Pre-crosslinking packaging adhesive film for perovskite lamination and photovoltaic module
By setting a combination structure of high pre-crosslinked layer and low pre-crosslinked layer in the pre-crosslinked encapsulating film for perovskite tandem, the problem of insufficient crosslinking degree in low-temperature lamination of perovskite solar cells is solved, achieving high crosslinking degree stability and heat resistance, which is suitable for perovskite tandem photovoltaic modules.
Patent Information
- Application Number
- CN202520634008.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-04-03
AI Technical Summary
The encapsulating film of perovskite solar cells has insufficient cross-linking degree under low-temperature lamination, which makes it difficult to meet the requirements of high cross-linking degree and affects the stability and heat resistance of the material.
A pre-crosslinked encapsulating film for perovskite laminates is formed by combining a high-pre-crosslinked layer with a low-pre-crosslinked layer, along with a curing layer and a barrier layer, thereby reducing the lamination temperature and increasing the degree of crosslinking.
High cross-linking degree was achieved under low temperature conditions, which protected the stability and heat resistance of perovskite materials, while improving fluidity and overcoming the defect of insufficient cross-linking degree in low temperature lamination.
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Figure CN223948769U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of encapsulation adhesive film for photovoltaic module, specifically relates to a kind of pre-crosslinking encapsulation adhesive film for perovskite laminated, photovoltaic module. BACKGROUND
[0002] Perovskite solar cells are solar cells that use perovskite-type organic metal halide semiconductors as light-absorbing materials, and belong to the third generation of solar cells, also known as new concept solar cells.
[0003] Perovskite materials are extremely sensitive to temperature, and lamination temperature needs to be below 120℃, while conventional crosslinking systems often require lamination temperature of 140℃ to achieve crosslinking degree of more than 70%.
[0004] Therefore, how to overcome the defects of low-temperature lamination crosslinking degree of perovskite encapsulation adhesive film is a technical problem that needs to be solved in the field.
[0005] It should be noted that the above information disclosed in the background section is only used to understand the background technology of the present application, and therefore, the above description is not considered to constitute prior art information. SUMMARY
[0006] The present disclosure provides at least a kind of pre-crosslinking encapsulation adhesive film for perovskite laminated, photovoltaic module.
[0007] In a first aspect, the present disclosure provides a pre-crosslinking encapsulation adhesive film for perovskite laminated, comprising: a high pre-crosslinking layer located in the upper layer and a low pre-crosslinking layer located in the lower layer; the pre-crosslinking degree of the high pre-crosslinking layer is 40-70%; the pre-crosslinking degree of the low pre-crosslinking layer is 20-40%; and the pre-crosslinking degree difference between the high pre-crosslinking layer and the low pre-crosslinking layer is not less than 10%.
[0008] In an optional embodiment, the material of the high pre-crosslinking layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.
[0009] In an optional embodiment, the thickness of the high pre-crosslinking layer is 50-400 μm.
[0010] In an optional embodiment, the material of the low pre-crosslinking layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.
[0011] In an alternative embodiment, the low pre-crosslinking layer has a thickness of 50-400 microns.
[0012] In an alternative embodiment, the low pre-crosslinking layer is further provided with a solidification layer on the side away from the high pre-crosslinking layer; the solidification layer is made of any one of thermosetting adhesive film and photocuring adhesive film.
[0013] In an alternative embodiment, the solidification layer has a thickness of 50-400 microns.
[0014] In an alternative embodiment, a barrier layer is further provided between the low pre-crosslinking layer and the solidification layer; the barrier layer is made of any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, ethylene-acrylic acid salt ionomer, polyolefin, polyester, polyamide, acrylate, and polyurethane.
[0015] In an alternative embodiment, the barrier layer has a thickness of 50-300 microns.
[0016] In a second aspect, the embodiments of the present disclosure further provide a photovoltaic module, comprising the pre-crosslinking encapsulation adhesive film as described above, and a perovskite laminated cell in contact with the high pre-crosslinking layer of the pre-crosslinking encapsulation adhesive film.
[0017] The pre-crosslinking encapsulation adhesive film for perovskite laminates and the photovoltaic module of the present application have the following beneficial effects: the high pre-crosslinking layer with high pre-crosslinking degree is in contact with the perovskite cell, the process temperature for laminating to reach the target crosslinking degree is reduced, the stability of the perovskite material in the laminating link is protected, the difference between the high pre-crosslinking layer and the low pre-crosslinking layer ensures the heat resistance and stability of the high pre-crosslinking layer, the fluidity of the lower pre-crosslinking layer is also achieved, and the defect of insufficient crosslinking degree in low-temperature lamination is overcome.
[0018] Other features and advantages of the present application will be set forth in the following description of the application, and in part will become apparent to those skilled in the art upon examination of the following or can be learned by practice of the application. The objects and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
[0019] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the specific embodiments or the prior art of the present application, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced as follows. Obviously, the drawings described below are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0021] Figure 1 A structure diagram of a pre-crosslinking packaging adhesive film for perovskite laminates provided by the embodiment of the present application is shown in the figure.
[0022] Figure 2 A structure diagram of a pre-crosslinking packaging adhesive film for perovskite laminates provided by the embodiment of the present application is shown in the figure.
[0023] Figure 3 A structure diagram of a pre-crosslinking packaging adhesive film for perovskite laminates provided by the embodiment of the present application is shown in the figure.
[0024] In the figure:
[0025] 1, high pre-crosslinking layer; 2, low pre-crosslinking layer; 3, curing layer; 4, barrier layer. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0027] As used herein, the phrases "in an embodiment", "according to an embodiment", "in some embodiments", and the like generally mean the fact that a particular feature, structure, or characteristic described after the phrase can be included in at least one embodiment of the present disclosure. Therefore, the particular feature, structure or characteristic can be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example", "exemplary", and the like are used as an example, instance, or illustration. Any implementation, aspect or design described herein as "example" or "exemplary" is not necessarily interpreted as preferred or superior to other implementations, aspects or designs. On the contrary, the use of the terms "example", "exemplary" and the like is intended to present the concept in a specific manner.
[0028] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.
[0029] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.
[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0031] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0032] Please see Figure 1 ,like Figure 1 As shown, this disclosure provides a pre-crosslinked encapsulating film for perovskite stacks, comprising: a high pre-crosslinked layer on the upper layer and a low pre-crosslinked layer on the lower layer; the pre-crosslinking degree of the high pre-crosslinked layer is 40-70%; the pre-crosslinking degree of the low pre-crosslinked layer is 20-40%; and the difference in pre-crosslinking degree between the high pre-crosslinked layer and the low pre-crosslinked layer is not less than 10%.
[0033] In some embodiments, specifically, the material of the highly pre-crosslinked layer is any one of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and ethylene-acrylate ionomer.
[0034] In some embodiments, specifically, the thickness of the highly pre-crosslinked layer is 50-400 μm.
[0035] In some embodiments, specifically, the material of the low pre-crosslinking layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.
[0036] In some embodiments, specifically, the thickness of the low pre-crosslinking layer is 50-400 μm.
[0037] Referring to Figure 2 As shown in Figure 2 In some embodiments, specifically, the low pre-crosslinking layer is further provided with a curing layer away from the high pre-crosslinking layer; the material of the curing layer is any one of heat-cured adhesive film and light-cured adhesive film.
[0038] In some embodiments, specifically, the thickness of the curing layer is 50-400 μm.
[0039] Referring to Figure 3 In some embodiments, specifically, the low pre-crosslinking layer and the curing layer are further provided with a barrier layer; the material of the barrier layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, ethylene-acrylic acid salt ionomer, polyolefin, polyester, polyamide, acrylate, and polyurethane.
[0040] Specifically, the barrier layer is provided to block the free radicals generated in the curing process of the lower curing layer by physical blocking or auxiliary absorption.
[0041] In some embodiments, specifically, the thickness of the barrier layer is 50-300 μm.
[0042] In the second aspect, the embodiments of the present disclosure further provide a photovoltaic module, comprising: the pre-crosslinking encapsulation adhesive film as described above, and a perovskite laminated cell in contact with the high pre-crosslinking layer of the pre-crosslinking encapsulation adhesive film.
[0043] Embodiments
[0044] Referring to Table 1, the structure and performance data of each embodiment in the present application are shown in Table 1.
[0045]
[0046] Specifically, the parameters in the high pre-crosslinking layer and the low pre-crosslinking layer in Table 1 are respectively the material, thickness and pre-crosslinking degree of the pre-crosslinking layer.
[0047] Specifically, the curing layer in Example 3 and Comparative Example 1 is prepared by using benzoyl peroxide (BPO) as a thermal initiator to obtain a heat-cured adhesive film.
[0048] Specifically, the cured layer in Example 4 is prepared by using benzoin dimethyl ether (BDK) as a photoinitiator to obtain a photocured adhesive film.
[0049] In summary, the pre-crosslinking encapsulation adhesive film of the perovskite stack, and the photovoltaic module are in contact with the perovskite battery piece through the high pre-crosslinking layer with high pre-crosslinking degree, which reduces the process temperature of laminating to reach the target crosslinking degree, protects the stability of the perovskite material in the laminating link, and the difference between the high pre-crosslinking layer and the low pre-crosslinking layer ensures the heat resistance and stability of the high pre-crosslinking layer, and also realizes the fluidity of the lower pre-crosslinking layer, overcoming the defect of insufficient crosslinking degree in low-temperature lamination.
[0050] With the above ideal embodiments of the present application as inspiration, through the above description, relevant personnel can make various changes and modifications without deviating from the technical concept of the present application. The technical scope of the present application is not limited to the content in the specification, and must be determined according to the scope of the claims.
Claims
1. A pre-crosslinking encapsulation adhesive film for perovskite stacks, characterized by, Comprising: a high pre-crosslinking layer on the upper layer and a low pre-crosslinking layer on the lower layer; the pre-crosslinking degree of the high pre-crosslinking layer is 40-70%; the pre-crosslinking degree of the low pre-crosslinking layer is 20-40%; and the difference between the pre-crosslinking degrees of the high pre-crosslinking layer and the low pre-crosslinking layer is not less than 10%.
2. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 1, wherein: the material of the high pre-crosslinking layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.
3. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 1, wherein: the thickness of the high pre-crosslinking layer is 50-400 μm.
4. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 1, wherein: the material of the low pre-crosslinking layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.
5. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 1, wherein: the thickness of the low pre-crosslinking layer is 50-400 μm.
6. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 1, wherein: a curing layer is further provided on the side of the low pre-crosslinking layer away from the high pre-crosslinking layer; the material of the curing layer is any one of heat-curing adhesive film and light-curing adhesive film.
7. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 6, wherein: the thickness of the curing layer is 50-400 μm.
8. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 6, wherein: a barrier layer is further provided between the low pre-crosslinking layer and the curing layer; the material of the barrier layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, ethylene-acrylic acid salt ionomer, polyolefin, polyester, polyamide, acrylic ester, and polyurethane.
9. The pre-crosslinking encapsulation adhesive film for perovskite laminated layers according to claim 8, wherein: the thickness of the barrier layer is 50-300 μm.
10. A photovoltaic module, characterized by, Comprising: the pre-crosslinking encapsulation adhesive film according to any one of claims 1-9, and a perovskite laminated battery piece in contact with the high pre-crosslinking layer of the pre-crosslinking encapsulation adhesive film.