Electroplating device

Abstract

The utility model provides an electroplating device which comprises an electroplating bath and an anode plate, the anode plate is immersed in an electroplating solution in the electroplating bath, and a first height difference is formed between the top of a body of the anode plate and the liquid level of the electroplating solution. According to the utility model, the anode plate is immersed in the plating solution in the electroplating bath, and the top of the body of the anode plate and the liquid level of the plating solution form the first height difference, so that the top of the body of the anode plate is slightly lower than the liquid level of the curing solution, the power receiving area of the top of the anode plate is reduced, and the current density is lower from top to bottom; the anode plate can ensure that the metal foil does not participate in the electroplating reaction when just in contact with the plating solution, electroplating is started until the metal foil is slowly immersed in the plating solution and gaps between metal teeth are fully infiltrated by the plating solution, and compared with electroplating started by directly entering a tank, the anode plate design can remarkably improve the uniformity of a curing layer.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating technical field especially is related to a kind of electroplating device. BACKGROUND

[0002] In the post-treatment solidification process of electrolytic copper foil, titanium is usually selected to make anode plate, which is generally called DSA (Dimensionally Stable Anode), i.e. dimensionally stable anode. In the use process, titanium anode does not dissolve, thereby maintaining the stability of the size, so titanium anode belongs to insoluble anode. In the electroplating process, in order to ensure the uniformity of electroplating, it is necessary to ensure that the electroplating conditions are controllable and stable, and one of the important points is to maintain the uniformity of the discharge from the anode end to the cathode end. In the existing electroplating device, the design of the electroplating anode plate is fixed, and the anode plate is level with the cathode and the plating liquid level, and the anode plate is as wide as or wider than the copper foil in the horizontal direction, to ensure that all parts of the copper foil can be electrified after being immersed in the electroplating solution. Although it can ensure that all parts of the copper foil can be electrified after being immersed in the electroplating solution, the copper foil participates in the electroplating reaction at a relatively fast rate as soon as it contacts the plating solution, and the part that has not been immersed in the plating solution does not participate in the electroplating reaction, which leads to a serious difference in the degree of participation in the electroplating reaction of different parts of the copper foil, affecting the uniformity of the solidification layer, and thus leading to poor quality of the solidification plating layer and easy falling off. SUMMARY

[0003] The utility model provides a kind of electroplating device, which can solve the problem of poor quality of solidification plating layer and easy falling off caused by the design of anode plate in the existing electroplating device.

[0004] To solve the above technical problems, the utility model embodiment provides an electroplating device, which comprises an electroplating tank and an anode plate. The anode plate is immersed in the plating solution in the electroplating tank. The top of the body of the anode plate forms a first height difference with the liquid level of the plating solution.

[0005] As a preferred solution, the first height difference is greater than or equal to 150 mm.

[0006] As a preferred solution, the bottom of the anode plate forms a second height difference with the bottom of the electroplating tank.

[0007] As a preferred solution, a fixing structure is provided in the electroplating tank, which is used to fix the anode plate.

[0008] As a preferred solution, a notch is formed in the bottom of the anode plate, and the notch forms a second height difference with the bottom of the electroplating tank.

[0009] As a preferred solution, first and second notches are formed in the opposite ends of the bottom of the anode plate along the width direction of the anode plate.

[0010] As a preferred solution, the cross-sectional shape of the notch is circular arc or broken line.

[0011] As a preferred solution, the first notch and the second notch are both composed of a first groove section and a second groove section perpendicular to each other; the shape of the first groove section and the second groove section is rectangular, the ratio of the width of the anode plate to the length of the first groove section is 11-12, and the ratio of the height of the anode plate to the length of the second groove section is 6-7.

[0012] As a preferred solution, along the width direction of the anode plate, the opposite sides of the anode plate are respectively provided with a first fixing member and a second fixing member, and the first fixing member and / or the second fixing member are fixedly matched with the fixing structure.

[0013] As a preferred solution, a plurality of fixing holes are arranged on the first fixing member and the second fixing member, and the fixing holes are fixedly matched with the fixing structure.

[0014] Compared with the prior art, the anode plate of the utility model is immersed in the plating solution in the electroplating tank, the top of the body of the anode plate forms a first height difference with the liquid level of the plating solution, the top of the body of the anode plate is slightly lower than the liquid level of the solidification liquid, the power receiving area of the top of the anode plate is reduced, the current density is lower and lower upwards, the metal foil can be ensured not to participate in the electroplating reaction when the metal foil just contacts the plating solution, the electroplating is started after the metal foil slowly immerses in the plating solution and the metal gap is fully immersed in the plating solution, compared with directly starting electroplating in the tank, the anode plate design can significantly improve the uniformity of the solidification layer. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 Fig. 1 is a structural schematic diagram of a preferred embodiment of the electroplating device provided by the utility model;

[0016] Figure 2 Fig. 2 is a structural schematic diagram of the electroplating device in the prior art;

[0017] Figure 3 Fig. 3 is a structural schematic diagram of a preferred embodiment of the anode plate provided by the utility model;

[0018] Figure 4 Fig. 4 is a structural schematic diagram of another preferred embodiment of the anode plate provided by the utility model;

[0019] Figure 5 Fig. 5 is a structural schematic diagram of still another preferred embodiment of the anode plate provided by the utility model;

[0020] Figure 6This is a box plot comparing the surface roughness of a roll of copper foil after electroplating using the embodiments and comparative examples provided by this utility model.

[0021] Among them, 101, anode plate; 102, first notch; 103, second notch; 104, first fixing member; 105, second fixing member; 106, fixing hole; 2, electroplating tank; 3, plating solution; 4, oxygen bubble;

[0022] H1: Width direction; H2: Height direction;

[0023] S: Power line;

[0024] L: The surface level of the plating solution;

[0025] L1: Length of the first groove segment; L2: Length of the second groove segment. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this application, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0028] In the description of the present application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. The terms "vertical", "horizontal", "left", "right", "up", "down" and similar expressions used herein are for the purpose of illustration only, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in specific circumstances.

[0029] In the description of the present application, it is necessary to point out that, unless otherwise defined, all technical and scientific terms used by the present application are the same as those commonly understood by those skilled in the art. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in specific circumstances.

[0030] Please refer to Figure 1 The embodiment of the present application provides a kind of electroplating device, electroplating device includes electroplating tank 2 and anode plate 101, anode plate 101 is immersed in the plating solution 3 in electroplating tank 2, the top of the body of anode plate 101 and the liquid level L of plating solution form first height difference.

[0031] It is worth mentioning that the arrangement of anode plate 101 will directly affect the distribution of electric power line S in the electroplating process, the place where electric power line S is more dense, the current density is greater, and the plating speed is also faster, on the contrary, the place where electric power line S is more sparse, the current density is smaller, and the plating speed is also slower, which leads to that even if using the same plating solution 3 and process parameters to carry out roughening treatment to metal foil, there will be great difference in solidification layer of each part of metal foil, wherein electric power line S can be regarded as the path of current propagation in plating solution 3. Therefore, dense anode distribution will lead to too large current density, which is easy to cause the solidification layer of metal foil to be too thick and uneven, especially when electroplating is carried out on uneven base (metal tooth).

[0032] Therefore, in this embodiment, the anode plate 101 is designed to be immersed in the plating solution 3 in the electroplating tank 2, and the top of the anode plate 101 body forms a first height difference with the liquid surface L of the plating solution. Thus, the top of the anode plate 101 body is slightly lower than the liquid surface of the curing solution, which reduces the charged area at the top of the anode plate 101. The current density decreases as it goes up, which ensures that the metal foil does not participate in the electroplating reaction when it first comes into contact with the plating solution 3. Electroplating only begins after the metal foil is slowly immersed in the plating solution 3 and the gaps between the metal teeth are fully wetted by the plating solution 3. This improves the uniformity of the cured layer.

[0033] Existing electroplating equipment such as Figure 2 As shown, in the metal foil curing process, to ensure uniform electric field distribution, the anode plate is typically positioned vertically flush with the plating solution surface, and horizontally equal in width to or wider than the metal foil serving as the cathode. This ensures that all parts of the metal foil are charged after immersion in the plating solution. However, the electric field distribution is relatively dense from the bottom of the plating tank 2 to the plating solution surface. This results in the metal foil participating in a rapid plating reaction as soon as it comes into contact with the plating solution, while the parts not yet immersed in the solution do not participate in the plating reaction. This leads to significant differences in the degree of participation in the plating reaction on different parts of the metal foil, resulting in an uneven final cured layer. In contrast, the electroplating apparatus in this embodiment has the following electric field distribution during the metal foil curing process: Figure 1 As shown, when the metal foil first comes into contact with the plating solution 3, the part immersed in the plating solution 3 does not have an opposite anode plate 101. Only the top of the body of the anode plate 101 located below will emit a weak current to the part immersed in the plating solution 3. The current density is greatly reduced, so that when the metal foil first comes into contact with the plating solution 3, the reaction rate is greatly reduced or even does not participate in the electroplating reaction compared with the existing electroplating device.

[0034] As a preferred option, the first height difference is greater than or equal to 150mm.

[0035] Specifically, in this embodiment, the first height difference between the top of the anode plate 101 and the liquid surface L of the plating solution is greater than or equal to 150 mm. For example, the first height difference can be 150 mm, 175 mm, 200 mm, 205 mm, 212 mm, 223 mm, 230 mm, etc. This embodiment does not make a specific limitation here, so as to ensure that the first height difference is large enough, so as to better avoid the electric field lines S distributed on the top of the anode plate 101 immersed in the plating solution 3 from being too dense, ensuring that the current density on the top of the anode plate 101 is small, and better ensuring that the metal foil does not participate in the electroplating reaction when it first comes into contact with the plating solution 3, so as to improve the uniformity of the cured layer.

[0036] As a preferred embodiment, the bottom of the anode plate 101 forms a second height difference with the bottom of the electroplating tank 2.

[0037] It is worth mentioning that in the process of electroplating metal foil (such as copper foil), the anode plate 101 will undergo oxygen evolution reaction as an insoluble anode, which is essentially because the water molecules in the plating solution 3 are affected by the electric field and undergo electrolysis reaction. The water molecules on the anode undergo oxidation reaction to produce oxygen and appear in the form of bubbles. If the oxygen bubbles 4 adhere to the surface of the metal foil (copper foil), it will affect the deposition of metal at the adhesion position, causing the metal to be deposited only around the oxygen bubbles 4. If the oxygen bubbles 4 remain on the surface of the metal foil (copper foil) throughout the electroplating process, it will cause the solidified plating layer to have holes, spots or pinholes, thereby affecting the uniformity of the solidified layer during the solidification post-processing of the electrolytic metal foil, and even causing holes in the base metal. Therefore, the second height difference is formed between the bottom of the anode plate 101 and the bottom of the electroplating tank 2, so as to form an exhaust channel between the bottom of the anode plate 101 and the bottom of the electroplating tank 2, which can effectively exhaust the oxygen bubbles 4 generated during electroplating. It can be understood that the oxygen bubbles 4 generated will move to the liquid surface due to their lower density than the plating solution 3. By providing an exhaust channel for the oxygen bubbles 4 at the bottom of the anode plate 101, the oxygen bubbles 4 can be exhausted from the bottom of the anode plate 101 to the liquid surface L of the plating solution during electroplating, thereby ensuring the effect of electroplating, avoiding excessive oxygen content in the plating solution 3, and preventing the oxygen bubbles 4 from affecting the uniformity of the plating layer and causing holes in the base metal.

[0038] As a preferred solution, the electroplating tank 2 is provided with a fixing structure for fixing the anode plate 101.

[0039] Specifically, considering the flow of the plating solution 3 in the electroplating tank 2, gas disturbance caused by electrode reaction and other situations, if the anode plate 101 is not reliably fixed, it is easy to shake or displace. Therefore, the fixing structure for fixing the anode plate 101 is provided in the electroplating tank 2, which can stably install the anode plate 101 in the electroplating tank 2 by mechanical fixation, so as to ensure that the anode plate 101 always maintains the correct position and posture during electroplating, and maintains the appropriate relative positional relationship with the electrolytic metal foil as the cathode plate, which is the basis for realizing uniform electroplating.

[0040] As a preferred solution, the bottom of the anode plate 101 is provided with a notch, and the notch forms a second height difference with the bottom of the electroplating tank 2.

[0041] Specifically, by providing a notch in the bottom of the anode plate 101, the anode plate 101 can be lowered during metal foil electroplating. For example, Figures 3 to 5The bottom of the anode plate 101 is provided with a notch, and the top of the body of the anode plate 101 is not flush with the liquid level L of the plating solution, so that the top of the body of the anode plate 101 is slightly lower than the solidification liquid, and the top of the body of the anode plate 101 forms a first height difference with the liquid level L of the plating solution, so that the top of the anode plate 101 is reduced, and the current density is lower and lower, which can ensure that the metal foil does not participate in the electroplating reaction when it just contacts the plating solution 3, and the electroplating does not start until the metal foil is slowly immersed in the plating solution 3 and the metal gap is fully immersed in the plating solution 3, thereby improving the uniformity of the solidification layer.

[0042] In addition, the bottom of the anode plate 101 is provided with a notch, and the second height difference between the notch and the bottom of the electroplating tank 2 forms an exhaust channel, so that the oxygen bubbles 4 generated during the electroplating process can be effectively discharged, the oxygen content in the plating solution 3 is prevented from being too high, the oxygen bubbles 4 stay on the surface of the copper foil and affect the uniformity of the plating layer, and the oxygen bubbles 4 can be effectively prevented from penetrating into the base metal to cause holes.

[0043] Optionally, the notch can be continuous or discontinuous, and the number of notches can be one or more than two, and the shape of the notch can be rectangular, wavy, arc-shaped, concave or other irregular shapes.

[0044] In an optional embodiment, the anode plate 101 comprises a titanium base layer and an insoluble anode coating layer coated on the surface of the titanium base layer.

[0045] As a preferred solution, the bottom of the anode plate 101 is provided with a first notch and a second notch at opposite ends along the width direction H1 of the anode plate 101.

[0046] It is worth noting that the shape of the anode plate 101 will also directly affect the distribution of the power line S during the electroplating process, so in order to ensure the uniform distribution of the power line S during the electroplating process and improve the discharge efficiency of the oxygen bubbles 4, the first notch 102 and the second notch 103 are provided at opposite ends of the bottom of the anode plate 101 along the width direction H1 of the anode plate 101. Figure 3As shown, compared with only one notch, the discharge efficiency of the oxygen bubbles 4 can be greatly improved, so that the oxygen bubbles 4 can be better prevented from staying on the surface of the electrolytic metal foil to affect the uniformity of the solidified layer, and the oxygen bubbles 4 can be better prevented from penetrating into the base metal to cause holes. In addition, by respectively providing the first notch 102 and the second notch 103 at the opposite ends of the bottom, it can be ensured that the shape of the anode plate 101 is not changed too much, and the integrity of the ion exchange area in the middle can be reserved, so that the influence on the uniformity of the power line S distribution is small. In the solidification process of the electrolytic metal foil, the power line S in some areas can be prevented from being too dense, and the plating speed is fast, and the power line S in some areas can be prevented from being too sparse, and the plating speed is slow. The solidified layer thickness of different parts of the metal foil is uniform.

[0047] It should be noted that the first notch 102 and the second notch 103 in the embodiment all penetrate the first surface and the second surface of the anode plate 101, wherein the first surface and the second surface of the anode plate 101 are two surfaces along the thickness direction of the anode plate 101, and the thickness direction is the direction perpendicular to the height direction H2 and the width direction H1. In the electroplating process, the first surface or the second surface can be used as the ion exchange area facing the cathode plate.

[0048] As a preferred solution, the cross-sectional shape of the notch is a circular arc shape or a polyline shape.

[0049] Specifically, the cross-sectional shape of the notch in the embodiment can be a circular arc shape or a polyline shape, which is not limited in the embodiment. It can be understood that, as shown in Figure 4 As shown, the cross-sectional shape of the notch provided at the bottom of the anode plate 101 is a circular arc shape, and the polyline shape is a shape connected by two or more line segments in sequence. As shown in Figure 3 As shown, the cross-sectional shape of the notch is a vertically flipped "L" shape, which belongs to one of the polyline shapes. In addition, as shown in Figure 5 As shown, the cross-sectional shape of the notch is a stepped shape, which also belongs to one of the polyline shapes. The embodiment will not be described in more detail here.

[0050] As a preferred solution, the first notch 102 and the second notch 103 are composed of a first groove section and a second groove section perpendicular to each other; the shapes of the first groove section and the second groove section are both rectangular, the ratio of the width of the anode plate 101 to the length L1 of the first groove section is 11-12, and the ratio of the height of the anode plate 101 to the length L2 of the second groove section is 6-7.

[0051] Specifically, in order to ensure that the shape of the anode plate 101 is not changed too much and the distribution of the power line S is uniform during the electroplating process, the first notch 102 and the second notch 103 in the embodiment are both composed of a first groove section and a second groove section perpendicular to each other, and the ratio of the width of the anode plate 101 to the length L1 of the first groove section is 11-12, and the ratio of the height of the anode plate 101 to the length L2 of the second groove section is 6-7. For example, the ratio of the width of the anode plate 101 to the length L1 of the first groove section can be 11.0, 11.1, 11.2, 11.3, 11.4, 11.5, 11.6, 11.7, 11.8, 11.9, 12.0, etc., which is not specifically limited in the embodiment; and the ratio of the height of the anode plate 101 to the length L2 of the second groove section can be 6.0, 6.1, 6.2, 6.3, 6.4, 6.5, 6.6, 6.7, 6.8, 6.9, 7.0, etc., which is not specifically limited in the embodiment; for example, in an embodiment, the width of the anode plate 101 is 1350mm, the length L1 of the first groove section is 115mm, and the ratio of the two is about 11.74, the height of the anode plate 101 is 970mm, and the length L2 of the second groove section is 150mm, and the ratio of the two is about 6.47. By limiting the above ratio, it can be ensured that the first notch 102 and the second notch 103 are not too small, thereby affecting the discharge efficiency of the oxygen bubbles 4, and at the same time, it can also be avoided that the first notch 102 and the second notch 103 are too large, so that the shape of the anode plate 101 is changed too much, thereby affecting the uniformity of the distribution of the power line S during the electroplating process.

[0052] As a preferred solution, along the width direction H1 of the anode plate 101, the opposite sides of the anode plate 101 are respectively provided with a first fixing member 104 and a second fixing member 105, and the first fixing member 104 and / or the second fixing member 105 are fixedly matched with the fixing structure.

[0053] Specifically, considering the existence of plating solution 3 flow, gas disturbance generated by electrode reaction and the like in the electroplating tank 2, if the anode plate 101 is not reliably fixed, it is easy to shake or displace, therefore, in the embodiment, first fixing member 104 and second fixing member 105 are respectively arranged on the opposite sides of the anode plate 101 along the width direction H1 of the anode plate 101, so that the anode plate 101 can be stably installed in the electroplating tank 2 through the fixing cooperation of the first fixing member 104 with the fixing structure in the electroplating tank 2, or the fixing cooperation of the second fixing member 105 with the fixing structure in the electroplating tank 2, or the fixing cooperation of the first fixing member 104 and the second fixing member 105 with the fixing structure in the electroplating tank 2, so as to ensure that the anode plate 101 always maintains the correct position and posture during the electroplating process, and maintains the appropriate relative positional relationship with the electrolytic metal foil as the cathode plate, which is the basis for realizing uniform electroplating. In addition, the uniform distribution of power lines S from the anode to the cathode can be effectively maintained through the arrangement of the first fixing member 104 and the second fixing member 105, so as to ensure the stability of the current density during the electroplating process and improve the uniformity of the metal foil solidification layer.

[0054] As a preferred solution, the first fixing member 104 and the second fixing member 105 are respectively provided with a plurality of fixing holes 106, and the fixing holes 106 are fixedly matched with the fixing structure.

[0055] Specifically, the first fixing member 104 and the second fixing member 105 in the embodiment are respectively provided with a plurality of fixing holes 106, so that when the anode plate 101 is assembled in the electroplating tank 2, the fixing holes 106 can be fixedly matched with the fixing structure through the bolt fixing mode, so as to accurately position and install the anode plate 101, ensure the installation stability of the anode plate 101, and facilitate the disassembly and replacement of the anode plate 101.

[0056] As a preferred solution, the first fixing member 104 includes a first fixing part and a second fixing part perpendicular to each other, and the second fixing member 105 includes a third fixing part and a fourth fixing part perpendicular to each other; the first fixing part and the third fixing part are respectively arranged at the opposite ends of the top of the anode plate 101, and the second fixing part and the fourth fixing part are respectively arranged on the opposite sides of the anode plate 101 along the width direction H1 of the anode plate 101; wherein the first fixing part and the second fixing part are integrally formed, and the third fixing part and the fourth fixing part are integrally formed.

[0057] Specifically, the first fixing member 104 in the embodiment is composed of a first fixing part and a second fixing part which are perpendicular to each other, and the second fixing member 105 is composed of a third fixing part and a fourth fixing part which are perpendicular to each other, so that the first fixing part and the second fixing part can surround one end and one side of the top of the anode plate 101, and the third fixing part and the fourth fixing part can surround the other end and the other side of the top of the anode plate 101, which can significantly improve the fixing effect of the anode plate 101 when the anode plate 101 needs to be assembled in the electroplating tank 2, and better ensure that the anode plate 101 will not shake or displace during the electroplating process. In addition, the first fixing part and the second fixing part are integrally formed, and the third fixing part and the fourth fixing part are integrally formed, so that the first fixing member 104 and the second fixing member 105 can have good structural stability, and the fixing effect of the anode plate 101 can be further improved.

[0058] The electroplating device provided by the embodiment of the utility model has at least one of the following beneficial effects:

[0059] (1) The anode plate 101 is immersed in the plating solution 3 in the electroplating tank 2, and the top of the body of the anode plate 101 forms a first height difference with the liquid level L of the plating solution, so that the top of the body of the anode plate 101 is slightly lower than the solidification liquid, the current density of the top of the anode plate 101 is reduced, the metal foil does not participate in the electroplating reaction when it just contacts the plating solution 3, and the electroplating is started after the metal foil slowly immerses in the plating solution 3 and the metal joint gap is fully infiltrated by the plating solution 3, so that the design of the anode plate 101 can significantly improve the uniformity of the solidification layer.

[0060] (2) The bottom of the anode plate 101 is provided with a gap, the anode plate 101 can be lowered during metal foil electroplating, the top of the body of the anode plate 101 is not flush with the liquid level L of the plating solution, the top of the body of the anode plate 101 is slightly lower than the solidification liquid, the top of the body of the anode plate 101 forms a large enough first height difference with the liquid level L of the plating solution, so that the top of the anode plate 101 has a reduced current receiving area, the current density is reduced upwards, the metal foil does not participate in the electroplating reaction when it just contacts the plating solution 3, and the electroplating is started after the metal foil slowly immerses in the plating solution 3 and the metal joint gap is fully infiltrated by the plating solution 3, so that the uniformity of the solidification layer can be improved. At the same time, a second height difference between the gap and the bottom of the electroplating tank 2 can form an exhaust passage, so that the oxygen bubbles 4 generated during the electroplating process can be effectively exhausted, the oxygen content in the plating solution 3 is prevented from being too high, the oxygen bubbles 4 are prevented from staying on the surface of the copper foil to affect the uniformity of the plating layer, and the oxygen bubbles 4 are prevented from penetrating into the base metal to cause holes.

[0061] (3) By setting the first notch 102 and the second notch 103 at the opposite ends of the bottom of the anode plate 101 along the width direction H1 of the anode plate 101, the oxygen bubble 4 discharge efficiency can be greatly improved, the shape of the anode plate 101 can be ensured not to be changed too much, the integrity of the ion exchange area in the middle can be reserved, the influence on the power line S distribution uniformity is small, and in the solidification process of the electrolytic metal foil, the power line S in some areas is dense, the plating speed is fast, the power line S in some areas is sparse, the plating speed is slow, and the solidification layer thickness of different parts of the metal foil is uniform.

[0062] (4) By limiting the ratio of the width of the anode plate 101 to the length L1 of the first groove section and the ratio of the height of the anode plate 101 to the length L2 of the second groove section, it can be ensured that the first notch 102 and the second notch 103 are not too small, thereby affecting the oxygen bubble 4 discharge efficiency, and at the same time, the first notch 102 and the second notch 103 are not too large, so that the shape of the anode plate 101 is changed too much, and the distribution uniformity of the power line S in the electroplating process is affected.

[0063] In order to fully reflect the beneficial effects of the electroplating device provided by the embodiment of the utility model, the following specific test data is used for illustration.

[0064] Embodiment: An electroplating device comprises an electroplating tank and an anode plate. Along the width direction of the anode plate, first and second fixing members are arranged at opposite sides of the anode plate. First and second notches are arranged at opposite ends of the bottom of the anode plate. The first and second notches are each composed of a first groove section and a second groove section which are perpendicular to each other. The height of the anode plate is 970 mm, the width of the anode plate is 1350 mm, the length of the first groove section is 115 mm, and the length of the second groove section is 150 mm. The anode plate is immersed in a plating solution in the electroplating tank. The liquid level of the plating solution is 180 cm. The first height difference between the top of the body of the anode plate and the liquid level of the plating solution is 150 mm.

[0065] Comparative example: An electroplating device comprises an electroplating tank and an anode plate. Along the width direction of the anode plate, first and second fixing members are arranged at opposite sides of the anode plate. The bottom of the anode plate is not provided with a notch. The height of the anode plate is 1120 mm, and the width of the anode plate is 1350 mm. The anode plate is immersed in a plating solution in the electroplating tank. The liquid level of the plating solution is 180 cm. The top of the body of the anode plate is flush with the liquid level of the plating solution.

[0066] Under the same process parameters, a copper foil is electroplated by using the above-mentioned embodiment and comparative example respectively, and the roughness Rz uniformity of the electroplated copper foil is measured. After discarding the first 1 meter, 50 data are continuously measured, and the data are compared. The results are shown in Table 1.

[0067] Table 1 roughness Rz comparison

[0068]

[0069]

[0070]

[0071] From Table 1, the range of roughness Rz of the copper foil obtained by the comparative example plating is 1.44 μm, and the overall variance of the data is 0.154; the range of roughness Rz of the copper foil obtained by the example plating is 0.68 μm, and the overall variance of the data is 0.035, obviously the overall uniformity of the roughness Rz of the copper foil obtained by the example plating is better. In addition, the comparison box chart of the roughness of the copper foil obtained by the comparative example plating and the roughness of the copper foil obtained by the example plating is shown in Figure 6 Obviously, the dispersion degree of the roughness of the copper foil obtained by the example plating is lower, thereby verifying that the plating device provided by the example of the present application can better ensure the uniformity of the plating layer.

[0072] The above is the preferred embodiment of the present application, it should be pointed out that for those skilled in the art, without departing from the principles of the present application, can make a number of improvements and refinements, these improvements and refinements are also considered to be within the scope of the present application.

Claims

1. An electroplating apparatus characterized by comprising: The electroplating device comprises an electroplating tank and an anode plate, the anode plate is immersed in plating solution in the electroplating tank, and the top of the body of the anode plate forms a first height difference with the liquid level of the plating solution.

2. The electroplating apparatus of claim 1, wherein The first height difference is greater than or equal to 150 mm.

3. The electroplating apparatus of claim 1, wherein The bottom of the anode plate forms a second height difference with the bottom of the electroplating tank.

4. The electroplating apparatus of claim 1, wherein The electroplating tank is provided with a fixing structure for fixing the anode plate.

5. The electroplating apparatus according to any one of claims 1 to 4, wherein The bottom of the anode plate is provided with a notch, and the notch forms a second height difference with the bottom of the electroplating tank.

6. The electroplating apparatus of claim 5, wherein Along the width direction of the anode plate, opposite ends of the bottom of the anode plate are respectively provided with a first notch and a second notch.

7. The electroplating apparatus of claim 5, wherein The cross-sectional shape of the notch is circular arc or polyline.

8. The electroplating apparatus of claim 6, wherein The first notch and the second notch are both composed of a first groove surface segment and a second groove surface segment perpendicular to each other; the shapes of the first groove surface segment and the second groove surface segment are both rectangular, the ratio of the width of the anode plate to the length of the first groove surface segment is 11-12, and the ratio of the height of the anode plate to the length of the second groove surface segment is 6-7.

9. The electroplating apparatus of claim 4, wherein Along the width direction of the anode plate, opposite sides of the anode plate are respectively provided with a first fixing member and a second fixing member, and the first fixing member and / or the second fixing member are fixedly matched with the fixing structure.

10. The electroplating apparatus of claim 9, wherein The first fixing member and the second fixing member are both provided with a plurality of fixing holes, and the fixing holes are fixedly matched with the fixing structure.

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