VC radiator of GPU card

Abstract

The utility model provides a VC radiator of a GPU card, the VC radiator comprises a plate body and a heat dissipation assembly, the first side surface of the plate body is provided with an installation part, the installation part is used for installing the GPU card, the heat dissipation assembly comprises a heat dissipation pipe and a capillary structure, the heat dissipation pipe is connected with the plate body and is located on the second side surface of the plate body, and the capillary structure is arranged on the plate body. The plate body comprises a first side face and a second side face, the first side face and the second side face are oppositely arranged in the thickness direction of the plate body, the capillary structure is installed in the heat dissipation pipe and provided with a plurality of heat dissipation holes, and the holes of the heat dissipation holes are gradually increased in the direction from the center of the heat dissipation pipe to the pipe wall of the heat dissipation pipe. The VC radiator of the GPU card has the advantage of being good in radiating effect.

Description

Technical Field

[0001] This utility model relates to the technical field of computer hardware heat dissipation, specifically to a VC heatsink for a GPU card. Background Technology

[0002] As the performance of graphics processing units (GPUs) continues to improve, their power consumption and heat generation have also increased significantly, placing higher demands on heat dissipation technology. Currently, most GPU coolers still use traditional aluminum or copper heat sinks combined with active fans for heat dissipation.

[0003] Vapor Chamber (VC) technology is increasingly being applied to heat dissipation in electronic devices. VC heat sinks utilize the phase change cycle of the internal working fluid to achieve efficient heat transfer, with thermal conductivity far exceeding that of traditional metal materials. The working fluid absorbs heat at the evaporation end and vaporizes. The vapor rapidly diffuses within the vacuum chamber to the condensation end, releasing heat and re-condensing into a liquid. It then flows back to the evaporation end via capillary action or gravity, forming a continuous and efficient heat transfer cycle.

[0004] In related technologies, the core functions of capillary structures are twofold: first, to provide channels for the reflux of the working fluid; and second, to provide a large surface area to promote liquid evaporation and vapor condensation. While capillary forces are strong, their random, porous, and tortuous structure results in low permeability, leading to significant resistance to the reflux of the working fluid and limiting its reflux rate. Utility Model Content

[0005] This utility model aims to at least partially solve one of the technical problems in the related art.

[0006] Therefore, embodiments of this utility model propose a VC heatsink for a GPU card, which has the advantage of good heat dissipation performance.

[0007] The VC heatsink for a GPU card according to an embodiment of the present invention includes:

[0008] The board body has a mounting portion on its first side, which is used to mount a GPU card.

[0009] A heat dissipation assembly includes a heat dissipation pipe and a capillary structure. The heat dissipation pipe is connected to the plate body and is located on the second side of the plate body. The first side and the second side are arranged opposite to each other in the thickness direction of the plate body. The capillary structure is installed inside the heat dissipation pipe and has a plurality of heat dissipation holes. The pore size of the plurality of heat dissipation holes gradually increases in the direction from the center of the heat dissipation pipe to the pipe wall.

[0010] The size of the heat dissipation holes inside the capillary structure of the VC heat sink of the GPU card in this embodiment of the invention gradually increases from the inside out, which helps to reduce the backflow resistance of the working fluid in the capillary structure, improve the backflow speed of the working fluid, and thus enhance the overall heat dissipation performance.

[0011] In some embodiments, a groove is provided on the second side of the plate, at least a portion of the heat dissipation pipe is placed in the groove, and the side of the heat dissipation pipe away from the bottom wall of the groove is arranged flush with the second side.

[0012] In some embodiments, there are multiple heat dissipation pipes, which are spaced apart along the width direction of the plate, and there are multiple grooves, each corresponding to one of the multiple heat dissipation pipes.

[0013] In some embodiments, there are multiple capillary structures, and the multiple capillary structures are arranged at intervals along the extension direction of the heat dissipation pipe.

[0014] In some embodiments, in a plurality of capillary structures, a plurality of heat dissipation holes on each capillary structure are arranged in a one-to-one correspondence along the extension direction of the heat dissipation tube.

[0015] In some embodiments, the heat dissipation assembly further includes a heat exchange tube installed inside the heat dissipation tube, and the extension direction of the heat exchange tube is consistent with the extension direction of the heat dissipation tube, wherein a circulating heat exchange medium is introduced into the heat exchange tube.

[0016] In some embodiments, there are multiple heat exchange tubes, which are arranged circumferentially at intervals along the centerline of the heat dissipation tube.

[0017] In some embodiments, there are multiple heat exchange tubes, which are divided into first heat exchange tubes and second heat exchange tubes. There are multiple second heat exchange tubes. The extension direction of the first heat exchange tube coincides with the extension direction of the center line of the heat dissipation tube. The multiple second heat exchange tubes are arranged at intervals along the circumference of the first heat exchange tube.

[0018] In some embodiments, the heat dissipation assembly further includes heat exchange fins connected to a second side of the plate, and there are multiple heat exchange fins arranged at intervals along the width direction of the plate.

[0019] In some embodiments, the width of the heat exchange fins is less than the length of the heat exchange fins in their extending direction.

[0020] The beneficial effects of this utility model are as follows:

[0021] 1. In the embodiment of this utility model, the size of the heat dissipation holes inside the capillary structure gradually increases from the inside to the outside, which helps to reduce the backflow resistance of the working fluid in the capillary structure, increase the backflow speed of the working fluid, and thus enhance the overall heat dissipation performance.

[0022] 2. The flush design of the heat pipes with the board in this embodiment of the invention helps optimize airflow, reduce airflow interference, and make the airflow around the heatsink smoother, thereby improving heat dissipation efficiency. It also helps reduce the space occupied by the heatsink, making the entire GPU card design more compact and facilitating installation and use in limited spaces.

[0023] 3. In this embodiment of the invention, multiple heat exchange tubes are arranged inside the heat dissipation pipe, which helps to distribute heat more evenly, avoid local overheating, and improve the overall heat dissipation performance. Furthermore, the distribution of multiple heat exchange tubes helps to enhance the structural strength of the entire radiator and improve its stability under high temperatures or mechanical vibration. Attached Figure Description

[0024] Figure 1 This is a cross-sectional view of the VC heatsink of the GPU card according to an embodiment of the present invention.

[0025] Figure 2 This is a first side view of the VC heatsink of the GPU card according to an embodiment of the present invention.

[0026] Figure 3 This is a schematic diagram of the second side of the VC heatsink of the GPU card according to an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram of the internal structure of the heat pipe of the VC heat sink of the GPU card according to an embodiment of the present invention.

[0028] Figure label:

[0029] 1. Panel body; 11. First side panel; 12. Second side panel; 13. Mounting part; 14. Fixing plate.

[0030] 2. Heat dissipation components, 21. Heat pipe, 22. Capillary structure, 23. Heat dissipation holes, 24. Groove, 25. First heat exchange pipe, 26. Second heat exchange pipe, 27. Heat exchange fins. Detailed Implementation

[0031] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] like Figures 1-4As shown, the VC heatsink of the GPU card in this embodiment of the present invention includes: a board body 1 and a heat dissipation component 2.

[0033] The first side 11 of the board body 1 is provided with a mounting part 13 for mounting a GPU card. The heat dissipation assembly 2 includes a heat pipe 21 and a capillary structure 22. The heat pipe 21 is connected to the board body 1 and is located on the second side 12 of the board body 1. The first side 11 and the second side 12 are in the thickness direction of the board body 1 (e.g., ...). Figure 1 The capillary structure 22 is installed inside the heat dissipation pipe 21 and is arranged opposite to each other in the vertical direction. The capillary structure 22 has multiple heat dissipation holes 23, and the pore size of the multiple heat dissipation holes 23 gradually increases in the direction from the center of the heat dissipation pipe 21 to the pipe wall of the heat dissipation pipe 21.

[0034] Specifically, such as Figures 1-4 As shown, the plate 1 is the basic structure of the entire heatsink, and its first side 11 is provided with a mounting part 13 for directly mounting the GPU card. The first side 11 of the plate 1 is the lower surface of the plate 1, and the second side 12 of the plate 1 is the upper surface of the plate 1. The heat pipe 21 has a hollow internal structure, and the peripheral wall of the capillary structure 22 is fixedly connected to the inner peripheral wall of the heat pipe 21.

[0035] It is understandable that the mounting part 13 can be connected to the GPU card by means of threaded connection or snap-fit ​​connection to ensure the fixed installation of the GPU card. The heat pipe 21 is connected to the second side 12 of the board body 1, and the heat pipe 21 is equipped with a capillary structure 22 to provide sufficient heat dissipation area. The heat pipe 21 can dissipate heat through air convection or liquid cooling.

[0036] The capillary structure 22 is installed inside the heat dissipation tube 21 and has multiple heat dissipation holes 23, with the pore size gradually increasing from the center of the heat dissipation tube 21 to the tube wall. This provides an efficient channel for the recirculation of the working fluid, reduces recirculation resistance, and increases the flow velocity of the working fluid. Furthermore, the design of the heat dissipation holes 23 promotes liquid evaporation and vapor condensation, improving heat dissipation performance. It also enhances capillary force, promotes rapid recirculation of the working fluid, prevents drying out, and maintains continuous heat transfer.

[0037] In other words, the size of the heat dissipation holes 23 inside the capillary structure 22 of the GPU card heat sink in this embodiment of the present invention gradually increases from the inside out, which helps to reduce the backflow resistance of the working fluid in the capillary structure 22, increase the backflow speed of the working fluid, and thus enhance the overall heat dissipation performance.

[0038] In some embodiments, the second side 12 of the plate 1 is provided with a groove 24, at least a portion of the heat dissipation pipe 21 is placed in the groove 24, and the side of the heat dissipation pipe 21 away from the bottom wall of the groove 24 is arranged flush with the second side 12.

[0039] It is understandable that, such as Figures 1-3 As shown, a portion of the heat sink 21 can be placed within the groove 24, or the entire heat sink 21 can be placed within the groove 24. That is, partially embedding the heat sink 21 into the groove 24 increases the structural stability between the heat sink and the plate 1, preventing the heat sink 21 from shifting under high temperature or vibration conditions. The increased contact area between the heat sink 21 and the plate 1 helps improve heat transfer efficiency, as the increased contact area promotes rapid heat conduction.

[0040] In addition, such as Figures 1-3 As shown, the side of the heat sink 21 away from the bottom wall of the groove 24 is flush with the second side 12 of the plate 1. This is to ensure that this side of the heat sink 21 is on the same plane as the surface of the plate 1, without any protrusions or depressions.

[0041] In other words, the flush design of heat pipe 21 with the board body 1 helps optimize airflow, reduce airflow interference, and make the airflow around the heatsink smoother, thus improving heat dissipation efficiency. It also helps to reduce the space occupied by the heatsink in the overall space, making the design of the entire GPU card more compact and easier to install and use in limited space.

[0042] Preferably, there are multiple heat dissipation pipes 21, which are arranged at intervals along the width direction of the plate 1, and there are multiple grooves 24, which correspond one-to-one with the multiple heat dissipation pipes 21.

[0043] Specifically, such as Figure 1 and Figure 3 As shown, multiple heat pipes 21 are arranged at intervals along the width of the board 1. This arrangement ensures that the heat generated by the GPU card can be absorbed and dispersed evenly. Multiple heat pipes 21 can absorb more heat, thereby reducing the operating temperature of the GPU card and improving its performance and reliability. By arranging the heat pipes 21 at intervals, it helps to distribute the heat source on the GPU card to the entire heatsink, reducing local hot spots and avoiding single-point overheating.

[0044] Understandably, the multiple recesses 24 correspond one-to-one with the multiple heat dissipation pipes 21, with each heat dissipation pipe 21 embedded in a recess 24, ensuring a tight fit between the heat dissipation pipe 21 and the board body 1. The connection between each heat dissipation pipe 21 and its corresponding recess 24 facilitates rapid heat transfer from the heat dissipation pipe 21 to the board body 1, and then dissipation into the surrounding environment. This one-to-one correspondence between the heat dissipation pipes 21 and the recesses 24 increases the structural stability of the heat sink, preventing the heat dissipation pipes 21 from shifting under high temperature or vibration conditions. The design of multiple heat dissipation pipes 21 and recesses 24 helps optimize airflow around the heat sink, reduces airflow interference, and improves heat dissipation efficiency.

[0045] In some embodiments, there are multiple capillary structures 22, which are arranged at intervals along the extension direction of the heat dissipation pipe 21.

[0046] Understandably, multiple capillary structures 22 are arranged at intervals along the extension direction of the heat pipe 21. The design of multiple capillary structures 22 increases the heat exchange area, making heat transfer from the GPU card to the working fluid more efficient. The spaced arrangement of the capillary structures 22 helps improve the heat distribution within the heat pipe 21, reducing localized heat concentration and resulting in more uniform heat transfer.

[0047] The capillary structures 22 are spaced apart within the heat sink 21, which helps to optimize the heat absorption and dissipation process. The spaced capillary structures 22 can absorb and conduct heat more effectively, that is, they start working immediately at the point of heat generation, rather than allowing heat to diffuse within the heat sink 21 before being transferred to the capillary structures 22.

[0048] In addition, the spaced arrangement of multiple capillary structures 22 can reduce the resistance to the flow of the working fluid. That is, multiple capillary structures 22 will be encountered during the flow process, instead of a long continuous capillary structure 22. This can reduce the flow resistance of the working fluid and improve the circulation efficiency.

[0049] In some embodiments, such as Figure 1 and Figure 4 As shown, in the multiple capillary structures 22, the multiple heat dissipation holes 23 on each capillary structure 22 are arranged one-to-one in the extension direction of the heat dissipation pipe 21.

[0050] Understandably, each of the multiple capillary structures 22 has multiple heat dissipation holes 23. The one-to-one arrangement of these heat dissipation holes 23 along the extension direction of the heat dissipation tube 21 helps ensure that each capillary structure 22 can uniformly absorb and transfer heat, as the corresponding arrangement of the heat dissipation holes 23 facilitates the uniform distribution of heat within the heat dissipation tube 21. This one-to-one arrangement of the heat dissipation holes 23 optimizes the heat exchange process, ensuring a more direct and efficient flow path for the working fluid during evaporation and condensation.

[0051] In some embodiments, the heat dissipation assembly 2 further includes a heat exchange tube, which is installed inside the heat dissipation tube 21 and extends in the same direction as the heat dissipation tube 21. A circulating heat exchange medium is introduced into the heat exchange tube.

[0052] It is understandable that, such as Figure 4 As shown, the heat exchange tube is installed inside the heat dissipation tube 21, and the extension direction of the heat exchange tube is consistent with the extension direction of the heat dissipation tube 21. This helps to maintain the continuity and efficiency of heat transfer. A circulating heat exchange medium is introduced into the heat exchange tube. This medium circulates within the heat exchange tube, absorbs heat, and transfers it within the system.

[0053] In other words, the heat exchange medium circulates within the heat exchange tubes. When it flows through the heat-generating areas of the GPU card, it absorbs and carries away heat, which is then transferred to the external environment through heat pipe 21, achieving effective heat dissipation. The circulating flow of the heat exchange medium helps improve heat dissipation efficiency because it can quickly absorb and transfer heat, reducing heat accumulation inside the heatsink. The circulating flow of the heat exchange medium enhances the heat exchange capacity of heat pipe 21, enabling the heatsink to handle the heat generated by the GPU card more effectively.

[0054] Preferably, there are multiple heat exchange tubes, which are arranged circumferentially at intervals along the center line of the heat dissipation tube 21.

[0055] Understandably, the design of multiple heat exchange tubes increases the heat exchange area in contact with the GPU card, thereby improving heat absorption efficiency. The circumferentially spaced heat exchange tubes help to distribute heat more evenly, avoiding localized overheating and improving overall heat dissipation performance. The distribution of multiple heat exchange tubes also helps to enhance the structural strength of the entire heatsink, improving its stability under high temperatures or mechanical vibration.

[0056] In other words, the design of multiple heat exchange tubes helps improve heat dissipation performance, as multiple heat exchange tubes can provide more heat exchange surface area, increasing the rate of heat dissipation. The arrangement of multiple heat exchange tubes also provides more flexibility in heat sink design, allowing the position and number of heat exchange tubes to be adjusted according to the specific heat distribution of the GPU card, achieving a more personalized heat dissipation solution.

[0057] In some embodiments, there are multiple heat exchange tubes, which are divided into first heat exchange tubes 25 and second heat exchange tubes 26. There are multiple second heat exchange tubes 26. The extension direction of the first heat exchange tube 25 coincides with the extension direction of the center line of the heat dissipation tube 21. The multiple second heat exchange tubes 26 are arranged at intervals along the circumference of the first heat exchange tube 25.

[0058] It is understandable that, such as Figure 4 As shown, the first heat exchange tube 25 is the main heat exchange tube, and its extension direction coincides with the extension direction of the centerline of the heat dissipation tube 21. That is, the first heat exchange tube 25 is located at the core of the heat dissipation tube 21 and is responsible for the main heat exchange function. The second heat exchange tubes 26 are auxiliary heat exchange tubes, and there are multiple of them, which are arranged at intervals around the first heat exchange tube 25. This makes the second heat exchange tubes 26 distributed around the first heat exchange tube 25, forming a ring structure.

[0059] In other words, multiple second heat exchange tubes 26 are arranged circumferentially around the first heat exchange tube 25, ensuring a uniform spatial distribution between the heat exchange tubes. The circumferential spacing of the second heat exchange tubes 26 increases the heat exchange area in contact with the GPU card, thereby improving the efficiency of heat absorption.

[0060] Furthermore, the circumferentially spaced second heat exchange tubes 26 help to distribute heat more evenly, avoid localized overheating, and improve overall heat dissipation performance. The distribution of multiple heat exchange tubes helps to enhance the structural strength of the entire radiator and improve its stability under high temperatures or mechanical vibration.

[0061] In some embodiments, the heat dissipation assembly 2 further includes heat exchange fins 27, which are connected to the second side surface 12 of the plate 1. There are multiple heat exchange fins 27, which are arranged along the width direction of the plate 1 (e.g., ...). Figure 1 Arranged at intervals in the left and right directions.

[0062] It is understandable that, such as Figure 1 and Figure 2 As shown, the heat exchange fins 27 are connected to the second side surface 12 of the plate body 1 by means of bolts and fixing plate 14, so that the lower end of the heat exchange fins 27 directly contacts the second side surface 12 of the plate body 1. There are multiple heat exchange fins 27, which are arranged at intervals along the left and right directions of the plate body 1 to ensure that heat is uniformly transferred and dissipated in the width direction of the plate body 1.

[0063] Understandably, arranging multiple heat exchange fins 27 on the second side 12 of the plate increases the heat dissipation area in contact with the air, thereby improving the efficiency of heat transfer from the GPU card to the surrounding environment. The spaced arrangement of the heat exchange fins 27 also helps to improve airflow, reduce airflow interference, and improve heat dissipation efficiency. In addition, the design of multiple heat exchange fins 27 helps to evenly distribute heat across the entire heatsink surface, reduce the formation of hot spots, and improve heat dissipation performance.

[0064] In some embodiments, the width of the heat exchange fin 27 is less than the length of the heat exchange fin 27 in its extending direction.

[0065] It is understandable that, such as Figure 1 and Figure 2 As shown, in the planes of the left-right and up-down directions, the cross-sectional profile of the heat exchange fin 27 is roughly "U" shaped, which makes the surface area of ​​the heat exchange fin 27 larger, which helps to increase the heat dissipation area in contact with the air, thereby improving the efficiency of heat transfer from the GPU card to the surrounding environment.

[0066] Furthermore, by optimizing the size and arrangement of the heat exchange fins 27, the heat dissipation performance has been significantly improved. The design of the heat exchange fins 27 provides redundancy; if one heat exchange fin 27 fails or its thermal conductivity decreases, the other heat exchange fins 27 can still continue to operate, ensuring the reliability of the entire heat dissipation system.

[0067] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0069] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0070] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0071] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0072] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A VC heatsink for a GPU card, characterized in that, include: The board body has a mounting portion on its first side, which is used to mount a GPU card. A heat dissipation assembly includes a heat dissipation pipe and a capillary structure. The heat dissipation pipe is connected to the plate body and is located on the second side of the plate body. The first side and the second side are arranged opposite to each other in the thickness direction of the plate body. The capillary structure is installed inside the heat dissipation pipe and has a plurality of heat dissipation holes. The pore size of the plurality of heat dissipation holes gradually increases in the direction from the center of the heat dissipation pipe to the pipe wall.

2. The VC heatsink for a GPU card according to claim 1, characterized in that, The second side of the plate is provided with a groove, at least a portion of the heat dissipation pipe is placed in the groove, and the side of the heat dissipation pipe away from the bottom wall of the groove is arranged flush with the second side.

3. The VC heatsink for a GPU card according to claim 2, characterized in that, There are multiple heat dissipation pipes, which are arranged at intervals along the width direction of the plate. There are multiple grooves, which correspond one-to-one with each of the multiple heat dissipation pipes.

4. The VC heatsink for a GPU card according to claim 1, characterized in that, The capillary structure is multiple, and the multiple capillary structures are arranged at intervals along the extension direction of the heat dissipation pipe.

5. The VC heatsink for a GPU card according to claim 4, characterized in that, In the plurality of capillary structures, the plurality of heat dissipation holes on each capillary structure are arranged in a one-to-one correspondence along the extension direction of the heat dissipation tube.

6. The VC heatsink for a GPU card according to any one of claims 1-5, characterized in that, The heat dissipation assembly also includes a heat exchange tube, which is installed inside the heat dissipation tube and extends in the same direction as the heat dissipation tube. A circulating heat exchange medium is introduced into the heat exchange tube.

7. The VC heatsink for a GPU card according to claim 6, characterized in that, There are multiple heat exchange tubes, which are arranged circumferentially at intervals along the center line of the heat dissipation tube.

8. The VC heatsink for a GPU card according to claim 6, characterized in that, There are multiple heat exchange tubes, which are divided into first heat exchange tubes and second heat exchange tubes. There are multiple second heat exchange tubes. The extension direction of the first heat exchange tube coincides with the extension direction of the center line of the heat dissipation tube. The multiple second heat exchange tubes are arranged at intervals along the circumference of the first heat exchange tube.

9. The VC heatsink for a GPU card according to claim 7 or 8, characterized in that, The heat dissipation assembly also includes heat exchange fins, which are connected to the second side of the plate. There are multiple heat exchange fins, which are spaced apart along the width direction of the plate.

10. The VC heatsink for a GPU card according to claim 9, characterized in that, The width of the heat exchange fin is less than the length of the heat exchange fin in its extending direction.

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