam distribution, or anti-glare high beam imaging. This helps to reduce the size of vehicle lights, enabling smaller, multi-functional vehicle lighting devices.

[0057] DMD stands for Surface Light Modulator, a type of spatial light modulator (SLM). A Surface Light Modulator comprises an array of micromirror actuators. The angle of each micromirror is individually adjustable, and the number of mirrors corresponds to the resolution of the projected image; each mirror can display one or more pixels. A crucial aspect of vehicle searchlights or lighting units with DLP technology is the necessary cooling of the micromirror components. When light illuminates a component, most of the light is reflected along a predetermined path, but a portion is recorded as reflection loss and converted into heat. Proper heat dissipation of the DMD is essential; otherwise, the efficiency and lifespan of the micromirrors will be affected.

[0058] Therefore, both the laser light source 121 and the digital micromirror element 131 require heat dissipation and cooling. In order to control the size of the lighting device 100 and make it as small as possible while having multiple functions, an integrated cooling module 140 is configured.

[0059] The cooling module 140 includes a first heat sink 141 and a second heat sink 142, and a heat sink cover 145, connected by a pipe 143. The heat sink cover 145 is sealed to the main housing 110. The first heat sink 141 is thermally connected to the first conductive plate 122, and the second heat sink 142 is thermally connected to the second conductive plate 132, so as to transfer the heat from the light source module 120 and the mirror module 130 to the heat sink cover 145. The pipe 143 is called a heat dissipation pipe.

[0060] In some embodiments, the cooling module 140 may further include at least one power element 144, which is disposed on one side of the heat dissipation cover 145.

[0061] The power element 144 can be, for example, a fan, used to accelerate airflow and improve heat transfer efficiency. The power element 144 can dissipate heat for the cooling module 140, or it can be understood as dissipating heat for the entire lighting device 100. The surface of the heat sink cover 145 can be provided with multiple heat dissipation fins. The heat dissipation fins and the heat sink cover 145 can be die-cast integrally, which helps improve the connection stability between the heat dissipation fins and the heat sink cover 145. When the heat from the light source module 120 and the mirror module 130 inside the main housing 110 is conducted to the heat sink cover 145 through the first heat sink 141 and the second heat sink 142, the heat dissipation fins absorb the heat and dissipate it through convection. During convection heat dissipation, the heat dissipation area is mainly determined by the surface area of ​​the heat sink fins; the larger the surface area, the better the heat dissipation effect; the smaller the surface area, the worse the heat dissipation effect. Multiple heat sink fins can improve the cooling efficiency of the heat sink cover.

[0062] In some implementations, the lens module 130 may also include a series of lens groups for beam shaping and collimation for beam transmission. A single lens module is used for transmission and imaging to achieve functions such as high beam, low beam, ADB, front fog light, playback of predetermined images, and playback of movies. Specifically, such as... Figure 4 As shown, the mirror module 130 may include: a lens sensing plate assembly 134, a lens assembly 136, a lens focusing motor 137, and a collecting lens assembly 138. The lens sensing plate assembly 134 is used to sense the lens position, facilitating the host computer's control of its positional focusing. Alternatively, the lens sensing plate assembly 134 is used to sense the focusing position of the lens assembly 136, enabling the illumination device to control the focusing of the lens assembly 136. The lens assembly 136 is used for imaging. The lens focusing motor 137 is used to ensure a clear projected image. The collecting lens assembly 138 is mainly used for shaping the light path. In some embodiments, the mirror module 130 may further include: an adjustable reflector assembly 135. The adjustable reflector assembly 135 is used to reflect and adjust the effective light spot from the wavelength conversion component 150 to the modulation area of ​​the spatial light modulator. That is, the adjustable reflector assembly 135 can be used to adjust the position of the light spot on the optical engine screen, avoiding color fringing on the screen due to the influence of accumulated tolerances.

[0063] In some implementations, the first heat sink 141 and the second heat sink 142 are perpendicular or parallel to each other, and the first heat sink 141 and the second heat sink 142 are connected in parallel or in series to the heat sink cover 145. Alternatively, in some embodiments, the first conductive plate 122 and the second conductive plate 132 can be parallel to each other. In other embodiments, the first conductive plate 122 and the second conductive plate 132 can be perpendicular to each other.

[0064] In some implementations, the first conductive plate 122 and the second conductive plate 132 can be connected in parallel to the heat dissipation cover plate. That is, the heat from the light source module 120 and the mirror module 130 is conducted to the heat dissipation cover plate 145 in parallel via the first heat dissipation plate 141 and the second heat dissipation plate 142, respectively. The temperature difference between the two ends of each heat sink in the parallel-connected heat dissipation plates is relatively large, resulting in high heat dissipation efficiency. In the parallel cooling system, the flow rate of the cooling medium (air) can be designed to ensure a balanced distribution. For example, the flow rate ratio of the cooling air can be determined based on the heat ratio of the light source module 120 and the mirror module 130, which helps to avoid the problem of reduced heat dissipation effect due to uneven flow.

[0065] like Figure 8 As shown, the first heat sink 141 and the second heat sink 142 are parallel to each other and are on the same mounting plane. The first heat sink 141 is used for heat transfer to the laser light source 121, and the second heat sink 142 is used for heat transfer to the digital micromirror element 131. They are parallel to each other, and both are connected by conduits 143 to transfer heat from the two substrates to the main fins of the heat sink cover 145 for heat dissipation. Figure 8 The connection between the first heat sink 141 and the second heat sink 142 shown is a series arrangement of the cooling module. The pipe 143 itself has a certain degree of flexibility due to its long lever arm. With the control of tolerances, the first heat sink 141 and the second heat sink 142 can be well matched with the matching parts, the first conductive plate 122 (corresponding to the laser light source 121) and the second conductive plate 132 (corresponding to the DMD), during the actual assembly process.

[0066] In some embodiments, the first heat sink 141 and the second heat sink 142, which are parallel to each other, may have a height difference to facilitate the adaptation of corresponding connecting elements.

[0067] In an integrated heat dissipation system, the heat sink substrate of the laser and the DMD can be designed at 90° or 180°, which facilitates assembly on the production line, simplifies the process, and reduces the number of components.

[0068] In some implementations, a heat-conducting element is provided at the connection between the main housing 110 and the heat sink 145. This heat-conducting element helps to quickly transfer heat from the main housing 110 to the integrated heat dissipation system (heat sink 145). For example... Figure 4 As shown, the thermal conductive element can be, for example, a thermal pad 148 or thermal grease.

[0069] In some implementations, such as Figure 4 As shown, the lighting device 100 may further include: an optomechanical cover plate 125, mainly used for shielding and dustproofing the entire optomechanical cavity system; a laser sealing ring 126, mainly used to form a sealing structure around the laser mounting, ensuring the entire optomechanical cavity is sealed; a DMD drive connection plate 127, used to control and drive the DMD; a socket 128, used to act as a bridge connection for communication between the DMD drive connection plate 127 and the digital micromirror element 131 (DMD); and a DMD sealing ring 129, used to form a sealing structure around the DMD mounting, ensuring the entire optomechanical cavity is sealed.

[0070] In this embodiment, the mirror module 130 adjusts the direction and area (such as field of view and range) of the emitted beam from the light source module 120, enabling the lighting device to project different patterns onto the road ahead of the vehicle. This allows for a smaller, multi-functional lighting device that integrates functions such as low beam distribution, turning beam distribution, high beam distribution, or anti-glare high beam imaging. This embodiment employs an integrated heat dissipation structure, which helps reduce the number of power components and heat dissipation pipes, decreases the overall size of the headlight module, reduces the number of parts, facilitates assembly, simplifies the process, and increases production efficiency.

[0071] To more clearly illustrate the embodiments of this application, the following will describe... Figure 1 The assembly relationships of the various modules involved in the embodiments are described in detail.

[0072] like Figure 2 As shown, the lighting device 100 may also include: a DLP driver module 180, an MCU module 190, a first supplementary light module 191, and a second supplementary light module 192.

[0073] The DLP driver module 180 and the MCU module 190 respectively control and drive the vehicle lights' illumination functions, providing a hardware and software implementation platform, which can be simply understood as a hardware control module. They can be fixed to the main housing 110 using screws. The first supplementary lighting module 191 and the second supplementary lighting module 192 are respectively disposed on both sides of the lens assembly 136 to broaden the emitted light from the lens assembly 136 to achieve a predetermined light intensity distribution of the lighting device 100. Alternatively, it can be said that the target emitted light of the lighting device 100 achieves a predetermined light intensity distribution. The target emitted light can be any of the various emitted light beams from the lighting device 100, including low beams, high beams, cornering beams, and anti-glare high beam imaging beams. Different emitted light beams have different requirements for the predetermined light intensity distribution. For example, the predetermined light intensity distribution of a high beam is: strong in the middle and weak at the edges.

[0074] like Figure 3 The optical path diagram shown depicts the heat dissipation surface of the DMD parallel to the heat dissipation surface of the laser source 121. (Reference) Figure 9 In the integrated cooling module 140, the first heat sink 141 and the second heat sink 142 (corresponding to DMD) are parallel to each other and on the same plane.

[0075] like Figure 11 As shown, the main housing 110 has multiple positioning holes and multiple through holes. The positioning holes are used to install the positioning light source module 120 and the mirror module 130, and the multiple through holes are used for locking. Some of the through holes can be used to assist in reinforcing and fixing the integrated cooling module 140. Specifically, the main housing 110 may include multiple positioning holes 195, waist holes 196, first through holes 197, and second through holes 198.

[0076] like Figure 7 As shown, the wavelength conversion component 150 is screwed onto the main housing 110 to provide fluorescence conversion functionality.

[0077] like Figure 9 , Figure 10 As shown, the integrated cooling module 140 is fixed to the main housing 110 with screws. Specifically, the main housing 110 is pre-installed with a first conductive plate 122 corresponding to the laser light source 121 and a second conductive plate 132 corresponding to the digital micromirror element 131. The first heat dissipation plate 141 and the second heat dissipation plate 142 of the cooling module 140 are respectively locked and fixed to the first conductive plate 122 and the second conductive plate 132. After the above assembly is completed, the heat dissipation cover 145 is reinforced and fixed to the main housing 110 with screws.

[0078] Furthermore, in the case of the integrated cooling module 140, a heat-conducting pad 148 is provided between the main housing 110 and the cooling module 140 (i.e., the heat dissipation cover 145) to assist in heat dissipation of the cavity of the main housing 110, which helps to transfer the heat of the cavity of the main housing 110 to the heat dissipation cover 145.

[0079] like Figure 12 , Figure 13 As shown, both the first supplementary lighting module 191 and the second supplementary lighting module 192 can be LED supplementary lighting modules, and are respectively fixed to the main housing 110. Specifically, the first heat dissipation fixing member 193 is fixed to the main housing 110 by screws, and the second heat dissipation fixing member 194 is fixed to the main housing 110 of the optical engine by screws. In some embodiments, the first supplementary lighting module 191 can be mounted and positioned on the first heat dissipation fixing member 193 through the positioning hole 195, and the second supplementary lighting module 192 can be mounted and positioned on the second heat dissipation fixing member 194 through the positioning waist hole 196. In other embodiments, the first supplementary lighting module 191 can be mounted and positioned through the positioning hole 195 and the positioning waist hole 196, and the second supplementary lighting module 192 can be mounted and positioned through the positioning hole 195 and the positioning waist hole 196.

[0080] Alternatively, in some other embodiments, the first supplementary lighting module 191 is fixed to the first heat dissipation fixture 193 by screws, and the second supplementary lighting module 192 is fixed to the second heat dissipation fixture 194 by screws. The first heat dissipation fixture 193 can be mounted and positioned on the main housing 110 through positioning holes 195 and / or positioning waist holes 196, and the second heat dissipation fixture 194 can be mounted and positioned on the main housing 110 through positioning holes 195 and / or positioning waist holes 196.

[0081] In some implementations, a heat-conducting element is provided between the supplementary lighting module and the connecting plate of the main housing 110. The heat-conducting element may be, for example, thermal grease, which helps to quickly conduct the heat generated by the supplementary lighting module to the main housing 110, and then to the cooling module 140.

[0082] Furthermore, thermally conductive grease is provided between the substrate of the first supplementary lighting module 191 and the first heat dissipation fixing member 193, and thermally conductive grease is provided between the substrate of the second supplementary lighting module 192 and the second heat dissipation fixing member 194. The thermally conductive grease is used to heat sink the heat generated by the LED chip of the first supplementary lighting module 191 onto the first heat dissipation fixing member 193. A certain thickness of thermally conductive grease or a thermally conductive pad can be provided between the first heat dissipation fixing member 193, the second heat dissipation fixing member 194 and the main housing 110 for passive heat dissipation of the LED supplementary lighting module.

[0083] The first supplementary lighting module 191 and the second supplementary lighting module 192 are detachable, modular in design and passively cooled, and can be customized according to the needs of the OEM. They can be omitted when not needed.

[0084] Combination Figure 2 , Figure 4 , Figure 13 The main assembly process of this application embodiment can be as follows: the light source module 120 and the mirror module 130 are fixed to the main housing 110, and the MCU module 190, the first supplementary light module 191, and the second supplementary light module 192 are all fixed to the main housing 110 with several screws, finally forming a complete vehicle lighting device. There is no predetermined order requirement for the installation of the cooling module 140, the MCU module 190, the first supplementary light module 191, and the second supplementary light module 192. The modular design simplifies the process and facilitates installation.

[0085] In this embodiment, the mirror module 130 adjusts the direction and area (such as field of view and range) of the emitted beam from the light source module 120, enabling the lighting device to project different patterns onto the road ahead of the vehicle. This allows for a smaller, multi-functional lighting device that integrates functions such as low beam distribution, cornering beam distribution, high beam distribution, or anti-glare high beam imaging. This embodiment employs an integrated heat dissipation structure, which helps reduce the number of power components and heat dissipation pipes, decreases the overall size of the headlight module, reduces the number of parts, facilitates assembly, simplifies the process, and increases production efficiency.

[0086] Figure 14 This is a schematic diagram of another vehicle lighting device provided in an embodiment of this application. Figure 14 In this embodiment, the digital micromirror element 131 and the heat sink surface of the laser source 121 are perpendicular to each other. For example... Figure 14 , Figure 15 As shown, the vehicle lighting device 100 of this application embodiment may include: a main housing 110, a light source module 120, a mirror module 130, and a cooling module 140.

[0087] The light source module 120 is disposed within the main housing 110. The light source module 120 includes at least one laser light source 121, a wavelength conversion component 150, and a first conductive plate 122. The wavelength conversion component 150 is located in the output light path of the laser light source 121.

[0088] The laser source 121 generates a lot of heat when producing laser light, and it needs to dissipate heat in time to maintain a stable operating temperature. Figure 17 yes Figure 14 An exploded view of the lighting device shown. Figure 17As shown, the laser source 121 is directly fixed on the first conductive plate 122. The first conductive plate 122 can be a heat sink substrate, which can quickly transfer the heat of the laser during operation to it.

[0089] The wavelength conversion component 150 may include a fluorescent color wheel 151 and a color wheel sensor 154. The fluorescent color wheel 151 can provide beams of different colors to facilitate the synthesis of white light. The color wheel sensor 154 is mainly used to monitor and provide feedback on the real-time position of the color wheel.

[0090] In some implementations, the fluorescent color wheel 151 is thermally connected to the first conductive plate 122 to quickly transfer the heat generated after the color wheel is excited to the first conductive plate 122.

[0091] The mirror module 130 is disposed within the main housing 110 and is used to adjust and project the emitted beam of the light source module 120 toward the direction of vehicle travel. The mirror module 130 includes a second conductive plate 132. The second conductive plate 132 can be a heat sink substrate to receive the heat generated by the components in the mirror module 130.

[0092] like Figure 17 As shown, the mirror module 130 may include a digital micromirror element 131 to adjust the direction and area of ​​the light beam. The lighting source undergoes digital light processing (DMD), which can adjust the illuminance individually for each pixel to achieve different light distributions, such as low beam distribution, cornering beam distribution, city light distribution, high beam distribution, or anti-glare high beam imaging, which helps to reduce the size of the vehicle headlight and realize a smaller, multi-functional vehicle lighting device.

[0093] Figure 16 The left half is Figure 14 The light path diagram of the lighting device shown is as follows. Figure 16 The right half is a side view of the optical path. For example... Figure 16 As shown, the digital micromirror element 131 is perpendicular to the heat sink surface (heat dissipation substrate surface) of the laser light source 121.

[0094] Both the laser and the digital micromirror element 131 require heat dissipation. In order to control the size of the lighting device 100 and make it as small as possible while maximizing its functionality, an integrated cooling module 140 is configured.

[0095] like Figure 17 As shown, a thermal pad 149 is also provided between the digital micromirror element 131 and the second conductive plate 132, which helps to quickly transfer heat from the DMD to the second conductive plate 132 (DMD copper substrate).

[0096] The cooling module 140 includes a first heat sink 141 and a second heat sink 142 connected by a pipe 143, at least one power element 144, and a heat sink cover 145. The heat sink cover 145 is sealed to the main housing 110. The first heat sink 141 is thermally connected to the first conductive plate 122, and the second heat sink 142 is thermally connected to the second conductive plate 132, so as to transfer the heat from the light source module 120 and the mirror module 130 to the heat sink cover 145.

[0097] The power component 144 can be, for example, a fan. The surface of the heat sink cover can be provided with multiple heat dissipation fins. The heat dissipation fins and the heat sink cover 145 can be die-cast as a single piece, which helps improve the connection stability between the heat dissipation fins and the heat sink cover 145. When the heat from the light source module 120 and the mirror module 130 inside the main housing 110 is conducted to the heat sink cover 145 through the first heat sink 141 and the second heat sink 142, the heat dissipation fins absorb the heat and dissipate it through convection.

[0098] like Figure 18 As shown, the first heat sink 141 and the second heat sink 142 are perpendicular to each other. The first heat sink 141 is used for heat transfer to the laser light source 121, while the second heat sink 142 is used for heat transfer to the digital micromirror device 131. Both are perpendicular to each other, and heat is transferred from the two substrates to the main fins of the heat sink cover 145 via conduits 143 for heat dissipation. The conduits 143 themselves have a certain degree of flexibility despite their long lever arms, and with tolerance control, the first heat sink 141 and the second heat sink 142 can be well fitted with the matching components, the first conductive plate 122 (corresponding to the laser light source) and the second conductive plate 132 (corresponding to the DMD), during actual assembly. Figure 18 The connection between the first heat sink 141 and the second heat sink 142 shown is a parallel arrangement of the cooling module.

[0099] Since the first heat sink 141 and the second heat sink 142 inside the cooling module 140 are fixedly connected to the first conductive plate 122 and the second conductive plate 132 inside the main housing 110, and each has a reference surface that is perpendicular to the other, and the heat sink cover 145 outside the cooling module 140 is also sealed and fixedly connected to the main housing 110, its installation will inevitably be affected by the positional tolerance of the internal connection.

[0100] The heat dissipation cover 145 of the cooling module 140 can be reinforced and fixed to the main housing 110 with the assistance of multiple screws and mounting holes. In some embodiments, this can improve the dimensional accuracy of the machining, but the heat dissipation plate itself may be affected by thermal deformation. In other embodiments, such as Figure 19As shown, the outer diameter of the mounting hole can be increased by a preset size based on the outer diameter of the corresponding locking screw. For example, the preset size can be 2.5mm or 3mm. Alternatively, the mounting hole can be a slotted hole to eliminate the positional tolerance effect caused by the installation of the heat sink inside the cooling module 140.

[0101] In this embodiment, the mirror module 130 adjusts the direction and area (such as field of view and range) of the emitted beam from the light source module 120, enabling the lighting device to project different patterns onto the road ahead of the vehicle. This allows for a smaller, more multifunctional lighting device that integrates features such as low beam distribution, turning beam distribution, high beam distribution, or anti-glare high beam imaging. This embodiment employs an integrated heat dissipation structure, which helps reduce the number of power components and heat dissipation pipes, decreases the overall size of the vehicle lighting device, reduces the number of parts, facilitates assembly, simplifies the process, and increases production efficiency.

[0102] In some implementations, the lens module 130 may also include a series of lens groups for beam shaping and collimation for beam transmission. A single lens module is used for both transmission and imaging to achieve functions such as high beam, low beam, ADB, front fog lights, and movie playback. Specifically, such as... Figure 17 As shown, the mirror module 130 may include: a first reflector assembly 133 for transmitting light; a lens sensor assembly 134 for sensing the lens position, facilitating position and focusing control by the host computer; an adjustable reflector assembly 135 for adjusting the position of the light spot on the optical engine screen, preventing color fringing caused by accumulated tolerances; a lens assembly 136 for imaging; a lens focusing motor 137 for ensuring a clear projected image; a collecting lens assembly 138 primarily for shaping the light path; a light source reflector assembly 139 primarily for transmitting the light beam emitted from the light source and correcting the position and angle of the beam; a light source reflector adapter 168 primarily for receiving the light source reflector assembly 139; and an aperture 169 for blocking some unwanted light beams to improve color performance, such as contrast.

[0103] like Figure 17 As shown, the light source module 120 and mirror module 130 may further include: an optical engine cover plate 125, mainly used for shielding and dustproofing the internal cavity system of the entire optical engine; a DMD drive connection board 127, used for controlling and driving the DMD; and a socket 128, used as a bridge connection for communication between the DMD drive connection board 127 and the digital micromirror element 131 (DMD).

[0104] To explain more clearly Figure 15 The following is a detailed description of the assembly relationships of the various modules involved in the embodiment.

[0105] like Figure 15As shown, the lighting device 100 may further include: a rear cover module 160, a front cover module 170, a DLP driver board 180, and an MCU module 190. It can be understood that the rear cover module 160 and the front cover module 170 form a... Figure 14 The outer sealed cavity structure of the lighting device 100 shown.

[0106] like Figure 19 As shown, the main housing 110 has multiple positioning holes and through holes. The positioning holes are used to install the positioning light source module 120 and the mirror module 130, and the through holes are used for locking. Specifically, some of the through holes can be used to assist in reinforcing and fixing the integrated cooling module 140. Specifically, the main housing 110 may include positioning holes 195, waist holes 196, and multiple third through holes 199.

[0107] Specifically, the first heat sink 141 and the second heat sink 142 of the integrated cooling module 140 are respectively secured to the first conductive plate 122 corresponding to the laser and the second conductive plate 132 corresponding to the DMD by multiple screws. The first conductive plate 122 and the second conductive plate 132 are then respectively secured to the main housing 110 of the optomechanical unit.

[0108] like Figure 15 As shown, the DLP driver module 180 and the MCU module 190 control and drive the vehicle lights, respectively, and provide a hardware and software implementation platform, which can be simply understood as a hardware control module. They can be fixed to the main housing 110 by several screws.

[0109] refer to Figure 20 The rear cover module 160 includes a rear cover 161 and a sealing silicone 162. The rear cover 161 provides the main body support for the main housing 110, and the sealing silicone 162 forms a seal when the main housing 110 and the rear cover 161 are fixedly connected, so that the cavity of the main housing 110 is kept dust-free and waterproof. That is, the sealing silicone 162 is used for waterproofing and dustproofing to meet automotive-grade requirements.

[0110] The tail cover 161 is provided with a first positioning post 163 and a second positioning post 164 for positioning the main housing 110. It is also provided with a plurality of fourth through holes 165 and fifth through holes 166, wherein the plurality of fourth through holes 165 are used to fix the front cover module 170, and the plurality of fifth through holes 166 on the inner side are used to fix the main housing 110, so that the lighting device 100 is in a completely sealed space.

[0111] Figure 21 yes Figure 14 A schematic diagram of the front cover module of the lighting device shown. Figure 22 yes Figure 14 An exploded view of the tail cover module of the lighting device shown. Figure 21 , Figure 22As shown, the front cover module 170 can be composed of a first dustproof component 171, a first foam 172, a second foam 173, a front cover 174, a dustproof sealing glass 175, a waterproof and dustproof breathable membrane 176, a second dustproof component 177, a third foam 178, and a front cover sealing silicone ring 179. The first foam 172 and the second foam 173 are respectively attached to the first dustproof component 171, the third foam 178 is attached to the second dustproof component 177, the dustproof sealing glass 175 is attached to the front cover 174, and the waterproof and dustproof breathable membrane 176 is attached to the front cover 174. The waterproof and dustproof breathable membrane 176 can increase the interchangeability of the inside and outside of the headlight module on the basis of dustproofing and waterproofing, and reduce the generation of water fog on the dustproof sealing glass 175 or lens glass due to weather conditions.

[0112] Furthermore, such as Figure 21 As shown, the front cover 174 is also provided with multiple holes, which are used to fix the front cover module 170 to the main housing 110 by screws.

[0113] Combination Figure 14 , Figure 15 , Figure 17 as well as Figure 22 The assembly process of the lighting device 100 can be as follows: First, fix the light source module 120 and the mirror module 130 to the main housing 110. Then, fix the DLP drive board 180 and the MCU module 190 to the main housing 110 respectively. Then, lock the tail cover module 160 to the main housing 110. Finally, lock the front cover module 170 to the main housing 110 to form a complete vehicle lighting device.

[0114] In this embodiment, the mirror module 130 adjusts the direction and area of ​​the emitted beam from the light source module 120, enabling the lighting device to project different patterns onto the road ahead of the vehicle. This allows for a smaller, more multifunctional lighting device, integrating features such as low beam distribution, cornering beam distribution, high beam distribution, or anti-glare high beam imaging. This embodiment employs an integrated heat dissipation structure, which helps reduce the number of power components and heat dissipation pipes, decreasing the overall size of the headlight module. It has fewer parts, is easier to assemble, has a simpler process, and higher production efficiency.

[0115] This application also provides a vehicle. Figure 23 This is a schematic diagram of the constituent units / partial constituent units of the vehicle provided in the embodiments of this application. For example... Figure 23 As shown, vehicle 2300 may include: vehicle body 2310 and lighting device 100 as described above.

[0116] Those skilled in the art will understand that Figure 23This is merely an example of vehicle 2300 and does not constitute a limitation on the vehicle. It may include more or fewer parts than shown, or combine certain parts, or use different parts.

[0117] It should be understood that the vehicles in the embodiments of this application can be wheeled vehicles or work equipment on land. Vehicles can be motor vehicles, including those used for passenger transport, goods transport, and specialized engineering operations. Vehicles can be passenger cars and freight cars. Passenger cars can be private cars, buses, commercial vehicles, or even soft-seat cars, hard-sleeper cars, dining cars, baggage cars, postal cars, etc. Freight cars can be flatcars, open wagons, covered wagons, tank cars, refrigerated cars, etc. Vehicles can also be special vehicles, such as armored cash transport vehicles, vans, or vehicle-mounted modular units. Vans or vehicle-mounted modular units are special-purpose equipment used in geological exploration, water conservancy projects, construction projects, military field operations, communications, and other operations requiring fieldwork or combat. Vehicles in the embodiments of this application can be vehicles powered by traditional energy sources, such as gasoline, diesel, or natural gas, or vehicles powered by new energy sources, such as electric vehicles or hydrogen fuel cell vehicles. The embodiments of this application do not specifically limit the type of vehicle.

[0118] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0119] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the intended application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each intended application, but such implementation should not be considered beyond the scope of this application.

[0120] In the embodiments provided in this application, it should be understood that the disclosed apparatus / device and method can be implemented in other ways. For example, the apparatus / device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0121] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0122] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0123] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0124] Furthermore, in the description of this application and the appended claims, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A lighting device for a vehicle, characterized in that, include: Main housing, on which a lens assembly is mounted; A light source module is disposed within the main housing. The light source module includes at least one light source, a wavelength conversion component, and a first conductive plate. The light source is thermally connected to the first conductive plate, and the wavelength conversion component is located in the outgoing light path of the light source. A mirror module is disposed within the main housing. The mirror module includes at least a spatial light modulator and a second conductive plate. The spatial light modulator modulates the emitted beam of the light source module and projects it onto the lens assembly. The spatial light modulator is thermally connected to the second conductive plate. The cooling module includes a first heat sink and a second heat sink connected by pipes, and a heat sink cover. The heat sink cover is sealed to the main housing. The first heat sink is thermally connected to the first conductive plate, and the second heat sink is thermally connected to the second conductive plate, so as to transfer the heat from the light source module and the mirror module to the heat sink cover.

2. The lighting device according to claim 1, characterized in that, The wavelength conversion component includes: The fluorescent color wheel and the permanent magnet are connected by an adapter, and the permanent magnet is fixedly installed in the positioning groove of the adapter. A sensing chip is used to monitor and sense the real-time position of the permanent magnet.

3. The lighting device according to claim 2, characterized in that, The wavelength conversion component also includes: A dynamic balancing ring, which is composed of multiple fins evenly distributed around the periphery of the positioning groove, is used to form a heat dissipation channel to dissipate heat from the permanent magnet.

4. The lighting device according to claim 2, characterized in that, The permanent magnet has a high temperature resistance of 250°C or higher.

5. The lighting device according to claim 1, characterized in that, The cooling module also includes at least one power element, which is disposed on one side of the heat dissipation cover.

6. The lighting device according to claim 1, characterized in that, The first heat sink and the second heat sink are perpendicular or parallel to each other, and the first heat sink and the second heat sink are connected in parallel or in series to the heat sink cover.

7. The lighting device according to claim 1, characterized in that, The mirror module also includes an adjustable reflector assembly, which is used to adjust the effective light spot reflection from the wavelength conversion assembly to the modulation region of the spatial light modulator.

8. The lighting device according to claim 1, characterized in that, The lighting device also includes a lens sensor assembly, which is used to sense the focusing position of the lens assembly, so that the lighting device can control the focusing of the lens assembly.

9. The lighting device according to any one of claims 1-8, characterized in that, Also includes: A supplementary lighting module is disposed on both sides of the lens assembly to broaden the emitted light from the lens assembly to achieve a predetermined light intensity distribution of the lighting device.

10. The lighting device according to claim 9, characterized in that, A heat-conducting element is provided at the connection between the main housing and the heat dissipation cover plate, and a heat-conducting element is provided between the supplementary lighting module and the connecting plate of the main housing.

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