Heat dissipation back splint

Abstract

The utility model relates to a heat dissipation back splint. Comprising a shell, a heat dissipation piece and a clamping assembly, the heat dissipation piece is arranged in the shell, containing grooves are formed in the two opposite sides of the heat dissipation piece respectively, and receding grooves communicating with the containing grooves are formed in the shell; the clamping assembly comprises elastic pieces, connecting pieces and clamping pieces, the number of the connecting pieces is two, the two connecting pieces correspond to the two containing grooves in a one-to-one mode, the connecting pieces are in sliding connection with the corresponding containing grooves, the connecting pieces are arranged in the corresponding containing grooves in an elastic telescopic mode through the elastic pieces, and the number of the clamping pieces is two. The two clamping pieces correspond to the two connecting pieces one to one, the clamping pieces are connected with the corresponding connecting pieces outside the shell, and the two connecting pieces can drive the clamping pieces to elastically stretch out and draw back relatively so that an elastic clamping space can be formed between the two clamping pieces. The containing grooves are formed in the two opposite sides of the heat dissipation piece, and the connecting pieces are arranged in the corresponding containing grooves in the elastic telescopic mode, so that the thickness of the whole heat dissipation back clamp cannot be excessively increased due to the arrangement of the connecting pieces.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology for electronic devices such as mobile phones and tablets, and in particular to a heat sink back clip. Background Technology

[0002] With the development of consumer electronics, in order to meet user needs, the performance of mobile phones, tablets, and other electronic devices has become increasingly powerful, inevitably leading to overheating. To solve this problem, many heat sinks have appeared on the market to dissipate heat and cool down mobile phones, tablets, and other electronic devices.

[0003] Heat sinks are typically equipped with clamping mechanisms to secure them to the heat-generating surface (back) of electronic devices such as mobile phones and tablets. However, the use of clamping mechanisms in existing technologies increases the thickness and size of the heat sink back clip, making it inconvenient for daily carrying and use, and negatively impacting the user experience. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is to provide a heat dissipation back clip to solve the problem that the heat dissipation back clip with a clamping mechanism in the prior art will increase the size and thickness.

[0005] This utility model discloses a heat dissipation back clip, comprising: a shell; a heat dissipation component disposed within the shell, wherein the heat dissipation component has receiving grooves on opposite sides, and the shell has a clearance groove communicating with the receiving grooves; and a clamping assembly comprising an elastic element, a connecting element, and a clamping element. Two connecting elements are provided, each corresponding to one of the two receiving grooves. The connecting elements are slidably connected to their corresponding receiving grooves, and are elastically extendable and retractable within their corresponding receiving grooves via the elastic element. Two clamping elements are provided, each corresponding to one of the two connecting elements. The clamping elements are connected to their corresponding connecting elements outside the shell. The two connecting elements can respectively drive the clamping elements to elastically extend and retract relative to each other to form an elastic clamping space between the two clamping elements.

[0006] Optionally, the heat sink includes a plate and a plurality of heat sinks disposed on one side of the plate, and the receiving groove is located on the side of the plate away from the heat sinks.

[0007] Optionally, the outer casing includes a first casing and a second casing connected to each other, the heat dissipation component is disposed between the first casing and the second casing, the clearance groove is disposed on the second casing, and the second casing is further provided with a first connecting post on the side facing the first casing. One end of the elastic component is connected to the first connecting post, and the other end of the elastic component is connected to the connecting component.

[0008] Optionally, the heat dissipation back clip further includes a fan assembly, which includes a mounting bracket and a cooling fan connected to each other. The mounting bracket is disposed on the side of the plate facing the first housing. The first housing is provided with an air inlet corresponding to the fan assembly. The heat sink is arranged around the fan assembly. There are also several air outlets along the periphery of the second housing. The air outlets are arranged corresponding to the heat sinks and are connected to the air inlet.

[0009] Optionally, the connector includes a sliding block and a cover plate that interlock with each other, at least one guide groove is formed between the sliding block and the cover plate, the elastic element is located in the guide groove, a second connecting post is provided in the sliding block, one end of the elastic element is connected to the second connecting post, and the other end of the elastic element is connected to the outer shell or the heat sink.

[0010] Optionally, one of the sliding block and the clamping member is provided with a rotating shaft, and the other is provided with a connecting hole adapted to the rotating shaft.

[0011] Optionally, the second housing is further provided with a through groove, and the side of the plate away from the heat sink is provided with a boss corresponding to the through groove. The heat sink back clip also includes a cooling plate, which is disposed in the through groove and connected to the boss.

[0012] Optionally, the second housing has a plurality of mounting grooves on the side opposite to the first housing, and magnetic components are provided in the mounting grooves. A protective plate is also provided on the second housing, and the protective plate covers the cooling chip and the magnetic components.

[0013] Optionally, the heat dissipation back clip further includes a circuit board, which is ring-shaped and corresponding to the heat sink. The circuit board is provided with a charging interface and a button, and the heat sink has a notch for avoiding the charging interface and the button. The second housing is provided with a through hole corresponding to the notch.

[0014] Optionally, the clamping assembly further includes a wear-resistant plate, both the wear-resistant plate and the connector are made of plastic material, the wear-resistant plate is fixed to the receiving groove and clamped between the connector and the receiving groove.

[0015] Compared with the prior art, the beneficial effects of the heat dissipation back clip provided in this embodiment are as follows: by providing receiving grooves on opposite sides of the heat dissipation component, the two connecting members of the clamping assembly can be elastically and telescopically arranged in their corresponding receiving grooves. Therefore, the arrangement of the connecting members does not excessively increase the overall thickness of the heat dissipation back clip. Furthermore, providing receiving grooves on opposite sides of the heat dissipation component does not excessively reduce the heat dissipation efficiency of the heat dissipation component itself. The heat dissipation back clip provided in this embodiment reduces the space occupied inside the heat dissipation back clip, optimizes the structural layout of the heat dissipation back clip, and makes the structure of the heat dissipation back clip more compact, smaller in size, and thinner. Attached Figure Description

[0016] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0017] Figure 1 This is a schematic diagram of the heat dissipation back clip provided in an embodiment of the present utility model;

[0018] Figure 2 This is an exploded view of the heat dissipation back clip provided in this embodiment of the utility model;

[0019] Figure 3 This is a schematic diagram of the heat dissipation component provided in an embodiment of the present utility model;

[0020] Figure 4 This is a schematic diagram of the second housing, cooling chip, and protective plate provided in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the second housing provided in an embodiment of the present utility model;

[0022] Figure 6 This is a schematic diagram of the clamping assembly provided in an embodiment of the present utility model;

[0023] Figure 7 This is a schematic diagram of the second housing, heat sink, and circuit board provided in an embodiment of the present invention.

[0024] The labels for the attached figures are as follows:

[0025] 1000, Heat dissipation back clip; 100, Outer shell; 101, First shell; 101, Air inlet; 102, Second shell; 1021, Clearance groove; 1022, First connecting post; 1023, Through groove; 1024, Mounting groove; 1025, Air outlet; 1026, Through hole; 200, Heat dissipation component; 201, Plate; 2011, Receiving groove; 202, Heat dissipation fin; 2021, Notch; 203, Boss; 300, Clamping assembly; 301. Elastic component; 302, Connector; 3021, Sliding block; 30211, Second connecting post; 30212, Rotating shaft; 3022, Cover plate; 3023, Guide groove; 303, Clamping component; 3031, Connecting hole; 400, Fan assembly; 401, Mounting bracket; 402, Cooling fan; 500, Cooling plate; 600, Magnetic component; 700, Protective plate; 800, Wear-resistant plate; 900, Circuit board; 901, Charging interface; 902, Button. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0027] This utility model embodiment provides a heat dissipation back clip 1000, such as Figure 1-4 As shown, the heat dissipation back clip 1000 includes: a housing 100, a heat dissipation component 200, and a clamping assembly 300. The heat dissipation component 200 is disposed inside the housing 100, and receiving grooves 2011 are respectively provided on opposite sides of the heat dissipation component 200. The housing 100 is provided with a clearance groove 1021 communicating with the receiving grooves 2011. The clamping assembly 300 includes an elastic member 301, a connecting member 302, and a clamping member 303. Two connecting members 302 are provided, and the two connecting members 302 correspond one-to-one with the two receiving grooves 2011. The connector 302 is slidably connected to its corresponding receiving groove 2011, and the connector 302 is elastically telescopically disposed in its corresponding receiving groove 2011 through the elastic member 301. Two clamping members 303 are provided, and the two clamping members 303 correspond one-to-one with the two connectors 302. The clamping members 303 are connected to their corresponding connectors 302 outside the housing 100. The two connectors 302 can respectively drive the clamping members 303 to elastically telescopically extend and retract relative to each other to form an elastic clamping space between the two clamping members 303.

[0028] Specifically, the heat dissipation back clip 1000 contacts the heat-generating surface (back side) of the electronic device and is stably clamped onto the electronic device by the clamping assembly 300. A heat sink 200 is provided inside the housing 100. The heat sink 200 absorbs and dissipates heat from the heat-generating surface of the electronic device, thereby achieving a heat dissipation effect. A receiving groove 2011 is provided on the heat sink 200. Two connecting members 302 on the clamping assembly 300 are slidably connected to their corresponding receiving grooves 2011 and are elastically extendable and retractable in their respective receiving grooves 2011 by an elastic member 301. Thus, when the two connecting members 302 drive the clamping members 303 to slide outwards (i.e., slide away from the housing 100), an elastic clamping space is formed between the two clamping members 303, allowing the clamping assembly 300 to stably clamp the electronic device. The elasticity and stretchability are inherent functions of the elastic element 301. When stretched or compressed, the elastic element 301 accumulates elastic potential energy, resulting in an inward (i.e., towards the outer casing 100) clamping force when the clamping element 303 slides outward. This allows the two clamping elements 303 to form an elastic clamping space, thus enabling the heat dissipation back clip 1000 to be stably clamped and fixed to the electronic device. This design allows the heat dissipation back clip 1000 to be fixed to the heat-generating surface of the electronic device via the clamping assembly 300, absorbing and dissipating the heat generated by the heat-generating surface. Furthermore, because the two connecting parts 302 of the clamping assembly 300 are located within the receiving groove 2011 of the heat dissipation element 200, the internal space occupied by the heat dissipation back clip 1000 is reduced, optimizing the structural layout of the heat dissipation back clip 1000 and making its structure more compact, smaller in size, and thinner.

[0029] The heat sink 200 can directly or indirectly contact the heat-generating surface of the electronic device, thereby transferring heat to itself and dissipating the heat through the heat sink 200. The clamping assembly 300 can firmly fix the heat sink back clip 1000 to the electronic device, preventing it from loosening or falling off during use.

[0030] Specifically, one end of the elastic element 301 is connected to the connector 302, and the other end is connected to the housing 100 or the heat sink 200, so that when the connector 302 slides in its corresponding receiving groove 2011, it can form an elastically stretchable structure by stretching or compressing the elastic element 301. The elastic element 301 can be set as a tension spring, a compression spring, or an elastic rope according to actual needs.

[0031] refer to Figure 1 , Figure 2 and Figure 5The outer casing 100 includes a first casing 101 and a second casing 102 connected to each other. A heat sink 200 is disposed between the first casing 101 and the second casing 102. A clearance groove 1021 is disposed on the second casing 102. The second casing 102 is also provided with a first connecting post 1022 on the side facing the first casing 101. One end of the elastic member 301 is connected to the first connecting post 1022, and the other end of the elastic member 301 is connected to the connecting member 302.

[0032] The first housing 101 and the second housing 102 are interconnected, and the heat dissipation component 200 is disposed between the first housing 101 and the second housing 102. A clearance groove 1021 for avoiding the clamping component 303 is disposed on the second housing 102, which can avoid the clamping action of the clamping component 300 from affecting the outer housing 100. A first connecting post 1022 is provided on the side of the second housing 102 facing the first housing 101. One end of the elastic member 301 is connected to the first connecting post 1022, and the other end is connected to the connecting component 302, so as to ensure that both ends of the elastic member 301 are fixed and limited, which can prevent the elastic member 301 from loosening or shifting during use.

[0033] The heat sink 200 is placed between the first housing 101 and the second housing 102. The heat sink 200 is located in the space between the two and can effectively dissipate the temperature to the surrounding air environment to promote the heat dissipation effect of the heat sink 200, improve the heat dissipation performance, and ensure the stability of the heat sink back clip 1000 under high load operation.

[0034] refer to Figure 2 and Figure 3 The heat sink 200 includes a plate 201 and a plurality of heat sinks 202 disposed on one side of the plate 201, and the receiving groove 2011 is located on the side of the plate 201 away from the heat sinks 202.

[0035] The heat sink 200 includes a plate 201 and a plurality of heat sinks 202 disposed on one side of the plate 201. The heat sinks 202 can increase the surface area of ​​the heat sink 200 in contact with the outside air, that is, increase the heat dissipation area of ​​the heat sink 200, and can effectively conduct heat from the heat sink 200 to the outside environment, improve the heat dissipation efficiency of the heat sink back clip 1000, and thus achieve the cooling of the heat-generating surface of the electronic device.

[0036] Specifically, the receiving slot 2011 is located on the side of the board 201 away from the heat sink 202 to prevent the connector 302 from affecting or interfering with the heat sink 202 during the sliding of its corresponding receiving slot 2011. This ensures the normal use of the heat sink 200.

[0037] It is easy to understand that the heat sink 202 helps to distribute heat evenly on the heat sink 200, avoids local overheating, improves the heat dissipation effect of the heat sink back clip 1000, and ensures stable operation.

[0038] refer to Figure 2 , Figure 4 and Figure 5 The heat dissipation back clip 1000 also includes a fan assembly 400, which includes a mounting bracket 401 and a cooling fan 402 connected to each other. The mounting bracket 401 is located on the side of the plate 201 facing the first housing 101. The first housing 101 is provided with an air inlet 101 corresponding to the fan assembly 400. The heat sink 202 is arranged around the fan assembly 400. There are also a number of air outlets 1025 along the periphery of the second housing 102. The air outlets 1025 are arranged corresponding to the heat sink 202 and are connected to the air inlet 101.

[0039] The fan assembly 400 primarily guides airflow into the heat dissipation back clip 1000, carrying away heat from the heat sink 202 of the heat sink 200, thereby cooling the electronic device connected to the heat dissipation back clip 1000. Several air outlets 1025 are also provided around the periphery of the second housing 102. After the heat dissipation back clip 1000 comes into contact with the heat-generating surface of the electronic device, the fan assembly 400 inside the heat dissipation back clip 1000 guides the airflow from the air inlet 101 to the air outlet 1025, increasing the airflow velocity at the heat sink 202 and enhancing its heat dissipation capacity. The air outlets 1025 are connected to the air inlet 101, ensuring normal airflow and flow, thus achieving the normal heat dissipation function of the heat dissipation back clip 1000.

[0040] It is easy to understand that the fan assembly 400 enhances airflow and accelerates heat dissipation, thereby improving the heat dissipation efficiency of the heat sink 1000 for electronic devices. The air inlet 101 corresponds to the fan assembly 400, facilitating the introduction of outside air into the heat sink 1000, guiding airflow to aid heat dissipation, preventing heat buildup on the heat sink 200, and improving the heat dissipation effect of the heat sink 1000. The air outlet 1025, corresponding to the heat sink 202, achieves balanced heat transfer, allowing airflow to carry away the heat from the heat sink 202 as it passes over it. Simultaneously, the airflow exits through the air outlet 1025, accelerating airflow and further enhancing heat dissipation and cooling of the heat sink 200, preventing localized overheating, and improving the stability and efficiency of the heat sink 1000.

[0041] The mounting bracket 401 is mounted on the board 201, and the cooling fan 402 is mounted on the mounting bracket 401, which gives the fan assembly 400 high structural strength and allows it to be stably fixed on the board 201.

[0042] Specifically, the heat sink 202 is arranged around the fan assembly 400, which can enhance the blowing of the fan assembly 400 on the heat sink 202. It can ensure that the airflow guided by the fan assembly 400 flows through the heat sink 202, helping the heat sink 202 to dissipate heat and cool down, thereby further enhancing the efficiency of heat dissipation, ensuring that heat can be quickly carried away, and improving the heat dissipation effect of the heat dissipation back clip 1000.

[0043] It should be noted that a drive component for driving the cooling fan 402 is provided between the cooling fan 402 and the mounting bracket 401.

[0044] refer to Figure 6 The connector 302 includes a sliding block 3021 and a cover plate 3022 that are interlocked. At least one guide groove 3023 is formed between the sliding block 3021 and the cover plate 3022. An elastic member 301 is located in the guide groove 3023. A second connecting post 30211 is provided in the sliding block 3021. One end of the elastic member 301 is connected to the second connecting post 30211, and the other end of the elastic member 301 is connected to the outer shell 100 or the heat sink 200.

[0045] The sliding block 3021 and the cover plate 3022 interlock, ensuring the structural strength and stability of the connector 302 and protecting the internal second connecting post 30211 and elastic member 301. At least one guide groove 3023 is formed between the sliding block 3021 and the cover plate 3022. The second connecting post 30211 is located within the guide groove 3023. One end of the elastic member 301 is connected to the second connecting post 30211, and the other end is connected to the housing 100 or the heat sink 200. Therefore, the elastic member 301 can generate elastic deformation and elastic force during the sliding of the connector 302 relative to the heat sink 200, causing the clamping assembly 300 to tend to move towards the housing 100. Ultimately, this allows the clamping assembly 300 to be stably and securely connected to the electronic device via the clamping member 303.

[0046] The guide groove 3023 can guide and limit the elastic element 301 within the guide groove 3023, preventing displacement and sliding of the elastic element 301 during elastic deformation and recovery deformation, and ensuring the normal operation of the elastic element 301.

[0047] refer to Figure 6 The sliding block 3021 has a rotating shaft 30212 on the exposed side of the receiving groove 2011. The clamping member 303 has a connecting hole 3031 that is rotatably connected to the rotating shaft 30212. The clamping member 303 is rotatably connected to the sliding block 3021 through the connecting hole 3031.

[0048] The rotating shaft 30212 and the connecting hole 3031 are rotatably connected to achieve a reliable rotatable connection between the sliding block 3021 and the clamping member 303. This allows the clamping member 303 to rotate relative to the sliding block 3021, enabling the clamping member 303 to clamp the electronic device after rotating relative to the sliding block 3021, thereby ensuring stable clamping of the electronic device.

[0049] Specifically, the rotatable connection between the pivot 30212 and the connecting hole allows for convenient connection between the sliding block 3021 and the clamping member 303. Simultaneously, when the heat dissipation back clip 1000 is not needed, the clamping member 303 can rotate relative to the sliding block 3021 to a storage position, facilitating the storage and carrying of the heat dissipation back clip 1000. In other embodiments, the connecting hole can be provided on the sliding block 3021, and the corresponding pivot can be provided on the clamping member 303. That is, if one of the sliding block 3021 and the clamping member 303 has a pivot, and the other has a connecting hole adapted to the pivot, a rotatable connection between the sliding block 3021 and the clamping member 303 can be achieved.

[0050] refer to Figure 2 and Figure 4 The second housing 102 is also provided with a through groove 1023. The plate 201 is provided with a boss 203 corresponding to the through groove 1023 on the side away from the heat sink 202. The heat sink back clip 1000 also includes a cooling plate 500, which is disposed in the through groove 1023 and connected to the boss 203.

[0051] The second housing 102 is provided with a through groove 1023 that penetrates the second housing 102. A cooling chip 500 is provided in the through groove 1023. The cooling chip 500 is directly connected to the heat sink 200 through the connection with the boss 203. It can transfer the heat generated by the hot surface of the cooling chip 500 to the heat sink 200, and then transfer the heat to the external environment through the heat sink 202 and the fan assembly 400 on the heat sink 200, thereby achieving the heat dissipation effect of electronic equipment.

[0052] The boss 203 is directly connected to the cooling chip 500, which can directly transfer heat to the heat sink 200, making the heat conduction path more direct and effective, and can transfer heat out more quickly, thus improving the heat dissipation effect.

[0053] The cooling element 500 can be configured as a cooling component with a cooling effect. In one embodiment, the cooling element 500 is configured as a semiconductor cooling element, which is a component that utilizes the Peltier effect of semiconductor materials to achieve cooling and heat dissipation. The Peltier effect refers to the phenomenon of heat transfer between two semiconductor materials with different conductivity through an electric current. When an electric current passes through two semiconductor materials with different conductivity, one side of a semiconductor chip absorbs heat while the other side releases heat, thereby achieving the effect of cooling the electronic device. The semiconductor cooling element 500 has advantages such as small size, light weight, fast cooling speed, no vibration, and no noise.

[0054] refer to Figure 2 and Figure 4 The second housing 102 has several mounting slots 1024 on the side opposite to the first housing 101. Magnetic components 600 are provided in the mounting slots 1024. The outer housing 100 also includes a protective plate 700, which covers the cooling chip 500 and the magnetic components 600.

[0055] The second housing 102 has several mounting slots 1024 on one side, and a magnetic component 600 is provided in the mounting slot 1024. The magnetic component 600 is used to magnetically connect with the heating surface of the electronic device, which can ensure the stability of the connection between the heat dissipation back clip 1000 and the electronic device. The protection plate 700 can effectively protect the cooling chip 500 and the magnetic component 600 from damage or contamination by the external environment.

[0056] On the other hand, the protection board 700 can also prevent the components inside the heat dissipation back clip 1000 from damaging the surface of the electronic device, and the protection board 700 can protect the electronic device.

[0057] Specifically, the magnetic component 600 can be used in conjunction with the clamping assembly 300 of the heat dissipation back clip 1000 or independently, providing a tighter and more secure connection between the heat dissipation back clip 1000 and the electronic device, ensuring the heat dissipation effect and efficiency of the heat dissipation back clip 1000. The magnetic connection fixing method is not only simple, but also improves the stability and reliability of the heat dissipation back clip 1000.

[0058] refer to Figure 4 and Figure 7 The heat dissipation back clip 1000 also includes a circuit board 900, which is ring-shaped and corresponding to the heat sink 202. The circuit board 900 is provided with a charging interface 901 and a button 902. The heat sink 202 has a notch 2021 for avoiding the charging interface 901 and the button 902. The second housing 102 is provided with a through hole 1026 corresponding to the notch 2021.

[0059] In one embodiment, a charging interface 901 and a button 902 are respectively provided on opposite radial sides of the circuit board 900. This avoids mutual interference and influence during the charging process and the pressing of the button 902, improving the usability and convenience of the heat dissipation back clip 1000. The circuit board 900 itself is ring-shaped, so it can correspond to the heat sink 202 and be placed on the heat sink 202.

[0060] The notch 2021 formed on the heat sink 202 to avoid the charging interface 901 and button 902 provides a certain degree of fixed support and protection for the charging interface 901 and button 902, while preventing the charging interface 901 and button 902 from interfering with or affecting the heat sink 202. A through hole 1026 is provided on the second housing 102 to expose the charging interface 901 and button 902, and the through hole 1026 is correspondingly arranged to the notch 2021, ensuring the exposure of the charging interface 901 and button 902 and guaranteeing normal functional use.

[0061] refer to Figure 2 The heat dissipation back clip 1000 also includes a wear-resistant plate 800. Both the wear-resistant plate 800 and the connector 302 are made of plastic material. The wear-resistant plate 800 is fixed to the receiving groove 2011 and clamped between the connector 302 and the receiving groove 2011. Since the heat dissipation component 200 is generally made of a metal material with good thermal conductivity and has high hardness, while the connector 302 is generally made of plastic material, if the connector 302 is allowed to slide and rub directly against the heat dissipation component 200, it is easy to cause rapid wear of the connector 302. Therefore, in this embodiment, both the wear-resistant plate 800 and the connector 302 are made of plastic material, and the wear-resistant plate 800 is fixed to the receiving groove 2011. The wear-resistant plate 800 isolates the connector 302 and the heat dissipation component 200. That is to say, when the connector 302 slides in its corresponding receiving groove 2011, it is in sliding contact with the wear-resistant plate 800, thereby avoiding rapid wear of the connector 302.

[0062] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. A heat dissipation back clip, characterized in that, include: shell; A heat sink is disposed inside the housing. The heat sink has receiving grooves on opposite sides, and the housing has clearance grooves communicating with the receiving grooves. A clamping assembly includes an elastic element, a connector, and a clamping element. Two connectors are provided, each corresponding to one of two receiving slots. Each connector is slidably connected to its corresponding receiving slot and is elastically extendable / retractable within its corresponding receiving slot via the elastic element. Two clamping elements are also provided, each corresponding to one of the two connectors. Each clamping element is connected to its corresponding connector outside the outer casing. The two connectors can respectively drive the clamping elements to elastically extend / retract relative to each other, forming an elastic clamping space between the two clamping elements.

2. The heat dissipation back clip according to claim 1, characterized in that, The heat sink includes a plate and a plurality of heat sinks disposed on one side of the plate, and the receiving groove is located on the side of the plate away from the heat sinks.

3. The heat dissipation back clip according to claim 2, characterized in that, The outer casing includes a first casing and a second casing connected to each other. The heat dissipation component is disposed between the first casing and the second casing. The clearance groove is disposed on the second casing. The second casing is also provided with a first connecting post on the side facing the first casing. One end of the elastic component is connected to the first connecting post, and the other end of the elastic component is connected to the connecting component.

4. The heat dissipation back clip according to claim 3, characterized in that, The heat dissipation back clip also includes a fan assembly, which includes a mounting bracket and a cooling fan connected to each other. The mounting bracket is mounted on the side of the plate facing the first housing. The first housing has an air inlet corresponding to the fan assembly. The heat sink is arranged around the fan assembly. There are also several air outlets along the periphery of the second housing. The air outlets are arranged corresponding to the heat sinks and are connected to the air inlet.

5. The heat dissipation back clip according to claim 1, characterized in that, The connector includes a sliding block and a cover plate that interlock with each other. At least one guide groove is formed between the sliding block and the cover plate. The elastic element is located in the guide groove. A second connecting post is provided in the sliding block. One end of the elastic element is connected to the second connecting post, and the other end of the elastic element is connected to the outer shell or the heat sink.

6. The heat dissipation back clip according to claim 5, characterized in that, One of the sliding block and the clamping member is provided with a rotating shaft, and the other is provided with a connecting hole adapted to the rotating shaft.

7. The heat dissipation back clip according to claim 3, characterized in that, The second housing is also provided with a through groove, and the side of the plate away from the heat sink is provided with a boss corresponding to the through groove. The heat sink back clip also includes a cooling plate, which is disposed in the through groove and connected to the boss.

8. The heat dissipation back clip according to claim 7, characterized in that, The second housing has several mounting slots on the side opposite to the first housing, and magnetic components are provided in the mounting slots. A protective plate is also provided on the second housing, and the protective plate covers the cooling chip and the magnetic components.

9. The heat dissipation back clip according to claim 3, characterized in that, The heat dissipation back clip also includes a circuit board, which is ring-shaped and corresponding to the heat sink. The circuit board is provided with a charging interface and a button, and the heat sink has a notch to avoid the charging interface and the button. The second housing is provided with a through hole corresponding to the notch.

10. The heat dissipation back clip according to any one of claims 1-9, characterized in that, It also includes a wear-resistant sheet, both of which are made of plastic material. The wear-resistant sheet is fixed to the receiving groove and sandwiched between the connecting member and the receiving groove.

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