Universal mold base for carrying reset pin mold
The modular design of the universal mold base solves the problem that existing mold bases can only install specific molds, enabling the use of reset pin molds on ordinary presses, reducing costs and improving production efficiency and product quality.
Patent Information
- Application Number
- CN202520415288.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-11
AI Technical Summary
Existing custom mold frames can only install molds of specific specifications and cannot accommodate reset pin molds. This means that reset pin molds can only be used in specialized and expensive equipment, which limits their wide application and increases the cost of new product development and production.
A universal mold base was designed, which includes a basic mold base structure, a mold positioning and heating system, a heat insulation and sealing structure, a mold ejection mechanism, a lower ejector plate ejection mechanism, an injection rod base mechanism, a reset rod plate, and other modular designs. It can be adapted to various molds on ordinary MGP presses, including reset pin molds. Through the coordinated work of a vacuum pump and a hydraulic cylinder, a negative pressure environment and precise control are achieved.
It enables the use of reset pin molds on ordinary presses, reducing equipment costs, improving production efficiency and product quality, reducing porosity, ensuring production stability and flexibility, and reducing maintenance costs.
Smart Images

Figure CN223948390U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor packaging equipment technology, specifically relating to a universal mold frame for mounting reset pin molds. Background Technology
[0002] In semiconductor packaging, mold loading and replacement is a critical step. Existing custom mold sets typically only accommodate molds of specific sizes and cannot mount reset pin molds. Reset pin molds are usually only used in dedicated automated equipment, which is expensive, has high maintenance costs, and a small market share. The poor versatility of existing mold sets leads to increased costs for new product development and production.
[0003] Furthermore, as a special type of mold, reset pin molds can only be used in dedicated automated reset pin equipment, which further limits their wide application. While market demand for reset pin molds is increasing, the limited market share, high price, high maintenance costs, and complex structure of dedicated automated equipment hinders the widespread adoption and application of reset pin molds. Summary of the Invention
[0004] The purpose of this invention is to provide a universal mold frame for mounting a reset pin mold, so as to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a universal mold frame with a reset pin mold, comprising a mold frame base structure, the mold frame including an upper mold base plate and a lower mold base plate, the upper mold base plate and the lower mold base plate being fixed on a universal MGP packaging mold press, and an oil circuit being machined on the lower mold base plate for connecting to the oil circuit on the press to drive the rotary cylinder and the reset pin cylinder;
[0006] The mold positioning and heating system is equipped with heating rods and thermocouples on the upper and lower mold plates to provide a stable working mold temperature. At the same time, guide sleeves and guide pillars are respectively installed on the upper and lower mold plates for rough positioning of the mold during mold closing.
[0007] The heat insulation and sealing structure includes a heat insulation plate between the upper mold base plate and the upper template, and at the lower part of the lower template, to reduce heat loss and isolate the equipment from the effects of high temperature. An upper vacuum frame and a lower vacuum frame are fixedly installed between the upper template and the lower template. The upper vacuum frame and the lower vacuum frame cooperate with the sealing ring to keep the mold in a sealed environment, which facilitates vacuuming.
[0008] The mold ejection mechanism has an upper mold ejector plate ejection mechanism mounted on the upper template, and the upper mold box ejection mechanism is pressed by the bottom plate of the upper mold box, providing ejection force when the mold is demolded;
[0009] An upper die box fixing support and a lower die box fixing support are arranged between the upper die plate and the lower die plate, and a die is arranged between the upper die box fixing support and the lower die box fixing support;
[0010] The lower ejector plate ejection mechanism comprises a ejector rod plate arranged on the lower die base plate, a pull claw connecting rod arranged on the ejector rod plate, and a lower ejector plate movable pull claw connected with the pull claw connecting rod, which is used for providing an upward thrust through the ejector rod on the press to drive the lower ejector plate to eject when the die is opened;
[0011] The injection rod base mechanism is arranged on the turning-in plate between the lower die base plate and the lower die plate, and is used for adapting to the diameters and pitches of different die barrels.
[0012] The reset rod plate is arranged above the ejector rod plate, and is connected with the reset pin ejector rod and the reset rod, and is used for controlling the up-down movement of the reset pin in the die.
[0013] Preferably, the mold slide rail positioning mechanism is arranged between the upper die box fixing support and the lower die box fixing support, and the die is clamped in the middle of the slide rail to position the die.
[0014] Preferably, the turning-in guide sliding block is arranged on the turning-in plate, and cooperates with the C-shaped support column with the copper sliding block arranged in the middle, and is used for stably moving the turning-in plate up and down.
[0015] Preferably, the turning-in sensing assembly is arranged on the turning-in plate, and is used for providing the position information of the turning-in plate to the press.
[0016] Preferably, the ejector rod plate is reset by a spring.
[0017] Preferably, the vacuum pump is connected with the upper vacuum frame and the lower vacuum frame through pipelines, and when the vacuum pump is started, the air in the die cavity is extracted to form a negative pressure environment.
[0018] Preferably, the guide column is arranged on the lower die base plate, and is used for guiding the movement of the ejector rod plate and the reset rod plate to ensure the stability and accuracy of the ejection and reset processes.
[0019] The technical effects and advantages of the utility model are as follows:
[0020] 1. The mold frame of the utility model can be used on a common MGP press without the need to purchase a special reset needle mold equipment; through modular design, the mold frame can be adapted to various different specifications of molds, including reset needle molds and ordinary structure molds, only the mold needs to be replaced during production, without the need to replace the mold frame, simplifying the production process and improving production efficiency.
[0021] 2. The utility model discloses a reset needle oil cylinder and reset rod plate design, reset needle mold can be used on a common press, without relying on a special reset needle automatic equipment, reset needle mold is more flexible, suitable for the production needs of various products, reduces the use threshold of reset needle mold, reduces the dependence of enterprises on special equipment.
[0022] 3. Through the cooperation of the vacuum pump and the upper and lower vacuum frames, the utility model can realize a negative pressure environment during injection molding, reduce air residues in the mold cavity, and effectively reduce the generation of product pores, improve the density and surface quality of the product, and the resin material can better fill the mold cavity under negative pressure, reduce the problem of uneven filling, and is suitable for the semiconductor packaging field with high product quality requirements.
[0023] 4. Through the cooperation of the guide sleeve and the guide column, the rough positioning of the mold is ensured; through the design of the turning-in guide sliding block and the C-shaped support column, the stable movement of the turning-in plate is ensured; through the linkage of the reset needle oil cylinder and the reset rod plate, the accurate control of the reset needle is realized; the mold frame structure is stable and can withstand high-frequency production operations, prolonging the service life of the equipment, the cooperation between the components is tight, the vibration during operation is small, ensuring the stability and reliability of production, and the turning-in sensor assembly monitors the position of the turning-in plate in real time, improving the automation degree of production.
[0024] 5. The utility model discloses a modular design, easy to disassemble and replace each component, convenient maintenance; the maintenance cost of the mold frame is low, reducing the equipment downtime and improving the production efficiency. DRAWINGS
[0025] Figure 1 is a structural schematic view of the utility model;
[0026] Figure 2 is a side sectional view of the utility model;
[0027] Figures 3-7 is a structural schematic view of the working process of the utility model.
[0028] In the figure: 1 - upper die base plate, 2 - heat insulation plate, 3 - upper die plate, 4 - sealing ring, 5 - guide sleeve, 6 - upper die box bottom plate, 7 - upper die box ejection mechanism, 8 - upper vacuum frame, 9 - upper die box fixing support, 10 - lower die box fixing support, 11 - lower vacuum frame, 12 - lower ejector plate movable pull claw, 13 - lower die plate, 14 - guide column, 15 - pull claw connecting rod, 16 - injection rod base mechanism, 17 - turning-in plate, 18 - reset pin ejection rod, 19 - back-off rod, 20 - reset rod plate, 21 - ejector rod plate, 22 - lower die base plate, 24 - turning-in sensor assembly, 25 - C-shaped support column, 26 - turning-in oil cylinder, 27 - reset pin oil cylinder, 28 - turning-in guide slider, 29 - guide column, 30 - vacuum pump. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0030] As Figures 1-7 A specific embodiment of a mold frame of a general type of reset pin-loaded mold of the utility model is shown:
[0031] The upper die base plate 1 and the lower die base plate 22 are fixed on the MGP packaging mold general press, and the oil circuit on the lower die base plate 22 is respectively used for connecting the turning-in oil cylinder 26 and the reset pin oil cylinder 27 with the oil circuit on the press. The upper die plate 3 and the lower die plate 13 are installed with heating rods and thermocouples like ordinary packaging molds, so as to provide stable working mold temperature for the mold. The upper and lower die plates are respectively installed with guide sleeves 5 and guide columns 14, so as to coarsely position the mold when the mold is closed. The heat insulation plate 2 on the mold reduces heat loss and simultaneously insulates high temperature from affecting the equipment;
[0032] The upper vacuum frame 8 and the lower vacuum frame 11 are fixed on the upper die plate 3 and the lower die plate 13 and cooperated with the sealing ring 4 to make the mold in a sealed environment, so as to facilitate vacuumizing. The vacuum pump 30 is connected with the upper vacuum frame 8 and the lower vacuum frame 11 through pipelines, and when the vacuum pump 30 is started, the air in the mold cavity is extracted to form a negative pressure environment. During the injection molding process, the vacuum pump cooperates with the turning-in oil cylinder 26 and the reset pin oil cylinder 27 to work, so as to ensure that the mold runs stably under the negative pressure environment and avoids mold vibration or deviation caused by pressure change;
[0033] The upper die box bottom plate 6 presses the upper die box ejection mechanism 7 to provide the ejection force when the mold is demolded; the upper die box fixing support 9 and the lower die box fixing support 10 are installed on the upper die plate 3 and the lower die plate 13, and a slide rail is processed in the middle, the mold can be clamped in the middle of the slide rail, and the mold is positioned; the lower ejector plate movable pull claw 12 is connected with the pull claw connecting rod 15 and is installed on the ejector rod plate 21, and the upward thrust provided by the ejector rod on the press drives the lower ejector plate to be ejected when the mold is opened, and the ejector rod plate is reset by the spring;
[0034] The injection rod base mechanism 16 is installed on the turning-in plate 17, and the structure is the same as that of the ordinary MGP mold, and the diameters and pitches of different mold barrels are different, and only the corresponding injection rod base mechanism needs to be replaced; the turning-in plate is provided with a thrust by the turning-in oil cylinder 26, and the reset is also reset by the oil pressure, the turning-in guide slider 28 cooperates with the C-shaped support column 25 in which the copper slider is arranged in the middle, so that the turning-in plate can stably move up and down, and the turning-in sensor assembly 24 installed on the turning-in plate can provide the position information of the turning-in plate to the press; the reset rod plate 20 is driven by the reset pin oil cylinder 27, and the reset rod plate connects the reset pin ejection rod 18 and the reset rod 19 to control the up and down of the reset pin in the mold;
[0035] The guide column 29 is installed on the lower mold bottom plate 22 and is used for guiding the movement of the ejector rod plate 21 and the reset rod plate 20 to ensure the stability and accuracy of the ejection and reset processes.
[0036] Action process:
[0037] First step, mold closing and heating:
[0038] The upper die bottom plate 1 and the lower die bottom plate 22 start to close the mold under the drive of the press. The upper die plate 3 and the lower die plate 13 are coarsely positioned by the guide sleeve 5 and the guide column 14 to ensure the accurate positioning of the mold; the heating system: the heating rod and the thermocouple installed on the upper die plate 3 and the lower die plate 13 start to work to provide stable working mold temperature, so that the mold can maintain constant temperature during the injection process. Heat insulation and sealing: the heat insulation plate 2 reduces heat loss, and the upper vacuum frame 8 and the lower vacuum frame 11 cooperate with the sealing ring 4 to form a sealed environment, which is convenient for subsequent vacuum operation.
[0039] Second step, vacuumizing and negative pressure environment:
[0040] The vacuum pump 30 is started, connected with the upper vacuum frame 8 and the lower vacuum frame 11 through the pipeline, and the air in the mold cavity is pumped out to form a negative pressure environment; the negative pressure environment reduces the air residue in the mold cavity, avoids the generation of pores during the injection process, and improves the density and surface quality of the product.
[0041] Third step, injection and turning-in:
[0042] Before injection, the reset plate 20 is pushed by the reset pin oil cylinder 27, and the reset pin ejection rod 18 pushes the reset pin plate assembly in the mold to push the reset pin against the frame to make the cooling fins adhere to the upper cavity surface, reducing the risk of overflow on the cooling fins. The injection rod base mechanism 16 starts working on the turning-in plate 17, the turning-in oil cylinder 26 drives the turning-in plate 17 to perform turning-in motion, and the resin material is injected into the mold cavity; turning-in guide: the turning-in guide slider 28 cooperates with the C-shaped support column 25 to ensure the stable up-down motion of the turning-in plate 17. The turning-in sensor assembly 24 monitors the position of the turning-in plate 17 in real time to ensure the accuracy of the injection process; before the resin has not completely solidified, the reset pin oil cylinder 27 retreats, driving the reset plate 20 and the reset pin retreat rod 19, and the reset pin retreat rod 19 pulls the reset pin plate assembly and the reset pin in the mold back to the initial position. The resin in the molten state is pushed by the turning-in force to fill the space left by the reset pin retreat.
[0043] Fourth step, mold opening and ejection:
[0044] After injection, the press drives the upper mold base plate 1 and the lower mold base plate 22 to separate, and the mold starts to open. Ejection mechanism: the upper mold ejector plate ejection mechanism 7 and the lower ejector plate ejection mechanism start to work. The upper mold ejector plate ejection mechanism 7 provides ejection force through the upper mold box base plate 6, and the lower ejector plate movable draw claw 12 drives the ejector rod plate 21 to move upward through the draw claw connecting rod 15, and the molded product is ejected from the mold. Reset: the ejector rod plate 21 is reset by the spring, the reset pin oil cylinder 27 drives the reset pin ejection rod 18 and the retreat rod 19 to reset, ensuring that the reset pin returns to the initial position.
[0045] Fifth step, reset and prepare for the next cycle:
[0046] The reset pin oil cylinder 27 and the turning-in oil cylinder 26 work together to ensure that the reset pin and the turning-in plate 17 return to the initial position, preparing for the next injection cycle. Vacuum system reset: the vacuum pump 30 stops working, the negative pressure environment in the mold cavity is released, and the sealing ring 4 remains in a sealed state, waiting for the next mold closing. Mold positioning: the guide sleeve 5 and the guide column 14 again coarsely position the mold to ensure the accuracy of the next mold closing.
[0047] The mold frame realizes the function of carrying the reset pin mold on the ordinary press through modular design and multi-mechanism cooperative work. The whole action process includes mold closing, vacuumizing, injection, mold opening, ejection and resetting, ensuring the stability and accuracy of the injection process, suitable for the production needs of various products, improving the production efficiency and product quality.
[0048] The applicant further states that the implementation method and device structure of the utility model are illustrated by the above-mentioned embodiments, but the utility model is not limited to the above-mentioned embodiments, namely, it does not mean that the utility model must rely on the above-mentioned method and structure to be implemented. The skilled in the art should understand that any improvement of the utility model, equivalent replacement of the implementation method selected by the utility model, addition of steps, selection of specific modes and the like fall within the protection scope and disclosed scope of the utility model.
[0049] The utility model is not limited to the above-mentioned embodiments, and all modes adopting similar structures and methods of the utility model to achieve the purpose of the utility model fall within the protection scope of the utility model.
Claims
1. A general purpose mold frame for mounting reset pin mold, comprising a mold base structure, the mold frame comprising an upper mold base plate (1) and a lower mold base plate (22), the upper mold base plate (1) and the lower mold base plate (22) are fixed on a general MGP package mold press, characterized in that: An oil channel is processed on the lower die base plate (22) to connect the oil channel on the press to drive the turning-in oil cylinder (26) and the reset pin oil cylinder (27); The mold positioning and heating system comprises an upper die plate (3), heating rods and thermocouples are installed on the upper die plate (3) and the lower die plate (13) to provide stable working mold temperature, and guide sleeves (5) and guide columns (14) are respectively installed on the upper die plate (3) and the lower die plate (13) to coarsely position the mold during clamping; The heat insulation and sealing structure comprises a heat insulation plate (2) arranged between the upper die base plate (1) and the upper die plate (3) and at the lower part of the lower die plate (13), and an upper vacuum frame (8) and a lower vacuum frame (11) are fixedly arranged between the upper die plate (3) and the lower die plate (13), and the upper vacuum frame (8) and the lower vacuum frame (11) cooperate with the sealing ring (4) to make the mold in a sealed environment; The mold ejection mechanism comprises an upper mold ejector pin plate ejection mechanism (7) arranged on the upper die plate (3) and pressed by the upper mold box bottom plate (6) to provide ejection force when the mold is demolded; The upper mold box fixing support (9) and the lower mold box fixing support (10) are arranged between the upper die plate (3) and the lower die plate (13), and the mold is arranged between the upper mold box fixing support (9) and the lower mold box fixing support (10); The lower ejector pin plate ejection mechanism comprises a ejector rod plate (21) arranged on the lower die base plate (22), a pull claw connecting rod (15) arranged on the ejector rod plate (21), and a lower ejector pin plate movable pull claw (12) connected with the pull claw connecting rod (15); The injection rod base mechanism (16) comprises a turning-in plate (17) arranged between the lower die base plate (22) and the lower die plate (13) through the support column (25), the injection rod base mechanism (16) is arranged on the turning-in plate (17) to adapt to the diameters and pitches of different mold barrels, and a turning-in oil cylinder (26) is arranged on the support column (25) outside the turning-in plate (17) to drive the turning-in plate (17) to turn in and reset; The reset rod plate (20) is arranged above the ejector rod plate (21) and is connected with the reset pin ejection rod (18) and the back-off rod (19) to control the up-down movement of the reset pin in the mold.
2. The mold base of claim 1, wherein: The mold slide rail positioning mechanism is arranged between the upper mold box fixing support (9) and the lower mold box fixing support (10) and the mold is clamped in the middle of the slide rail.
3. The mold base of claim 1, wherein: The turning-in guide sliding block (28) is arranged on the turning-in plate (17) and cooperates with the C-shaped support column (25) with the copper sliding block arranged in the middle to make the turning-in plate (17) move stably up and down.
4. The mold base of claim 1, wherein: The turning-in sensing assembly (24) is arranged on the turning-in plate (17) to provide position information of the turning-in plate (17) to the press.
5. The mold base of claim 1, wherein: The ejector rod plate (21) is reset by the spring.
6. The mold base of claim 1, wherein: The vacuum pump (30) is connected with the upper vacuum frame (8) and the lower vacuum frame (11) through pipelines.
7. The mold base of claim 1, wherein: Further included are guide columns (29) mounted on the lower die base plate (22) for guiding the movement of the ejector rod plate (21) and the reset rod plate (20).