Metallized film capacitor

Abstract

According to the metalized film capacitor provided by the utility model, the heat dissipation holes are arranged at the four corners of the shell and are used for heat dissipation in the shell, the dustproof nets are arranged at the inner sides of the heat dissipation holes and are used for preventing dust and impurities from entering the shell to cause pollution, and the heat dissipation cavities are distributed in the front, rear, left, right, upper and lower directions in the shell, so that the heat dissipation efficiency is improved. The ceramic radiating fins are arranged in the shell, the radiating cavities are communicated with one another, and air convection can be formed among the radiating cavities under the action of the four radiating holes, so that the metalized film far away from the ceramic radiating fins can be further radiated, and the heat of the ceramic radiating fins can be brought out of the shell; the outer wall of the ceramic cooling fin is coated with the heat-conducting silica gel coating, and the heat-conducting silica gel coating is made of silica gel materials, not only can conduct heat, but also has certain elasticity, can buffer the ceramic cooling fin when the ceramic cooling fin is subjected to external force, can reduce the brittleness of the ceramic cooling fin, and cannot be directly exposed to scratch a metallized film when the ceramic cooling fin is broken.

Description

Technical Field

[0001] This utility model belongs to the field of capacitor technology, and in particular relates to a metallized film capacitor. Background Technology

[0002] Metallized film capacitors are capacitors made by winding organic plastic films as dielectrics and metallized films as electrodes. The films used in metallized film capacitors include polyethylene, polypropylene, and polycarbonate. In addition to wound types, there are also laminated types. Among them, polyester film dielectric and polypropylene film dielectric are the most widely used. Metallized film capacitors use polyester film or polypropylene film as dielectric, and zinc-aluminum alloy is attached to the surface of the film by vacuum evaporation to form electrodes. The capacitor is formed by winding or stacking. Metallized film capacitors have high voltage resistance, high insulation resistance, good impedance frequency characteristics, and high capacitance stability.

[0003] A search revealed that Chinese authorized patent number CN214254131U discloses a metallized film capacitor, comprising a plastic film, a protective layer, and a ceramic heat sink. The front and back of the plastic film are respectively provided with a positive electrode evaporation layer and a negative electrode evaporation layer, and one end of each of the positive and negative electrode evaporation layers is connected to a metal contact layer. A lead is fixedly installed on one side of the metal contact layer, and a pin is fixedly installed on the bottom of the lead. The lead, plastic film, positive electrode evaporation layer, negative electrode evaporation layer, and metal contact layer are all inside the protective layer. The outside of the protective layer is filled with a flame-retardant layer, and the surface of the flame-retardant layer is provided with an outer packaging layer, and the surface of the outer packaging layer is provided with a marking area.

[0004] The aforementioned comparative documents also have the following shortcomings: First, because the plastic film is wrapped in multiple layers on the surface of the ceramic heat sink, there is a temperature difference in heat dissipation between the outer plastic film and the inner plastic film, which will reduce the lifespan of the capacitor after long-term use; Second, the ceramic heat sink used is relatively brittle and easily breaks or is damaged. Damage to the ceramic heat sink not only affects heat dissipation but also scratches the metallized film; Therefore, this utility model proposes a metallized film capacitor to solve the above problems. Utility Model Content

[0005] The purpose of this utility model is to provide a solution to the problems raised in the background art.

[0006] This utility model is achieved through the following technical solution:

[0007] This utility model is a metallized film capacitor, including a housing assembly, a metallized film assembly, and a heat dissipation assembly;

[0008] The outer casing assembly includes an outer casing, which has a rectangular structure. Each of the four corners of the outer casing has a heat dissipation hole, and the inner wall of each heat dissipation hole is provided with a dustproof mesh.

[0009] The metallized film assembly includes a base layer, a metal film layer, and a metal contact layer. The metal film layer is deposited on the surface of the base layer and electrically connected to the metal contact layer. There is a gap between the metallized film assembly and the inner wall of the outer shell, and the gap is a heat dissipation cavity.

[0010] The heat dissipation component includes a ceramic heat sink with a thermally conductive silicone coating on its outer wall, and the base layer and metal film layer are wrapped around the outside of the heat dissipation component.

[0011] Preferably, the heat dissipation cavities are distributed on the six sides inside the outer casing: front, rear, left, right, top, and bottom, and all of them are connected to form air convection.

[0012] Preferably, the outer surface of the housing has two oppositely distributed pins.

[0013] Preferably, the pin is connected to a soldering foot, and the soldering foot has a soldering hole.

[0014] Preferably, the metal contact layer is electrically connected to the pin.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. Heat dissipation holes are provided at the four corners of the outer shell. The heat dissipation holes are used for heat dissipation inside the outer shell. Dustproof screens are provided inside the heat dissipation holes to prevent dust and impurities from entering the inner shell and causing pollution. There is a gap between the metallized film assembly and the inner wall of the outer shell. This gap is a heat dissipation cavity. The heat dissipation cavities are distributed in six directions inside the outer shell: front, back, left, right, top, and bottom. The heat dissipation cavities are connected to each other. Under the action of the four heat dissipation holes, air convection can be formed between the heat dissipation cavities. This can further dissipate heat from the metallized film that is far away from the ceramic heat sink and carry the heat of the ceramic heat sink out of the inner shell.

[0017] 2. A thermally conductive silicone coating is applied to the outer wall of the ceramic heat sink. The thermally conductive silicone coating is made of silicone material, which not only conducts heat but also has a certain degree of elasticity. It can buffer the ceramic heat sink when it is subjected to external force, reduce the brittleness of the ceramic heat sink, and prevent the metallization film from being directly exposed and scratched when the ceramic heat sink breaks. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0020] Figure 3 for Figure 2Enlarged view of a portion of point A in the middle.

[0021] In the picture:

[0022] 1. Housing assembly; 11. Housing; 12. Heat dissipation holes; 13. Dust filter; 14. Heat dissipation cavity; 15. Pins; 16. Solder leads; 17. Solder holes;

[0023] 2. Metallized film assembly; 21. Base layer; 22. Metal film layer; 23. Metal contact layer;

[0024] 3. Heat dissipation components; 31. Ceramic heat sink; 32. Thermally conductive silicone coating. Detailed Implementation

[0025] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0026] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0027] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] Please see Figures 1 to 3 This utility model provides a technical solution: a metallized film capacitor, including a housing assembly 1, a metallized film assembly 2, and a heat dissipation assembly 3; the housing assembly 1 includes a housing 11, which has a rectangular structure, and heat dissipation holes 12 are provided at the four corners of the housing 11, and dustproof mesh 13 is provided on the inner wall of each heat dissipation hole 12; the metallized film assembly 2 includes a base layer 21, a metal film layer 22, and a metal contact layer 23, the metal film layer 22 is vapor-deposited on the surface of the base layer 21, the metal film layer 22 is electrically connected to the metal contact layer 23, and there is a gap between the metallized film assembly 2 and the inner wall of the housing 11, the gap being a heat dissipation cavity 14; the heat dissipation assembly 3 includes a ceramic heat sink 31, the outer wall of the ceramic heat sink 31 is provided with a thermally conductive silicone coating 32, and the base layer 21 and the metal film layer 22 are wrapped around the outside of the heat dissipation assembly 3.

[0031] In this embodiment, heat dissipation holes 12 are provided at the four corners of the outer casing 11. The heat dissipation holes 12 are used for heat dissipation inside the outer casing 11. A dustproof mesh 13 is provided inside the heat dissipation holes 12 to prevent dust and impurities from entering the interior of the outer casing 11 and causing contamination. There is a gap between the metallized film assembly 2 and the inner wall of the outer casing 11. This gap is a heat dissipation cavity 14. The heat dissipation cavities 14 are distributed in six directions inside the outer casing 11: front, back, left, right, top, and bottom. The heat dissipation cavities 14 are interconnected. Under the action of the four heat dissipation holes 12, the heat dissipation cavities are connected to each other. Air convection can be formed between 14, which can further dissipate heat from the metallization film away from the ceramic heat sink 31 and carry the heat of the ceramic heat sink 31 out of the interior of the outer casing 11; a thermally conductive silicone coating 32 is coated on the outer wall of the ceramic heat sink 31. The thermally conductive silicone coating 32 is made of silicone material, which can not only conduct heat, but also has a certain elasticity. It can buffer the ceramic heat sink 31 when it is subjected to external force, reduce the brittleness of the ceramic heat sink 31, and prevent the metallization film from being directly exposed and scratched when the ceramic heat sink 31 breaks.

[0032] For further details, please refer to Figure 2 The heat dissipation cavities 14 are distributed on the front, back, left, right, top and bottom sides inside the outer shell 11, and all of them are connected to form air convection.

[0033] In this embodiment, there is a gap between the metallized film assembly 2 and the inner wall of the outer shell 11. This gap is a heat dissipation cavity 14. The heat dissipation cavities 14 are distributed in six directions inside the outer shell 11: front, back, left, right, top, and bottom. The heat dissipation cavities 14 are connected to each other. Under the action of the four heat dissipation holes 12, air convection can be formed between the heat dissipation cavities 14, which facilitates heat dissipation.

[0034] For further details, please refer to Figure 1 The outer casing 11 has two oppositely distributed pins 15.

[0035] For further details, please refer to Figure 2 , Metal contact layer 23 electrically connects to pin 15.

[0036] In this embodiment, pin 15 is connected to metal contact layer 23, and metal contact layer 23 is connected to metal film layer 22, thus forming a circuit.

[0037] Furthermore, please refer to the figure, pin 15 is connected to solder foot 16, and solder foot 16 has a solder hole 17.

[0038] In this embodiment, the welding feet 16 and welding holes 17 facilitate the welding and installation of the capacitor, and prevent the capacitor from becoming loose due to welding defects.

[0039] The working principle and usage process of this utility model are as follows: Heat dissipation holes 12 are provided at the four corners of the outer shell 11. These holes 12 are used for heat dissipation inside the outer shell 11. Dustproof mesh 13 is provided inside the heat dissipation holes 12 to prevent dust and impurities from entering the outer shell 11 and causing contamination. A gap exists between the metallized film assembly 2 and the inner wall of the outer shell 11; this gap forms heat dissipation chambers 14. The heat dissipation chambers 14 are distributed in six directions inside the outer shell 11: front, back, left, right, top, and bottom. All heat dissipation chambers 14 are interconnected. Under the action of the four heat dissipation holes 12, each... Air convection can be formed between the heat dissipation cavities 14, which can further dissipate heat from the metallization film away from the ceramic heat sink 31 and carry the heat of the ceramic heat sink 31 out of the interior of the outer casing 11. The outer wall of the ceramic heat sink 31 is coated with a thermally conductive silicone coating 32. The thermally conductive silicone coating 32 is made of silicone material, which can not only conduct heat but also has a certain degree of elasticity. It can buffer the ceramic heat sink 31 when it is subjected to external force, reduce the brittleness of the ceramic heat sink 31, and prevent the metallization film from being directly exposed and scratched when the ceramic heat sink 31 breaks.

[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A metallized film capacitor, characterized in that: It includes a housing assembly (1), a metallized film assembly (2), and a heat dissipation assembly (3); The outer shell assembly (1) includes an outer shell (11), which is a rectangular structure. Each of the four corners of the outer shell (11) is provided with a heat dissipation hole (12), and the inner wall of each heat dissipation hole (12) is provided with a dustproof mesh (13). The metallized film assembly (2) includes a base layer (21), a metal film layer (22) and a metal contact layer (23). The metal film layer (22) is deposited on the surface of the base layer (21) and electrically connected to the metal contact layer (23). There is a gap between the metallized film assembly (2) and the inner wall of the outer shell (11). The gap is a heat dissipation cavity (14). The heat dissipation component (3) includes a ceramic heat sink (31), and a thermally conductive silicone coating (32) is provided on the outer wall of the ceramic heat sink (31). The base layer (21) and the metal film layer (22) are wrapped around the outside of the heat dissipation component (3).

2. A metallized film capacitor according to claim 1, characterized in that: The heat dissipation cavities (14) are distributed on the front, back, left, right, top and bottom sides inside the outer shell (11), and all of them are connected to form air convection.

3. A metallized film capacitor according to claim 1, characterized in that: The outer casing (11) has two oppositely distributed pins (15).

4. A metallized film capacitor according to claim 3, characterized in that: The pin (15) is connected to the soldering foot (16), and the soldering foot (16) has a soldering hole (17).

5. A metallized film capacitor according to claim 3, characterized in that: The metal contact layer (23) is electrically connected to the pin (15).

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