Laminated aluminum cover plate for processing circuit board

Abstract

The utility model discloses a laminating aluminum cover plate for processing a circuit board, which comprises a base material layer and a resin film surface layer, a transition layer is arranged between the base material layer and the resin film surface layer, an oxidation film layer is arranged on one side of the base material layer far away from the transition layer, a plurality of grooves are arranged on the combined surface of the base material layer and the transition layer, raised lines are formed between the adjacent grooves, and the raised lines are arranged on the surface of the base material layer far away from the transition layer. The transition layer is filled in the groove, the head end of the raised line extends into the resin film surface layer, and a plurality of nano ceramic particles are uniformly distributed in the resin film surface layer. The nano ceramic particles are added in the surface layer of the resin film, so that the hardness and the wear resistance of the film can be remarkably improved, chip winding is reduced, lubrication and chip breakage are further balanced, meanwhile, the transition layer is introduced, filament forming is effectively restrained, a drilling needle head is protected, hole wall damage is reduced, and in addition, the service life of the film is prolonged. Micro-textures formed by the grooves and the raised lines are constructed on the surface of the base material layer, so that the binding force between the base material layer and the transition layer and between the base material layer and the resin film surface layer is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a processing auxiliary material technical field of circuit board especially uses laminated aluminum cover plate for processing circuit board. BACKGROUND

[0002] The laminated aluminum cover plate is a material composed of an aluminum sheet and a thin film covering the surface of the aluminum sheet, which plays an important role in the drilling process of the circuit board. When the laminated aluminum sheet is used as a pad for drilling on the circuit board, the drill tip can be accurately positioned without deviation, the drill needle can penetrate the circuit board more accurately, and the hole position deviation is reduced, thereby improving the hole position accuracy of drilling.

[0003] The resin layer of the existing laminated aluminum cover plate can reduce friction, but it can change the chip shape, cause the continuous aluminum wire to wind around the drill bit, and further cause the problem of broken needle and hole wall damage.

[0004] Therefore, we propose a laminated aluminum cover plate for processing circuit board to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a laminated aluminum cover plate for processing circuit board to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A laminated aluminum cover plate for processing circuit board, comprising a base material layer and a resin film surface layer, a transition layer is provided between the base material layer and the resin film surface layer, an oxidation film layer is provided on the side of the base material layer away from the transition layer, a plurality of grooves are provided on the bonding surface of the base material layer and the transition layer, a protruding strip is formed between adjacent grooves, the transition layer is filled in the grooves, the head end of the protruding strip extends into the resin film surface layer, and a plurality of nano ceramic particles are uniformly distributed inside the resin film surface layer.

[0008] In a further embodiment, the depth of the groove is 15-20 μm, the width is 10-15 μm, and the distance between adjacent grooves is 8-10 μm.

[0009] In a further embodiment, the thickness of the oxidation film layer is 5-10 μm.

[0010] In a further embodiment, the transition layer is made of one of silicon oxide or aluminum nitride, and the thickness of the transition layer is 10-15 μm.

[0011] In a further embodiment, the thickness of the resin film surface layer is 40-60 μm.

[0012] In a further embodiment, the head end of the protruding strip forms a tapered protrusion to the two sides to reduce the opening end of the groove.

[0013] In further embodiments, the resin film surface layer surface is provided with a wavy concave-convex texture.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The utility model discloses a resin film surface layer is added nano ceramic particles, can significantly improve the hardness and wear resistance of the film, reduce the chip winding, and then balance lubrication and chip fracture, simultaneously introduce the brittle transition layer, control the chip fracture behavior at the interface of different materials, effectively inhibit the filament formation, thereby protect the drilling needle, reduce the hole wall damage, in addition, the microtexture of the groove and the convex strip formed on the substrate layer surface is favorable to the bonding force between the substrate layer and the transition layer and the resin film surface layer, improves the lubricating effect, and simultaneously reduces the friction heat accumulation. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is partial section structure schematic drawing of the utility model;

[0017] Figure 2 It is section structure schematic drawing of the utility model substrate layer and the transition layer and the resin film surface layer junction;

[0018] Figure 3 It is partial solid structure schematic drawing of the utility model substrate layer bonding surface;

[0019] Figure 4 It is partial section structure schematic drawing of the utility model resin film surface layer surface.

[0020] In the drawing: 1, substrate layer;11, groove;12, convex strip;2, oxide film layer;3, transition layer;4, resin film surface layer;41, nano ceramic particles. DETAILED DESCRIPTION

[0021] In the description of the utility model, it is understood that the orientation or position relationship of the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it can not be understood as the limitation of the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0022] In the description of the utility model, it is necessary to explain, unless another definite provision and limitation, the term "installation", "link", "connection" should do the broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirectly connected through the intermediate medium, can be the communication inside two elements. For ordinary skilled person in the art, the specific meaning of the above-mentioned term in the utility model can be understood through specific circumstances.

[0023] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments only are a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary skilled person in the art without creative labor belong to the protection scope of the utility model.

[0024] Please refer to Figures 1-4 A kind of film-coated aluminum cover plate for processing circuit board, including substrate layer 1 and resin film surface layer 4, wherein, substrate layer 1 is aluminum sheet, thickness is 140-200 μm, the thickness of resin film surface layer 4 is 40-60 μm, resin film surface layer 4 inside still uniformly distributed with several nano ceramic particles 41, the high hardness of nano particle can enhance the wear resistance of resin layer, reduce drill adhesion, its thermal stability helps to disperse friction heat, avoid local high temperature to cause resin softening, simultaneously, resin film surface layer 4 surface is equipped with wave-shaped concave and convex texture, so that when contacting drill, it is not easy to slip, positioning is more accurate.

[0025] Please refer to Figures 1-2 Transition layer 3 is used between substrate layer 1 and resin film surface layer 4, transition layer 3 uses one of silicon oxide or aluminum nitride, and the thickness of transition layer 3 is 10-15 μm, transition layer 3 can control the fracture behavior of chip at the interface of different materials, effectively inhibits filament formation.

[0026] Please refer to Figures 2-3 The bonding surface of substrate layer 1 and transition layer 3 is equipped with several grooves 11, convex strip 12 is formed between adjacent grooves 11, the depth of groove 11 is 15-20 μm, the width is 10-15 μm, the pitch of adjacent groove 11 is 8-10 μm, transition layer 3 is filled in groove 11, the head end of convex strip 12 is inserted into resin film surface layer 4, which is beneficial to enhance the bonding force between substrate layer 1 and transition layer 3 and resin film surface layer 4, improve lubricating effect, reduce friction heat accumulation at the same time, further, the head end of convex strip 12 forms tapered protrusion to the two sides, to reduce the open end of groove 11, improve the anchoring effect between resin film surface layer 4 and substrate layer 1, make its connection more firm.

[0027] Please refer toFigure 1 The substrate layer 1 is provided with an oxide film layer 2 on the side away from the transition layer 3, the thickness of the oxide film layer 2 is 5-10 microns, the oxide film layer 2 is formed by anodic oxidation technology, and the service life of the substrate layer 1 can be prolonged.

[0028] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0029] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A cover film aluminum cover plate for processing a wiring board, comprising a base material layer (1) and a resin film surface layer (4), characterized by: The base material layer (1) and the resin film surface layer (4) are provided with a transition layer (3), and the side of the base material layer (1) away from the transition layer (3) is provided with an oxidation film layer (2), the bonding surface of the base material layer (1) and the transition layer (3) is provided with a plurality of grooves (11), the adjacent grooves (11) form a convex strip (12), the transition layer (3) is filled in the groove (11), the head end of the convex strip (12) extends into the resin film surface layer (4), and a plurality of nano ceramic particles (41) are uniformly distributed in the resin film surface layer (4).

2. The cover film aluminum cover plate for processing a circuit board according to claim 1, characterized in that: The depth of the groove (11) is 15-20μm, the width is 10-15μm, and the distance between adjacent grooves (11) is 8-10μm.

3. The coverlay aluminum plate for processing a circuit board according to claim 1, characterized in that: The thickness of the oxidation film layer (2) is 5-10μm.

4. The coverlay aluminum plate for processing a circuit board according to claim 1, characterized in that: The transition layer (3) is made of one of silicon oxide or aluminum nitride, and the thickness of the transition layer (3) is 10-15μm.

5. The coverlay aluminum plate for processing a circuit board according to claim 1, characterized in that: The thickness of the resin film surface layer (4) is 40-60μm.

6. The coverlay aluminum plate for processing a circuit board according to claim 1, characterized in that: The head end of the convex strip (12) forms a tapered protrusion to the two sides to reduce the opening end of the groove (11).

7. The coverlay aluminum plate for processing a circuit board according to claim 1, characterized in that: The surface of the resin film surface layer (4) is provided with a wavy concave-convex texture. The surface of the resin film surface layer (4) is provided with a wavy concave-convex texture.

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