Chip testing seat, chip testing device and chip testing system

Abstract

The utility model discloses a chip testing seat, a chip testing device and a chip testing system, the chip testing seat comprises a bearing block, the top surface of the bearing block is provided with a groove, two opposite side walls of the groove are respectively provided with a strip-shaped hole extending along the top surface, and the two strip-shaped holes are opposite to each other; an air blowing hole and an air exhausting hole are formed in the outer wall of the bearing block, one strip-shaped hole is communicated with the air blowing hole, and the other strip-shaped hole is communicated with the air exhausting hole; the bottom of the groove is provided with at least one through hole for the probe to pass through, and the through hole is located right below the area between the two strip-shaped holes. According to the technical scheme of the utility model, the yield of chip testing is improved, and the productivity of chips is further ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and in particular to a chip test socket, a chip test device, and a chip test system. Background Technology

[0002] With the development of semiconductor chip testing technology, the testing content and requirements have also increased, placing higher demands on the corresponding equipment. Currently, test sockets are cleaned manually. However, due to the large number of test sockets and the fact that they may be designed inside the equipment, manual cleaning is very difficult. Manual cleaning also cannot remove contaminants from the test sockets in time, leading to contaminant residue. Test contamination can cause a significant drop in test yield and even affect production capacity. Utility Model Content

[0003] This invention provides a chip test socket, a chip test device, and a chip test system, aiming to solve the problem of test contamination, improve the yield of chip testing, and thus ensure chip production capacity.

[0004] To achieve the above objectives, the present invention proposes a chip test socket, which includes a support block. The top surface of the support block is provided with a groove, and two opposite sidewalls of the groove are respectively provided with a strip-shaped hole extending along the top surface, with the two strip-shaped holes facing each other.

[0005] The outer wall of the support block is provided with an air blowing hole and an air extraction hole, one of the strip holes is connected to the air blowing hole, and the other strip hole is connected to the air extraction hole;

[0006] The bottom of the groove is provided with at least one through hole for the probe to pass through, and the through hole is located directly below the area between the two strip holes.

[0007] In some embodiments, the support block is provided with a first airflow channel and a second airflow channel, the blowing hole is connected to one of the strip holes through the first airflow channel, and the suction hole is connected to another of the strip holes through the second airflow channel.

[0008] In some embodiments, the first airflow channel extends adjacent to and along a connected strip-shaped hole, and the second airflow channel extends adjacent to and along a connected strip-shaped hole, with the inner end of one strip-shaped hole penetrating the sidewall of the first airflow channel and the inner end of the other strip-shaped hole penetrating the sidewall of the second airflow channel.

[0009] In some embodiments, the section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

[0010] The chip testing device proposed in this utility model includes the chip testing socket and mounting block described in the above embodiments. The mounting block is located below the support block, and the top side of the mounting block is provided with a plurality of probes passing through the through hole. The top tip of the probe is lower than the strip hole.

[0011] In some embodiments, the mounting block and the carrier block are restricted to move relative to each other in the horizontal direction by a positioning structure, and the mounting block and the carrier block are locked together by a plurality of screws.

[0012] In some embodiments, the positioning structure includes a plurality of positioning posts and a plurality of positioning holes, wherein one of the positioning posts and the positioning holes is located on the top side of the mounting block and the other is located on the bottom side of the bearing block.

[0013] In some embodiments, the probe is located in the middle region of the top side of the mounting block, and the through hole corresponds one-to-one with the probe.

[0014] In some embodiments, the chip testing apparatus further includes a base located below the mounting block, the mounting block being mounted on the base.

[0015] The chip testing system proposed in this utility model includes an air blowing device, an air extraction device, and the chip testing device described in the above embodiments. The air blowing device is connected to the air blowing hole through an air pipe, and the air extraction device is connected to the air extraction hole through another air pipe.

[0016] In the technical solution of this chip test socket, strip-shaped holes are respectively set on the two opposite sidewalls of the groove of the support block, and an air blowing hole communicating with one strip-shaped hole and an air extraction hole communicating with the other strip-shaped hole are set on the outer wall of the support block. Compressed gas can be blown into the groove through the air blowing hole and the strip-shaped hole, while air is extracted into the groove through the air extraction hole and the other strip-shaped hole. A high-speed airflow layer is formed between the two strip-shaped holes, which can remove contaminants in the groove and on the probes passing through the through holes. This effectively avoids contaminants affecting the chip test yield, improves the test yield, and thus ensures the chip production capacity. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the chip test socket in one embodiment of the present invention;

[0018] Figure 2 This is a top view of the chip test socket in one embodiment of the present invention;

[0019] Figure 3 This is a cross-sectional schematic diagram of the chip test socket in one embodiment of the present invention;

[0020] Figure 4This is a schematic diagram of the chip testing device in one embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the mounting block in one embodiment of the present invention. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0024] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0025] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0026] This utility model proposes a chip test socket.

[0027] Reference Figure 1 and Figure 2The chip test socket 100 proposed in this utility model includes a support block 10. The top surface of the support block 10 is provided with a groove 11. Two opposite side walls of the groove 11 are respectively provided with a strip hole 121 extending along the top surface, and the two strip holes 121 face each other. That is to say, one side wall of the groove 11 is provided with a strip hole 121, and the other side wall opposite to the side wall is provided with another strip hole 121 facing the strip hole 121.

[0028] The outer wall of the support block 10 is provided with an air blowing hole 12 and an air extraction hole 13. One strip hole 121 communicates with the air blowing hole 12, and the other strip hole 121 communicates with the air extraction hole 13. That is, the air blowing device can blow compressed gas into the groove 11 of the support block 10 through the air blowing hole 12 and the strip hole 121. Simultaneously, the air extraction device can draw negative pressure into the air extraction hole 13 to extract air from the groove 11 through the other strip hole 121. In this embodiment, the air blowing hole 12 and the air extraction hole 13 can be located on the outer sidewalls of the support block 10 corresponding to the sidewalls of the groove 11, wherein the air blowing hole 12 and the air extraction hole 13 can be located on the same outer sidewall. In other embodiments, the air blowing hole 12 and the air extraction hole 13 can be located on other outer sidewalls, such as the top side of the support block 10.

[0029] The bottom of the groove 11 is provided with at least one through hole 122 for the probe 210 to pass through. The through hole 122 is located directly below the area between the two shaped holes 121. It can be understood that the area between the two shaped holes 121 can cover the entire through hole 122, so that when the gas between the two shaped holes 121 flows through the groove 11, it can cover the entire probe 210, which can avoid cleaning dead corners and thus improve the cleaning power of contaminants in the groove 11.

[0030] In this embodiment, when the chip test socket is used for chip testing, the probe 210 passes through the through hole 122 at the bottom of the groove 11, so that the tip of the probe extends into the groove 11. The air blowing hole 12 is connected to the air blowing device, and the air extraction hole 13 is connected to the air extraction device. In this way, before the chip is placed in the groove 11 for testing, the air blowing device and the air extraction device can be activated, so that the strip hole 121 connected to the air blowing hole 12 blows air into the groove 11, and at the same time, the strip hole 121 connected to the air extraction hole 13 draws air from the groove 11. Through the combination of air blowing and air extraction, This creates a high-speed airflow layer within the groove 11. This high-speed airflow layer carries away dust and other contaminants adhering to the groove 11 or on the probe 210 through the strip-shaped hole 121 connected to the extraction hole 13. During this process, dust and other contaminants falling from above the groove are directly carried out by the high-speed airflow layer, preventing them from falling into the groove or onto the probe 210. This also avoids contaminants affecting other test positions. Therefore, it effectively prevents contaminants in the groove 11 and on the probe 210 from affecting the chip test results. When the chip needs to be placed for testing, the blowing and extraction devices are turned off, allowing the chip to be placed in the groove 11 to contact the tip of the probe for testing.

[0031] The technical solution of the chip test socket 100 of this utility model is to provide strip-shaped holes 121 on two opposite sidewalls of the groove 11 of the support block 10, and to provide an air blowing hole 12 communicating with one strip-shaped hole 121 and an air extraction hole 13 communicating with the other strip-shaped hole 121 on the outer wall of the support block 10. This allows compressed gas to be blown into the groove 11 through the air blowing hole 12 and the other strip-shaped hole 121 through the air extraction hole 13, thereby forming a high-speed airflow layer between the two strip-shaped holes 121. This can remove contaminants from the groove 11 and the probes passing through the through holes 122, and allow contaminants to fall from above the groove into the groove or onto the probes 122. This effectively avoids contaminants affecting the yield of chip testing, improves the test yield, and thus ensures the production capacity of the chip.

[0032] Reference Figures 1-3 In some embodiments, the support block 10 is provided with a first airflow channel 14 and a second airflow channel 15. The blowing hole 12 is connected to a strip-shaped hole 121 via the first airflow channel 14, and the suction hole 13 is connected to another strip-shaped hole 121 via the second airflow channel 15. That is, the blowing hole 12 can deliver compressed gas through the first airflow channel 14 to the strip-shaped hole 121 to enter the groove 11; the suction hole 13 can carry the gas in the groove 11 from the other strip-shaped hole 121 to the suction hole 13 via the second airflow channel 15 to discharge the gas in the groove 11 from the chip test socket 100. In this embodiment, the first airflow channel 14 and the second airflow channel 15 can be cylindrical.

[0033] Reference Figures 1-3In some embodiments, the first airflow channel 14 extends adjacent to and along the connected strip-shaped hole 121, and the second airflow channel 15 extends adjacent to and along the connected strip-shaped hole 121. This means that the first airflow channel 14 and the second airflow channel 15 are both arranged in the same direction as the strip-shaped hole 121. The inner end of one strip-shaped hole 121 penetrates the sidewall of the first airflow channel 14, and the inner end of the other strip-shaped hole 121 penetrates the sidewall of the second airflow channel 15. This means that the first airflow channel 14 can communicate with the groove 11 through the strip-shaped hole 121, and the second airflow channel 15 can communicate with the groove 11 through the other strip-shaped hole 121. In this embodiment, the strip-shaped hole 121 can be rectangular.

[0034] Reference Figure 1 and Figure 3 In some embodiments, the section of the groove 11 near its opening is a guide section 123. The cross-sectional area of ​​the guide section 123 gradually decreases from top to bottom. That is, it can be understood that the section of the groove 11 near its opening is an outwardly inclined surface. During the chip placement process, the guide section 123 can tolerate a larger positional error, so that the chip can complete the chip position adjustment during the sliding process and finally fall into the customized position. In this embodiment, the guide section 123 mainly serves to guide the chip when it is placed in the groove 11.

[0035] Reference Figures 1-3 In some embodiments, compressed gas can enter the first airflow channel 14 through the blowing hole 12, then enter the groove 11 through the strip hole 121, and then enter the second airflow channel 15 through the other strip hole 121, and then be extracted through the extraction hole 13, thereby removing contaminants in the groove 11 to avoid affecting the subsequent chip test results.

[0036] This utility model also proposes a chip testing device.

[0037] Reference Figure 4 The chip testing device 1000 proposed in this utility model includes a chip testing socket 100 and a mounting block 200. The specific structure of the chip testing socket 100 is as described in the above embodiments. Since the chip testing device 1000 adopts all the technical solutions of all the embodiments of the chip testing socket 100, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0038] Reference Figure 4 and Figure 5In this embodiment, the mounting block 200 is located below the support block 10. The top side of the mounting block 200 is provided with multiple probes 210 passing through the through-hole 122. The top tip of each probe 210 is lower than the strip-shaped hole 121. Therefore, when the chip is placed in the recess 11 for testing, the probes 210 can pass through the through-hole 122 to contact the chip for testing. In this embodiment, with the combined action of blowing air through the air hole 12 and drawing air through the air hole 13, the airflow flowing through the recess 11 can form a high-speed airflow layer above the top tip of the probe 210, thereby preventing contaminants from falling into the chip test socket 100 and adhering to the top tip of the probe 210, thus affecting subsequent chip testing.

[0039] Reference Figure 4 and Figure 5 In some embodiments, the mounting block 200 and the carrier block 10 are restricted from relative movement in the horizontal direction by a positioning structure, thereby preventing the mounting position of the mounting block 200 and the chip test socket 100 from shifting; and the mounting block 200 and the carrier block 10 are locked and fixed by multiple screws. In this embodiment, the positioning structure may use a pin to restrict the horizontal movement of the mounting block 200 and the carrier block 10. In this embodiment, the pin may be located at the edge of the top side of the mounting block 200. In this embodiment, the top side of the mounting block 200 and the bottom side of the carrier block 10 may have corresponding threaded holes to fix the mounting block 200 and the carrier block 10 by screws.

[0040] Reference Figure 4 and Figure 5 In some embodiments, the positioning structure includes a plurality of positioning pins 220 and a plurality of positioning holes, one of which is located on the top side of the mounting block 200 and the other on the bottom side of the support block 10. In this embodiment, the positioning pin 220 may be a pin, and in this embodiment, the positioning pin 220 may be located on the top side of the mounting block 200 and the positioning hole may be located on the bottom side of the support block 10; in other embodiments, the positioning pin 220 may be located on the bottom side of the support block 10 and the positioning hole may be located on the top side of the mounting block 200.

[0041] Reference Figure 4 and Figure 5 In some embodiments, the probe 210 is located in the middle region of the top side of the mounting block 200, and the through hole 122 corresponds one-to-one with the probe 210. That is, it can be understood that each through hole 122 has a probe 210.

[0042] Reference Figure 4 In some embodiments, the chip testing apparatus 1000 further includes a base 300 located below the mounting block 200. The mounting block 200 is mounted on the base 300. In this embodiment, the base 300 mainly serves a supporting function.

[0043] Reference Figures 1-5 In some embodiments, after the chip is placed in the recess 11, external pressure can be applied to make the chip fully contact the top of the probe 210 in the through hole 122 at the bottom of the recess 11 for chip testing.

[0044] This invention further proposes a chip testing system.

[0045] Reference Figure 4 The chip testing system proposed in this utility model includes an air blowing device, an air extraction device, and the chip testing device 1000 in the above embodiments. The specific structure of the chip testing device 1000 is as described in the above embodiments. Since this chip testing system adopts all the technical solutions of all embodiments of the chip testing device 1000, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The air blowing device is connected to the air blowing hole 12 through an air pipe 400, and the air extraction device is connected to the air extraction hole 13 through another air pipe 400. In this embodiment, the air blowing device blows compressed gas into the air blowing hole 12 through the air pipe 400, and the air extraction device draws gas from the air extraction hole 13 through the other air pipe 400, thereby cleaning the chip test socket 100 can be completed through the cooperation of the air blowing device and the air extraction device.

[0046] Reference Figure 3 and Figure 4 In some embodiments, before chip testing, compressed gas can be sent to the blowing hole 12 through the air pipe 400 by the blowing device, and then flow through the first air flow channel 14 to the strip hole 121 to be sent into the groove 11 of the chip test holder 100. At the same time, the suction device can send the gas in the groove 11 from another strip hole 121 through the second air flow channel 15 to the suction hole 13, and then extract it through another air pipe 400.

[0047] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.

Claims

1. A chip test socket, characterized in that, The device includes a support block, the top surface of which is provided with a groove, and two opposite sidewalls of the groove are respectively provided with a strip-shaped hole extending along the top surface, the two strip-shaped holes being directly opposite each other; The outer wall of the support block is provided with an air blowing hole and an air extraction hole, one of the strip holes is connected to the air blowing hole, and the other strip hole is connected to the air extraction hole; The bottom of the groove is provided with at least one through hole for the probe to pass through, and the through hole is located directly below the area between the two strip holes.

2. The chip test socket according to claim 1, characterized in that, The support block is provided with a first airflow channel and a second airflow channel. The blowing hole is connected to one of the strip holes through the first airflow channel, and the suction hole is connected to another strip hole through the second airflow channel.

3. The chip test socket according to claim 2, characterized in that, The first airflow channel extends adjacent to and along the connected strip-shaped hole, and the second airflow channel extends adjacent to and along the connected strip-shaped hole. The inner end of one of the strip-shaped holes penetrates the sidewall of the first airflow channel, and the inner end of the other strip-shaped hole penetrates the sidewall of the second airflow channel.

4. The chip test socket according to claim 1, characterized in that, The section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

5. A chip testing device, characterized in that, include: The chip test socket according to any one of claims 1-4; The mounting block is located below the support block. The top side of the mounting block is provided with a plurality of probes that pass through the through hole, and the top tip of the probe is lower than the strip hole.

6. The chip testing apparatus according to claim 5, characterized in that, The mounting block and the bearing block are restricted from moving relative to each other in the horizontal direction by a positioning structure, and the mounting block and the bearing block are locked and fixed by multiple screws.

7. The chip testing apparatus according to claim 6, characterized in that, The positioning structure includes multiple positioning posts and multiple positioning holes, one of which is located on the top side of the mounting block and the other is located on the bottom side of the bearing block.

8. The chip testing apparatus according to claim 6, characterized in that, The probe is located in the middle area on the top side of the mounting block, and the through hole corresponds to the probe one by one.

9. The chip testing apparatus according to claim 5, characterized in that, The chip testing device also includes a base located below the mounting block, and the mounting block is mounted on the base.

10. A chip testing system, characterized in that, The device includes an air blowing device, an air extraction device, and a chip testing apparatus according to any one of claims 5-9, wherein the air blowing device is connected to the air blowing port through an air pipe, and the air extraction device is connected to the air extraction port through another air pipe.

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