Atomization assembly and atomization device

Abstract

The utility model relates to the technical field of electronic atomization. The utility model provides an atomization assembly and an atomization device. The atomization assembly comprises an atomization core, a base assembly, a circuit board and a sealing piece. The atomizing core comprises a heating element and a lead electrically connected with the heating element, and the heating element is used for heating and atomizing the atomizing matrix into aerosol; the base assembly supports the atomizing core, and a mounting cavity and a lead channel which are communicated with each other are arranged in the base assembly; the circuit board is mounted in the mounting cavity, and an encryption chip is arranged on the circuit board; the lead passes through the lead channel and is electrically connected with the circuit board; and the sealing element is in sealing connection with the inner wall of the lead channel and / or the inner wall of the mounting cavity so as to seal a passage between the atomizing core and the circuit board in the base assembly. According to the atomization assembly, the sealing piece is arranged in the base assembly and can seal a passage between the atomization core and the circuit board, so that the atomization core is prevented from leaking liquid to the circuit board and electronic elements on the circuit board, and the sealing performance of the atomization assembly is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic atomization, in particular to an atomization assembly and an atomization device. BACKGROUND

[0002] The atomization device is a device capable of heating an atomization substrate to generate aerosol. In some refillable atomization devices, the atomization assembly and the power supply assembly are detachably connected, the power supply assembly can supply power to the atomization assembly, and the power supply assembly can also control the atomization assembly to heat the atomization substrate. An encryption chip can be arranged in the atomization assembly, and the power supply assembly is identified through the encryption chip. When the identification is correct, the power supply assembly can supply power to the atomization assembly, thereby preventing product mixing between different regions and facilitating management and control.

[0003] However, when the atomization assembly heats the atomization substrate, condensate may be generated in the atomization channel of the atomization core, and the condensate is easy to leak to the electronic elements such as the encryption chip in the atomization assembly, resulting in damage to the atomization device and failure to work normally. CONTENT OF THE UTILITY MODEL

[0004] The present application provides an atomization assembly and an atomization device, which can solve the technical problem that the atomization core is easy to leak liquid to the electronic elements in the atomization assembly.

[0005] In order to solve the above technical problem, the present application provides an atomization assembly, which comprises an atomization core, a base assembly, a circuit board and a sealing element. The atomization core comprises a heating element and a lead wire electrically connected to the heating element, and the heating element is used for heating and atomizing the atomization substrate into aerosol; the base assembly supports the atomization core, and the base assembly is provided with a mounting cavity and a lead wire channel in communication; the circuit board is installed in the mounting cavity, and the circuit board is provided with an encryption chip; the lead wire passes through the lead wire channel and is electrically connected to the circuit board; and the sealing element is sealingly connected to the inner wall of the lead wire channel and / or the inner wall of the mounting cavity to seal the passage between the atomization core and the circuit board in the base assembly.

[0006] In an embodiment, the sealing element comprises an assembly part and a sealing part connected to each other, the assembly part is arranged in the mounting cavity, and the sealing part is arranged in the lead wire channel and sealingly connected to the inner wall of the lead wire channel; the sealing element is provided with a lead wire hole penetrating through the assembly part and the sealing part, and the lead wire passes through the lead wire hole.

[0007] In an embodiment, a thin film connected to the inner wall of the lead wire hole is arranged in the lead wire hole, and the thickness of the thin film is less than the axial length of the lead wire hole; the thin film is used to seal the gap between the lead wire and the inner wall of the lead wire hole.

[0008] In an embodiment, the atomization assembly further comprises a first electrode and a second electrode; one end of the first electrode is mounted on the base assembly and exposed from the base assembly, and the other end of the first electrode is electrically connected with the circuit board so that the first electrode is electrically connected with the lead wire; one end of the second electrode is mounted on the base assembly and exposed from the base assembly, and the other end of the second electrode is electrically connected with the circuit board so that the second electrode is electrically connected with the encryption chip; the first electrode and the second electrode are both used to be electrically connected with the power supply assembly.

[0009] In an embodiment, the base assembly comprises a support and an insulating member connected with each other, the support forms the lead wire channel therein, and the support supports the atomization core; the support and the insulating member cooperatively form the mounting cavity; the insulating member is provided with the first electrode hole and the second electrode hole which are in communication with the mounting cavity; the first electrode is assembled in the first electrode hole, and the second electrode is assembled in the second electrode hole.

[0010] In an embodiment, the lead wire passes through the circuit board, and the lead wire, the first electrode and the second electrode are all electrically connected with the side of the circuit board which is away from the lead wire channel; the insulating member is stacked with the circuit board, and the side of the insulating member which faces the circuit board is provided with the first air-avoiding groove and the second air-avoiding groove; the first electrode hole is formed in the groove wall of the first air-avoiding groove which is away from the circuit board; and the second electrode hole is formed in the groove wall of the second air-avoiding groove which is away from the circuit board.

[0011] In an embodiment, the base assembly is provided with the insertion slot at the end close to the atomization core, the atomization core further comprises an atomization tube, the heating element is mounted in the atomization tube, and the atomization channel in the atomization tube is in communication with the lead wire channel; the atomization tube has an insertion part which is inserted in the insertion slot, the insertion slot has a glue pouring opening in the radial direction of the base assembly, and the atomization assembly further comprises a bonding body which is filled in the insertion slot to bond the insertion part with the insertion slot.

[0012] In an embodiment, the channel wall of the lead wire channel is provided with the air inlet, and the atomization channel in the atomization core is in communication with the air inlet; the air inlet is located at the side of the sealing member which faces the atomization core, and the air inlet is separated from the mounting cavity by the sealing member.

[0013] In an embodiment, the encryption chip is used to close the output voltage of the first electrode, the encryption chip is used to receive the identification information of the power supply assembly through the second electrode, and the output voltage of the first electrode is opened based on the identification information.

[0014] To solve the above technical problems, the present application provides an atomization device, which comprises an atomization assembly and a power supply assembly. The atomization assembly is the atomization assembly involved in any of the above embodiments; and the power supply assembly is electrically connected with the circuit board.

[0015] The application provides an atomization assembly, which comprises an atomization core, a base assembly, a circuit board and a sealing piece. The atomization core comprises a heating element and a lead wire electrically connected with the heating element, and the heating element is used for heating and atomizing an atomization substrate into an aerosol; the base assembly supports the atomization core, and the base assembly is provided with a mounting cavity and a lead wire channel in communication; the circuit board is mounted in the mounting cavity, and the circuit board is provided with an encryption chip; the lead wire passes through the lead wire channel and is electrically connected with the circuit board; and the sealing piece is sealingly connected with the inner wall of the lead wire channel and / or the inner wall of the mounting cavity, so as to seal the passage between the atomization core and the circuit board in the base assembly. The circuit board of the atomization assembly of the application is arranged in the mounting cavity of the base assembly. Since the lead wire of the atomization core needs to be led to the mounting cavity through the lead wire channel of the base assembly, so that the lead wire can be electrically connected with the circuit board, the atomization core and the circuit board are connected through the lead wire channel and the mounting cavity. The sealing piece arranged in the base assembly can seal the passage between the atomization core and the circuit board, thereby preventing the atomization core from leaking liquid to the circuit board and electronic elements on the circuit board, and improving the sealing performance of the atomization assembly. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structural schematic view of an atomization core, a base assembly, a circuit board, a sealing piece, a first electrode and a second electrode provided by an embodiment of the application is provided;

[0017] Figure 2 A sectional view of Figure 1 ;

[0018] Figure 3 An exploded view of an atomization core, a base assembly, a circuit board, a sealing piece, a first electrode and a second electrode provided by an embodiment of the application is provided;

[0019] Figure 4 A structural schematic view of an atomization tube provided by an embodiment of the application is provided;

[0020] Figure 5 A sectional view of a base assembly provided by an embodiment of the application is provided;

[0021] Figure 6 A structural schematic view of a sealing piece provided by an embodiment of the application is provided;

[0022] Figure 7 A structural schematic view of an insulating piece provided by an embodiment of the application is provided;

[0023] Figure 8 A structural schematic view of a supporting piece provided by an embodiment of the application is provided;

[0024] Figure 9 A sectional view of an atomization core, a base assembly, a circuit board, a sealing piece, a first electrode and a second electrode provided by an embodiment of the application is provided.

[0025] wherein, Figure 9 The arrows indicate the flow direction of the gas.

[0026] Reference signs: base assembly 10, mounting cavity 11, lead wire channel 12, support 13, assembly groove 131, insulating piece 14, first electrode hole 141, second electrode hole 142, first clearance groove 143, second clearance groove 144, outer cover 15, insertion slot 16, glue pouring port 161, air inlet 17, atomizing core 20, atomizing tube 21, atomizing channel 211, liquid guide hole 212, plug-in part 213, liquid guide piece 22, heating element 23, lead wire 24, circuit board 30, sealing piece 40, assembly part 41, sealing part 42, convex ring 421, lead wire hole 43, film 44, first electrode 50, second electrode 60. DETAILED DESCRIPTION

[0027] The application will be further described in details through specific embodiments in combination with the drawings. In different embodiments, similar elements are marked with similar reference signs. In the following embodiments, many details are described in order to make the application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different cases, or can be replaced by other elements, materials or methods. In some cases, some operations related to the application are not shown or described in the specification in order to avoid the core part of the application being overwhelmed by too much description, and it is not necessary to describe these related operations in detail for those skilled in the art according to the description in the specification and general technical knowledge in the art.

[0028] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate way to form various embodiments, and the operation steps involved in each embodiment can also be sequentially adjusted or adjusted in a manner that can be easily seen by those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing one embodiment, and do not mean that the composition and / or order is necessary.

[0029] In this paper, the serial numbers of components themselves, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any order or technical meaning. Unless otherwise specified, "connection" and "coupling" in this application include direct and indirect connection (coupling).

[0030] The terms “parallel”, “perpendicular” and the like are defined in relation to the current process level, rather than the absolute strict definition in mathematics, and a small deviation is allowed, and approximately parallel, approximately perpendicular, etc. can be used. For example, A is parallel to B, which means that A is parallel to B or approximately parallel to B, and the included angle between A and B is between 0° and 10°. For example, A is perpendicular to B, which means that A is perpendicular to B or approximately perpendicular to B, and the included angle between A and B is between 80° and 100°. The orientation terms mentioned in the embodiments of the present application, such as “upper”, “inner”, “outer”, “side” and the like, are only the directions of the drawings, therefore, the orientation terms are used to better and more clearly illustrate and understand the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0031] The present application provides an atomization device, which comprises an atomization assembly and a power supply assembly (not shown in the figure). The atomization assembly can comprise a shell assembly (not shown in the figure), a base assembly 10 and an atomization core 20. The shell assembly is provided with a liquid storage cavity inside, which is used to store an atomization substrate. The atomization substrate is usually a liquid substrate, which can generate an aerosol after being heated by the atomization core 20. The atomization substrate can be a substrate such as tobacco tar or medicinal liquid.

[0032] The shell assembly has a suction nozzle. The base assembly 10 is connected to the end of the shell assembly away from the suction nozzle, and supports the atomization core 20. Specifically, the atomization core 20 is arranged in the internal space enclosed by the base assembly 10 and the shell assembly. As shown in Figure 3 and Figure 4 The atomization core 20 comprises an atomization tube 21, a liquid guide 22, a heating element 23 and a lead wire 24. One end of the atomization tube 21 is connected to the base assembly 10, and the other end of the atomization tube 21 is connected to the shell assembly. The inside of the atomization tube 21 forms an atomization channel 211, which communicates with the air outlet channel in the suction nozzle. The liquid guide 22 and the heating element 23 are arranged in the atomization channel 211. Specifically, the liquid guide 22 is arranged on the inner wall of the atomization channel 211, and the heating element 23 is arranged in the inside of the liquid guide 22.

[0033] A liquid guide hole 212 is formed in the atomization tube 21. The atomization substrate in the liquid storage cavity can flow to the liquid guide 22 through the liquid guide hole 212, and the liquid guide 22 guides the atomization substrate to the heating element 23. The liquid guide 22 can be a porous material, such as cotton, porous ceramic and the like, so as to guide the atomization substrate.

[0034] The heating element 23 is electrically connected with the lead wire 24. By electrically connecting the lead wire 24 with the power supply assembly, the power supply assembly can supply power to the heating element 23 to heat the atomization substrate into aerosol. The aerosol can flow to the air outlet channel of the mouthpiece through the atomization channel 211, and the user can inhale the aerosol from the mouthpiece.

[0035] The heating element 23 may, for example, be a heating sheet, a heating wire, a heating net, or the like structure. The heating element 23 has an electrode part, the number of the electrode part is at least two, and the number of the lead wire 24 is at least two. The lead wire 24 is in contact with the electrode part of the heating element 23 to realize the electrical connection between the lead wire 24 and the heating element 23. The number of the lead wire 24 can be the same as or different from the number of the electrode part. Preferably, the number of the lead wire 24 is the same as the number of the electrode part, and the lead wire 24 is connected to the electrode part one by one. For example, in the embodiment of Figure 3 , the number of the electrode part of the heating element 23 is two. The number of the lead wire 24 is two.

[0036] The power supply assembly can be detachably connected with the atomization assembly. For example, the power supply assembly and the atomization assembly can be detachably connected through magnetic attraction, buckling, plug-in, or the like. Through the detachable connection between the power supply assembly and the atomization assembly, the atomization assembly can be replaced when the atomization substrate in the atomization assembly is almost consumed. Since only the atomization assembly needs to be replaced, the power supply assembly does not need to be replaced, and thus the purchase cost of the user can be reduced.

[0037] The power supply assembly can be electrically connected with the atomization assembly. Specifically, the power supply assembly can include a battery, a controller, and the like. After the power supply assembly and the heating element 23 of the atomization assembly are electrically connected, the controller can control the battery to supply power to the heating element 23.

[0038] As shown in Figure 2 and Figure 3 , the atomization assembly further includes a circuit board 30 and a sealing member 40. As shown in Figure 2 and Figure 5 , the base assembly 10 is provided with a mounting cavity 11 and a lead wire channel 12. The circuit board 30 is mounted in the mounting cavity 11, and the lead wire 24 is electrically connected with the circuit board 30. Specifically, one end of the lead wire channel 12 communicates with the mounting cavity 11, and the other end of the lead wire channel 12 communicates with the atomization channel 211. The lead wire 24 can pass through the lead wire channel 12 and be electrically connected with the circuit board 30.

[0039] The circuit board 30 is provided with an encryption chip (not shown in the figure). When the power supply assembly and the atomization assembly are connected, the circuit board 30 can be electrically connected with the power supply assembly, so that the power supply assembly can send identification information to the encryption chip. When the encryption chip receives correct identification information, the power supply assembly can supply power to the heating element 23, and the atomization device can work normally. When the encryption chip receives incorrect signals or no signals, the power supply assembly cannot drive the atomization assembly to work normally. By setting the encryption chip in the atomization assembly, it can prevent product counterfeiting in different regions from being unable to be controlled, prevent the production of high-imitation fake products, and facilitate the tracking of product quality.

[0040] The sealing member 40 is arranged on the side of the circuit board 30 close to the atomization core 20. The sealing member 40 is sealingly connected with the inner wall of the lead channel 12 and / or the inner wall of the mounting cavity 11, that is, the sealing member 40 can be arranged only in the lead channel 12 and sealingly connected with the inner wall of the lead channel 12; the sealing member 40 can also be arranged only in the mounting cavity 11 and sealingly connected with the inner wall of the mounting cavity 11; the sealing member 40 can also be arranged partially in the lead channel 12 and sealingly connected with the inner wall of the lead channel 12, and partially in the mounting cavity 11. The sealing member 40 is used to seal the passage between the atomization core 20 and the circuit board 30 in the base assembly 10, so as to prevent the condensed liquid in the atomization core 20 from flowing to the circuit board 30 along the lead channel 12 and the mounting cavity 11. The sealing member 40 can be made of elastic material, for example, can be made of silica gel material, so as to achieve good sealing.

[0041] The circuit board 30 of the atomization assembly of the present application is arranged in the mounting cavity 11 of the base assembly 10. Since the lead 24 of the atomization core 20 needs to be led to the mounting cavity 11 through the lead channel 12 of the base assembly 10, so that the lead 24 can be electrically connected with the circuit board 30, the atomization core 20 and the circuit board 30 are connected through the lead channel 12 and the mounting cavity 11. The present application sets the sealing member 40 in the base assembly 10, which can seal the passage between the atomization core 20 and the circuit board 30, thereby preventing the atomization core 20 from leaking liquid to the circuit board 30 and the electronic elements on the circuit board 30, and improving the sealing performance of the atomization assembly.

[0042] As Figure 2 and Figure 6As shown, in an embodiment, the sealing member 40 comprises an assembling portion 41 and a sealing portion 42, preferably, the assembling portion 41 and the sealing portion 42 are integrally formed. The sealing member 40 is connected to the side of the assembling portion 41 facing the atomization core 20. The assembling portion 41 is arranged in the mounting cavity 11, and the sealing portion 42 is arranged in the lead passage 12 and sealingly connected to the inner wall of the lead passage 12. Specifically, the outer surface of the sealing portion 42 can have a convex ring 421, which can be in interference fit with the inner wall of the lead passage 12, so that the sealing portion 42 is sealingly connected to the inner wall of the lead passage 12. The sealing member 40 is provided with a lead hole 43 penetrating through the assembling portion 41 and the sealing portion 42, and the lead 24 is sequentially connected to the circuit board 30 from the side of the heating element 23 through the atomization passage 211, the lead passage 12, and the lead hole 43. The circuit board 30 is arranged on the side of the assembling portion 41 away from the sealing portion 42.

[0043] By arranging the assembling portion 41 and the sealing portion 42, the sealing member 40 not only seals the lead passage 12 through the sealing portion 42 to prevent liquid from flowing from the side of the atomization core 20 to the side of the circuit board 30, but also can abut against the circuit board 30 through the assembling portion 41. Avoidance portions can be arranged on the assembling portion 41 according to the arrangement of the electronic elements on the circuit board 30, so as to avoid the electronic elements from colliding with the hard base assembly 10 during use and transportation, and to prevent the circuit board 30 from being damaged.

[0044] In an embodiment, as shown in Figure 2 The lead hole 43 is provided with a film 44 connected to the inner wall of the lead hole 43, and the film 44 can be integrally formed with the sealing member 40. The thickness of the film 44 is less than the axial length of the lead hole 43, and the film 44 is used to seal the gap between the lead 24 and the inner wall of the lead hole 43. Specifically, the film 44 is substantially annular, the outer periphery of the annular is connected to the inner wall of the lead hole 43, and the inner periphery of the annular is tightly abutted against the outer wall of the lead 24. Before assembly, the film 44 is a complete circle, and during assembly, the lead 24 can pierce the film 44 to make the film 44 substantially annular. By piercing the film 44 with the lead 24, the gap between the lead 24 and the inner wall of the lead hole 43 can be sealed by the film 44, preventing liquid from flowing along the lead 24 and the lead hole 43 to the circuit board 30, so as to further enhance the sealing of the atomization assembly.

[0045] In an embodiment, as shown in Figure 2 and Figure 3As shown, the atomization assembly further comprises a first electrode 50 and a second electrode 60. The first electrode 50 is a positive or negative power supply electrode of the heating element 23, and the second electrode 60 is a signal transmission electrode of the encryption chip. One end of the first electrode 50 is mounted on and exposed from the base assembly 10, and the other end of the first electrode 50 is electrically connected to the circuit board 30, so that the first electrode 50 is electrically connected to the lead wire 24 through the circuit board 30. The number of the first electrode 50 can be consistent with the number of the lead wire 24, for example, in the embodiment of Figure 2 and Figure 3 , the number of the first electrode 50 is two.

[0046] One end of the second electrode 60 is mounted on and exposed from the base assembly 10, and the other end of the second electrode 60 is electrically connected to the circuit board 30, so that the second electrode 60 is electrically connected to the encryption chip through the circuit board 30. Both the first electrode 50 and the second electrode 60 are used to be electrically connected to the power supply assembly. In this way, the power supply assembly can supply power to the heating element 23 through the first electrode 50, and the power supply assembly can send identification information to the encryption chip through the second electrode 60. The first electrode 50 and the second electrode 60 are exposed from the base assembly 10, so that after the atomization assembly is connected to the power supply assembly, the first electrode 50 and the second electrode 60 can be respectively in contact with the contacts of the power supply assembly.

[0047] The encryption chip closes the output voltage of the first electrode 50 when there is no signal on the second electrode 60 or the second electrode 60 receives an incorrect signal, so that the power supply assembly cannot supply power to the heating element 23. After the first electrode 50 and the second electrode 60 are in contact with the contacts of the power supply assembly, the encryption chip is used to receive correct identification information of the power supply assembly through the second electrode 60, and to open the output voltage of the first electrode 50 based on the correct identification information, so that the power supply assembly can supply power to the heating element 23.

[0048] In one embodiment, as Figure 2 , 3As shown in Figure 5, the base assembly 10 includes a support member 13 and an insulating member 14 connected to each other. A lead wire channel 12 is formed within the support member 13, which supports the atomizing core 20. The support member 13 and the insulating member 14 cooperate to form a mounting cavity 11. Specifically, an assembly groove 131 is provided within the support member 13, communicating with the lead wire channel 12. The insulating member 14 is disposed within the assembly groove 131, so that the insulating member 14 and the groove wall of the assembly groove 131 enclose the mounting cavity 11. The insulating member 14 can be made of an elastic material, for example, silicone. By making the insulating member 14 an elastic material, a tight fit between the insulating member 14 and the assembly groove 131 is facilitated, thus facilitating the installation of the atomizing assembly. The insulating member 14 is provided with a first electrode hole 141 and a second electrode hole 142 communicating with the mounting cavity 11. The first electrode 50 is assembled in the first electrode hole 141, and the second electrode 60 is assembled in the second electrode hole 142. The insulating component 14, which mounts the first electrode hole 141 and the second electrode hole 142, can prevent the first electrode 50 and the second electrode 60 from being electrically connected.

[0049] In addition, the base assembly 10 may also include an outer cover 15, which can be connected to the housing assembly. The outer cover 15 has side walls and a bottom wall. The side walls of the outer cover 15 can be fitted around the outer periphery of the support member 13, and the bottom wall of the outer cover 15 can be located at the end of the support member 13 and the insulating member 14 away from the atomizing core 20. Through holes are respectively provided on the outer cover 15 at positions corresponding to the first electrode hole 141 and the second electrode hole 142, so that the first electrode 50 and the second electrode 60 can be connected to the power supply assembly through the through holes. By providing the support member 13 and the insulating member 14, it is convenient to assemble the sealing member 40 and the circuit board 30 inside the base assembly 10, and it is also convenient to solder the first electrode 50, the second electrode 60 and the lead wire 24 to the circuit board 30.

[0050] In one embodiment, such as Figure 2 As shown, lead 24 passes through circuit board 30. Lead 24, first electrode 50, and second electrode 60 are all electrically connected to the side of circuit board 30 away from lead channel 12. Specifically, lead 24, first electrode 50, and second electrode 60 are all soldered to the side of circuit board 30 away from lead channel 12. Insulating component 14 is stacked with circuit board 30, as shown... Figure 7As shown, the insulation piece 14 is provided with a first empty slot 143 and a second empty slot 144 on the side facing the circuit board 30, the first empty slot 143 is provided with a first electrode hole 141 on the slot wall away from the circuit board 30, and the second empty slot 144 is provided with a second electrode hole 142 on the slot wall away from the circuit board 30. Since the first electrode 50 is welded on the side of the circuit board 30 away from the lead channel 12, the side of the circuit board 30 away from the lead channel 12 is provided with solder, and the first empty slot 143 can accommodate the solder to prevent the solder from lifting the insulation piece 14. Since the lead 24 needs to be welded on the side of the circuit board 30 away from the lead channel 12 after the circuit board 30 is assembled in the assembly slot 131, the second empty slot 144 can accommodate the lead 24 to prevent the lead 24 from lifting the insulation piece 14.

[0051] In an embodiment, as shown in Figure 4 and Figure 8 The base assembly 10 is provided with a slot 16 near one end of the atomizing core 20, specifically, the support piece 13 is provided with a slot 16 near one end of the atomizing core 20. The atomizing tube 21 has a plug-in part 213, which is inserted into the slot 16 to connect the atomizing tube 21 and the support piece 13. The slot 16 has a glue pouring hole 161 in the radial direction of the base assembly 10, and the atomizing assembly further comprises a bonding body (not shown), which is filled in the slot 16 to bond the plug-in part 213 and the slot 16, so that the atomizing tube 21 can be stably fixed on the support piece 13.

[0052] In an embodiment, as shown in Figure 8 and Figure 9 The channel wall of the lead channel 12 is provided with an air inlet 17, which communicates with the lead channel 12, and the air inlet 17 communicates with the atomizing channel 211 through the lead channel 12. The air inlet 17 is located on the side of the sealing piece 40 facing the atomizing core 20, and the air inlet 17 is separated from the mounting cavity 11 by the sealing piece 40. The air inlet 17 also communicates with the outside atmosphere, so that the outside airflow can enter the atomizing channel 211 through the air inlet 17.

[0053] When the atomizing assembly of the present application is assembled, the heating element 23 is placed on the liquid guide 22 with the side away from the lead 24, the cotton swab is placed on the side of the heating element 23 with the lead 24, the heating element 23 is wrapped around the cotton swab and then is loaded into the auxiliary jig cotton groove, the excess liquid guide 22 is removed along the cotton groove, and then the liquid guide 22 and the heating element 23 are loaded into the corresponding position in the atomizing tube 21 by the auxiliary jig. The plug-in part 213 of the atomizing tube 21 is inserted into the slot 16 of the support piece 13, and then glue is poured into the slot 16 through the glue pouring hole 161 for fixation.

[0054] Then, the sealing member 40 is installed into the assembling groove 131 of the supporting member 13, the lead wire 24 is passed through the lead wire hole 43 of the sealing member 40 and pierces the film 44 in the lead wire hole 43, the circuit board 30 is installed into the assembling groove 131, and the lead wire 24 is passed through the hole on the circuit board 30, then the lead wire 24, the first electrode 50 and the second electrode 60 are welded on the circuit board 30. The insulating member 14 is installed into the assembling groove 131, and each electrode hole on the insulating member 14 is installed corresponding to the first electrode 50 and the second electrode 60 respectively, finally the outer cover 15 is riveted on the supporting member 13. The structure and assembling mode of the atomizing assembly of the present application are simple, the production efficiency is high, and the automatic assembling can be realized.

[0055] The above application of specific examples to illustrate the present application, is only used to help understand the present application, and is not used to limit the present application. For the skilled in the art to which the present application belongs, according to the idea of the present application, a number of simple deductions, deformation or replacement can be made.

Claims

1. An atomizing component, characterized in that, include: An atomizing core, comprising a heating element and leads electrically connected to the heating element, wherein the heating element is used to heat and atomize the atomizing matrix into an aerosol; A base assembly that supports the atomizing core, and the base assembly having a communicating mounting cavity and a lead wire channel. A circuit board is mounted in the mounting cavity and has an encryption chip on it; a lead wire passes through the lead wire channel and is electrically connected to the circuit board. And a seal, which is sealed to the inner wall of the lead channel and / or the inner wall of the mounting cavity to seal the passage between the atomizing core and the circuit board within the base assembly.

2. The atomizing component according to claim 1, characterized in that, The sealing element includes an assembly part and a sealing part connected to each other. The assembly part is disposed in the mounting cavity, and the sealing part is disposed in the lead wire channel and is sealed to the inner wall of the lead wire channel. The sealing element is provided with a lead wire hole that penetrates the assembly part and the sealing part, and the lead wire passes through the lead wire hole.

3. The atomizing component according to claim 2, characterized in that, A thin film is provided inside the lead hole and connected to the inner wall of the lead hole. The thickness of the thin film is less than the axial length of the lead hole. The thin film is used to seal the gap between the lead and the inner wall of the lead hole.

4. The atomizing component according to any one of claims 1-3, characterized in that, The atomizing component further includes a first electrode and a second electrode; one end of the first electrode is mounted on the base assembly and protrudes from the base assembly, and the other end of the first electrode is electrically connected to the circuit board so that the first electrode is electrically connected to the lead wire. One end of the second electrode is mounted on the base assembly and protrudes from the base assembly, and the other end of the second electrode is electrically connected to the circuit board so that the second electrode is electrically connected to the encryption chip; both the first electrode and the second electrode are used to be electrically connected to the power supply assembly.

5. The atomizing component according to claim 4, characterized in that, The base assembly includes a support member and an insulating member connected to each other. The lead wire channel is formed in the support member, and the support member supports the atomizing core. The support member and the insulating member cooperate to form the mounting cavity. The insulating member is provided with a first electrode hole and a second electrode hole that communicate with the mounting cavity. The first electrode is assembled in the first electrode hole, and the second electrode is assembled in the second electrode hole.

6. The atomizing component according to claim 5, characterized in that, The lead wire passes through the circuit board, and the lead wire, the first electrode, and the second electrode are all electrically connected to the side of the circuit board away from the lead wire channel. The insulating component is stacked with the circuit board, and the side of the insulating component facing the circuit board is provided with a first clearance groove and a second clearance groove. The first clearance groove has a first electrode hole on its groove wall away from the circuit board, and the second clearance groove has a second electrode hole on its groove wall away from the circuit board.

7. The atomizing component according to any one of claims 1-3, characterized in that, The base assembly has a slot at one end near the atomizing core. The atomizing core also includes an atomizing tube. The heating element is installed inside the atomizing tube, and the atomizing channel inside the atomizing tube communicates with the lead wire channel. The atomizing tube has a plug-in portion that is inserted into the slot. The slot has a glue-filling port in the radial direction of the base assembly. The atomizing assembly also includes an adhesive that fills the slot to bond the plug-in portion to the slot.

8. The atomizing component according to any one of claims 1-3, characterized in that, An air inlet is provided on the channel wall of the lead wire channel, and the atomizing core has an atomizing channel communicating with the air inlet; the air inlet is located on the side of the sealing member facing the atomizing core, and the air inlet is separated from the mounting cavity by the sealing member.

9. The atomizing component according to claim 4, characterized in that, The encryption chip is used to turn off the output voltage of the first electrode, and the encryption chip is used to receive the identification information of the power supply component through the second electrode, and turn on the output voltage of the first electrode based on the identification information.

10. An atomizing device, characterized in that, include: Atomizing component, wherein the atomizing component is the atomizing component as described in any one of claims 1-9; and a power supply component, which is electrically connected to the circuit board.

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