Flat plate structure with built-in radiating fins

Abstract

The utility model provides a flat plate structure with built-in radiating fins, which comprises a flat plate shell, a heat conduction block is arranged in the flat plate shell, a placing groove is arranged at the top of the heat conduction block, a heat conduction pipe is arranged on the inner wall of the flat plate shell, and the heat conduction pipe is connected with the heat conduction block. According to the utility model, the plurality of heat conduction pipes are arranged and are distributed in the flat plate shell, heat at different positions in the flat plate shell is conveyed into the heat conduction blocks, the heat conduction blocks are in contact with chips and the like in the flat plate, and the liquid gold is placed in the placement groove for heat dissipation; meanwhile, an external auxiliary heat dissipation structure can be installed on the outer wall of the flat plate according to the use requirement of the flat plate and used for increasing the heat dissipation speed of the flat plate, and heat is prevented from being accumulated in the flat plate.

Description

Technical Field

[0001] This utility model belongs to the field of flat plate heat dissipation technology, specifically relating to a flat plate structure with built-in heat sink. Background Technology

[0002] As electronic devices rapidly evolve towards higher power density and miniaturization, heat dissipation has become a critical factor restricting device performance and reliability. Especially in applications such as smartphones, tablets, LED lighting modules, and high-power chip carriers, if the heat generated by components within the compact flat structure cannot be dissipated in time, it will lead to a sharp increase in local temperature, resulting in device frequency reduction, shortened lifespan, or even failure.

[0003] However, because tablets have a closed structure, the built-in heat dissipation structure cannot quickly dissipate heat, and the dissipated heat will directly cause the local temperature of the tablet casing to rise rapidly, affecting the performance of the tablet. Utility Model Content

[0004] Purpose of utility model

[0005] To address the aforementioned technical problems, this utility model provides a flat plate structure with built-in heat sinks to solve the technical problems mentioned in the background art.

[0006] Technical solution

[0007] To achieve the above objectives, the present invention provides a flat plate structure with built-in heat sink, comprising a flat plate shell, a heat-conducting block disposed inside the flat plate shell, a placement groove being provided on the top of the heat-conducting block, a heat-conducting pipe disposed on the inner wall of the flat plate shell, the heat-conducting pipe being connected to the heat-conducting block, and an external auxiliary heat dissipation structure disposed on the outer wall of the flat plate shell.

[0008] Preferably, the outer wall of the flat plate housing has an insertion hole, and the two sides of the outer wall of the flat plate housing are provided with adhesive strips, the inner side of the adhesive strips being inclined.

[0009] Preferably, the number of heat pipes is set to multiple, and the multiple heat pipes are distributed at equal intervals inside the flat shell.

[0010] Preferably, the external auxiliary heat dissipation structure includes a heat dissipation shell, the bottom of which has a connecting groove aligned with the insertion hole, and a conductive post is provided inside the connecting groove.

[0011] Preferably, a heat sink is provided on the top of the conductive post, and a spring is provided between the heat sink and the heat sink housing.

[0012] Preferably, the outer wall of the heat dissipation housing is provided with side strips on both sides, the top of the heat dissipation housing is provided with a top cover, a positioning groove is provided between the top cover and the heat dissipation housing, and a heat dissipation fan is provided inside the positioning groove.

[0013] Beneficial effects

[0014] The technical solution provided by this utility model has the following advantages compared with the prior art:

[0015] This invention utilizes multiple heat pipes distributed inside the flat plate shell to transfer heat from different locations within the shell to the heat-conducting block. Simultaneously, the heat-conducting block contacts the chips and other components inside the flat plate. Liquid metal is placed inside the placement slot for heat dissipation, allowing heat to escape from the flat plate. Furthermore, depending on the flat plate's usage requirements, an external auxiliary heat dissipation structure can be installed on the outer wall of the flat plate to increase its heat dissipation speed and prevent heat accumulation inside. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present utility model;

[0017] Figure 2 This is a perspective view of the present utility model;

[0018] Figure 3 This is a three-dimensional cross-sectional view of the external auxiliary heat dissipation structure of this utility model.

[0019] Figure Labels

[0020] 1. Flat shell; 2. Heat-conducting block; 3. Placement slot; 4. Heat-conducting pipe; 5. Adhesive strip; 6. Insertion hole; 7. External auxiliary heat dissipation structure; 701. Heat dissipation shell; 702. Connection slot; 703. Conductive pillar; 704. Heat dissipation plate; 705. Side strip; 706. Top cover; 707. Positioning slot; 708. Cooling fan. Detailed Implementation

[0021] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "other end", "one side", "front", "both ends", "both sides", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "equipped with" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] Referring now to the accompanying drawings, the various figures are intended only to illustrate certain exemplary embodiments and are not intended to limit the scope of the invention. In the various figures, the same reference numerals denote the same or corresponding parts. The dimensions and scales in the various figures are also for illustrative purposes only and should not be construed as limiting the scope of the invention; these dimensions may be enlarged relative to actual products.

[0025] Reference Figure 1-3 The diagram illustrates a flat panel structure with a built-in heat sink, comprising a flat panel housing 1. A heat-conducting block 2 is disposed inside the flat panel housing 1, and a placement groove 3 is formed on the top of the heat-conducting block 2. Heat-conducting pipes 4 are disposed on the inner wall of the flat panel housing 1 and connected to the heat-conducting block 2. An external auxiliary heat dissipation structure 7 is disposed on the outer wall of the flat panel housing 1, and an insertion hole 6 is formed on the outer wall of the flat panel housing 1. Adhesive strips 5 are disposed on both sides of the outer wall of the flat panel housing 1, with the inner side of the adhesive strips 5 being inclined. Multiple heat-conducting pipes 4 are evenly distributed inside the flat panel housing 1. Liquid metal is applied between the chip inside the flat panel and the placement groove 3 to dissipate heat from the motherboard chip. Simultaneously, the heat-conducting pipes 4 are distributed to different positions inside the flat panel to conduct heat to different positions on the flat panel, transferring heat to the interior of the heat-conducting block 2 and then dissipating it through the insertion hole 6 on the outer wall of the flat panel housing 1 outside the heat-conducting block 2.

[0026] Furthermore, in the above technical solution, the external auxiliary heat dissipation structure 7 includes a heat dissipation housing 701. A connecting groove 702 is provided at the bottom of the heat dissipation housing 701, which is aligned with the insertion hole 6. A conductive post 703 is disposed inside the connecting groove 702, and a heat dissipation plate 704 is disposed at the top of the conductive post 703. A spring is disposed between the heat dissipation plate 704 and the heat dissipation housing 701. Side strips 705 are provided on both sides of the outer wall of the heat dissipation housing 701. A top cover 706 is provided at the top of the heat dissipation housing 701, and a positioning groove 707 is provided between the top cover 706 and the heat dissipation housing 701. A cooling fan 708 is disposed inside the positioning groove 707. When the chips inside the tablet are running at high speed, an external auxiliary heat dissipation structure 7 needs to be installed on the outer wall of the tablet housing 1. Align the side strip 705 with the bonding strip 5, and then slide the external auxiliary heat dissipation structure 7 so that the outer wall of the conductive post 703 slides on the outer wall of the tablet housing 1 and squeezes the spring. Then the conductive post 703 is aligned with the socket 6, and the spring pushes the conductive post 703 to move downward. The conductive post 703 is then attached to the placement groove 3. Then the cooling fan 708 is activated. The cooling fan 708 sends external air into the space between the heat dissipation housing 701 and the top cover 706. Heat is sent into the interior of the heat dissipation plate 704 through the conductive post 703 and is carried away by the flowing air to achieve heat dissipation.

[0027] One side of the conductive post 703 is inclined. Subsequently, the heat sink housing 701 is pushed to slide towards the inclined side of the conductive post 703. The external auxiliary heat dissipation structure 7 can be removed from the outer wall of the flat housing 1 by sliding the inclined surface of the conductive post 703 on the inner wall of the socket 6.

[0028] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A flat plate structure with built-in heat sink, characterized in that, include A flat plate housing (1) is provided inside the flat plate housing (1), a heat-conducting block (2) is provided inside the heat-conducting block (2), a placement groove (3) is provided on the top of the heat-conducting block (2), a heat-conducting pipe (4) is provided on the inner wall of the flat plate housing (1), the heat-conducting pipe (4) is connected to the heat-conducting block (2), and an external auxiliary heat dissipation structure (7) is provided on the outer wall of the flat plate housing (1).

2. The flat plate structure with built-in heat sink according to claim 1, characterized in that: The outer wall of the flat shell (1) is provided with an insertion hole (6), and the two sides of the outer wall of the flat shell (1) are provided with a bonding strip (5), and the inner side of the bonding strip (5) is inclined.

3. The flat plate structure with built-in heat sink according to claim 1, characterized in that: The number of heat pipes (4) is set to multiple, and the multiple heat pipes (4) are distributed at equal intervals inside the flat shell (1).

4. A flat plate structure with built-in heat sink according to claim 1, characterized in that: The external auxiliary heat dissipation structure (7) includes a heat dissipation housing (701), and a connecting groove (702) is provided at the bottom of the heat dissipation housing (701). The connecting groove (702) is aligned with the insertion hole (6), and a conductive post (703) is provided inside the connecting groove (702).

5. A flat plate structure with built-in heat sink according to claim 4, characterized in that: A heat sink (704) is provided on the top of the conductive post (703), and a spring is provided between the heat sink (704) and the heat sink housing (701).

6. A flat plate structure with built-in heat sink according to claim 4, characterized in that: Side strips (705) are provided on both sides of the outer wall of the heat dissipation housing (701), and a top cover (706) is provided on the top of the heat dissipation housing (701). A positioning groove (707) is provided between the top cover (706) and the heat dissipation housing (701), and a cooling fan (708) is provided inside the positioning groove (707).

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