LED lamp bead

Abstract

An embodiment of the utility model provides an LED lamp bead, relates to the LED lamp bead technical field, the LED lamp bead comprises an injection molding part, a plurality of pads, a plurality of chips and a plurality of pins, the plurality of pads are arranged on the injection molding part and comprise a first common electrode pad, each chip is electrically connected with two corresponding pads, the plurality of chips comprise a red light chip, a green light chip and a blue light chip, the first common electrode pad is electrically connected with the first common electrode pad, and the second common electrode pad is electrically connected with the second common electrode pad. Wherein the green light chip and the blue light chip are both connected with the first common electrode bonding pad, the plurality of pins comprise two first heat dissipation pins, and the two first heat dissipation pins are arranged on the two sides of the bottom of the injection molding part and are electrically connected with the first common electrode bonding pad. According to the LED lamp bead, the injection molding part, the bonding pads, the chips and the pins are arranged, the first common electrode bonding pad and the two first heat dissipation pins are included, the heat dissipation efficiency of the LED lamp bead is improved, aging of the chips is delayed, and the service life of the LED lamp bead is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to an LED lamp bead. Background Technology

[0002] In a typical LED chip, the pads are electrically connected to the chip to provide current. At the same time, the pads transfer the heat generated by the chip during operation to the outside, thus playing a role in heat dissipation. In other words, each pad has both power supply and heat dissipation functions.

[0003] However, this traditional LED bead configuration can easily lead to reduced device reliability. A large part of the reason is that the heat dissipation efficiency of the chip in the bead is low. Excessive temperature will accelerate the aging of the chip and even cause chip damage, thus shortening the lifespan of the LED bead. Utility Model Content

[0004] This utility model provides an LED lamp bead to solve the technical problems of low heat dissipation efficiency and short service life of LED lamp beads in related technologies.

[0005] In a first aspect, this utility model embodiment provides an LED lamp bead, the LED lamp bead comprising an injection molded part;

[0006] Multiple solder pads are disposed on the injection molded part, including a first common electrode solder pad;

[0007] Multiple chips, each of which is electrically connected to two corresponding pads, the multiple chips including a red light chip, a green light chip and a blue light chip, wherein the green light chip and the blue light chip are both connected to the first common electrode pad;

[0008] Multiple pins, including two first heat dissipation pins, which are located on both sides of the bottom of the injection molded part and are electrically connected to the first common electrode pad.

[0009] In some embodiments, the first common electrode pad is T-shaped.

[0010] In some embodiments, the injection molded part has a multi-bend structure.

[0011] In some embodiments, it also includes:

[0012] The green light chip and the blue light chip are spaced apart on the first common electrode pad.

[0013] In some embodiments, the distances between the red light chip, green light chip, and blue light chip and the two side edges of the injection molded part are equal.

[0014] Secondly, this utility model embodiment also provides an LED lamp bead, comprising:

[0015] Injection molded parts;

[0016] Multiple solder pads are disposed on the injection molded part, including heat dissipation solder pads and second common electrode solder pads, which are respectively disposed on both sides of the injection molded part;

[0017] Multiple chips, each of which is electrically connected to two corresponding pads, the multiple chips including a red light chip, a green light chip and a blue light chip, wherein the green light chip and the blue light chip are disposed on the heat dissipation pads;

[0018] Multiple pins, including a second heat dissipation pin and a common anode pin, the second heat dissipation pin and the common anode pin are disposed opposite each other on both sides of the bottom of the injection molded part and are electrically connected to the heat dissipation pad and the second common electrode pad, respectively.

[0019] In some embodiments, the heat dissipation pad is L-shaped.

[0020] In some embodiments, the injection molded part is made of PPA material.

[0021] In some embodiments, an encapsulating adhesive layer is also included, which fills the internal space of the injection molded part.

[0022] In some embodiments, the encapsulating adhesive layer is made of epoxy resin.

[0023] The beneficial effects of the technical solution provided by this utility model include:

[0024] This utility model provides an LED lamp bead, which includes an injection molded part, multiple pads, multiple chips, and multiple pins. The multiple pads are disposed on the injection molded part and include a first common electrode pad. Each chip is electrically connected to two corresponding pads. The multiple chips include red, green, and blue light chips, wherein the green and blue light chips are both connected to the first common electrode pad. The multiple pins include two first heat dissipation pins disposed on both sides of the bottom of the injection molded part and electrically connected to the first common electrode pad. This utility model, with its injection molded part, multiple pads, multiple chips, and multiple pins, and the two first heat dissipation pins, improves the heat dissipation efficiency of the LED lamp bead, delays chip aging, and extends the lifespan of the LED lamp bead. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a first top view schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0027] Figure 2 This is a first bottom view schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0028] Figure 3 This is a first cross-sectional schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0029] Figure 4 This is a second top view schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0030] Figure 5 This is a second bottom-view schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0031] Figure 6 This is a second cross-sectional schematic diagram of an LED lamp bead provided in an embodiment of the present utility model;

[0032] Figure label:

[0033] 1. Injection molded parts;

[0034] 21. First common electrode pad; 22. Heat dissipation pad; 23. Second common electrode pad; 24. Red LED chip cathode pad; 25. Green LED chip cathode pad; 26. Red LED chip anode pad; 27. Blue LED chip cathode pad;

[0035] 31. Red light chip; 32. Green light chip; 33. Blue light chip;

[0036] 41. First heatsink pin; 42. Second heatsink pin; 43. Common anode pin;

[0037] 5. Encapsulating adhesive layer. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] This utility model provides an LED lamp bead that can solve the technical problems of low heat dissipation efficiency and short service life of LED lamp beads in related technologies.

[0040] See Figure 1 , Figure 2 and Figure 3 As shown in the figure, an embodiment of the present invention provides an LED lamp bead, which includes an injection molded part 1, multiple pads, multiple chips, and multiple pins. The multiple pads are disposed on the injection molded part 1, and each pad has a first common electrode pad 21. Each chip is electrically connected to two corresponding pads. The multiple chips include a red light chip 31, a green light chip 32, and a blue light chip 33. The green light chip 32 and the blue light chip 33 are both connected to the first common electrode pad 21. The multiple pins have two first heat dissipation pins 41, which are disposed on both sides of the bottom of the injection molded part 1 and are electrically connected to the first common electrode pad 21. This invention comprises an injection-molded part 1, multiple solder pads, multiple chips, and multiple pins. Among the solder pads is a first common electrode solder pad 21. The green light chip 32 and the blue light chip 33 are both connected to the first common electrode solder pad 21. Two first heat dissipation pins 41 are located on both sides of the bottom of the injection-molded part 1 and are electrically connected to the first common electrode solder pad 21. Compared to traditional LED beads, the addition of two first heat dissipation pins 41 improves the heat dissipation efficiency of the LED bead, delays chip aging, and extends the lifespan of the LED bead. Furthermore, in this embodiment, if one of the first heat dissipation pins 41 breaks, causing the LED bead to fail, the connection of the first heat dissipation pin 41 on the other side ensures the normal lighting of the LED bead, preventing LED bead failure due to the breakage of one first heat dissipation pin 41.

[0041] As an optional implementation, in one embodiment of the utility model, see [link to utility model description]. Figure 1As shown, the first common electrode pad 21 is T-shaped, and the first common electrode pad 21 can be a cathode or an anode. In this embodiment of the invention, the number of pads is five, including a first common electrode pad 21, a red light chip cathode pad 24, a green light chip cathode pad 25, a red light chip anode pad 26, and a blue light chip cathode pad 27. The red light chip cathode pads 24, 25, 26, and 27 are dispersed around the injection molded part 1. The first common electrode pad 21 is located between the red light chip cathode pads 24, 25, 26, and 27. The green light chip 32 and the blue light chip 33 are spaced apart on the axis of symmetry of the T-shaped first common electrode pad 21. This arrangement ensures that the multiple chips are highly concentrated while avoiding the green light chip 32 and the blue light chip 33 being too far from their corresponding negative electrode pads. The layout is reasonable and facilitates the formation of electrical paths.

[0042] As an optional implementation, in one embodiment of the utility model, the injection molded part 1 has a multi-bend structure. The surface area of ​​the injection molded part 1 with the multi-bend structure is greatly increased, which improves heat dissipation efficiency and further extends the service life of the LED lamp bead. Moreover, when the LED lamp bead is subjected to force, the multi-bend structure can buffer the pressure and improve the stability of the LED lamp bead structure.

[0043] As an optional implementation, in one embodiment of the utility model, see [link to utility model description]. Figure 3 As shown, the green light chip 32 and the blue light chip 33 are spaced apart on the first common electrode pad 21, which facilitates the connection of the green light chip 32 and the blue light chip 33 to the first common electrode pad 21. The spaced arrangement also facilitates heat dissipation and ensures the reliability of the LED beads.

[0044] As an optional implementation, in one embodiment of the utility model, the red light chip 31, the green light chip 32, and the blue light chip 33 are spaced apart along a direction parallel to the plurality of pins on both sides, and the red light chip 31, the green light chip 32, and the blue light chip 33 are spaced apart along the same direction. The layout is reasonable, easy to connect, and ensures that the distance between each pixel is equal during use, thereby improving the display effect.

[0045] In some embodiments, after considering the heat dissipation problem and through extensive experimental verification, it was found that the structure has a potential difference between the green light chip 32 and the blue light chip 33 and the heat dissipation pad 22 because one electrode of the green light chip 32 and the blue light chip 33 is electrically connected to the heat dissipation pad 22. This poses a risk of metal migration. Therefore, the following structure was designed to further prevent metal migration while meeting the high heat dissipation requirements, reduce the risk of failure, and improve the overall reliability of the LED.

[0046] See Figure 4 , Figure 5 and Figure 6 As shown, this utility model embodiment also provides an LED lamp bead, which includes an injection molded part 1, multiple pads, multiple chips, and multiple pins. The multiple pads are disposed on the injection molded part 1, and the multiple pads are provided with heat dissipation pads 22 and second common electrode pads 23. The heat dissipation pads 22 and second common electrode pads 23 are respectively disposed on both sides of the injection molded part 1. Each chip is electrically connected to the corresponding two pads. The multiple chips are provided with red light chip 31, green light chip 32, and blue light chip 33, wherein the green light chip 32 and blue light chip 33 are disposed on the heat dissipation pads 22. The multiple pins are provided with second heat dissipation pins 42 and common anode pins 43. The second heat dissipation pins 42 and common anode pins 43 are disposed opposite to each other on both sides of the bottom of the injection molded part 1 and are electrically connected to the heat dissipation pads 22 and second common electrode pads 23, respectively. This embodiment of the invention adds a second heat dissipation pin 42 to improve LED heat dissipation efficiency. The heat dissipation pad 22 where the second heat dissipation pin 42 is located is not connected to power. The green light chip 32 and the blue light chip 33 are placed on the heat dissipation pad 22. Therefore, there is no potential difference between the green light chip 32 and the blue light chip 33 and the heat dissipation pad 22, thereby achieving thermoelectric separation, preventing metal migration from the pad, reducing the risk of failure, and improving the service life of the LED beads.

[0047] As an optional implementation, in one embodiment of the utility model, see [link to utility model description]. Figure 4 As shown, the heat dissipation pad 22 is L-shaped. In this embodiment of the invention, there are six pads, including a heat dissipation pad 22, a second common electrode pad 23, a red light chip cathode pad 24, a green light chip cathode pad 25, a red light chip anode pad 26, and a blue light chip cathode pad 27. The red light chip cathode pad 24, green light chip cathode pad 25, red light chip anode pad 26, and blue light chip cathode pad 27 are dispersed around the injection molded part 1. The heat dissipation pad 22 and the second common electrode pad 23 are located between the red light chip cathode pad 24, green light chip cathode pad 25, red light chip anode pad 26, and blue light chip cathode pad 27. The green light chip 32 and the blue light chip 33 are spaced apart on the L-shaped heat dissipation pad 22. This arrangement ensures that the multiple chips are highly concentrated while avoiding the green light chip 32 and the blue light chip 33 being too far away from their corresponding negative electrode pads. The layout is reasonable and facilitates the formation of electrical paths.

[0048] As an optional implementation, in one embodiment of the invention, the injection molded part 1 is an injection molded part made of PPA material. In this embodiment of the invention, PPA rubber, namely polyphthalamide, is used as the main material of the injection molded part 1. PPA rubber has excellent high temperature resistance, is not easy to soften and deform, and has reliable insulation in high humidity environments, ensuring the stability of LED beads and improving the service life of LED beads.

[0049] As an optional implementation, in one embodiment of the utility model, see [link to utility model description]. Figure 6 As shown, the LED bead is also provided with an encapsulating adhesive layer 5, which fills the internal space of the injection molded part 1 and wraps each chip and bonding wire to improve the stability and chemical properties of the LED bead and ensure the reliability of the LED bead.

[0050] As an optional implementation, in one embodiment of the utility model, the encapsulating adhesive layer 5 is made of epoxy resin. The encapsulating adhesive layer 5 made of epoxy resin has high strength, strong impact resistance, and excellent optical performance, ensuring the reliability of the LED beads.

[0051] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0052] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0053] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the present invention.

Claims

1. An LED lamp bead, characterized in that, include: Injection molded part (1); Multiple pads are provided on the injection molded part (1), including a first common electrode pad (21); Multiple chips, each of which is electrically connected to two corresponding pads, the multiple chips include a red light chip (31), a green light chip (32) and a blue light chip (33), wherein the green light chip (32) and the blue light chip (33) are both connected to the first common electrode pad (21); Multiple pins, including two first heat dissipation pins (41), the two first heat dissipation pins (41) are located on both sides of the bottom of the injection molded part (1), and the two first heat dissipation pins (41) are electrically connected to the first common electrode pad (21).

2. The LED lamp bead according to claim 1, characterized in that: The first common electrode pad (21) is T-shaped.

3. The LED lamp bead according to claim 1, characterized in that: The multiple pins have a multi-bend structure.

4. The LED lamp bead according to claim 1, characterized in that, The green light chip (32) and the blue light chip (33) are disposed at intervals on the first common electrode pad (21).

5. An LED lamp bead according to claim 1, characterized in that: The distances between the red light chip (31), green light chip (32) and blue light chip (33) and the two sides of the injection molded part (1) are equal.

6. An LED lamp bead, characterized in that, include: Injection molded part (1); Multiple solder pads are provided on the injection molded part (1), including a heat dissipation solder pad (22) and a second common electrode solder pad (23), wherein the heat dissipation solder pad (22) and the second common electrode solder pad (23) are respectively provided on both sides of the injection molded part (1); Multiple chips, each of which is electrically connected to two corresponding pads, the multiple chips including a red light chip (31), a green light chip (32) and a blue light chip (33), wherein the green light chip (32) and the blue light chip (33) are disposed on the heat dissipation pad (22); Multiple pins, including a second heat dissipation pin (42) and a common anode pin (43), the second heat dissipation pin (42) and the common anode pin (43) are disposed opposite to each other on the bottom sides of the injection molded part (1) and are electrically connected to the heat dissipation pad (22) and the second common electrode pad (23) respectively.

7. An LED lamp bead according to claim 6, characterized in that: The heat dissipation pad (22) is L-shaped.

8. An LED lamp bead according to claim 6, characterized in that: The injection molded part (1) is made of PPA material.

9. An LED lamp bead according to claim 6, characterized in that, Also includes: An encapsulating adhesive layer (5) fills the internal space of the injection molded part (1).

10. An LED lamp bead according to claim 9, characterized in that: The encapsulating adhesive layer (5) is made of epoxy resin.

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