Double-layer packaged LED light source, backlight module and electronic equipment

Abstract

The utility model relates to the field of LEDs, and provides a double-layer packaged LED light source, a backlight module and electronic equipment, the LED light source comprises a substrate, and the substrate is provided with a light emitting circuit; the light-emitting chip is arranged on the substrate and is electrically connected with the light-emitting circuit; the transparent shell is arranged on the substrate and covers the light-emitting chip, and a first gap is formed between the light-emitting chip and the transparent shell; and the transparent adhesive layer is filled between the light-emitting chip and the transparent shell, the first gap is sealed by the transparent adhesive layer, and the hardness of the transparent adhesive layer is smaller than that of the transparent shell. Through mutual supporting of the transparent adhesive layer and the transparent shell, the overall mechanical stability and durability are enhanced, and the problem that the LED light source is prone to being eroded by water vapor is solved.

Description

Technical Field

[0001] This application relates to the field of LED technology, and more specifically, to a double-layer packaged LED light source, backlight module, and electronic device. Background Technology

[0002] With the rapid development of semiconductor lighting technology, LEDs (light-emitting diodes), as a new generation of high-efficiency and energy-saving light sources, have been widely applied in various fields such as daily lighting, display technology, and automotive lighting. In recent years, the performance improvement and cost reduction of LEDs have greatly promoted their market penetration, and LED light source packaging technology plays a crucial role in this process.

[0003] Currently, most common LED packaging structures on the market use lens housings for chip protection and light output control. However, due to the limited packaging gap between the lens housing and the circuit board, the tiny gap becomes a potential channel for water vapor penetration, making the inside of the package susceptible to water vapor erosion. This can lead to oxidation and corrosion of the LED chip, and in severe cases, functional failure, shorten product lifespan, increase maintenance costs, and limit the application potential of LED light sources.

[0004] Therefore, existing technologies still need improvement and development. Utility Model Content

[0005] The purpose of this application is to propose a double-layer packaged LED light source to solve the technical problem that LED light sources in the prior art are easily corroded by moisture.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] In a first aspect, this utility model provides a double-layer packaged LED light source, comprising:

[0008] Substrate, the substrate having light-emitting circuitry;

[0009] A light-emitting chip is mounted on a substrate and electrically connected to the light-emitting circuit.

[0010] A transparent outer shell is disposed on a substrate and covers a light-emitting chip, with a first gap between the light-emitting chip and the transparent outer shell;

[0011] A transparent adhesive layer is filled between the light-emitting chip and the transparent outer shell. The transparent adhesive layer seals the first gap, and the hardness of the transparent adhesive layer is less than that of the transparent outer shell.

[0012] In some implementations, the refractive index of the transparent outer shell is greater than that of the transparent adhesive layer.

[0013] In some embodiments, the transparent shell has an arc-shaped surface, and the top of the transparent shell has a recessed portion that is recessed into the light-emitting chip.

[0014] In some embodiments, the transparent shell includes an injection-molded shell, which is a rigid shell manufactured by an injection molding process; the transparent adhesive layer includes a silicone layer, which is a rigid shell manufactured by a dispensing process.

[0015] In some embodiments, the transparent housing also includes an adhesive ring disposed on the substrate and surrounding the circumference of the transparent adhesive layer, with the bottom of the transparent housing sealed to the adhesive ring.

[0016] In some embodiments, the thickness ratio of the transparent adhesive layer to the transparent outer shell ranges from 1.1:1 to 2:1.

[0017] In some embodiments, the light-emitting chip includes a blue light chip and a phosphor layer. The blue light chip is electrically connected to the light-emitting circuit, and the phosphor layer covers at least the front side of the blue light chip. The phosphor layer is used to convert and mix the light emitted by the light-emitting chip to emit white light.

[0018] Furthermore, the fluorescent adhesive layer contains phosphor, including KSF phosphor.

[0019] Secondly, this utility model provides a backlight module, including the light-emitting chip in the above embodiments.

[0020] Thirdly, this utility model provides an electronic device, including the backlight module in the above embodiments.

[0021] The beneficial effects of the dual-layer packaged LED light source provided in this application are at least as follows: a substrate having a light-emitting circuit; an LED device disposed on top of the substrate and connected to the light-emitting circuit; a transparent adhesive layer covering the light-emitting chip; and a transparent outer shell covering the transparent adhesive layer, with the transparent adhesive layer and a second adhesive layer connecting to form a mini CSP structure. This application, through its dual-layer packaging structure, not only protects the LED device from external environmental factors such as humidity and dust, but also enhances the overall mechanical stability and durability through the mutual support of the transparent adhesive layer and the transparent outer shell, helping to extend the lifespan of the LED light source and reduce the risk of damage caused by external impacts or environmental factors. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A vertical cross-sectional view of a double-encapsulated LED light source when placed horizontally, as provided in an embodiment of this application;

[0024] Figure 2 Another vertical cross-sectional view of a double-encapsulated LED light source when placed horizontally, as provided in an embodiment of this application;

[0025] The following are the labeling elements in the figure:

[0026] 101. Substrate;

[0027] 102. Light-emitting chip;

[0028] 103. Transparent adhesive layer;

[0029] 104. Transparent outer shell. Detailed Implementation

[0030] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0031] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0032] The following description, in conjunction with the accompanying drawings, describes a double-layer packaged LED light source according to an embodiment of this application.

[0033] Please see Figure 1 , Figure 1This application illustrates a double-layer packaged LED light source, comprising: a substrate 101 having a light-emitting circuit; a light-emitting chip 102 disposed on the substrate 101 and electrically connected to the light-emitting circuit; a transparent shell 104 disposed on the substrate 101 and covering the light-emitting chip 102, with a first gap between the light-emitting chip 102 and the transparent shell 104; and a transparent adhesive layer 103 filling the gap between the light-emitting chip 102 and the transparent shell 104, sealing the first gap, wherein the hardness of the transparent adhesive layer 103 is less than the hardness of the transparent shell 104.

[0034] Specifically, substrate 101 refers to the platform material used to carry and physically support the light-emitting chip 102 and its related circuits. The light-emitting circuit is a wiring layer above substrate 101. The wiring layer connects circuit elements to form a closed loop, so that current flows from the power source to the light-emitting chip 102 and back to the power source.

[0035] The light-emitting chip 102 is connected to the light-emitting circuit of the substrate 101 via a conductive material, realizing the conversion of electrical energy into light energy. In some embodiments, the light-emitting chip 102 is a monochromatic light-emitting chip 102, such as a light-emitting chip 102 of a primary color such as blue, green, or red LEDs. The specific light-emitting chip 102 used depends on the actual situation. In addition, the active area of ​​the light-emitting chip 102 can be directly connected to the substrate 101 with the active area facing down through flip-chip packaging technology, which shortens the current path, reduces parasitic resistance and thermal resistance, and improves the heat dissipation capacity and photoelectric conversion efficiency of the device.

[0036] The transparent adhesive layer 103 directly wraps around the light-emitting chip 102, protecting it from environmental factors and providing optical transparency to ensure effective light transmission. A transparent outer shell 104 is located on the transparent adhesive layer 103, further enhancing the protective effect of the encapsulation. In some embodiments, the light-emitting chip 102 is a mini LED, and the transparent outer shell 104 participates in forming a mini CSP structure. CSP (Chip Scale Package) technology aims for a package size close to the bare chip size, which is beneficial for improving integration, reducing product size, and potentially enhancing thermal conductivity. The combination of the adhesive layer and the transparent outer shell 104 ensures good sealing and optical uniformity.

[0037] According to the technical solution provided in the embodiments of this application, by placing a transparent shell 104 on the substrate 101 and covering the light-emitting chip 102, and filling the space between the transparent shell 104 and the substrate 101 with a transparent adhesive layer 103, a sealed structure is formed. This double-layer encapsulation method strengthens the protection of the light-emitting chip 102, so that the light emitted by the light-emitting chip 102 is uniformly propagated to the outside, reducing the impact of environmental factors on the light-emitting chip 102, protecting the light-emitting chip 102 from the corrosion of moisture in the external environment, thereby improving the reliability and durability of the LED light source.

[0038] In some implementations, when the double-encapsulated LED light source is a white backlight, the light-emitting chip 102 is also covered with a light conversion medium.

[0039] Specifically, the light-emitting chip 102 can be a light-emitting diode. A light-emitting diode is a solid-state light-emitting device that uses photons generated by the electron recombination process to realize the conversion from electricity to light. Its light-emitting principle is that under the action of a forward voltage, electrons in the n-region propagate in the positive direction and holes in the p-region propagate in the negative direction. The two recombine in the active layer between the two PN junctions and emit spontaneously emitted light.

[0040] When the light-emitting chip 102 is a blue LED, the light-emitting conversion medium includes, but is not limited to, a phosphor layer and a quantum thin film. The phosphor layer is made of a mixture of a resin substrate and phosphor. The resin substrate is a transparent polymer material that serves as a carrier for the phosphor. Due to the high transparency of the resin matrix, the blue light emitted by the blue LED can effectively pass through the resin matrix and excite the phosphor. Simultaneously, the light emitted by the phosphor can pass through the resin substrate, reducing light loss. Phosphor is a light-emitting material that can absorb light energy of a certain wavelength and convert it into visible light of another wavelength. Specifically, the LED emits high-energy photons, which strike phosphor particles coated on the LED surface or inside the package. The active centers of the phosphor absorb the energy of these short-wavelength photons, causing electrons to transition from the ground state to the excited state. These active centers include, but are not limited to, Ce3+ and Eu2+ ions. The blue light emitted by the blue LED combines with the yellow light emitted by the yellow phosphor to form white light through the additive mixing principle. When using an ultraviolet LED as the light-emitting chip 102, the fluorescent adhesive layer can also use tri-color phosphors in combination with the ultraviolet LED to obtain white light with color rendering properties through a more complex spectral combination.

[0041] Quantum thin films are thin-film materials made based on the unique optical properties of quantum dots. Quantum dots are a class of nanoscale semiconductor materials, only a few nanometers to tens of nanometers in size, capable of efficiently absorbing light of specific wavelengths and re-emitting light of different wavelengths, a phenomenon known as the "quantum confinement effect." By coating a blue LED with a quantum thin film, the quantum dots in the film are designed to absorb some blue light and convert it into red and green light. When these three colors are mixed in appropriate proportions, white light is produced. Quantum thin films provide higher light conversion efficiency and more stable light output, helping to improve the overall energy efficiency of LED light sources and reduce energy consumption.

[0042] When the light-emitting chip 102 uses an infrared light chip or a red light chip, the light-emitting conversion medium is an upconversion light-emitting material. Upconversion is an anti-Stokes luminescence phenomenon, in which the light emitted is excited by low-energy light and then emitted as high-energy light. The upconversion light-emitting material absorbs two or more low-energy photons and emits a high-energy photon. The light-emitting principle of the upconversion light-emitting material mainly includes three types: excited-state absorption, energy transfer upconversion, and photon avalanche. The excited-state absorption principle is based on a single ion or molecule absorbing multiple low-energy photons in a short time, gradually rising to a high-energy state, and then releasing a high-energy photon through radiative transition. Energy transfer upconversion is achieved through the synergistic effect of two or more adjacent activated ions. When an ion acts as a donor, it absorbs a photon and nonradiatively transfers its energy to another ion acting as a acceptor. The acceptor, receiving sufficient energy, transitions to an energy level capable of emitting high-energy photons, thus producing high-energy light. Photon avalanche is a process combining excited-state absorption and energy transfer; it is a special form of energy transfer upconversion where energy transfer occurs between ions of the same type, creating an "avalanche effect"—a rapid increase in the number of ions at high energy levels, ultimately leading to the emission of a large number of high-energy photons. Upconversion luminescent materials can be used to control the wavelength and intensity of light emitted by LED light sources for infrared or red light chips, thereby optimizing the color temperature and color rendering index of white light. Upconversion luminescent materials can also achieve more uniform and efficient backlighting, improving screen brightness, contrast, and color saturation, enhancing display effects, and reducing energy consumption.

[0043] According to the technical solution provided in this embodiment, the transparent adhesive layer 103 and the transparent shell 104 ensure that the light-emitting chip 102 and the light conversion material are more tightly protected, isolating external moisture, oxygen and other harmful substances, enhancing the mechanical strength of the device, and thus extending the service life of the product.

[0044] In some embodiments, the refractive index of the transparent outer shell 104 is greater than that of the transparent adhesive layer 103.

[0045] In other words, the refractive index of the lens formed by the transparent adhesive layer 103 is lower than that of the lens structure formed by the transparent outer shell 104. Therefore, the light beam emitted by the light-emitting chip 102 diffuses and propagates through the transparent adhesive layer 103. It is reflected and refracted at the interface between the transparent adhesive layer 103 and the transparent outer shell 104 and then disperses. Some of the light is refracted and enters the transparent outer shell 104, while some of the light is reflected and continues to propagate in the transparent adhesive layer 103. It is reflected at the interface between the transparent adhesive layer 103 and the light-emitting chip 102, and then reflected multiple times at the interface between the transparent adhesive layer 103 and the transparent outer shell 104 and between the transparent adhesive layer 103 and the light-emitting chip 102, until finally most of the light is scattered out through the transparent outer shell 104.

[0046] According to the technical solution provided in this embodiment, the refractive index of the transparent adhesive layer 103 is lower than that of the transparent outer shell 104. The transparent adhesive layer 103 is close to the light-emitting chip 102. Due to the lower refractive index of the transparent adhesive layer 103, light begins to diffuse upon initial emission. That is, when light emitted from the light-emitting chip 102 passes through this layer, it begins to diverge due to the difference in refractive index of the materials, increasing the light emission angle and reducing the concentrated light spot. When light enters the transparent outer shell 104 from the transparent adhesive layer 103, significant refraction and partial reflection occur due to the difference in refractive index. The refracted portion of the light continues to spread over a wider area, while the reflected portion returns to the transparent outer shell. The light from the gelatin layer 103 is reflected multiple times at the interfaces between the two layers and between the transparent adhesive layer 103 and the light-emitting chip 102 until the light is scattered through the transparent shell 104. This increases the light diffusion angle and improves the scattering performance of the light source. By making full use of the light through multiple internal reflections and refractions, light loss is reduced and the overall light extraction efficiency is enhanced. In addition, the transparent adhesive layers 103 with different refractive indices have different bonding properties. After double-layer encapsulation, the overall mechanical stability of the encapsulation is further enhanced, avoiding the threat of moisture corrosion and reducing the risk of performance degradation or failure caused by moisture. This improves the performance, reliability and durability of the LED light source.

[0047] In some implementations, such as Figure 2 As shown, the transparent shell 104 has an arc-shaped surface, and the top of the transparent shell 104 has a recessed portion that is recessed into the light-emitting chip 102.

[0048] Specifically, the top of the transparent shell 104 is provided with a recessed portion that is recessed into the light-emitting chip 102. The position can be the center of the transparent shell 104. Through the recessed portion of the transparent shell 104, the diffusion angle of the light is further increased. When light is emitted from the self-emissive chip 102, it undergoes its first refraction at the interface between the chip 102 and the transparent adhesive layer 103, entering the low-refractive-index transparent adhesive layer 103. The light begins to diffuse within the transparent adhesive layer 103, widening the beam angle and gradually unifying the light intensity distribution, reducing the initial concentrated light intensity. The light then enters the transparent outer shell 104 with its concave portion. Due to the difference in refractive indices between the two materials, the light is refracted and partially reflected again. The refracted light continues to propagate into the transparent outer shell 104, while the reflected light returns to the transparent adhesive layer 103 to participate in multiple reflections and refractions. In the concave region of the transparent outer shell 104, the light path is further dispersed by the shape guidance. The light in the central region is effectively dispersed due to the concave design, avoiding the formation of a strong central light spot. Simultaneously, it encourages more light to scatter outwards, increasing the intensity and scattering range of the edge light. After multiple internal reflections and refractions within the transparent outer shell 104, the light gradually scatters towards the edges and top, ultimately with most of the light exiting through the top of the transparent outer shell 104, forming a uniform, wide-angle light field.

[0049] According to the technical solution provided in the embodiments of this application, a transparent shell 104 with a recessed portion that is recessed into the light-emitting chip 102 is used to optimize the light path propagation and light output characteristics, ensure that the entire packaging structure is more compact, reduce gaps, further improve the waterproof and oxygen-proof performance of the packaging, enhance the stability and reliability of the LED packaging, reduce corrosion, aging and other problems caused by water and oxygen penetration, thereby extending the service life of the LED light source.

[0050] In some embodiments, the transparent shell 104 includes an injection-molded shell, which is a rigid shell manufactured by an injection molding process; the transparent adhesive layer 103 includes a silicone layer, which is a rigid shell manufactured by a dispensing process.

[0051] Specifically, the injection-molded shell is a lens made by injecting plastic material into a mold through an injection molding process, followed by a series of processes such as cooling and demolding. The plastic material includes, but is not limited to, polycarbonate, polymethyl methacrylate, and cyclic olefin polymers, and can be selected based on transparency, optical performance, and material stability. This embodiment does not limit the shape of the injection-molded shell; it can be a hollow, semi-enclosed shell such as a hemispherical or ellipsoidal shape. Specifically, a transparent adhesive layer 103 can be directly applied to cover the light-emitting chip 102 using a dispensing process. Before the transparent adhesive layer 103 is fully cured, the pre-designed injection-molded lens shell is installed, utilizing the adhesive properties of the dispensing to achieve initial bonding with the bottom of the injection-molded shell. After curing the transparent adhesive layer 103, the LED light source encapsulation is completed. Using the injection-molded shell as the transparent shell 104, the high precision of the injection-molded shell allows for the planning of the LED light path and precise control of the light emitted by each light-emitting chip, thereby improving the overall brightness and uniformity of the LED light source.

[0052] Furthermore, by employing an injection-molded housing, injection molding technology ensures high consistency in size, appearance, and performance for each product during mass production, thereby improving the quality stability of the LED light source. In addition, the formation of a silicone layer by dispensing transparent adhesive layer 103, followed by encapsulation of the silicone layer with transparent housing 104, creates a double-layer encapsulation structure that further strengthens the physical protection of the light-emitting chip 102. Moreover, the combination with the transparent adhesive layer 103 further enhances the sealing performance of the encapsulation, effectively isolating moisture and contaminants, protecting the LED chip from environmental factors, and extending the lifespan and reliability of the LED light source.

[0053] In an alternative embodiment, the transparent housing 104 further includes an adhesive ring disposed on the substrate 101 and surrounding the circumference of the transparent adhesive layer 103, with the bottom of the transparent housing 104 sealed to the adhesive ring.

[0054] Specifically, the rubber ring is placed on the substrate 101 in advance. After the transparent shell 104 is directly injection molded, the transparent shell 104 is snapped onto the not fully cured transparent adhesive layer 103 and the transparent shell 104 is integrated with the rubber ring. The integration method includes, but is not limited to, tight fitting, snap-fit ​​fixing, thread fixing and other fixing methods.

[0055] Furthermore, after the light-emitting chip 102 is wrapped with a transparent adhesive layer 103 through a dispensing process, before the transparent adhesive layer 103 is fully cured, an adhesive ring is added. Then, the transparent outer shell 104 is fastened onto the transparent adhesive layer 103, causing the transparent outer shell 104 and the adhesive ring to form a sealed interface. The bottom of the transparent outer shell 104 contacts and adheres to the uncured part of the transparent adhesive layer 103. Utilizing the fluidity and adhesive force of the transparent adhesive layer 103, it is ensured that the bottom of the transparent outer shell 104 is tightly attached to the adhesive ring and the transparent adhesive layer 103, establishing a preliminary sealed shape. Finally, after the transparent adhesive layer 103 is fully cured, the integrated double-layer encapsulated LED light source structure is completed.

[0056] In this embodiment, the adhesive ring can also be fixed in advance at a predetermined position on the substrate 101, which simplifies the assembly steps and improves the assembly efficiency and accuracy. The pre-placed adhesive ring can ensure precise alignment and tight fit with the substrate 101, avoiding positional deviation or poor sealing caused by improper operation, and improving the overall stability of the package and its moisture-proof and dust-proof performance.

[0057] When the adhesive ring is directly injection molded into the transparent housing 104, it is integrated with the transparent housing 104. After the light-emitting chip 102 is wrapped by the transparent adhesive layer 103 through a dispensing process, the transparent adhesive layer 103 is not fully cured. The transparent housing 104 is then fastened onto the transparent adhesive layer 103. Finally, the transparent adhesive layer 103 is cured, completing the integrated double-layer encapsulated LED light source structure. The integration of the adhesive ring and the transparent housing 104 is completed in one injection molding process, ensuring a tight, gapless bond between the two and improving the overall sealing and stability of the transparent housing 104 structure. Through the direct bonding of the adhesive layer to the transparent housing 104 and the sealing effect of the adhesive ring, the physical strength and resistance to environmental factors of the entire encapsulation structure are improved, thereby extending the lifespan of the LED light source and maintaining the stability of its optical performance.

[0058] In one alternative embodiment, the thickness ratio of the transparent adhesive layer 103 to the transparent outer shell 104 ranges from 1.1:1 to 2:1.

[0059] By setting the thickness ratio of the transparent adhesive layer 103 to the transparent outer shell 104 to a range of 1.1:1 to 2:1, the mechanical strength and sealing performance of the encapsulation are enhanced, while also effectively preventing external environmental factors such as moisture and dust from corroding internal components, extending the lifespan of the LED light source, and reducing the failure rate. Furthermore, setting the thickness ratio of the transparent adhesive layer 103 to the transparent outer shell 104 to a range of 1.1:1 to 2:1 can also optimize the heat conduction path, reduce thermal resistance, and help the heat generated by the light-emitting chip 102 to dissipate more quickly, lowering the operating temperature, thereby improving the stability of the LED light source and extending its lifespan.

[0060] In one optional embodiment, the light-emitting chip 102 includes a blue light chip and a phosphor layer. The blue light chip is electrically connected to the light-emitting circuit, and the phosphor layer covers at least the front side of the blue light chip. The phosphor layer is used to convert and mix the light emitted by the light-emitting chip 102 to emit white light.

[0061] Specifically, the core of the blue light chip is a heterojunction structure composed of P-type and N-type semiconductor materials, including gallium nitride or its alloys as the active layer. Due to the direct bandgap characteristics of the materials used, electrons can directly release energy as photons when transitioning from the conduction band to the valence band, i.e., emitting light. When the substrate 101 applies a forward bias voltage to the light-emitting chip 102, electrons move from the N-type layer to the P-type layer, while holes move from the P-type layer to the N-type layer. Near the PN junction, electrons and holes meet and recombine. In direct bandgap materials like gallium nitride, the energy released when electrons jump from the conduction band to the valence band corresponds precisely to the wavelength of blue light, thus emitting blue light. Furthermore, the blue light chip also includes a multi-quantum-well structure to further improve luminous efficiency. The quantum wells are composed of several very thin quantum well layers and thicker barrier layers stacked alternately, which can trap electrons and holes, increasing the chance of electrons meeting and recombinating in the active region, thereby improving light output efficiency.

[0062] The phosphors in the fluorescent adhesive layer possess specific excitation and emission spectral characteristics. When blue light emitted by the blue LED chip passes through the fluorescent adhesive layer, the phosphors absorb this energy and then re-radiate it as longer-wavelength light, thereby changing the color of the light emitted by the LED chip 102. By adjusting the type and proportion of phosphors, the color temperature and corresponding color rendering index of white light can be precisely controlled, thus achieving adaptability of light emission and meeting the lighting needs of different scenarios. This results in a diverse, high-performance, and highly adaptable light source.

[0063] According to the technical solution provided in the embodiments of this application, the light-emitting chip 102 includes a blue light chip and a phosphor layer. Based on the short-wavelength blue light emitted by the blue light chip, the phosphor contained in the phosphor layer absorbs the blue light energy and undergoes a non-radiative transition. Then, when it returns from the excited state to the ground state, it releases energy and radiates it in the form of longer-wavelength light. The blue light mixes with other colors emitted by the phosphor to synthesize white light with different color temperatures, achieving efficient and flexible light generation. Furthermore, the phosphor layer covering the blue light chip effectively blocks moisture and harmful gases in the air, reducing the erosion of the blue light chip by external factors and preventing chip corrosion and performance degradation caused by humidity.

[0064] Furthermore, the fluorescent adhesive layer includes an encapsulating adhesive and a phosphor mixed in the encapsulating adhesive, wherein the phosphor is KSF phosphor.

[0065] Specifically, KSF phosphor is a material that can effectively absorb blue light and emit red light with a wavelength in the range of 610-640 nanometers. It enhances the red spectral component, thereby optimizing the color rendering index and color temperature adjustment of the light emitted by the light-emitting chip 102, and achieving high-quality light output that is closer to natural light.

[0066] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A double-layer packaged LED light source, characterized in that, include: A substrate, wherein a light-emitting circuit is provided on the substrate; A light-emitting chip is disposed on the substrate and electrically connected to the light-emitting circuit; A transparent outer shell is disposed on the substrate and covers the light-emitting chip, and a first gap exists between the light-emitting chip and the transparent outer shell; A transparent adhesive layer is filled between the light-emitting chip and the transparent outer shell, the transparent adhesive layer seals the first gap, and the hardness of the transparent adhesive layer is less than the hardness of the transparent outer shell.

2. The double-layer packaged LED light source according to claim 1, characterized in that, The refractive index of the transparent outer shell is greater than that of the transparent adhesive layer.

3. The double-layer packaged LED light source according to claim 1, characterized in that, The transparent outer shell has an arc-shaped surface, and the top of the transparent outer shell has a recessed portion that is recessed into the light-emitting chip.

4. The double-layer packaged LED light source according to claim 1, characterized in that, The transparent shell includes an injection-molded shell, which is a rigid shell manufactured by injection molding. The transparent adhesive layer includes a silicone layer, which is a rigid outer shell manufactured by a dispensing process.

5. The double-layer packaged LED light source according to claim 4, characterized in that, The transparent housing also includes an adhesive ring, which is disposed on the substrate and surrounds the transparent adhesive layer circumferentially, and the bottom of the transparent housing is sealed to the adhesive ring.

6. The double-layer packaged LED light source according to claim 1, characterized in that, The thickness ratio of the transparent adhesive layer to the transparent outer shell ranges from 1.1:1 to 2:

1.

7. The double-layer packaged LED light source according to any one of claims 1-6, characterized in that, The light-emitting chip includes a blue light chip and a fluorescent adhesive layer. The blue light chip is electrically connected to the light-emitting circuit. The fluorescent adhesive layer covers at least the front side of the blue light chip. The fluorescent adhesive layer is used to convert and mix the light emitted by the light-emitting chip to emit white light.

8. The double-layer packaged LED light source according to claim 7, characterized in that, The fluorescent adhesive layer contains fluorescent powder, including KSF fluorescent powder.

9. A backlight module, characterized in that, The LED light source includes the double-encapsulated LED light source as described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the backlight module as described in claim 9.

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