Capacitive touch control chip heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, and discloses a heat dissipation device for a capacitive touch control chip, which comprises the capacitive touch control chip, a heat dissipation substrate and a frame body, heat dissipation fins are fixedly arranged on the heat dissipation substrate, a fixed support is fixedly arranged in the frame body, a fan is fixedly arranged on the fixed support, and the fan is fixedly arranged on the heat dissipation substrate. And a dustproof net is arranged above the fan in the frame body. By arranging the heat conduction layer, the heat conduction efficiency between the capacitive touch chip and the heat dissipation substrate is improved, the heat dissipation area is increased through the design of the heat dissipation fins, the natural convection heat dissipation effect is improved, meanwhile, the fan in the frame body runs to accelerate air flow, forced convection heat dissipation is achieved, heat dissipation is further accelerated, the heat dissipation efficiency is improved, and the service life of the capacitive touch chip is prolonged. Through the dustproof net arranged above the fan in the frame body, dust in the air can be effectively prevented from entering the heat dissipation device, so that dust accumulation of blades of the fan is reduced, the fan can work more efficiently, and the temperature of the capacitive touch control chip is kept stable.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, specifically a heat dissipation device for capacitive touch chips. Background Technology

[0002] As electronic devices develop towards miniaturization and high performance, electronic components, especially integrated circuits, generate a lot of heat during operation. If this heat is not dissipated in a timely and effective manner, it will cause the chip temperature to rise, thereby affecting its performance and stability, and even damaging the chip. As a commonly used interactive interface component in modern smart devices, the heat dissipation problem of capacitive touch chips is particularly important. Therefore, developing an efficient heat dissipation device for capacitive touch chips has significant practical application value. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation device for capacitive touch chips to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a capacitive touch chip heat dissipation device, comprising a capacitive touch chip, a heat dissipation substrate, and a frame. A heat sink is fixedly disposed on the heat dissipation substrate, a fixed bracket is fixedly disposed within the frame, a fan is fixedly disposed on the fixed bracket, and a dustproof mesh is disposed above the fan within the frame. A thermally conductive layer is disposed between the heat dissipation substrate and the capacitive touch chip. A fixing block is fixedly disposed on the heat dissipation substrate, and a first screw hole is formed on the fixing block. An insertion hole is formed on the frame, and a first screw is inserted into the insertion hole and screwed into the first screw hole. A fixing frame is fixedly disposed within the frame, and a second screw hole is formed on the fixing frame. A mounting frame overlaps the fixing frame, and the dustproof mesh is fixedly disposed within the mounting frame. A fixing hole is formed on the mounting frame, and a second screw is inserted into the fixing hole and screwed into the second screw hole.

[0005] Preferably, the heat dissipation substrate is made of a material with high thermal conductivity.

[0006] Preferably, the thermally conductive layer is a high thermal conductivity silicone pad or other soft material with a high thermal conductivity coefficient, which can fill the tiny gap between the heat dissipation substrate and the capacitive touch chip to ensure good thermal contact.

[0007] Preferably, the heat sink is made of metal, and multiple heat sinks are provided. The multiple heat sinks are evenly spaced on the heat dissipation substrate, which can increase the heat dissipation area and air circulation.

[0008] Preferably, the fan is a DC fan, which can automatically adjust its speed by sensing the temperature of the capacitive touch chip through an internally mounted temperature sensor and control circuit.

[0009] Preferably, a mounting component is fixedly provided on the side end of the heat dissipation substrate, and the mounting component has mounting holes for fixing the heat dissipation substrate.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] 1) This capacitive touch chip heat dissipation device improves the heat conduction efficiency between the capacitive touch chip and the heat dissipation substrate by setting a thermal conductive layer. The heat sink design increases the heat dissipation area and improves the natural convection heat dissipation effect. At the same time, the fan inside the frame accelerates the airflow to achieve forced convection heat dissipation, further accelerating heat dissipation and improving heat dissipation efficiency. The dustproof net set above the fan inside the frame can effectively prevent dust in the air from entering the heat dissipation device, thereby reducing dust accumulation on the fan blades, enabling the fan to work more efficiently and maintaining the temperature stability of the capacitive touch chip.

[0012] 2) The capacitive touch chip heat dissipation device allows for easy removal of the mounting frame from the housing by removing the second screw. This facilitates daily cleaning and maintenance of the dust filter, ensuring it maintains good filtration and optimal performance. Removing the first screw allows the housing to be separated from the fixing block on the heat dissipation substrate, making it easy to remove the housing for repair when the fan malfunctions. This eliminates the need to disassemble the entire heat dissipation device, effectively reducing wear and extending its lifespan. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a heat dissipation device for a capacitive touch chip according to an embodiment of the present utility model;

[0014] Figure 2 This is a schematic diagram of the separation structure of the chip, heat dissipation substrate, and frame in an embodiment of this utility model;

[0015] Figure 3 This is a three-dimensional structural diagram of the heat dissipation substrate in an embodiment of the present utility model;

[0016] Figure 4 This is a three-dimensional structural diagram of the frame in an embodiment of the present utility model.

[0017] In the diagram: 1. Capacitive touch chip; 2. Heat sink substrate; 3. Heat sink; 4. Frame; 5. Mounting bracket; 6. Fan; 7. Socket; 8. Mounting block; 9. First screw hole; 10. Thermal conductive layer; 11. Mounting component; 12. Mounting hole; 13. First screw; 14. Mounting frame; 15. Mounting frame; 16. Dustproof mesh; 17. Mounting hole; 18. Second screw hole; 19. Second screw. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example 1

[0020] Combination Figures 1-4 A heat dissipation device for a capacitive touch chip includes a capacitive touch chip 1, a heat dissipation substrate 2, and a frame 4. A heat sink 3 is fixedly disposed on the heat dissipation substrate 2. A fixing bracket 5 is fixedly disposed inside the frame 4, and a fan 6 is fixedly disposed on the fixing bracket 5. A dustproof mesh 16 is disposed inside the frame 4 above the fan 6. A thermally conductive layer 10 is disposed between the heat dissipation substrate 2 and the capacitive touch chip 1. The heat dissipation substrate 2 is made of a material with a high thermal conductivity. The thermally conductive layer 10 is a high thermal conductivity silicone pad or other soft material with a high thermal conductivity. The heat sink 3 is made of metal. Multiple heat sinks 3 are disposed evenly and spaced on the heat dissipation substrate 2. The fan 6 is a DC fan. A mounting part 11 is fixedly disposed on the side end of the heat dissipation substrate 2. The mounting part 11 has mounting holes 12 for fixing the heat dissipation substrate 2.

[0021] Specifically, by setting a thermal conductive layer, the thermal conduction efficiency between the capacitive touch chip and the heat dissipation substrate is improved. The design of the heat sink increases the heat dissipation area and improves the natural convection heat dissipation effect. At the same time, the fan inside the frame accelerates the airflow to achieve forced convection heat dissipation, further accelerating heat dissipation and improving heat dissipation efficiency. The dustproof mesh set above the fan inside the frame can effectively prevent dust in the air from entering the heat dissipation device, thereby reducing dust accumulation on the fan blades, enabling the fan to work more efficiently and keeping the temperature of the capacitive touch chip stable.

[0022] See Figures 2-4 Furthermore, a fixing block 8 is fixedly installed on the heat dissipation substrate 2, and a first screw hole 9 is provided on the fixing block 8. An insertion hole 7 is provided on the frame 4, and a first screw 13 that is screwed into the insertion hole 7 and connected to the first screw hole 9 is inserted into the insertion hole 7. A fixing frame 14 is fixedly installed inside the frame 4, and a second screw hole 18 is provided on the fixing frame 14. An installation frame 15 is attached to the fixing frame 14. A dustproof net 16 is fixedly installed inside the installation frame 15, and a fixing hole 17 is provided on the installation frame 15. A second screw 19 that is screwed into the fixing hole 17 and connected to the second screw hole 18 is inserted into the fixing hole 17.

[0023] Specifically, by removing the second screw 19, the mounting frame 15 can be easily removed from the frame 4, facilitating daily cleaning and maintenance of the dust filter 16 and ensuring it maintains good filtration performance to preserve the optimal performance of the heat dissipation device. By removing the first screw 13 on the frame 4, the frame 4 can be separated from the fixing block 8 on the heat dissipation base plate 2, making it easy to remove the frame 4. This allows the fan 6 to be removed separately for repair when it malfunctions, without having to disassemble the entire heat dissipation device, effectively reducing wear and tear on the heat dissipation device and extending its service life.

[0024] In actual operation, the device is fixed on the circuit board where the capacitive touch chip 1 is located by the mounting part 11 and the mounting hole 12, and the bottom of the heat dissipation substrate 2 is in contact with the surface of the capacitive touch chip 1. The heat generated by the capacitive touch chip 1 during operation is transferred to the heat dissipation substrate 2 through the heat conduction layer 10, and then dissipated to the surrounding environment by the heat dissipation fins 3 on the heat dissipation substrate 2. At the same time, the fan 6 inside the frame 4 runs to accelerate the air flow and further improve the heat dissipation efficiency.

[0025] The dust filter 16 located above the fan 6 inside the frame 4 effectively prevents dust in the air from entering the heat dissipation device, thereby reducing dust accumulation on the fan blades and enabling the fan 6 to work more efficiently. This keeps the temperature of the capacitive touch chip 1 stable and improves heat dissipation efficiency. By removing the second screw 19, the mounting frame 15 can be easily removed from the frame 4, making it convenient for users to perform daily cleaning and maintenance on the dust filter 16, ensuring that it always maintains a good filtration effect and maintains the best performance of the heat dissipation device.

[0026] By removing the first screw 13 on the frame 4, the frame 4 can be separated from the fixing block 8 on the heat dissipation base plate 2, making it easy to disassemble the frame 4. This allows the fan 6 to be removed separately for repair when it malfunctions, without having to disassemble the entire heat dissipation device, thus reducing the wear and tear on the heat dissipation device.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for a capacitive touch chip, comprising a capacitive touch chip (1), a heat dissipation substrate (2), and a frame (4), characterized in that: A heat sink (3) is fixedly installed on the heat dissipation substrate (2), a fixed bracket (5) is fixedly installed inside the frame (4), a fan (6) is fixedly installed on the fixed bracket (5), and a dustproof net (16) is installed inside the frame (4) above the fan (6). A heat-conducting layer (10) is provided between the heat dissipation substrate (2) and the capacitive touch chip (1). A fixing block (8) is fixedly provided on the heat dissipation substrate (2). A first screw hole (9) is provided on the fixing block (8). An insertion hole (7) is provided on the frame (4). A first screw (13) that is screwed into the insertion hole (7) and connected to the first screw hole (9) is inserted into the insertion hole (7). A fixing frame (14) is fixedly provided inside the frame (4). A second screw hole (18) is provided on the fixing frame (14). An mounting frame (15) overlaps on the fixing frame (14). A dustproof net (16) is fixedly provided inside the mounting frame (15). A fixing hole (17) is provided on the mounting frame (15). A second screw (19) that is screwed into the fixing hole (17) and connected to the second screw hole (18) is inserted into the fixing hole (17).

2. The heat dissipation device for a capacitive touch chip according to claim 1, characterized in that: The heat dissipation substrate (2) is made of a material with high thermal conductivity.

3. The heat dissipation device for a capacitive touch chip according to claim 1, characterized in that: The thermally conductive layer (10) is a high thermal conductivity silicone pad.

4. The heat dissipation device for a capacitive touch chip according to claim 1, characterized in that: The heat sink (3) is made of metal. There are multiple heat sinks (3), which are evenly spaced on the heat dissipation substrate (2).

5. The heat dissipation device for a capacitive touch chip according to claim 1, characterized in that: The fan (6) is a DC fan.

6. The heat dissipation device for a capacitive touch chip according to claim 1, characterized in that: The heat dissipation substrate (2) is fixedly provided with a mounting component (11) on its side end, and the mounting component (11) is provided with mounting holes (12) for fixing the heat dissipation substrate (2).

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