Vapor chamber and electronic equipment
By setting through holes and limiting holes in the capillary structure of the heat exchange plate, the problem of difficult diffusion of gaseous heat exchange medium after the thickness of the heat exchange plate is reduced is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202520350314.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-02-28
AI Technical Summary
As the thickness of the heat exchange plate decreases, the gaseous heat exchange medium becomes difficult to diffuse, resulting in limited heat dissipation capacity.
Through holes and limiting holes are set in the capillary structure of the heat exchange plate to realize the vaporization and flow of the liquid heat exchange medium through the capillary effect, thereby improving the diffusion rate of the gaseous heat exchange medium.
With a thinner heat exchange plate, the diffusion rate and heat dissipation capacity of the gaseous heat exchange medium are increased, thereby enhancing the heat dissipation effect on the heat source.
Smart Images
Figure CN223943038U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat spreader and electronic device. Background Technology
[0002] Heat sinks are widely used in electronic devices, especially high-performance and high-capacity electronic devices, such as mobile phones and tablets.
[0003] As electronic devices become increasingly thinner, heat exchange plates also need to be made thinner. However, as the thickness of the heat exchange plate decreases, the gaseous heat exchange medium inside the heat exchange plate becomes difficult to diffuse, which limits the heat dissipation capacity of the heat exchange plate. Utility Model Content
[0004] This disclosure provides a heat spreader and an electronic device, which can solve the aforementioned technical problems existing in related technologies. The technical solution is as follows:
[0005] In a first aspect, a heat spreader is provided, the heat spreader comprising a shell and a first capillary structure;
[0006] The first capillary structure is located inside the housing and forms a cavity between itself and the inner wall of the housing. The first capillary structure includes a first part and a second part connected together. The first part is positioned opposite a heat source, and the second part has a through hole that communicates with the cavity.
[0007] In some possible implementations, the through-hole is strip-shaped and extends along the length of the first capillary structure.
[0008] In some possible implementations, one end of the through hole is connected to the first portion.
[0009] In some possible implementations, the through-hole is rectangular, and the width of the rectangle is 8mm-12mm.
[0010] In some possible implementations, the housing has a first protrusion that extends along the length of the housing and is connected to two opposite inner walls of the housing, respectively.
[0011] The first capillary structure has a limiting hole that matches the first protrusion.
[0012] In some possible implementations, the limiting hole is connected to the through hole, and its length is greater than the length of the through hole.
[0013] In some possible implementations, the heat spreader further includes a second capillary structure located between the first capillary structure and the housing;
[0014] The second capillary structure includes a third part and a fourth part. The third part is located on the side of the first protrusion away from the heat source, and the fourth part is connected to the third part and the first part, respectively.
[0015] In some possible implementations, the housing is located in a portion of the connection area between the third and fourth portions, with the distance between the two inner walls being smaller than in other areas.
[0016] In some possible implementations, the first outer surface of the housing has a second protrusion for connection to the heat source.
[0017] In some possible implementations, the second outer surface of the housing, away from the first outer surface, has a groove that is opposite to the second protrusion.
[0018] In some possible implementations, the depth of the groove is 0.1 mm to 0.3 mm.
[0019] In some possible implementations, the housing has a plurality of third protrusions that are evenly distributed on one inner surface of the housing.
[0020] In a second aspect, an electronic device is provided, the electronic device comprising a heat spreader provided in the first aspect and its possible implementations.
[0021] The beneficial effects of the technical solution provided in this disclosure include at least the following:
[0022] The liquid heat exchange medium stored in the capillary structure vaporizes upon heating. The resulting gaseous heat exchange medium flows within the cavity, releasing heat and liquefying during its flow. This gas-liquid conversion transfers heat from the heat source to other locations, thus achieving heat dissipation. Furthermore, in this disclosure, by creating through-holes in the second part, the flow resistance of the gaseous heat exchange medium within the shell can be reduced even with a thin heat spreader, thereby increasing the diffusion rate of the gaseous heat exchange medium and enhancing the heat dissipation capacity of the heat spreader.
[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the structure of a heat spreader provided in an embodiment of this disclosure;
[0026] Figure 2 This is an exploded view of a heat spreader provided in an embodiment of this disclosure;
[0027] Figure 3 This is a schematic diagram of a first capillary structure provided in an embodiment of this disclosure;
[0028] Figure 4 This is a schematic diagram of a lower shell structure provided in an embodiment of this disclosure;
[0029] Figure 5 This is a schematic diagram of a second capillary structure provided in an embodiment of this disclosure;
[0030] Figure 6 This is a schematic diagram of the structure of an upper shell provided in an embodiment of this disclosure;
[0031] Figure 7 This is a schematic diagram of the structure of a lower shell provided in an embodiment of this disclosure.
[0032] Figure label:
[0033] 1. Shell; 11. Upper shell; 12. Lower shell; 101. First protrusion; 102. Second protrusion; 103. Groove; 104. Third protrusion;
[0034] 2. First capillary structure; 201. Limiting hole; 21. First part; 22. Second part; 221. Through hole;
[0035] 3. Second capillary structure; 31. Third part; 32. Fourth part. Detailed Implementation
[0036] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.
[0037] It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.
[0038] This disclosure provides a heat spreader, combined with... Figure 1 , Figure 2 As shown, the heat spreader includes a shell 1 and a first capillary structure 2. The first capillary structure 2 is located inside the shell 1 and forms a cavity with the inner wall of the shell 1, which is then combined with... Figure 3As shown, the first capillary structure 2 includes a first part 21 and a second part 22 connected together. The first part 21 is used to be opposite to the heat source, and the second part 22 has a through hole 221 that communicates with the cavity.
[0039] In this way, the liquid heat exchange medium stored in the capillary structure is heated and vaporized. The resulting gaseous heat exchange medium flows within the cavity, releasing heat and liquefying during the flow. This gas-liquid conversion transfers heat from the heat source to other locations, thereby achieving a heat dissipation effect. Furthermore, in this embodiment, by opening a through hole 221 in the second part 22, the obstruction to the flow of the gaseous heat exchange medium in the shell 1 can be reduced when the heat exchange plate is relatively thin, thereby increasing the diffusion rate of the gaseous heat exchange medium and improving the heat dissipation capacity of the heat exchange plate for the heat source.
[0040] Among them, such as Figure 3 As shown, the second part 22 is the part of the first capillary structure 2 other than the first part 21.
[0041] The first capillary structure 2 is plate-shaped and has interconnected regular or irregular pores inside, so as to realize the transport of liquid heat exchange medium through capillary effect.
[0042] Optionally, the first capillary structure 2 can be, for example, but not limited to, a mesh structure formed of copper material, which has a porous structure similar to that of a sponge.
[0043] Combination Figure 1 , Figure 2 As shown, the housing 1 includes an upper shell 11 and a lower shell 12, which are fixedly connected to form a housing 1 with a cavity.
[0044] Optionally, the housing 1 can be rolled from a metal material such as copper, aluminum, or stainless steel. Of course, the housing 1 can also be made of other materials with good thermal conductivity and chemical stability, and this disclosure does not limit this.
[0045] Optionally, the thickness of the shell 1 is 0.04mm-0.07mm, and the thickness of the cavity is 0.3mm-0.4mm, to meet the requirements for ultra-thin heat spreader.
[0046] Optionally, the thickness of the first capillary structure 2 can be 0.03mm-0.05mm.
[0047] Optionally, the heat exchange medium can be deionized water or acetone. Of course, the heat exchange medium can also be other substances with stable chemical properties and good thermal conductivity, and this disclosure does not limit this.
[0048] Alternatively, the heat source can be the CPU of the electronic device.
[0049] In some embodiments, such as Figure 3 As shown, the through hole 221 is strip-shaped and extends along the length direction of the first capillary structure 2.
[0050] Thus, when the liquid heat exchange medium stored in the capillary structure is heated and vaporized in the first part 21 and its periphery, the gaseous heat exchange medium formed by vaporization will flow to the part away from the heat source. Since the through hole 221 is strip-shaped and extends along the length of the first capillary structure 2, the gaseous heat exchange medium can flow more conveniently to the position away from the first part 21, thereby further improving the diffusion efficiency of the gaseous heat exchange medium, so as to facilitate the gaseous heat exchange medium to release heat and improve the heat exchange effect of the heat exchange plate.
[0051] In some embodiments, such as Figure 3 As shown, one end of the through hole 221 is connected to the first part 21.
[0052] Thus, when the liquid heat exchange medium stored in the capillary structure vaporizes at the location of the heat source, the gaseous heat exchange medium can flow directly and quickly to a location far away from the heat source through the through hole 221, thereby achieving the flow of gaseous steam.
[0053] In some embodiments, such as Figure 3 As shown, the through hole 221 is rectangular, and the width of the rectangle is 8mm-12mm.
[0054] If the width of the rectangle is less than 8mm, the rectangle is too small, and the effect of improving the diffusion efficiency of the gaseous heat exchange medium through the through-hole 221 is relatively poor. If the width of the rectangle is greater than 12mm, the rectangle is too large, which would result in an excessively large hollow portion of the first capillary structure 2, thus hindering the storage of the liquid heat exchange medium. Therefore, in this embodiment, the width of the rectangle is set to 8mm-12mm, which ensures that the liquid heat exchange medium storage capacity is guaranteed while ensuring that the through-hole 221 has a good effect on improving the diffusion efficiency of the gaseous heat exchange medium.
[0055] Optionally, the width of the rectangle can be 10mm.
[0056] In some embodiments, such as Figure 4 As shown, the housing 1 has a first protrusion 101, which extends along the length of the housing 1 and is connected to two opposite inner walls of the housing 1. Figure 2 , Figure 3 As shown, the first capillary structure 2 has a limiting hole 201, which matches the first protrusion 101.
[0057] Thus, the first capillary structure 2 can be engaged with the first protrusion 101 through the limiting hole 201, so as to fix the first capillary structure 2 inside the housing 1, to prevent the first capillary structure 2 from shifting during use. In addition, the installation of the first capillary structure 2 can be positioned by the limiting cooperation between the first protrusion 101 and the limiting hole 201, so as to improve the assembly efficiency of the heat spreader.
[0058] The first protrusion 101 is located on either the upper shell 11 or the lower shell 12. The upper shell 11 and the lower shell 12 are welded at the position corresponding to the first protrusion 101 to realize the assembly process of the shell 1.
[0059] In some embodiments, such as Figure 3 As shown, the limiting hole 201 is connected to the through hole 221, and its length is greater than the length of the through hole 221.
[0060] Thus, by making only one opening in the first capillary structure 2, both the through hole 221 and the limiting hole 201 can be obtained simultaneously. This reduces the number of openings required for the first capillary structure 2, thereby improving the efficiency of the final forming of the first capillary structure 2. Simultaneously, it avoids stress concentration in multiple locations caused by multiple openings, thus improving the structural strength of the first capillary structure 2. Furthermore, the length of the limiting hole 201 is greater than the length of the through hole 221, preventing the first capillary structure 2 from shifting during positioning, ensuring a proper fit between the first capillary structure 2 and the limiting hole 201.
[0061] In some embodiments, combined with Figure 2 , Figure 5 As shown, the heat spreader also includes a second capillary structure 3, which is located between the first capillary structure 2 and the shell 1. The second capillary structure 3 includes a third part 31 and a fourth part 32. The third part 31 is located on the side of the first protrusion 101 away from the heat source, and the fourth part 32 is connected to the third part 31 and the first part 21 respectively.
[0062] Thus, since the third part 31 is located on the side of the first protrusion 101 away from the heat source, its temperature is relatively low. When the gaseous heat exchange medium passes through the third part 31, it can dissipate more heat, which is more conducive to the liquefaction of the gaseous heat exchange medium. Furthermore, the third part 31 is connected to the fourth part 32, and the fourth part 32 is connected to the first part 21. Thus, through the capillary effect, the liquefied liquid heat exchange medium can be transported from the third part 31 to the fourth part 32 and even to the location of the first part 21, so that the liquid heat exchange medium can absorb the energy of the heat source, thereby further improving the heat dissipation effect of the heat exchange plate on the heat source.
[0063] Similar to the first capillary structure 2, the second capillary structure 3 is plate-shaped and has interconnected regular or irregular pores inside to transport the liquid heat exchange medium through capillary effect.
[0064] Optionally, the second capillary structure 3 can be, for example, but not limited to, a mesh structure formed of copper material, which has a porous structure similar to that of a sponge.
[0065] In some embodiments, combined with Figure 1 , Figure 2 , Figure 5 As shown, the housing 1 is located in a portion of the area where the third part 31 and the fourth part 32 are connected, and the distance between the two side walls is smaller than that in other areas.
[0066] According to Bernoulli's law, an increase in flow velocity during gas flow leads to a decrease in pressure. When the gaseous heat exchange medium flows through a position in the shell 1 where the distance between the two side walls is relatively small, due to the reduction in the cross-sectional area of the gaseous heat exchange medium flow channel, according to the continuity equation, it must pass through at a higher velocity to maintain a constant total flow rate. This increase in velocity leads to an increase in gas kinetic energy, accompanied by a decrease in pressure. With the decrease in the pressure of the gaseous heat exchange medium, it can be liquefied more easily, thereby improving the efficiency of the heat exchange medium's conversion from a gaseous state to a liquid state, and thus ensuring the stable operation of the gas-liquid circulation of the heat exchange medium.
[0067] Optionally, the housing 1 is shaped by flattening at the position where the distance between the two side walls is smaller.
[0068] In some embodiments, such as Figure 6 As shown, the first outer surface of the housing 1 has a second protrusion 102, which is used to connect to a heat source.
[0069] Thus, on the one hand, the heat spreader can be positioned by the second protrusion 102; on the other hand, when the housing 1 is connected to the heat source by the second protrusion 102, there is a certain gap between other parts of the first outer surface of the housing 1 and the electronic device to prevent the heat spreader from contacting other components and causing damage to other components. Furthermore, the certain gap between other parts of the first outer surface of the housing 1 and the electronic device is also conducive to the heat spreader dissipating heat outward, thereby improving the heat dissipation efficiency of the heat spreader.
[0070] Optionally, the second protrusion 102 is connected to the heat source by silicone grease, liquid metal or other thermal paste.
[0071] Optionally, the height of the second protrusion 102 is 0.3mm-0.5mm, so as to ensure that there is a certain gap between other parts of the first outer surface of the housing 1 and the electronic device, while preventing the height of the protrusion from being too large, resulting in the maximum thickness of the heat spreader being too large.
[0072] Optionally, the second protrusion 102 is located in the lower shell 12 and is formed by pressing.
[0073] In some embodiments, such as Figure 7 As shown, the second outer surface of the housing 1 away from the first outer surface has a groove 103, which is opposite to the second protrusion 102.
[0074] In particular, the position on the second outer surface of the housing 1 corresponding to the second protrusion 102 often has a high temperature. Therefore, by providing a groove 103 on the second outer surface, the temperature of this part can be prevented from being too high when the second outer surface comes into contact with the component, which would cause the component to be damaged by high temperature.
[0075] Optionally, the groove 103 is located on the upper shell 11 and is formed by pressing.
[0076] Optionally, the second outer surface primarily contacts the back of the electronic device's display screen. In this way, the groove 103 can prevent localized overheating of the electronic device's display screen, which could make certain areas of the display screen difficult to touch.
[0077] In some embodiments, the depth of the groove 103 is 0.1mm-0.3mm.
[0078] If the depth of the groove 103 is less than 0.1 mm, the depth is too small, which makes it difficult to guarantee the effectiveness of the groove 103 in preventing high-temperature damage to components caused by the second outer surface. If the depth of the groove 103 is greater than 0.3 mm, the depth is too large, which will result in a high protrusion height inside the shell 1, leading to an excessively thick internal cavity and consequently an excessively thick overall heat spreader. Setting the depth of the groove 103 to 0.1 mm-0.3 mm ensures that the groove 103 has sufficient effectiveness in preventing high-temperature damage to components caused by the second outer surface, while keeping the overall size of the heat spreader within a small range.
[0079] Optionally, the depth of the groove 103 is 0.2 mm.
[0080] In some embodiments, such as Figure 7 As shown, the housing 1 has a plurality of third protrusions 104, which are evenly distributed on one inner surface of the housing 1.
[0081] Since the overall thickness of the shell 1 is relatively small, its structural strength is relatively low. By setting multiple third protrusions 104 inside the shell 1, the shell 1 can be supported in various parts to improve its structural strength and resistance to deformation.
[0082] The height of the third protrusion 104 is 0.04mm-0.07mm.
[0083] Where the distance between the two side walls of the shell 1 is small, no third protrusion 104 is arranged to avoid the third protrusion 104 obstructing the flow of the gaseous heat exchange medium at that location.
[0084] Based on the same concept, this disclosure also provides an electronic device, which includes the heat spreader provided above.
[0085] The electronic device can be, for example, but not limited to, a smartphone, a smart bracelet, a tablet computer, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, or a laptop computer. The electronic device may also be referred to as a user device, a portable terminal, a laptop computer, or other names. This disclosure does not impose any limitations on these claims.
[0086] Taking a smartphone as an example, the smartphone's display screen and CPU are located on opposite sides of the mid-frame. The CPU is the main heat source, the second protrusion 102 is in contact with the CPU, and the second outer surface is in contact with the back of the display screen.
[0087] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0088] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of this disclosure. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0089] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0090] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0091] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this disclosure.
[0092] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. A heat spreader, characterized in that, The heat spreader includes a shell (1) and a first capillary structure (2); The first capillary structure (2) is located inside the housing (1) and forms a cavity between it and the inner wall of the housing (1). The first capillary structure (2) includes a first part (21) and a second part (22) connected together. The first part (21) is used to be opposite to a heat source. The second part (22) has a through hole (221) that communicates with the cavity.
2. The heat spreader according to claim 1, characterized in that, The through hole (221) is strip-shaped and extends along the length direction of the first capillary structure (2).
3. The heat spreader according to claim 1, characterized in that, One end of the through hole (221) is connected to the first part (21).
4. The heat spreader according to claim 2, characterized in that, The through hole (221) is rectangular, and the width of the rectangle is 8mm-12mm.
5. The heat spreader according to claim 1, characterized in that, The housing (1) has a first protrusion (101) which extends along the length of the housing (1) and is connected to two opposite inner walls of the housing (1); The first capillary structure (2) has a limiting hole (201) that matches the first protrusion (101).
6. The heat spreader according to claim 5, characterized in that, The limiting hole (201) is connected to the through hole (221), and its length is greater than the length of the through hole (221).
7. The heat spreader according to claim 5, characterized in that, The heat spreader also includes a second capillary structure (3), which is located between the first capillary structure (2) and the shell (1); The second capillary structure (3) includes a third part (31) and a fourth part (32). The third part (31) is located on the side of the first protrusion (101) away from the heat source, and the fourth part (32) is connected to the third part (31) and the first part (21) respectively.
8. The heat spreader according to claim 7, characterized in that, The shell (1) is located in a portion of the connection between the third part (31) and the fourth part (32), and the distance between the two inner walls is smaller than that in other areas.
9. The heat spreader according to claim 1, characterized in that, The first outer surface of the housing (1) has a second protrusion (102) for connecting to the heat source.
10. The heat spreader according to claim 9, characterized in that, The housing (1) has a groove (103) on its second outer surface away from the first outer surface, the groove (103) being opposite to the second protrusion (102).
11. The heat spreader according to claim 10, characterized in that, The depth of the groove (103) is 0.1mm-0.3mm.
12. The heat spreader according to claim 1, characterized in that, The housing (1) has a plurality of third protrusions (104) which are evenly distributed on one inner surface of the housing (1).
13. An electronic device, characterized in that, The electronic device includes the heat spreader as described in any one of claims 1-12.