Three-jaw chuck

By adjusting the position of the clamping mechanism and using a spring clamping mechanism, the problem of uneven force when the three-jaw chuck clamps wafers of different sizes is solved, achieving stable clamping and safe operation of wafers of different sizes.

CN223946835UActive Publication Date: 2026-02-27HEBEI HONGXU MASCH TOOL ACCESSORIES MFG CO LTD
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Patent Information

Application Number
CN202520409493.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-11
Publication Date
2026-02-27
Estimated Expiration
2035-03-11

AI Technical Summary

Technical Problem

Existing three-jaw chucks apply uneven clamping force when clamping wafers of different sizes, resulting in insufficient clamping force for smaller wafers, which may cause the wafers to fall and be damaged.

Method used

By adjusting the position of the clamping mechanism, the difference in clamping force applied to wafers of different sizes is reduced. The use of a spring clamping mechanism ensures high adaptability and meets the clamping requirements of wafers of different sizes.

Benefits of technology

It achieves stable clamping of wafers of different sizes, reduces the risk of wafers falling, improves operational safety, and simplifies the operation process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The three-jaw chuck comprises a base, three first square grooves are formed in the base, sliding blocks are arranged in the three first square grooves, the tops of the sliding blocks are fixedly connected with a first square plate, a pressing mechanism is arranged on one side of the first square plate, and the bottom of the base is fixedly connected with a first circular ring; the inner wall of the first circular ring is slidably connected with a circular plate, the outer wall of the bottom end of the circular plate is fixedly connected with a limiting ring, the limiting ring is sleeved with a limiting sleeve plate, the outer wall of the limiting sleeve plate is fixedly connected with a knob, the outer wall of the first circular ring is provided with a threaded groove, the inner wall of the knob is fixedly connected with a threaded strip, and the threaded strip is matched with the threaded groove. And three second square grooves are formed in the circular plate, second square plates are arranged in the second square grooves, and the second square plates are fixedly connected with the bottoms of the sliding blocks. The wafer clamping device is high in adaptability, can clamp wafers of different sizes, is simple to operate, reduces the risk of wafer falling in the detection and processing process, and improves the operation safety.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer chuck technical field especially relates to a three jaw chuck. BACKGROUND

[0002] Wafer is the carrier used for producing integrated circuit, and is mostly single crystal silicon wafer, and the thickness of wafer is very small, mostly about 1mm, when wafer is detected, three jaw chuck is needed to clamp and fix wafer.

[0003] Through the retrieval, the patent of CN214818007U discloses a kind of wafer clamping device, when clamping wafer, make wafer not easy to break, including: base, one side end face has the circular recess for letting wafer insert;Multiple compression mechanisms are installed on the base, for clamping wafer, wherein, each compression mechanism has the compression block being set around circular recess and the elastic element being set in matched with the compression block, the compression block is compressed wafer under the action of elastic element to the direction of center close to circular recess.Compared with the prior art that wafer is directly clamped by the device similar to three jaw chuck, the wafer on the wafer clamping device of the present application is subjected to smaller force, and also has side face support and blocking effect, can effectively prevent wafer from breaking in clamping process.

[0004] The wafer clamping device in the above patent has the following disadvantages: the clamping force applied to wafers of different sizes is different, when clamping wafer of smaller size, the clamping force applied will be smaller than the clamping force applied to wafer of larger size, which will result in insufficient clamping force, and in the process of detection, wafer may fall and be damaged, therefore, a three jaw chuck needs to be designed to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in the prior art, and provides a three jaw chuck.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] The utility model provides a three -jaw chuck, including the base, three first square grooves are seted up in the base, the top of the slider is fixedly connected with the first square plate, one side of first square plate is provided with the pressure mechanism, the bottom of base is fixedly connected with the first circular ring, the inner wall of first circular ring is connected with the round plate, the bottom outer wall of round plate is fixedly connected with the limit ring, the limit ring is equipped with the limit sleeve, the outer wall of limit sleeve is fixedly connected with the knob, the outer wall of first circular ring is seted up with the thread groove, the inner wall of knob is fixedly connected with the thread strip, the thread strip is matched with thread groove, three second square grooves are seted up on the round plate, and the second square plate is seted up in the second square groove, and the bottom of slider is fixedly connected with the second square plate, and the second square plate is seted up with the inclined slot, and the inclined slot is provided with the sliding rod, and the sliding rod is fixedly connected with the round plate, because the position of pressure mechanism is adjusted, when the wafers of different sizes are clamped, the difference of the clamping force of the wafers of different sizes is reduced by adjusting the position of pressure mechanism, effectively solve the problem that the clamping force of the wafers of different sizes is different in the background art, when the wafer of smaller size is clamped, the clamping force is less than the clamping force of the wafer of larger size, and the clamping force is insufficient, in the process of detection, the wafer can fall and be damaged, thereby realizing high adaptability, clamping the wafer of different sizes, simple operation, reducing the risk of wafer falling in the detection and processing process, and improving the operation safety.

[0008] Preferably, the pressure mechanism includes two circular rods, the circular rods pass through the first square plate, the circular rods are slidingly connected to the first square plate, both of the circular rods are fixedly connected to the same fixed plate, one side of the fixed plate is fixedly connected to a pressing block, and the circular rods are sleeved with springs.

[0009] Preferably, both of the circular rods are fixedly connected to the same connecting plate away from the fixed plate.

[0010] Preferably, a circular recess is formed in the top of the base.

[0011] Preferably, the bottom of the base is fixedly connected to a fixed rod, and the bottom of the fixed rod is fixedly connected to a fixed disc.

[0012] Preferably, four mounting holes are formed in the fixed disc.

[0013] The utility model has the advantages of:

[0014] By adopting the technical means of adjusting the position of the pressing mechanism, the difference in the clamping force applied to wafers of different sizes is reduced by adjusting the position of the pressing mechanism when clamping wafers of different sizes, effectively solving the problem of different clamping forces applied to wafers of different sizes in the background art, which can cause the clamping force to be insufficient when clamping smaller wafers, and the wafer may fall and be damaged during detection, thereby achieving the technical effects of high adaptability, simple operation, reduced risk of wafer falling during detection and processing, and improved operation safety. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A three-jaw chuck is provided.

[0016] Figure 2 A three-jaw chuck is provided.

[0017] Figure 3 A three-jaw chuck is provided.

[0018] Figure 4 A three-jaw chuck is provided.

[0019] Figure 5 A three-jaw chuck is provided.

[0020] Figure 6 A three-jaw chuck is provided.

[0021] In the figure: 1, base; 101, circular groove; 2, first square groove; 3, sliding block; 4, first square plate; 5, pressing mechanism; 501, round rod; 502, fixed plate; 503, pressing block; 504, spring; 505, connecting plate; 6, first circular ring; 601, threaded groove; 7, circular plate; 8, limiting ring; 9, limiting sleeve plate; 10, knob; 1001, threaded strip; 11, second square groove; 12, second square plate; 13, inclined groove; 14, sliding rod; 15, fixed rod; 16, fixed disc; 1601, mounting hole. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0023] Reference Figures 1-6 A three-jaw chuck includes a base 1 with three first square slots 2, each containing a slider 3. A first square plate 4 is fixedly connected to the top of each slider 3. A clamping mechanism 5 is located on one side of the first square plate 4. A first ring 6 is fixedly connected to the bottom of the base 1. A circular plate 7 is slidably connected to the inner wall of the first ring 6. A limit ring 8 is fixedly connected to the outer wall of the bottom end of the circular plate 7. A limit sleeve 9 is fitted onto the limit ring 8. A knob 10 is fixedly connected to the outer wall of the limit sleeve 9. A threaded groove 601 is formed on the outer wall of the first ring 6. A threaded strip 1001 is fixedly connected to the inner wall of the knob 10, and the threaded strip 1001 is adapted to the threaded groove 601. Three second square slots 11 are formed on the circular plate 7, each containing a second square plate 12. The second square plate 12 is fixedly connected to the bottom of the slider 3. A slanted groove 13 is provided on the square plate 12, and a sliding rod 14 is provided in the slanted groove 13. The sliding rod 14 is fixedly connected to the circular plate 7. Due to the adoption of the technical means of adjusting the position of the clamping mechanism, when clamping wafers of different sizes, the difference in clamping force applied to wafers of different sizes can be reduced by adjusting the position of the clamping mechanism. This effectively solves the problem in the background art that the clamping force applied to wafers of different sizes is different. When clamping smaller wafers, the clamping force applied is less than that applied to larger wafers, which will lead to insufficient clamping force. During the inspection process, the wafer may fall and be damaged. Thus, it achieves the technical effect of high adaptability, being able to clamp wafers of different sizes, simple operation, reducing the risk of wafer falling during inspection and processing, and improving operational safety.

[0024] In this utility model, the clamping mechanism 5 includes two round rods 501. The round rods 501 pass through the first square plate 4 and are slidably connected to the first square plate 4. Both round rods 501 are fixedly connected to the same fixing plate 502. A pressure block 503 is fixedly connected to one side of the fixing plate 502. The pressure block 503 moves closer to the wafer and clamps the wafer through the three pressure blocks 503. The round rods 501 are fitted with springs 504. The clamping by the springs 504 reduces the force on the wafer and prevents the wafer from breaking during clamping.

[0025] In this invention, the two round rods 501 are fixedly connected to the same connecting plate 505 on the side away from the fixing plate 502.

[0026] In this utility model, a circular groove 101 is provided on the top of the base 1, so that the wafer can be placed in the circular groove 101 and then the clamping mechanism 5 can be moved close to the wafer for clamping.

[0027] In this utility model, a fixing rod 15 is fixedly connected to the bottom of the base 1, and a fixing plate 16 is fixedly connected to the bottom of the fixing rod 15.

[0028] The fixing disc 16 is provided with four mounting holes 1601, and the device is installed and fixed by bolts penetrating through the mounting holes 1601.

[0029] Working principle: when in use, the wafer is placed in the circular groove 101, then the knob 10 can be twisted by the worker, the rotation of the knob 10 will drive the threaded strip 1001 to move in the threaded groove 601, so that the knob 10 moves towards the base 1, the knob 10 will drive the limiting sleeve plate 9 to move close to the base 1, the movement of the limiting sleeve plate 9 will drive the limiting ring 8 to move, the limiting ring 8 will drive the circular plate 7 to move, the circular plate 7 will move along the second square plate 12, the movement of the circular plate 7 will drive the sliding rod 14 to move, the sliding rod 14 will move in the inclined groove 13, the sliding rod 14 will press the second square plate 12 to make the second square plate 12 move along the second square groove 11 and the first square groove 2, the movement of the second square plate 12 will drive the sliding block 3 to move, the sliding block 3 will drive the first square plate 4 to move, the first square plate 4 will drive the spring 504 to move, the spring 504 will drive the fixed plate 502 to move, the fixed plate 502 will drive the pressing block 503 to move until the pressing block 503 contacts the wafer, and the wafer is positioned and clamped, the spring 504 is clamped when in use, so that the wafer receives a smaller force, which can effectively prevent the wafer from being broken during clamping, when clamping some smaller wafers, continue to twist the knob 10 to make the first square plate 4 continue to move, adjust the position of the pressing mechanism 5, that is, adapt to smaller wafers, when it is needed to release the clamping, reverse twist the knob 10 to make the knob 10 move away from the base 1, so that the pressing mechanism 5 moves away from the wafer, that is, the clamping is released, and the wafer can be taken out.

[0030] The above is only a preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the technical field according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model can make equivalent replacement or change, which should be covered in the protection scope of the utility model.

Claims

1. A three-jaw chuck comprising a base (1), characterized in that, The base (1) is provided with three first square grooves (2), and the three first square grooves (2) are provided with sliding blocks (3); the top of the sliding block (3) is fixedly connected with a first square plate (4); one side of the first square plate (4) is provided with a pressing mechanism (5); the bottom of the base (1) is fixedly connected with a first circular ring (6); the inner wall of the first circular ring (6) is slidably connected with a circular plate (7); the bottom outer wall of the circular plate (7) is fixedly connected with a limiting ring (8); the limiting ring (8) is sleeved with a limiting sleeve plate (9); the outer wall of the limiting sleeve plate (9) is fixedly connected with a knob (10); the outer wall of the first circular ring (6) is provided with a threaded groove (601); the inner wall of the knob (10) is fixedly connected with a threaded strip (1001); the threaded strip (1001) is matched with the threaded groove (601); the circular plate (7) is provided with three second square grooves (11); the second square grooves (11) are provided with second square plates (12); the bottom of the second square plate (12) is fixedly connected with the sliding block (3); the second square plate (12) is provided with an inclined groove (13); the inclined groove (13) is provided with a sliding rod (14); and the sliding rod (14) is fixedly connected with the circular plate (7).

2. The three-jaw chuck according to claim 1, characterized in that The pressing mechanism (5) comprises two circular rods (501), the circular rods (501) pass through the first square plate (4), the circular rods (501) are slidably connected with the first square plate (4), the two circular rods (501) are fixedly connected with the same fixed plate (502), one side of the fixed plate (502) is fixedly connected with a pressing block (503), and the circular rods (501) are sleeved with springs (504).

3. The three jaw chuck according to claim 2, wherein The two circular rods (501) are fixedly connected with the same connecting plate (505) away from the fixed plate (502).

4. The three jaw chuck according to claim 1, wherein The top of the base (1) is provided with a circular groove (101).

5. The three jaw chuck according to claim 4, wherein The bottom of the base (1) is fixedly connected with a fixed rod (15), and the bottom of the fixed rod (15) is fixedly connected with a fixed disc (16).

6. The three jaw chuck according to claim 5, wherein The fixed disc (16) is provided with four mounting holes (1601).

Citation Information

Patent Citations

  • Wafer clamping device

    CN214818007U