Chip packaging jig

Abstract

The utility model provides a chip packaging jig, and relates to the field of chip packaging. The chip packaging jig comprises a chip packaging jig bottom supporting plate, the upper surface of the chip packaging jig bottom supporting plate is fixedly connected with a light pipe fitting supporting stand column, and the top end of the light pipe fitting supporting stand column is fixedly connected with a hollow positioning rubber suction cup. According to the chip packaging jig, through cooperation of the light pipe fitting supporting stand column and the hollow positioning rubber suction cup, the chip is prevented from being in direct contact with the surface of the jig; meanwhile, through mutual cooperation of a left side fixing supporting frame, a chip left side fixing clamping piece, an auxiliary balance extension groove, an auxiliary balance extension rod, a right side positioning moving frame, a chip right side moving clamping piece, a spring and an open groove, chips of different sizes are limited, and movement of the chips in the packaging process is further prevented; the problems that chips are directly placed on the surface of a jig during packaging, the chips are prone to repeated movement in packaging work, and the surfaces of the chips are scratched to be damaged are solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a chip packaging fixture. Background Technology

[0002] Chip packaging is the outer casing used to mount semiconductor integrated circuit chips. It serves to house, fix, seal, and protect the chip, enhance its electrical and thermal performance, and act as a bridge between the chip's internal world and external circuits—the contacts on the chip are connected to the pins of the package casing via wires, and these pins, in turn, connect to other devices via wires on the printed circuit board. Therefore, packaging plays a crucial role in CPUs and other LSI integrated circuits. Since the design and manufacture of the 4-bit microprocessor chip in 1971, over the past 20 years, CPUs have evolved from Intel 4004, 80286, 80386, and 80486 to Pentium, PII, PIII, and P4; from 4-bit, 8-bit, 16-bit, and 32-bit to 64-bit; clock speeds have increased from MHz to today's GHz; the number of transistors integrated in CPU chips has jumped from over 2,000 to over ten million; and the scale of semiconductor manufacturing technology has progressed from SSI, MSI, LSI, and VLSI (Very Large Scale Integration) to ULSI. The number of input / output (I / O) pins in a package has gradually increased from dozens to hundreds, and even potentially up to 2000. This is truly a revolutionary change. Everyone is familiar with CPUs: 286, 386, 486, Pentium, PII, Celeron, K6, K6-2, Athlon… you can probably list a long list like the back of your hand. But when it comes to CPU and other large-scale integrated circuit (LSI) packaging, not many people may know much about it. Packaging refers to the outer casing used to mount semiconductor integrated circuit chips. It not only serves to house, fix, seal, and protect the chip and enhance its thermal conductivity, but it also acts as a bridge between the chip's internal world and external circuits—the contacts on the chip are connected to the pins of the package casing by wires, and these pins, in turn, connect to other devices through wires on the printed circuit board. Therefore, packaging plays a crucial role in CPUs and other LSI (Large Scale Integration) integrated circuits, and the emergence of new generations of CPUs is often accompanied by the use of new packaging forms. Chip packaging technology has undergone several generations of evolution, from DIP, QFP, PGA, BGA, to CSP and then to MCM. Each generation boasts more advanced technical specifications than the last, including a chip area to package area ratio approaching 1, higher applicable frequencies, and better temperature resistance. Other advancements include increased pin count, smaller pin pitch, reduced weight, improved reliability, and greater ease of use. However, chip packaging also requires appropriate fixtures for its operation.

[0003] DIP (Dual Inline-pin Package) refers to integrated circuit chips packaged in a dual inline form. The vast majority of small- and medium-scale integrated circuits (ICs) use this package, typically with no more than 100 pins. DIP-packaged CPU chips have two rows of pins and need to be inserted into a DIP socket. Alternatively, they can be directly soldered onto a circuit board with the same number and arrangement of solder holes. Special care should be taken when inserting or removing DIP-packaged chips from their sockets to avoid damaging the pins. PQFP (Plastic Quad Flat Package) chips have very small pin spacing and thin leads, and are generally used for large-scale or very large-scale integrated circuits, typically with more than 100 pins. Chips packaged in this form must be soldered to the motherboard using SMD (Surface Mount Device) technology. SMD-mounted chips do not require holes in the motherboard; the motherboard surface usually has pre-designed solder pads for the corresponding pins. Aligning the chip's pins with the corresponding solder pads allows for soldering to the motherboard. Chips soldered in this way are difficult to remove without special tools. Currently, chips are placed directly on the surface of the fixture during packaging. During the packaging process, the chips are prone to repeated movement, which can cause scratches and damage to the chip surface. Utility Model Content

[0004] The purpose of this invention is to provide a chip packaging fixture that solves the problem that current chip packaging processes involve placing the chip directly on the fixture surface, which can cause repeated movement of the chip during the packaging process, resulting in scratches and damage to the chip surface.

[0005] Technical solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip packaging fixture, comprising a bottom support plate, a lightweight tubular support column fixedly connected to the upper surface of the bottom support plate, a hollow positioning rubber suction cup fixedly connected to the top of the lightweight tubular support column, and a chip body structure to be packaged adsorbed on the upper surface of the hollow positioning rubber suction cup. When the chip body structure to be packaged is placed on the surface of the hollow positioning rubber suction cup, the chip body structure to be packaged can be slightly pressed down, causing the hollow positioning rubber suction cup to adsorb the lower surface of the chip body structure to be packaged, thereby pre-stabilizing the chip body structure to be packaged. A chip left-side fixing clip is engaged with the left side of the chip body structure to be packaged, a left-side fixing support frame is fixedly connected to the bottom of the chip left-side fixing clip, the right side of the left-side fixing support frame is fixedly connected to the left side of the bottom support plate of the chip packaging fixture, and a chip right-side movable clip is engaged with the right side of the chip body structure to be packaged. The bottom of the moving part is fixedly connected to a right-side positioning moving frame. A slot is opened on the right side of the bottom support plate of the chip packaging fixture. An auxiliary balance extension slot is opened on the left inner wall of the slot. An auxiliary balance extension rod is movably connected inside the auxiliary balance extension slot. The right end of the auxiliary balance extension rod is fixedly connected to the left side of the right-side positioning moving frame. Pull the right-side positioning moving frame to the right, and then place the chip body structure to be packaged on the surface of the hollow positioning rubber suction cup and press it down slightly so that the hollow positioning rubber suction cup can adsorb and position the chip body structure to be packaged. At the same time, the left side of the chip body structure to be packaged is stuck inside the chip left-side fixing clip. Finally, the right-side positioning moving frame is released. At this time, the spring contracts and drives the right-side positioning moving frame to reset. The right-side positioning moving frame will drive the right-side moving clip of the chip to move to the left and lock it on the right side of the chip body structure to be packaged. At the same time, it works with the chip left-side fixing clip to further limit the chip body structure to be packaged, so as to avoid displacement and friction of the chip body structure to be packaged during packaging.

[0007] Furthermore, a spring is sleeved on the surface of the auxiliary balance extension rod, and the left end of the spring is fixedly connected to the left inner wall of the slot.

[0008] Furthermore, the right end of the spring is fixedly connected to the left side of the right positioning and moving frame.

[0009] Furthermore, the left side of the right positioning moving frame overlaps with the right side of the bottom support plate of the chip packaging fixture.

[0010] Furthermore, the number of hollow positioning rubber suction cups is four.

[0011] Furthermore, the chip left-side fixing clip and the chip right-side movable clip are symmetrically arranged around the central axis of the bottom support plate of the chip packaging fixture.

[0012] Furthermore, the hollow positioning rubber suction cup is shaped like a frustum.

[0013] This utility model provides a chip packaging fixture. It has the following beneficial effects:

[0014] This chip packaging fixture, through the cooperation of a lightweight tubular support column and a hollow positioning rubber suction cup, avoids direct contact between the chip and the fixture surface. Simultaneously, the interaction of the left-side fixed support frame, the left-side chip fixing clip, the auxiliary balancing extension slot, the auxiliary balancing extension rod, the right-side positioning moving frame, the right-side chip movable clip, springs, and slots effectively limits the positioning of chips of different sizes, further preventing movement during chip packaging. This solves the problem that current chip packaging methods, where chips are directly placed on the fixture surface, easily lead to repeated movement during the packaging process, resulting in scratches and damage to the chip surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This utility model Figure 1 Enlarged view of the local structure at point A in the middle.

[0017] The components include: 1. bottom support plate of chip packaging fixture; 2. lightweight tubular support column; 3. hollow positioning rubber suction cup; 4. chip body structure to be packaged; 5. left side fixed support frame; 6. left side chip fixed clip; 7. auxiliary balance extension groove; 8. auxiliary balance extension rod; 9. right side positioning moving frame; 10. right side chip movable clip; 11. spring; and 12. slot. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figure 1-2As shown, Embodiment 1 of this utility model provides a chip packaging fixture, including a bottom support plate 1. The bottom support plate 1 is made of lightweight aluminum to reduce the overall weight of the fixture, facilitating handling and transfer. A lightweight tubular support column 2 is fixedly connected to the upper surface of the bottom support plate 1. A hollow positioning rubber suction cup 3 is fixedly connected to the top of the lightweight tubular support column 2. There are four hollow positioning rubber suction cups 3 in total. The hollow positioning rubber suction cups 3 are frustoconical in shape. The upper surface of the hollow positioning rubber suction cups 3 is adsorbed with the chip body structure 4 to be packaged. When the chip body structure 4 to be packaged is placed on the surface of the hollow positioning rubber suction cup 3, the chip body structure 4 to be packaged can be slightly pressed down so that the hollow positioning rubber suction cup 3 can hold the chip body structure to be packaged. The lower surface of the structure 4 is adsorbed, thereby pre-stabilizing the chip body structure 4 to be packaged. The left side of the chip body structure 4 to be packaged is snapped with a chip left side fixing clip 6. The bottom of the chip left side fixing clip 6 is fixedly connected to a left side fixing support frame 5. The right side of the left side fixing support frame 5 is fixedly connected to the left side of the bottom support plate 1 of the chip packaging fixture. The right side of the chip body structure 4 to be packaged is snapped with a chip right side movable clip 10. The chip left side fixing clip 6 and the chip right side movable clip 10 are symmetrically arranged about the central axis of the bottom support plate 1 of the chip packaging fixture. The bottom of the chip right side movable clip 10 is fixedly connected to a right side positioning moving frame 9. The left side of the right side positioning moving frame 9 overlaps with the right side of the bottom support plate 1 of the chip packaging fixture. The left side fixing support frame 5 and the right side positioning moving frame 9 are the same size.

[0020] In the second embodiment of this utility model, a slot 12 is provided on the right side of the bottom support plate 1 of the chip packaging fixture. An auxiliary balancing extension slot 7 is provided on the left inner wall of the slot 12. An auxiliary balancing extension rod 8 is movably connected inside the auxiliary balancing extension slot 7. A spring 11 is sleeved on the surface of the auxiliary balancing extension rod 8. The left end of the spring 11 is fixedly connected to the left inner wall of the slot 12, and the right end of the spring 11 is fixedly connected to the left side of the right positioning and moving frame 9. The right end of the auxiliary balancing extension rod 8 is fixedly connected to the left side of the right positioning and moving frame 9. The column 2 and the hollow positioning frame are supported by lightweight tubular components. The rubber suction cup 3 helps to prevent the chip from directly contacting the surface of the fixture. At the same time, through the cooperation of the left fixed support frame 5, the left chip fixed clip 6, the auxiliary balance extension groove 7, the auxiliary balance extension rod 8, the right positioning and moving frame 9, the right chip movable clip 10, the spring 11 and the slot 12, chips of different sizes are limited, further preventing movement during chip packaging. This solves the problem that currently, chips are directly placed on the surface of the fixture during packaging, and the chips are prone to repeated movement, resulting in scratches and damage to the chip surface.

[0021] Working principle: Pull the right positioning moving frame 9 to the right, then place the chip body structure 4 to be packaged on the surface of the hollow positioning rubber suction cup 3 and press it down slightly, so that the hollow positioning rubber suction cup 3 can adsorb and position the chip body structure 4 to be packaged. At the same time, the left side of the chip body structure 4 to be packaged is stuck inside the chip left side fixing clip 6. Finally, release the right positioning moving frame 9. At this time, the spring 11 retracts and drives the right positioning moving frame 9 to reset. The right positioning moving frame 9 will drive the right side movable clip 10 of the chip to move to the left and be stuck on the right side of the chip body structure 4 to be packaged. At the same time, it works with the chip left side fixing clip 6 to further limit the chip body structure 4 to be packaged, so as to avoid displacement and friction of the chip body structure 4 to be packaged during packaging.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging fixture, comprising a bottom support plate (1) for the chip packaging fixture, characterized in that: A lightweight tubular support column (2) is fixedly connected to the upper surface of the bottom support plate (1) of the chip packaging fixture. A hollow positioning rubber suction cup (3) is fixedly connected to the top of the lightweight tubular support column (2). The upper surface of the hollow positioning rubber suction cup (3) is adsorbed with the chip body structure (4) to be packaged. A chip left-side fixing clip (6) is snapped into the left side of the chip body structure (4). A left-side fixing support frame (5) is fixedly connected to the bottom of the chip left-side fixing clip (6). The right side of the left-side fixing support frame (5) is connected to the bottom support plate (1) of the chip packaging fixture. The left side of the chip body structure (4) is fixedly connected to the chip body structure (4), and the right side of the chip body structure (4) is snapped with a right side movable clip (10). The bottom of the right side movable clip (10) is fixedly connected to a right side positioning moving frame (9). The right side of the bottom support plate (1) of the chip packaging fixture has a slot (12). The left inner wall of the slot (12) has an auxiliary balance extension slot (7). The auxiliary balance extension slot (7) is movably connected to an auxiliary balance extension rod (8). The right end of the auxiliary balance extension rod (8) is fixedly connected to the left side of the right side positioning moving frame (9).

2. The chip packaging fixture according to claim 1, characterized in that: A spring (11) is sleeved on the surface of the auxiliary balance extension rod (8), and the left end of the spring (11) is fixedly connected to the left inner wall of the slot (12).

3. A chip packaging fixture according to claim 2, characterized in that: The right end of the spring (11) is fixedly connected to the left side of the right positioning and moving frame (9).

4. A chip packaging fixture according to claim 1, characterized in that: The left side of the right positioning moving frame (9) overlaps with the right side of the bottom support plate (1) of the chip packaging fixture.

5. A chip packaging fixture according to claim 1, characterized in that: The number of hollow positioning rubber suction cups (3) is four.

6. A chip packaging fixture according to claim 1, characterized in that: The chip left fixed card (6) and the chip right movable card (10) are symmetrically arranged around the central axis of the bottom support plate (1) of the chip packaging fixture.

7. A chip packaging fixture according to claim 1, characterized in that: The hollow positioning rubber suction cup (3) is shaped like a frustum.

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