Movable grabbing mechanism for solar silicon wafers

Abstract

The utility model provides a movable grabbing mechanism for solar silicon wafers, which relates to the technical field of solar silicon wafer production equipment and comprises an equipment main body, a driving assembly arranged on the lower surface of the equipment main body, a moving assembly arranged on the outer surface of the driving assembly, and a mounting piece fixedly connected to the lower surface of the moving assembly. And a telescopic motor is fixedly connected into the mounting part. During use, the output end of the telescopic motor pushes the mounting plate, the mounting plate pushes the suction nozzle assembly to be close to a solar silicon wafer through the buffer assembly, after the suction nozzle assembly sucks the solar silicon wafer through a suction nozzle, the telescopic motor drives the mounting plate to be lifted upwards, and the buffer assembly is pulled by the suction nozzle assembly, the damper and the spring stretch and absorb kinetic energy. And when the solar silicon wafer is separated from the ground, the damper and the spring are stretched and compressed to absorb inertial potential energy of the pulled solar silicon wafer, so that the solar silicon wafer is prevented from being driven by the inertial potential energy to cause shaking of parts, and the service life of the parts is ensured.

Description

Technical Field

[0001] This utility model relates to the field of solar silicon wafer production equipment technology, and in particular to a moving gripping mechanism for solar silicon wafers. Background Technology

[0002] Chinese Patent Publication No. CN208240646U discloses a mobile gripping mechanism for solar silicon wafers, comprising a guide rail plate, two parallel gantry frames, a drive assembly, and a suction nozzle assembly. The guide rail plate is connected at both ends along its length to the bottom of the top beams of the two gantry frames. A linear guide rail is provided on the side of the guide rail plate, and a linear slider is mounted on the linear guide rail. The linear slider is connected to a slider drive plate, and the drive assembly is driven by the slider drive plate. A connecting plate is connected to the slider drive plate, and a stepper motor is fixed to the connecting plate. A screw rod is connected to the drive end of the stepper motor, and the screw rod is perpendicular to the direction of the linear guide rail. A through slot is formed on the suction nozzle plate, and a suction nozzle is inserted into the through slot. A photoelectric sensor is mounted on the suction nozzle plate. This utility model aims to achieve a separate, asynchronous management method for wafer transport, thereby achieving precise gripping, greatly reducing the breakage rate, and improving the overall working efficiency of the equipment.

[0003] However, in the above technical solution, when the solar silicon wafer is grasped by the drive component and the suction nozzle component, the inertia of the solar silicon wafer is not effectively controlled due to its large mass during the lifting process, which will cause unstable movement of the equipment and thus cause the equipment to shake, which is a defect. Utility Model Content

[0004] The purpose of this invention is to solve the technical problem in the above-mentioned technical solutions that the inertia of solar silicon wafers is not effectively controlled during the lifting process, which leads to unstable movement of the equipment and causes equipment vibration, and thus has defects. Therefore, a moving gripping mechanism for solar silicon wafers is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a mobile gripping mechanism for solar silicon wafers, comprising a main body, a driving component disposed on the lower surface of the main body, a moving component disposed on the outer surface of the driving component, a mounting component fixedly connected to the lower surface of the moving component, a telescopic motor fixedly connected inside the mounting component, a mounting plate fixedly connected to the output end of the telescopic motor, a buffer component disposed on the lower surface of the mounting plate, the buffer component comprising a damper, a suction nozzle component fixedly connected to the lower end of the damper, and a spring fixedly connected to the lower surface of the mounting plate.

[0006] Furthermore, a bidirectional bearing is fixedly connected to the lower end of the spring, and a nut adjusting ring is fixedly connected to the lower surface of the bidirectional bearing.

[0007] Furthermore, the outer surface of the damper is provided with a threaded groove, and the outer surface of the damper is threadedly connected to the inside of the nut adjusting ring through the threaded groove.

[0008] Furthermore, the outer surface of the mounting component is fixedly connected to two connecting assemblies, each including a sliding member, and a support member is provided on one side surface of the sliding member.

[0009] Furthermore, an L-shaped kit is fixedly connected to one side surface of the support member, and the outer surface of the slider is embedded inside the L-shaped kit.

[0010] Furthermore, the inside of the spring is fitted onto the outer surface of the damper.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, during use, the output end of the telescopic motor pushes the mounting plate, causing the mounting plate to push the suction nozzle assembly closer to the solar silicon wafer through the buffer assembly. After the suction nozzle assembly picks up the solar silicon wafer through the suction nozzle, the telescopic motor drives the mounting plate to lift upwards. Under the pull of the suction nozzle assembly, the damper and spring of the buffer assembly are stretched to absorb kinetic energy until the solar silicon wafer leaves the ground. At this point, the damper and spring are stretched and compressed to absorb the inertial potential energy of the solar silicon wafer after it is lifted, thus preventing the components from shaking due to the inertial potential energy of the solar silicon wafer and ensuring the service life of the components.

[0013] 2. In this utility model, the rotating nut adjusting ring, under the action of the threaded groove, adjusts the stroke of the spring through the bidirectional bearing, which can be applied to solar silicon wafers of different specifications and qualities, and has a wide range of applications. When the nozzle assembly moves up and down, the two connecting components slide inside the two L-shaped kits, limiting the movement trajectory of the nozzle assembly, preventing the nozzle assembly from rotating under external force, and ensuring safety during use. The damper provides support for the spring, preventing the spring from bending when subjected to lateral force, and ensuring the normal operation of the spring. Attached Figure Description

[0014] Figure 1 A three-dimensional structural schematic diagram of a moving gripping mechanism for solar silicon wafers provided by this utility model;

[0015] Figure 2 A three-dimensional structural schematic diagram of a suction nozzle assembly for a moving gripping mechanism of a solar silicon wafer provided by this utility model;

[0016] Figure 3 A three-dimensional structural schematic diagram of a buffer assembly for a moving gripping mechanism of a solar silicon wafer provided by this utility model;

[0017] Figure 4A three-dimensional structural diagram of a connecting component for a moving gripping mechanism of a solar silicon wafer provided by this utility model.

[0018] Legend: 1. Main body of equipment; 2. Drive component; 3. Mounting component; 4. Telescopic motor; 5. Mounting plate; 6. Nozzle assembly; 7. Connecting component; 701. Sliding component; 702. Support component; 703. L-shaped kit; 8. Moving component; 9. Buffer assembly; 901. Damper; 902. Spring; 903. Threaded groove; 904. Nut adjusting ring; 905. Double-sided bearing. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] like Figure 1-4 As shown, this utility model provides a technical solution: a mobile gripping mechanism for solar silicon wafers, including a device body 1, a driving component 2 disposed on the lower surface of the device body 1, a moving component 8 disposed on the outer surface of the driving component 2, a mounting component 3 fixedly connected to the lower surface of the moving component 8, a telescopic motor 4 fixedly connected inside the mounting component 3, a mounting plate 5 fixedly connected to the output end of the telescopic motor 4, a buffer component 9 disposed on the lower surface of the mounting plate 5, the buffer component 9 including a damper 901, a suction nozzle component 6 fixedly connected to the lower end of the damper 901, a spring 902 fixedly connected to the lower surface of the mounting plate 5, a bidirectional bearing 905 fixedly connected to the lower end of the spring 902, and a nut adjusting ring 904 fixedly connected to the lower surface of the bidirectional bearing 905.

[0022] In this embodiment, during use, the output end of the telescopic motor 4 pushes the mounting plate 5, causing the mounting plate 5 to push the suction nozzle assembly 6 closer to the solar silicon wafer via the buffer assembly 9. After the suction nozzle assembly 6 picks up the solar silicon wafer through the suction nozzle, the telescopic motor 4 drives the mounting plate 5 to lift upwards. Under the pull of the suction nozzle assembly 6, the damper 901 and spring 902 of the buffer assembly 9 are stretched to absorb kinetic energy until the solar silicon wafer is lifted off the ground. At this point, the damper 901 and spring 902 are stretched and compressed to absorb the inertial potential energy of the solar silicon wafer after it is lifted, thus preventing the components from shaking due to the inertial potential energy of the solar silicon wafer and ensuring the service life of the components.

[0023] Example 2

[0024] like Figure 1-4As shown, the outer surface of the damper 901 is provided with a threaded groove 903. The outer surface of the damper 901 is threadedly connected to the inside of the nut adjusting ring 904 through the threaded groove 903. Two connecting components 7 are fixedly connected to the outer surface of the mounting part 3. The connecting component 7 includes a sliding part 701. A support part 702 is provided on one side surface of the sliding part 701. An L-shaped kit 703 is fixedly connected to one side surface of the support part 702. The outer surface of the sliding part 701 is embedded in the inside of the L-shaped kit 703. The inside of the spring 902 is sleeved on the outer surface of the damper 901.

[0025] In this embodiment, the rotating nut adjusting ring 904, under the action of the threaded groove 903, adjusts the stroke of the spring 902 through the bidirectional bearing 905. It can be applied to solar silicon wafers of different specifications and qualities, and has a wide range of applications. When the two connecting components 7 move up and down with the suction nozzle assembly 6, the two sliding parts 701 slide inside the two L-shaped kits 703, restricting the movement trajectory of the suction nozzle assembly 6 and preventing the suction nozzle assembly 6 from rotating under external force, thus ensuring safety during use. The damper 901 provides support for the spring 902, preventing the spring 902 from bending when subjected to lateral force, and ensuring the normal operation of the spring 902.

[0026] Working principle: such as Figure 1-4 As shown, during use, the output end of the telescopic motor 4 pushes the mounting plate 5, causing the mounting plate 5 to push the suction nozzle assembly 6 closer to the solar silicon wafer via the buffer assembly 9. After the suction nozzle assembly 6 picks up the solar silicon wafer through the suction nozzle, the telescopic motor 4 drives the mounting plate 5 to lift upwards. Under the pull of the suction nozzle assembly 6, the damper 901 and spring 902 of the buffer assembly 9 are stretched, absorbing kinetic energy. Until the solar silicon wafer is lifted off the ground, the damper 901 and spring 902 are stretched and compressed, absorbing the inertial potential energy of the solar silicon wafer after being lifted. The adjusting nut 904 is then rotated. Under the action of the threaded groove 903, the nut adjusting ring 904 adjusts the stroke of the spring 902 through the bidirectional bearing 905, which can be applied to solar silicon wafers of different specifications and qualities, with a wide range of applications. When the two connecting components 7 move up and down in the suction nozzle assembly 6, the two sliding parts 701 slide inside the two L-shaped kits 703, restricting the movement trajectory of the suction nozzle assembly 6 and preventing the suction nozzle assembly 6 from rotating under external force, thus ensuring safety during use. The damper 901 provides support for the spring 902 and prevents the spring 902 from bending when subjected to lateral force.

[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A mobile gripping mechanism for solar silicon wafers, comprising a main body (1), characterized in that: The device body (1) has a drive assembly (2) on its lower surface. The drive assembly (2) has a moving assembly (8) on its outer surface. The moving assembly (8) has a mounting component (3) fixedly connected to its lower surface. The mounting component (3) has a telescopic motor (4) fixedly connected inside its interior. The output end of the telescopic motor (4) has a mounting plate (5) fixedly connected to its output end. The mounting plate (5) has a buffer assembly (9) on its lower surface. The buffer assembly (9) includes a damper (901). The lower end of the damper (901) has a suction nozzle assembly (6) fixedly connected to its lower end. The mounting plate (5) has a spring (902) fixedly connected to its lower surface.

2. The moving gripping mechanism for solar silicon wafers according to claim 1, characterized in that: The lower end of the spring (902) is fixedly connected to a double-sided bearing (905), and the lower surface of the double-sided bearing (905) is fixedly connected to a nut adjusting ring (904).

3. The moving gripping mechanism for solar silicon wafers according to claim 2, characterized in that: The outer surface of the damper (901) is provided with a threaded groove (903), and the outer surface of the damper (901) is threadedly connected to the inside of the nut adjusting ring (904) through the threaded groove (903).

4. The moving gripping mechanism for solar silicon wafers according to claim 3, characterized in that: The outer surface of the mounting component (3) is fixedly connected to two connecting components (7), the connecting components (7) include a sliding component (701), and a support component (702) is provided on one side surface of the sliding component (701).

5. The moving gripping mechanism for solar silicon wafers according to claim 4, characterized in that: An L-shaped kit (703) is fixedly connected to one side surface of the support member (702), and the outer surface of the slider (701) is embedded inside the L-shaped kit (703).

6. The moving gripping mechanism for solar silicon wafers according to claim 1, characterized in that: The spring (902) is fitted inside the damper (901) on the outer surface.

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